4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES PACKAGE H11A817 SERIES H11AA814 SCHEMATIC 1 4 COLLECTOR 2 3 EMITTER 4 1 DESCRIPTION H11A617 & H11A817 SCHEMATIC The H11AA814 Series consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a single silicon phototransistor in a 4-pin dual in-line package. The H11A617 and H11A817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package. FEATURES * Compact 4-pin package * Current transfer ratio in selected groups: H11AA814: 20-300% H11A817: H11AA814A: 50-150% H11A817A: H11A617A: 40%-80% H11A817B: H11A617B: 63%-125% H11A817C: H11A617C: 100%-200% H11A817D: H11A617D: 160%-320% ANODE 1 CATHODE 2 4 COLLECTOR 3 EMITTER 50-600% 80-160% 130-260% 200-400% 300-600% * Minimum BVCEO of 70V guaranteed APPLICATIONS H11AA814 Series * AC line monitor * Unknown polarity DC sensor * Telephone line interface H11A617 and H11A817 Series * Power supply regulators * Digital logic inputs * Microprocessor inputs (c) 2003 Fairchild Semiconductor Corporation Page 1 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES Parameter H11A817 SERIES Symbol Device Value Units Storage Temperature TSTG All -55 to +150 C Operating Temperature TOPR All -55 to +100 C Lead Solder Temperature TSOL All 260 for 10 sec C PD All 200 mW Continuous Forward Current IF All 50 mA Reverse Voltage VR H11A617A/B/C/D H11A817/A/B/C/D 6 5 V IF(pk) All 1.0 A PD All 100 1.33 mW mW/C VCEO All 70 V VECO H11AA814/A H11A617A/B/C/D H11A817/A/B/C/D 6 7 6 V IC All 50 mA All 150 2.0 mW mW/C TOTAL DEVICE Total Device Power Dissipation (-55C to 50 C) EMITTER Forward Current - Peak (1 s pulse, 300 pps) LED Power Dissipation (25C ambient) Derate above 25C DETECTOR Collector-Emitter Voltage Emitter-Collector Voltage Continuous Collector Current Detector Power Dissipation (25C ambient) Derate above 25C PD ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol (IF = 60 mA) EMITTER (IF = 20 mA) Input Forward Voltage (VR = 6.0 V) (VR = 5.0 V) (IC = 1.0 mA, IF = 0) BVCEO Emitter-Collector Breakdown Voltage (IE = 100 A, IF = 0) BVECO (VCE = 10V, IF = 0) ICEO (VCE = 0 V, f = 1 MHz) Typ* Max 1.35 1.65 H11A817/A/B/C/D 1.2 1.5 H11AA814/A 1.2 1.5 .001 10 H11A617A/B/C/D IR DETECTOR Collector-Emitter Breakdown Voltage Collector-Emitter Capacitance Min H11A617A/B/C/D VF (IF = 20 mA) Reverse Leakage Current Collector-Emitter Dark Current Device H11A817/A/B/C/D Unit V A ALL 70 100 V H11AA814/A H11A617A/B/C/D H11A817/A/B/C/D H11AA814/A, H11A817/A/B/C/D, H11A617C/D H11A617A/B 6 7 6 10 V CCE ALL 1 100 nA 50 8 pF *Typical values at TA = 25C. (c) 2003 Fairchild Semiconductor Corporation Page 2 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES H11A817 SERIES TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specified.) DC Characteristic Test Conditions Symbol Device Min (IF = 1 mA, VCE = 5 V) (note 1) H11AA814 (IF = 1 mA, VCE = 5 V) (note 1) (IF = 10 mA, VCE = 5 V) (note 1) Current Transfer Ratio CTR (IF = 5 mA, VCE = 5 V) (note 1) (IF = 1 mA, VCE = 5 V) (note 1) Typ* Max Unit 20 300 % H11AA814A 50 150 % H11A617A 40 80 % H11A617B 63 125 % H11A617C 100 200 % H11A617D 160 320 % H11A817 50 600 % H11A817A 80 160 % H11A817B 130 260 % H11A817C 200 400 % H11A817D 300 600 % H11A617A 13 % H11A617B 22 % H11A617C 34 % H11A617D 56 % H11AA814/A 0.2 H11A617A/B/C/D 0.4 H11A817/A/B/C/D 0.2 (IC = 1 mA, IF = 20 mA) (IC = 2.5 mA, IF = 10 mA) (IC = 1 mA, IF = 20 mA) VCE (SAT) Rise Time (IC = 2 mA, VCE = 2 V, RL = 100) (note 2) tr ALL 2.4 18 s Fall Time (IC = 2 mA, VCE = 2 V, RL = 100) (note 2) tf ALL 2.4 18 s Collector-Emitter Saturation Voltage V AC Characteristic ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Input-Output Isolation Voltage (note 3) f = 60Hz, t = 1 min VISO 5300 Vac(rms) Isolation Resistance (VI-O = 500 VDC) RISO 1011 (VI-O = 0, f = 1 MHz) CISO Isolation Capacitance Typ* 0.5 Max Units pf *Typical values at TA = 25C. NOTES 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2. For test circuit setup and waveforms, refer to Figure 8. 