DS90CR286A/
DS90CR286AQ/DS90CR216A
May 5, 2009
+3.3V Rising Edge Data Strobe LVDS Receiver 28-Bit
Channel Link—66 MHz, +3.3V Rising Edge Strobe LVDS
Receiver 21-Bit Channel Link—66 MHz
General Description
The DS90CR286A receiver converts the four LVDS data
streams (Up to 1.848 Gbps throughput or 231 Megabytes/sec
bandwidth) back into parallel 28 bits of CMOS/TTL data. Also
available is the DS90CR216A that converts the three LVDS
data streams (Up to 1.386 Gbps throughput or 173
Megabytes/sec bandwidth) back into parallel 21 bits of
CMOS/TTL data. Both Receivers' outputs are Rising edge
strobe.
Both devices are offered in TSSOP packages.
The DS90CR286A / DS90CR216A devices are enhanced
over prior generation receivers and provided a wider data
valid time on the receiver output.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
20 to 66 MHz shift clock support
50% duty cycle on receiver output clock
Best–in–Class Set & Hold Times on RxOUTPUTs
Rx power consumption <270 mW (typ) @66MHz Worst
Case
Rx Power-down mode <200μW (max)
ESD rating >7 kV (HBM), >700V (EIAJ)
PLL requires no external components
Compatible with TIA/EIA-644 LVDS standard
Low profile 56-lead or 48-lead TSSOP package
Operating Temperature: −40°C to +85°C
Automotive Q grade available - AEC-Q100 grade 3
qualified
Block Diagrams
DS90CR286A
10087330
Order Number DS90CR286AMTD, DS90CR286AQMT
See NS Package Number MTD56
DS90CR216A
10087331
Order Number DS90CR216AMTD
See NS Package Number MTD48
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2010 National Semiconductor Corporation 100873 www.national.com
DS90CR286A/DS90CR286AQ/DS90CR216A +3.3V Rising Edge Data Strobe LVDS Receiver 28-
Bit Channel Link—66 MHz, +3.3V Rising Edge Data Strobe LVDS Receiver 21-Bit Channel
Link—66 MHz
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)−0.3V to +4V
CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V)
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature
(Soldering, 4 sec) +260°C
Maximum Package Power Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package:
DS90CR286AMTD 1.61 W
MTD48 (TSSOP) Package:
DS90CR216AMTD 1.89 W
Package Derating:
DS90CR286AMTD 12.4 mW/°C above +25°C
DS90CR216AMTD 15 mW/°C above +25°C
ESD Rating
(HBM, 1.5 k, 100 pF) > 7 kV
(EIAJ, 0, 200 pF) > 700V
Recommended Operating
Conditions
Min No
m
Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Free Air
Temperature (TA) −40 +25 +85 °C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (VCC) 100 mVPP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS (For PowerDown Pin)
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VCL Input Clamp Voltage ICL = −18 mA −0.79 −1.5 V
IIN Input Current V IN = 0.4V, 2.5V or VCC +1.8 +10 μA
V IN = GND −10 0 μA
CMOS/TTL DC SPECIFICATIONS
VOH High Level Output Voltage IOH = −0.4 mA 2.7 3.3 V
VOL Low Level Output Voltage IOL = 2 mA 0.06 0.3 V
IOS Output Short Circuit Current VOUT = 0V −60 −120 mA
LVDS RECEIVER DC SPECIFICATIONS
VTH Differential Input High Threshold V CM = +1.2V +100 mV
VTL Differential Input Low Threshold −100 mV
I IN Input Current V IN = +2.4V, VCC = 3.6V ±10 μA
