HS9-82C85RH-8 - Intersil Corporation

FN3044.3

HS-82C85RH

Radiation Hardened CMOS Static Clock

Controller/Generator

The Intersil HS-82C85RH is a high performanc e, radiation

hardened CMOS Clock Controller/Generator designed to

support systems utilizing radiation hardened static CMOS

microprocessors such as the HS-80C86RH. The

HS-82C85RH contains a crystal controlled oscillator, reset

pulse conditioning, halt/restart logic, and divide-by-256

circuitry. These features provide the means to stop the

system clock, stop the clock oscillator, or run the system at a

low frequency (CLK/256), enhancing control of static system

power dissipation and allowing system shut-down during

periods of external stress.

Static CMOS circuit design insures low operating power and

permits operation with an external frequency source from

DC to 15MHz. Crystal controlled operation to 15MHz is

guaranteed with the use of a parallel, fundamental mode

crystal and two small load capacitors. Outputs are

guaranteed compatible with both CMOS and TTL

specifications. The Intersil hardened field CMOS process

results in performance equal to or greater than existing

radiation resistant products at a fraction of the power.

Specifications for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed here must be used when ordering.

Detailed Electrical Sp ecifications for these devices are

contained in SMD 5962-95820. A “hot-link” is provided

on our homepage for downloading .

http://www.intersil.com/military/

Features

• Electrically Screened to SMD # 5962-95820

• QML Qualified pe r MIL-PRF-38535 Requirements

• Radiation Hardened

- Total Dose. . . . . . . . . . . . . . . . . . . . . 100 krad(Si) (Max)

- Transient Upset . . . . . . . . . . . . . . . . . . . .>108 rad(Si)/s

- Latch Up Free EPI-CMOS

• Very Low Power Consumption

• Pin Compatible with NMOS 8285 and Intersil 82C85

• Generates System Clocks for Microprocessors and

Peripherals

• Complete Control Over System Clock Operation for Very

Low System Power

- S top-Oscillator

- Stop-Clock

- Low Frequency (Slo) Mode

- Full Speed Operation

• DC to 15MHz Operation (DC to 5MHz System Clock)

• Generates Both 50% and 33% Duty Cycle Clocks

(Synchronized)

• Uses Either Parallel Mode Crystal Circuit or External

Frequency Source

• Hardened Field, Self-Aligned, Jun ction Isolated CMOS

Process

• Single 5V Supply

• Military Temperature Range. . . . . . . . . . .-55°C to +125°C

Ordering Information

ORDERING NUMBER INTERNAL

MKT. NUMBER PART MARKING TEMP. RANGE

(°C) PACKAGE PKG. DWG. #

5962R9582001VJC HS1-82C85RH-Q Q 5962R95 82001VJC -55 to +125 24 Ld SBDIP D24.6

5962R9582001VXC HS9-82C85RH-Q Q 5962R95 82001VXC -55 to +125 24 Ld Flatpack K24.A

5962R9582001QJC HS1-82C85RH-8 Q 5962R95 82001VJC -55 to +125 24 Ld SBDIP D24.6

5962R9582001QXC HS9-82C85RH-8 Q 5962R95 82001VXC -55 to +125 24 Ld Flatpack K24.A

Data Sheet April 20, 2007

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

2FN3044.3

April 20, 2007

Pinouts

24 LEAD CERAMIC DUAL-IN-LINE

METAL SEAL PACKAGE (SBDIP)

MIL-STD-1835 CDIP2-T24

TOP VIEW

24 LEAD CERAMIC METAL SEAL

FLATPACK PACKAGE (FLATPACK)

MIL-STD-1835 CDFP4-F24

TOP VIEW

CSYNC

PCLK

AEN1

RDY1

READY

RDY2

AEN2

CLK

GND

CLK50

START

SLO/FST

VDD

ASYNC

EFI

F/C

RES

S2/STOP

OSC

RESET

SLO/FST

CSYNC

PCLK

AEN1

RDY1

READY

RDY2

AEN2

CLK

GND

CLK50

START

VDD

S2/STOP

RESET

RES

ASYNC

EFI

OSC

F/C

Pin Descriptions

PIN PIN

NUMBER TYPE DESCRIPTION

X2 23

22 I

OCRYST AL CONNECTIONS: X1 and X2 are the crystal oscillator connections. The crystal frequency must

be three times the maximum desired processor clock frequency. X1 is the oscillator circuit input and X2

is the output of the oscillator circuit.

EFI 20 I EXTERNAL FREQUENCY IN: When F/C is HIGH, CLK is generated from the EFI input signal. This input

signal should be a square wave with a frequency of three times the maximum desired CLK output

frequency.

F/C 19 I FREQUENCY/CRYSTAL SELECT: F/C selects either the crystal oscillator or the EFI input as the main

frequency source. When F/C is LOW, the HS-82C85RH clocks are derived from the crystal oscillator

circuit. When F/C is HIGH, CLK is generated from the EFI input. F/C cannot be dynamically switched

during normal operation.

START 11 I A low-to-high transition on START will restart the CLK, CLK50 and PCLK outputs after the appropriate

restart sequence is completed.

When in the crystal mode (F/C LOW) with the oscillator stopped, the oscillator will be restarted when a

Start command is received. The CLK, CLK50 and PCLK outputs will start after the oscillator input signal

(X1) reaches the Schmitt trigger input threshold and an 8K internal counter reaches terminal count. If F/C

is HIGH (EFI mode), CLK, CLK50 and PCLK will restart within 3 EFI cycles after START is recognized.

The HS-82C85RH will restart in the same mode (SLO/FST) in which it stopped. A high level on START

disables the STOP mode.

S2/STOP

S2/STOP, S1, S0 are used to stop the HS-82C85RH clock outputs (CLK, CLK50, PCLK) and are sampled

by the rising edge of CLK. CLK, CLK50 and PCLK are stopped by S2/STOP, S1, S0 being in the LHH

state on the low-to-high transition of CLK. This LHH state must follow a passive HHH state occurring on

the previous low-to-high CLK transition. CLK and CLK50 stop in the high state. PCLK stops in it’ s current

state (high or low).

When in the crystal mode (F/C) low and a STOP command is issued, the HS-82C85RH oscillator will stop

along with the CLK, CLK50 and PCLK outputs. When in the EFI mode, only the CLK, CLK50 and PCLK

outputs will be halted. The oscillator circuit if operational, will continue to run. The oscillator and/or clock

is restarted by the START input signal going true (HIGH) or the reset input (RES) going low.

HS-82C85RH

3FN3044.3

April 20, 2007

SLO/FST 12 I SLO/FST is a level-triggered input. When HIGH, the CLK and CLK50 outputs run at the maximum

frequency (crystal or EFI frequency divided by 3). When LOW, CLK and CLK50 frequencies are equal to

the crystal or EFI frequency divided by 768. SLO/FST mode changes are internally synchronized to

eliminate glitches on the CLK and CLK50. START and STOP control of the oscillator or EFI is available

in either the SLOW or FAST frequency modes.

The SLO/FST input must be held LOW for at least 195 OSC/EFI clock cycles before it will be recognized.

This eliminates unwanted frequency changes which could be caused by glitches or noise transients. The

SLO/FST input must be held HIGH for at least 6 OSC/EFI clock pulses to guarantee a transition to F AST

mode operation.

CLK 8 O PROCESSOR CLOCK: CLK is the clock output used by the HS-80C86RH processor and other

peripheral devices. When SLO/FST is high, CLK has an output frequency which is equal to the crystal or

EFI input frequency divided by three. When SLO/FST is low , CLK has an output frequency which is equal

to the crystal or EFI input frequency divide by 768. CLK has a 33% duty cycle.

CLK50 10 O 50% DUTY CYCLE CLOCK: CLK50 is an auxiliary clock with a 50% duty cycle and is synchronized to

the falling edge of CLK. When SLO/FST is high, CLK50 has an output frequency which is equal to the

crystal or EFI input frequency divided by 3. When SLO/FST is low , CLK50 has an output frequency equal

to the crystal or EFI input frequency divided by 768.

PCLK 2 O PERIPHERAL CLOCK: PCLK is a peripheral clock signal whose output frequency is equal to the crystal

or EFI input frequency divided by six and has a 50% duty cycle. PCLK frequency is unaffected by the

state of the SLO/FST input.