3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common. (c) 2003 Fairchild Semiconductor Corporation Page 3 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11A617 SERIES Fig. 1 Normalized CTR vs. Forward Current 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 10 5 15 20 25 30 NORMALIZED CTR CTR NORMALIZED @ IF = 5 mA, VCE = 5 V, TA = 25C NORMALIZED CTR CTR NORMALIZED @ IF = 5 mA, VCE = 5 V, TA = 25C H11AA814 SERIES H11A817 SERIES Fig. 2 Normalized CTR vs. Ambient Temperature 1.2 IF = 10 mA 1 IF = 5 mA 0.8 0.6 0.4 -50 -25 IF - FORWARD CURRENT (mA) 0 +25 +50 +75 +100 TA - AMBIENT TEMPERATURE (C) Fig. 3 Collector-Emitter Saturation Voltage vs. Ambient Temperature Fig. 4 Forward Voltage vs. Forward Current IF = 20 mA IC = 1 mA 1.7 .12 VF - FORWARD VOLTAGE (V) VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) .14 .1 .08 .06 .04 .02 0 -50 1.5 1.3 T = -55C 1.1 T = 25C 0.9 T = 100C 0.7 0.5 -25 25 0 50 75 100 125 TA - AMBIENT TEMPERATURE (C) 0.1 0.2 0.5 1.0 2.0 5 10 20 50 100 IF - FORWARD CURRENT (mA) Fig. 5 Collector Current vs. Collector-Emitter Voltage IC - COLLECTOR CURRENT (mA) 25 IF = 20 mA 20 15 IF = 10 mA 10 IF = 5 mA 5 IF = 1 mA 0 0 1 2 3 4 5 6 7 8 9 10 VCE - COLLECTOR-EMITTER VOLTAGE (V) (c) 2003 Fairchild Semiconductor Corporation Page 4 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES Fig. 7 Rise and Fall Time vs. Load Resistor Fig. 6 Collector Leakage Current vs. Ambient Temperature 1000 10 IF = 5 mA VCC = 5 V TA = 25C VCE = 10 V 1 Tr/ Tf- RISE AND FALL TIME (s) ICEO - COLLECTOR-EMITTER CURRENT (A) H11A817 SERIES 10-1 10-2 10-3 10-4 toff tf 100 10 ton 1 tr 10-5 10-6 0.1 0 25 50 75 100 0.1 125 1 10 100 R - LOAD RESISTOR (KV) TA - AMBIENT TEMPERATURE (C) Figure 8. Switching Time Test Circuit and Waveforms TEST CIRCUIT WAVE FORMS VCC = 10V INPUT PULSE IC IF INPUT RL = 100 10% OUTPUT OUTPUT PULSE 90% tr tf Adjust IF to produce IC = 2 mA Recommended Thermal Reflow Profile for Surface Mount DIP Package Temperature (C) 225C 250 220C: 10 sec to 40 sec 200 150 Time > 183C: 120 sec to 180 sec 100 50 0 0 (c) 2003 Fairchild Semiconductor Corporation 1 2 3 Page 5 of 9 4 5 Time (Min) 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES Package Dimensions (Through Hole) H11A817 SERIES Package Dimensions (Surface Mount) 0.270 (6.86) 0.250 (6.35) 0.270 (6.86) 0.250 (6.35) SEATING PLANE 0.200 (5.08) 0.115 (2.92) 0.200 (5.08) 0.115 (2.92) 0.070 (1.78) 0.045 (1.14) 0.154 (3.90) 0.120 (3.05) 0.300 (7.62) TYP 0.190 (4.83) 0.175 (4.45) SEATING PLANE 0.270 (6.86) 0.250 (6.35) 0.190 (4.83) 0.175 (4.45) 0.020 (0.51) MIN 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 15 0.100 (2.54) TYP 0.315 (8.00) MIN 0.405 (10.30) MAX 0.016 (0.40) 0.008 (0.20) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 0.300 (7.62) typ Lead Coplanarity 0.004 (0.10) MAX Package Dimensions (0.4" Lead Spacing) Footprint Dimensions (Surface Mount) 0.070 (1.78) 0.270 (6.86) 0.250 (6.35) SEATING PLANE 0.060 (1.52) 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.270 (6.86) 0.250 (6.35) 0.100 (2.54) 0.295 (7.49) 0.415 (10.54) 0.154 (3.90) 0.120 (3.05) 0.030 (0.76) 0.004 (0.10) MIN 0.100 (2.54) TYP 0.400 (10.16) TYP 0.016 (0.40) 0.008 (0.20) 0 to 15 NOTE All dimensions are in inches (millimeters) (c) 2003 Fairchild Semiconductor Corporation Page 6 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES H11A817 SERIES ORDERING INFORMATION Option Order Entry Identifier Description S .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION 4 5 V X YY T 3 814 6 2 1 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) 4 One digit year code 5 Two digit work week ranging from `01' to `53' 6 Assembly package code (c) 2003 Fairchild Semiconductor Corporation Page 7 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES H11A817 SERIES Carrier Tape Specifications 12.0 0.1 5.00 0.20 0.30 0.05 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 16.0 0.3 13.2 0.2 4.95 0.20 0.1 MAX 10.30 0.20 O1.6 0.1 User Direction of Feed NOTE All dimensions are in millimeters (c) 2003 Fairchild Semiconductor Corporation Page 8 of 9 11/18/03 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS H11AA814 SERIES H11A617 SERIES H11A817 SERIES DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. (c) 2003 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 9 of 9 11/18/03