V IN = 0V, VCC = 3.6V ±10 μA
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current Worst Case CL = 8 pF, Worst Case
Pattern, DS90CR286A
(Figures 1, 2 ), TA=−10°C
to +70°C
f = 33 MHz 49 65 mA
f = 37.5 MHz 53 70 mA
f = 66 MHz 81 105 mA
ICCRW Receiver Supply Current Worst Case CL = 8 pF, Worst Case
Pattern, DS90CR286A
(Figures 1, 2 ), TA=−40°C
to +85°C
f = 40 MHz 53 70 mA
f = 66 MHz 81 105 mA
ICCRW Receiver Supply Current Worst Case CL = 8 pF, Worst Case
Pattern, DS90CR216A
(Figures 1, 2 ), TA=−10°C
to +70°C
f = 33 MHz 49 55 mA
f = 37.5 MHz 53 60 mA
f = 66 MHz 78 90 mA
ICCRW Receiver Supply Current Worst Case CL = 8 pF, Worst Case
Pattern, DS90CR216A
(Figures 1, 2 ), TA=−40°C
to +85°C
f = 40 MHz 53 60 mA
f = 66 MHz 78 90 mA
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DS90CR286A/DS90CR286AQ/DS90CR216A
Symbol Parameter Conditions Min Typ Max Units
ICCRZ Receiver Supply Current Power Down = Low 10 55 μA
Power Down Receiver Outputs Stay Low during
Power Down Mode
Note 1: Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VCC = 3.3V and TA = +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except VOD and ΔV OD).
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time (Figure 2 ) 2 5 ns
CHLT CMOS/TTL High-to-Low Transition Time (Figure 2 ) 1.8 5 ns
RSPos0 Receiver Input Strobe Position for Bit 0 (Figure 9, Figure
10)
f = 40 MHz 1.0 1.4 2.15 ns
RSPos1 Receiver Input Strobe Position for Bit 1 4.5 5.0 5.8 ns
RSPos2 Receiver Input Strobe Position for Bit 2 8.1 8.5 9.15 ns
RSPos3 Receiver Input Strobe Position for Bit 3 11.6 11.9 12.6 ns
RSPos4 Receiver Input Strobe Position for Bit 4 15.1 15.6 16.3 ns
RSPos5 Receiver Input Strobe Position for Bit 5 18.8 19.2 19.9 ns
RSPos6 Receiver Input Strobe Position for Bit 6 22.5 22.9 23.6 ns
RSPos0 Receiver Input Strobe Position for Bit 0
(Figure 9, Figure 10)
f = 66 MHz 0.7 1.1 1.4 ns
RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (Note 4) (Figure 11 ) f = 40 MHz 490 ps
f = 66 MHz 400 ps
RCOP RxCLK OUT Period (Figure 3)15 T 50 ns
RCOH RxCLK OUT High Time (Figure 3 ) f = 40 MHz 10.0 12.2 ns
RCOL RxCLK OUT Low Time (Figure 3)10.0 11.0 ns
RSRC RxOUT Setup to RxCLK OUT (Figure 3 ) 6.5 11.6 ns
RHRC RxOUT Hold to RxCLK OUT (Figure 3 ) 6.0 11.6 ns
RCOH RxCLK OUT High Time (Figure 3 ) f = 66 MHz 5.0 7.6 ns
RCOL RxCLK OUT Low Time (Figure 3)5.0 6.3 ns
RSRC RxOUT Setup to RxCLK OUT (Figure 3 ) 4.5 7.3 ns
RHRC RxOUT Hold to RxCLK OUT (Figure 3 ) 4.0 6.3 ns
RCCD RxCLK IN to RxCLK OUT Delay @ 25°C, VCC = 3.3V (Note 5)(Figure 4 ) 3.5 5.0 7.5 ns
RPLLS Receiver Phase Lock Loop Set (Figure 5 ) 10 ms
RPDD Receiver Power Down Delay (Figure 8 ) 1 μs
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions
(min and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable), and clock jitter (less than 250 ps).
Note 5: Total latency for the channel link chipset is a function of clock period and gate delays through the transmitter (TCCD) and receiver (RCCD). The total
latency for the 215/285 transmitter and 216A/286A receiver is: (T + TCCD) + (2*T + RCCD), where T = Clock period.
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DS90CR286A/DS90CR286AQ/DS90CR216A
AC Timing Diagrams
10087302
FIGURE 1. “Worst Case” Test Pattern
10087304
FIGURE 2. DS90CR286A/DS90CR216A (Receiver) CMOS/TTL Output Load and Transition Times
10087305
FIGURE 3. DS90CR286A/DS90CR216A (Receiver) Setup/Hold and High/Low Times
10087306
FIGURE 4. DS90CR286A/DS90CR216A (Receiver) Clock In to Clock Out Delay
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DS90CR286A/DS90CR286AQ/DS90CR216A
10087307
FIGURE 5. DS90CR286A/DS90CR216A (Receiver) Phase Lock Loop Set Time
10087309
FIGURE 6. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CR286A
10087310
FIGURE 7. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CR216A
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DS90CR286A/DS90CR286AQ/DS90CR216A
10087308
FIGURE 8. DS90CR286A/DS90CR216A (Receiver) Power Down Delay
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DS90CR286A/DS90CR286AQ/DS90CR216A
10087325
FIGURE 9. DS90CR286A (Receiver) LVDS Input Strobe Position
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DS90CR286A/DS90CR286AQ/DS90CR216A
10087326
FIGURE 10. DS90CR216A (Receiver) LVDS Input Strobe Position
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DS90CR286A/DS90CR286AQ/DS90CR216A
10087311
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos—Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note Cycle-to-cycle jitter is less than TBD ps at 66 MHz. ) + ISI (Inter-symbol interference)
(Note ISI is dependent on interconnect length; may be zero. )
Cable Skew—typically 10 ps–40 ps per foot, media dependent
Note 6: Cycle-to-cycle jitter is less than TBD ps at 66 MHz.
Note 7: ISI is dependent on interconnect length; may be zero.
FIGURE 11. Receiver LVDS Input Skew Margin
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DS90CR286A/DS90CR286AQ/DS90CR216A
DS90CR286A Pin Descriptions —
MTD56 Package — 28-Bit Channel
Link Receiver
Pin Name I/O No
.
Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs.
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The rising edge acts as data strobe.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V CC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V CC I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V CC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
DS90CR216A Pin Descriptions —
MTD48 Package — 21-Bit Channel
Link Receiver
Pin Name I/O No
.
Description
RxIN+ I 3 Positive LVDS differentiaI data inputs. (Note 8)
RxIN− I 3 Negative LVDS differential data inputs. (Note 8)
RxOUT O 21 TTL level data outputs.
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The rising edge acts as data strobe.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V CC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V CC I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V CC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
Note 8: These receivers have input failsafe bias circuitry to guarantee a stable receiver output for floating or terminated receiver inputs. Under these conditions
receiver inputs will be in a HIGH state. If a clock signal is present, outputs will all be HIGH; if the clock input is also floating/terminated outputs will remain in the
last valid state. A floating/terminated clock input will result in a LOW clock output.
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DS90CR286A/DS90CR286AQ/DS90CR216A
Pin Diagram for TSSOP Packages
DS90CR286AMTD
10087323
DS90CR216AMTD
10087313
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DS90CR286A/DS90CR286AQ/DS90CR216A
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CR286AMTD, DS90CR286AQMT
NS Package Number MTD56
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CR216AMTD
NS Package Number MTD48
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DS90CR286A/DS90CR286AQ/DS90CR216A
Notes
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DS90CR286A/DS90CR286AQ/DS90CR216A
Notes
DS90CR286A/DS90CR286AQ/DS90CR216A +3.3V Rising Edge Data Strobe LVDS Receiver 28-
Bit Channel Link—66 MHz, +3.3V Rising Edge Data Strobe LVDS Receiver 21-Bit Channel
Link—66 MHz
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