HD74AC174
Hex D-Type Flip-Flop with Master Reset
Description
The HD74AC174 is a high-speed hex D flip-flop. The device is used primarily as a 6-bit edge-triggered
storage register. The information on the D inputs is transferred to storage during the Low-to-High clock
transition. The device has a Master Reset to simultaneously clear all flip-flops.
Feature
• Outputs Source/Sink 24 mA
Pin Arrangement
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MR
Q0
D0
D1
Q1
Q2
D2
GND
VCC
Q5
D5
D4
Q4
D3
Q3
CP
(Top view)
HD74AC174
2
Logic Symbol
D0D1D2D3D4D5
Q0
CP
MR
Q1Q2Q3Q4Q5
Pin Names
D0 to D5Data Inputs
CP Clock Pulse Input
MR Master Reset Input
Q0 to Q5Outputs
Functional Description
The HD74AC174 consists of six edge-triggered D flip-flops with individual D inputs and Q outputs. The
Clock (CP) and Master Reset (MR) are common to all flip-flops. Each D input’s state is transferred to the
corresponding flip-flops’s output following the Low-to-High Clock (CP) transition. A Low input to the
Master Reset (MR) will force all outputs Low independent of Clock or Data inputs. The HD74AC174 is
useful for applications where the true output only is required and the Clock and Master Reset are common
to all storage elements.
Truth Table
Inputs Output
MR CP D Q
LX X L
HHH
HLL
HLXQ
H : High Voltage Level
L : Low Voltage Level
X : Immaterial
: Low-to-High Transition of Clock
HD74AC174
3
Logic Diagram
CP
CD
CPMR D5
Q5Q4Q3Q2Q1Q0
D4D3D2D1D0
DQ
CP
CD
DQ
CP
CD
DQ
CP
CD
DQ
CP
CD
DQ
CP
CD
DQ
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
DC Characteristics (unless otherwise specified)
Item Symbol Max Unit Condition
Maximum quiescent supply current ICC 80 µAV
IN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current ICC 8.0 µAV
IN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
AC Characteristics: HD74AC174
Ta = +25°C
CL = 50 pF Ta = –40°C to +85°C
CL = 50 pF
Item Symbol VCC (V)*1Min Typ Max Min Max Unit
Maximum clock fmax 3.3 90 100 — 70 — MHz
frequency 5.0 100 125 — 100 —
Propagation delay tPLH 3.3 1.0 9.0 11.5 1.0 12.5 ns
CP to Qn5.0 1.0 6.0 8.5 1.0 9.5
Propagation delay tPHL 3.3 1.0 8.5 11.0 1.0 12.0 ns
CP to Qn5.0 1.0 6.0 8.0 1.0 9.0
Propagation delay tPHL 3.3 1.0 9.0 11.5 1.0 12.5 ns
MR to Qn5.0 1.0 7.0 9.0 1.0 10.5
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
HD74AC174
4
AC Operating Requirements: HD74AC174
Ta = +25°C
CL = 50 pF
Ta = –40°C
to +85°C
CL = 50 pF
Item Symbol VCC (V)*1Typ Guaranteed Minimum Unit
Setup time, HIGH or LOW tsu 3.3 2.5 6.5 7.0 ns
Dn to CP 5.0 2.0 5.0 5.5
Hold time, HIGH or LOW th3.3 1.0 3.0 3.0 ns
Dn to CP 5.0 0.5 3.0 3.0
MR pulse width, LOW tw3.3 1.0 5.5 7.0 ns
5.0 1.0 5.0 5.0
CP pulse width tw3.3 1.0 5.5 7.0 ns
5.0 1.0 5.0 5.0
Recovery time trec 3.3 0 2.5 2.5 ns
MR to CP 5.0 0 2.0 2.0
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item Symbol Typ Unit Condition
Input capacitance CIN 4.5 pF VCC = 5.5 V
Power dissipation capacitance CPD 85.0 pF VCC = 5.0 V
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
6.30
19.20
16 9
81 1.3
20.00 Max
7.40 Max
7.62
0.25+ 0.13
– 0.05
2.54 ± 0.25 0.48 ± 0.10
0.51 Min
2.54 Min 5.06 Max
0° – 15°
1.11 Max
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.22 ± 0.05
*0.42 ± 0.08
0.12
0.15
M
2.20 Max 5.5
10.06
0.80 Max
16 9
18
10.5 Max
+ 0.20
– 0.30
7.80
0.70 ± 0.20
0° – 8°
0.10 ± 0.10
1.15
1.27
0.40 ± 0.06
0.20 ± 0.04
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
1.27
16 9
18
0.15
0.25 M
1.75 Max 3.95
*0.22 ± 0.03
9.9
0° – 8°
10.3 Max
+ 0.10
– 0.30
6.10
+ 0.67
– 0.20
0.60
+ 0.11
– 0.04
0.14
*0.42 ± 0.08
0.635 Max
0.40 ± 0.06
0.20 ± 0.03
1.08
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
TTP-16DA
—
—
0.05 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
0.50 ± 0.10
0° – 8°
*0.17 ± 0.05
6.40 ± 0.20
0.10
1.10 Max
0.13 M
0.65
18
16 9
4.40
5.00
5.30 Max
0.07+0.03
–0.04
0.65 Max
1.0
0.20 ± 0.06
+ 0.08
– 0.07
*0.22
0.15 ± 0.04
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
URL NorthAmerica : http:semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to:
