LANGUAGE PRODUCT SPECIFICATION 1 JAPANESE ENGLISH SCOPE 0.4 mm This specification covers the 0.4 mm PITCH BOARD TO BOARD CONNECTOR series. 2 PRODUCT NAME AND PART NUMBER Product Name Part Number J- Receptacle Housing Assembly J-Bend Tail With Nail LEAD FREE Embossed Tape Package for 51338-***9 LEAD FREE Plug Assembly With Nail LEAD FREE Embossed Tape Package for 55909-**73 LEAD FREE * : REV. A B SHEET 1~13 1~15 REVISE ON PC ONLY REVISED J2016-0650 '15/12/17 M.TAKASHIMA B REV. DESCRIPTION STATUS DESIGN CONTROL J DOCUMENT NUMBER PS-51338-005 Refer to the drawing. TITLE: 0.4 BOARD TO BOARD CONNECTOR -LEAD FREE- (Hgt=1.5mm) CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: CHECKED BY: Y.ONO S.MARUYAMA APPROVED BY: M.SASAO DATE : YR/MO/DAY 2010/06/23 FILE NAME PS-51338-005.docx SHEET 1 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 3 JAPANESE ENGLISH RATINGS Item Rated Voltage (MAX.) Rated Current (MAX.) *1 Ambient Temperature Range Storage Condition Standard 50 V [ AC ( rms) / DC ] 0.3 A -25C Temperature Humidity Terms ~ +85C *2 -10C +50C 85%R.H. 85%R.H. MAX. (No Condensation) 6 For 6 months after shipping (unopened package) *1 : Non-operating connectors after reflow must follow the operating temperature range condition. *2 : This includes the terminal temperature rise generated by conducting electricity. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 2 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 4 JAPANESE ENGLISH PERFORMANCE 4-1 Electrical Performance Item Contact Resistance 4-1-1 Insulation Resistance 4-1-2 Dielectric Strength 4-1-3 4-2. Test Condition 20mV 10mA (JIS C5402 5.4) Requirement 40 milliohm MAX. Mate connectors and measured by dry circuit, 20mV MAX., 10mA. (JIS C5402 5.4) DC 250V (JIS C5402 5.2/MIL-STD-202 302) 100 Megohm MIN. Mate connectors and apply 200V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) AC(rms) 250V () 1 (JIS C5402 5.1/MIL-STD-202 301) No Breakdown Mate connectors and apply 250V AC(rms) for 1 minute between adjacent terminal or ground. (JIS C5402 5.1/MIL-STD-202 Method 301) Mechanical Performance Item 4-2-1 Insertion and Withdrawal Force 4-2-2 Terminal / Housing Retention Force Test Condition 253mm Insert and withdraw connectors at the speed rate of 253 mm/minute. 253mm Apply axial pull out force at the speed rate of 253 mm/minute on the terminal assembled in the housing. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION Requirement 6 Refer to paragraph 6 0.49N {0.05 kgf} MIN. TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 3 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 4-3 Environmental Performance and Others Item Repeated Insertion / Withdrawal 4-3-1 Temperature Rise 4-3-2 Vibration 4-3-3 Mechanical Shock 4-3-4 4-3-5 4-3-6 JAPANESE ENGLISH Test Condition 1 10 30 When mated up to 30 cycles repeatedly by the rate of 10 cycles per minute. (UL 498) Carrying rated current load. (UL 498) DC 1mA 3 105510 Hz/ 1.5mm 2 (MIL-STD-202 201) Amplitude : 1.5mm P-P Frequency : 10~55~10 Hz in 1 minute. Duration : 2 hours in each X.Y.Z.axes. (MIL-STD-202 Method 201) DC 1mA 6 490m/s { 50G } 3 (JIS C60068-2-27/MIL-STD-202 213) Heat Resistance 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C60068-2-27/MIL-STD-202 Method 213) 852C 96 1~2 (JIS C60068-2-2/MIL-STD-202 108) Cold Resistance 852C, 96 hours (JIS C60068-2-2/MIL-STD-202 Method 108) -253C 96 1~2 (JIS C60068-2-1) -253C, 96 hours (JIS C60068-2-1) REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION Requirement Contact Resistance 80 milliohm MAX. Temperature Rise 30 C MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. Discontinuity 1.0 microsecond MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. Discontinuity 1.0 microsecond MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 4 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Temperature Cycling 4-3-8 Salt Spray 4-3-9 SO2 Gas 4-3-10 402C 90~95 96 1 ~2 (JIS C60068-2-3/MIL-STD-202 103) Temperature : 402C Relative Humidity : 90~95% Duration : 96 hours (JIS C60068-2-3/MIL-STD-202 Method 103) -55C 30+85C 30 1 5 5 1~2 (JIS C0025) 5 cycles of : a) - 55C 30 minutes b) + 85C 30 minutes (JIS C0025) 352C 51% 484 (JIS C60068-2-11/MIL-STD-202 101) 484 hours exposure to a salt spray from the 51% solution at 352C. (JIS C60068-2-11/MIL-STD-202 Method 101) 402 505ppm 24 24 hours exposure to 505ppm SO2 gas at 402. Solderability 4-3-11 Requirement Test Condition Humidity 4-3-7 JAPANESE ENGLISH 2453C 30.5 Soldering Time : 30.5 sec. Solder Temperature : 2453 C REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION Appearance No Damage Contact Resistance Dielectric Strength Insulation Resistance 4-1-3 Must meet 4-1-3 Appearance No Damage Contact Resistance 80 milliohm MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. Appearance No Damage Contact Resistance 80 milliohm MAX. Solder Wetting 95% 95% of immersed area must show no voids, pin holes. 80 milliohm MAX. 50 Megohm MIN. TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 5 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Item JAPANESE ENGLISH Requirement Test Condition 72 Reflow soldering method Repeat paragraph 7, condition twice. Soldering iron method 0.2mm0.2mm Appearance 350105 Resistance to Soldering Heat 4-3-12 0.2mm from terminal tip and fitting nail tip. Soldering time : 5 seconds MAX. Solder temperature : 35010 ( ) : { } : 5 No Damage Reference Reference Standard Unit PRODUCT SHAPE, DIMENSIONS AND MATERIALS Refer to the drawing. 6 INSERTION/WITHDRAWAL FORCE N {kgf} Insertion (MAX.) 1st 6th 30th 11.9 11.9 11.9 {1.21} {1.21} {1.21} Withdrawal (MIN.) 1st 6th 30th 1.92 1.92 1.92 {0.19} {0.19} {0.19} 44 N {kgf} 51.8 {5.28} 51.8 {5.28} 51.8 {5.28} 8.62 {0.98} 8.62 {0.98} 8.62 {0.98} 54 N {kgf} 63.5 {6.48} 63.5 {6.48} 63.5 {6.48} 10.58 {1.08} 10.58 {1.08} 10.58 {1.08} 64 N {kgf} 75.3 {7.68} 75.3 {7.68} 75.3 {7.68} 12.48 {1.27} 12.48 {1.27} 12.48 {1.27} No. of CKT UNIT 10 { REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION } : Reference Unit TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 6 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 7 JAPANESE ENGLISH INFRARED REFLOW CONDITION +5 250 -0 () +5 250 -0 (PEAK TEMP.) 2040 (230 ) 2040 sec. (230 MIN.) 90120 90120 sec. (150200) (Pre-heat 150200) () TEMPERATURE CONDITION GRAPH (TEMPERATURE ON THE SURFACE OF P.C.BOARD PATTERN) NOTE (N2) Please check the reflow soldering condition by your own devices beforehand, because the condition changes by the soldering devices, PWB, and so on. Also please check mount condition in case of Nitrogen atmosphere. Recommended Pattern dimension Sales Drawing Refer to the Sales Drawing. Reference Thickness of metal mask t = 0.12 mm Reference Open aperture ratio of metal mask 100 ( in Air atmosphere ) REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 7 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 8 JAPANESE ENGLISH INSTRUCTION UPON USAGE [] 10 Mate connectors parallel to the mating axis as much as possible. (Figure-1) In doing so, priory determine the position with temporary fitting each inner wall of the Receptacle and Plug housing, then mate those fully. If angled mating is inevitable, determine the position priory with temporary fitting each inner wall of the Receptacle and Plug housing softly within an angle less than 10 degree, and mate the connector parallel. (Figure-2) Avoid from mating connectors with fitting each outer wall of Receptacle and Plug housing as a supporting point because the each inner wall on the opposite side could interfere each other and cause housing or pin breakage. (Figure-3) [] Withdraw the connector parallel to mating axis as much as possible (Figure-1), Or do it with slightly swinging them right to left. (Figure-4) (Please take care NOT to do excess twist extraction. It could cause the housing or pin breakage.) (Figure-5) REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 8 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION JAPANESE ENGLISH TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 9 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9 OTHERS 1. LCP Although this product may have a small black dot, a weld line or a scratch on the housing, it doesn't impact the product's performance. Also, although weld line may stand out due to LCP used to mold material of this product, it doesn't impact the product's performance. 2. Although there may be slight differences in the housing color tone, it doesn't impact the product's performance. 3. Although the surface of the product could have scratch marks by frictions because of the Tin plating, it doesn't impact the product's performance. 4. N2 () Please make sure to do test run under the mounting condition (reflow soldering condition) on your own devices before use because reflow condition may change due to the local condition (Air / N2 reflow / temperature profile / solder paste, metal mask thickness / aperture rate / pattern layout of PWB / types of PWB / and other factors ). Depending on the mounting condition, product's performance might be influenced by occurrence of solder-wicking or flux wicking at contact area. 5. The product performance was tested using rigid PWB. In case the product needs to be mounted onto FPC, please conduct a reflow test on the FPC before use. 6. In case of mounting the connector onto FPC, add a stiffener on the FPC in order to prevent the deformation. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 10 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 7. In case of designing with changing our recommended board pattern size, please consult the contact person in advance because it may cause a fatal defect. 8. Max0.02mm The mounting specification for coplanarity does not include the influence of warpage of the PWB. Warpage of the PWB should be 0.02mm at maximum at center of the connector based on the both sides of connector. 9. N2 N2 This product is designed to be mounted by air reflow. So, if this product is mounted by N2 reflow, solder wicking may caused after reflow. Therefore if it is plan to adopt N2 reflow for this connector, an evaluation is needed separately. 