Surface Mount Sense Resistors
OARS, OARS-XP, OARSZ Series
Performance Data (AEC-Q200)
OARS1 <R004R004 to R015 >R015
OARS-XP <R002R002 to R007 >R007
TCR (-55 to 125ºC) ppm/ºC 240 40 40
Thermal Shock ∆R% 0.75 0.75 0.75
High Temp. Exposure (125ºC) ∆R% 1.75 0.5 1
Temp. Cycling (-40 to 125ºC) ∆R% 1 1 0.75
Operational Life ∆R% 2 1 1
Biased Humidity ∆R% 0.75 0.5 0.5
Mechanical Shock ∆R% 1.5 1 1
Vibration ∆R% 1 1 1
Terminal Strength Meets JIS-C-6429
Solvent Resistance Meets MIL-STD-002 Method215
Solderability Meets J-STD-002 Method B
Note: Temperature rise data are given here for typical mounting conditions. Actual figures depend on PCB copper weight, mounting pad size, track
width and substrate type. Also, the open air format responds better to forced air cooling than chip format resistors. For values below 5 milliohms
allowance should be made for heat generated in the copper tracks themselves. Application-specific guidance is available on request.
Temperature Derating
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
Am bient Te m perature (Deg C)
% of Rated Power
Pulse Energy Rating
0
20
40
60
80
100
120
1 10 100
Value (milliohm s)
Energy (J)
OARS1 OARS-XP
Note: For OARS-1Z the above derating graph may be applied to
the square of the current rating.
Note: This graph relates to single pulses of short duration (≤100ms).
Higher energy limits apply for longer pulses and overloads
Hot Spot Temperature Rise
7.6m m x 7.6mm pads, 2 oz copper on FR4, still air
0
50
100
150
200
250
300
25%50%75% 100%
Proportion of Rated Power
Temperature Rise (K)
50 / 25
30 / 15
10 / 5
5 / -
Value in m illiohm s
OARS1 / OARS-XP
Joint Temperature Rise
7.6mm x 7.6mm pads, 2 oz copper on FR4, still air
0
20
40
60
80
100
25%50%75% 100%
Proportion of Rated Power
Temperature Rise (K)
5/ -
10 / 5
30 / 15
50 / 25
Value in milliohms
OARS1 / OARS-XP
07.11