10. Our evaluation is conducted based on Molex-recommended condition specified in this product specification. Only coplanarity before reflow is guaranteed. Coplanarity in and after reflow is not guaranteed. 11. 12. () The solderability of the terminal tip, which is cut surface without plating, is worse than the sides/back of the terminal with plating. However, it will not impact the product's function or the retention force if good soldering fillet is formed at the sides/back of the terminal. 13. If you leave any soldering area on this product open, it could occur terminal disengagement, short circuit between pins, terminal buckling or connector disengagement from the PWB. Therefore, please solder all of the soldering tails and fitting nails on the PWB. 14. Since this product is low profile product, flux wicking could be occurred on the areas except for the terminal contacts. However it does not impact on the product's performance. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 11 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 15. If accidental contact is added onto connectors in the reflow machine, connectors could be deformed or damaged. Therefore review the reflow machine before use of the connectors. 16. Although color tone of housing or surface of terminal plating could be varied depending on reflow conditions, it does not impact on the product's performance. 17. Although some discoloration could be seen on the soldering tail after reflow, it does not impact on the product's performance. 18. PIN When using this product, ensure that the specification for rated current per a circuit is followed. Do not allow the sum of the current used on several circuits to exceed the maximum allowable current. 19. Do not use the connector in a condition where the mating area (contact area) are constantly moved due to sympathetic vibration of wires and PWB or constant movement of devices. It may cause contact failure due to the worn out. Therefore fix wires and PWB on the chassis to reduces sympathetic vibration. 20. Keep enough clearance between connector and chassis of your application in order to avoid pressure on the connector. 21. When using this product in an environment where dew condensation and water wetting occur, apply an appropriate drip-proof treatment. Dew condensation and water wetting could cause insulation failure between the circuits. Avoid using a connector alone to mechanically support the PWB. Adopt separate fixture to support PWB besides the connector in the chassis. 22. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 12 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 23. Do not mate and un-mate connectors while those are energized since this connector is not designed to allow it. It may cause danger due to sparks and functional failure of the product. 24. When mounting several board to board connectors on a same PWB, ensure to mount the each mating connector on a separate PWB. 25. At packaging, transportation and storing, avoid applying loads to connectors by handling, interference of connectors or piling-up packages. It could cause functional defect such as connector deformation or breakage. Store the products under recommended storage condition. If the recommended storage conditions of the packaging is exceeded, check the appearance of the products and solder-wettability before use. 26. 27. Do not stack PWB directly after mounting the connector on it. 28. Do not wash connector because it may impact the product's function. 29. Do not touch the terminals and fitting nails of connectors before or after mounting onto the PWB. 30. 31. Avoid move or assembly of connector which could apply loads to the direction of the connector pitch, span or rotation. It may damage the connector and crack the soldering. Ensure to mate connectors fully. Also mount and assemble the connector in your application unit with disengagement proof to avoid connector disengagement due to vibration or shocks. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 13 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 32. When conducting manual repairs using a soldering iron, follow the soldering conditions shown in the product specification. If the conditions in the product specification are not followed, it may cause the terminal disengagement, contact gap change, housing deformation, housing melting, and connector damage. 33. When conducting manual repairs using a soldering iron, do not use excess solder and flux than needed. It may cause solder wicking and flux wicking issues, and also eventually cause a contact defect and functional issues. REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 14 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION REV. REV. RECORD A B DATE ECN NO. WRITTEN BY : CHECKED BY : '10/06/23 J2010-2563 Y.ONO S.MARUYAMA 2015/12/17 J2016-0650 M.TAKASHIMA T.ASAKAWA RELEASED REVISED JAPANESE ENGLISH REVISE ON PC ONLY B SEE SHEET 1 OF 15 REV. DESCRIPTION TITLE: 0.4 BOARD TO BOARD CONNECTOR (Hgt=1.5mm) -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-51338-005 PS-51338-005.docx 15 OF 15 EN-037(2015-11 rev.1)