OSC 18 O OSCILLA TOR OUTPUT: OSC is the output of the internal oscillator circuitry . Its frequency is equal to that

of the crystal oscillator circuit. OSC is unaffected by the state of the SLO/FST input.

When the HS-82C85RH is in the crystal mode (F/C LOW) and a STOP command is issued, the OSC

output will stop in the HIGH state. When the HS-82C85RH is in the EFI mode (F/C HIGH), the oscillator

(if operational) will continue to run when a STOP command is issued and OSC remains active.

RES 17 I RESET IN: RES is an active LOW signal which is used to generate RESET. The HS-82C85RH provides

a Schmitt trigger input so that an RC connection can be used to establish the power-up reset of proper

duration. RES starts crystal oscillator operation.

RESET 16 O RESET: RESET is an active HIGH signal which is used to reset the HS-80C86RH processor. Its timing

characteristics are determined by RES. RESET is guaranteed to be HIGH for a minimum of 16 CLK

pulses after the rising edge of RES.

CSYNC 1 I CLOCK SYNCHRONIZA TION: CSYNC is an active HIGH signal which allows multiple HS-82C85RHs to

be synchronized to provide multiple in-phase clock signals. When CSYNC is HIGH, the internal counters

are reset and force CLK, CLK50 and PCLK into a HIGH state. When CSYNC is LOW, the internal

counters are allowed to count and the CLK, CLK50 and PCLK outputs are active. CSYNC must be

externally synchronized to EFI.

AEN1

AEN2 3

IADDRESS ENABLE: AEN is an active LOW signal. AEN serves to qualify its respective Bus Ready

Signal (RDY1 or RDY2). AEN1 validates RDY1 while AEN2 validates RDY2. Two AEN signal inputs are

useful in system configurations which permit the processor to access two Multi-Master System Buses.

RDY1

RDY2 4

IBUS READY: (Transfer Complete). RDY is an active HIGH signal which is an indication from a device

located on the system data bus that data has been received, or is available. RDY1 is qualified by AEN1

while RDY2 is qualified by AEN2.

ASYNC 21 I READY SYNCHRONIZATION SELECT: ASYNC is an input which defines the synchronization mode of

the READY logic. When ASYNC is LOW, two stages of READY synchronization are provided. When

ASYNC is left open or HIGH a single stage of READY synchronization is provided.

READY 5 O READY: READY is an active HIGH signal which is used to inform the HS-80C86RH that it may conclude

a pending data transfer.

GND 9 I Ground

VDD 24 I +5V power supply

Pin Descriptions (Continued)

PIN PIN

NUMBER TYPE DESCRIPTION

HS-82C85RH

4FN3044.3

April 20, 2007

AC Test Circuit

NOTES:

1. R = 370Ω at V = 2.25 for CLK and CLK50 outputs.

2. R = 494Ω at V = 2.87 for all other outputs.

3. CL = 50pF.

4. CL Includes probe and jig capacitance.

Functional Diagram

RESET PULSE

CONDITIONING

LOGIC

SYNC

LOGIC

SPEED SELECT

÷256 OR ÷1

CLOCK

LOGIC

(÷3)

PERIPHERAL

CLOCK

(÷6)

RESTART

LOGIC

EXTERNAL

FREQUENCY

SELECT

READY

SELECT

OSCILLATOR

STOP

LOGIC

READY

SYNC

RES (17)

START (11)

(16) RESET

CSYNC (1)

SLO/FST (12)

F/C (19)

X2 (22)

X1 (23)

S2/STOP (15)

S1 (14)

SO (13)

RDY1 (4)

AEN1 (3)

AEN2 (7)

RDY2 (6)

ASYNC (21)

(8) CLK

(10) CLK50

(2) PCLK

(18) OSC

(5) READY

RESTART

EFI (20)

SELECTED OSC

OSC

HALT

SYNC

MASTER

OSC

(24) VDD

(9) GND

FROM OUTPUT

UNDER TEST

VDD

CL (NOTE 4)

R (NOTES 1, 2)

HS-82C85RH

5FN3044.3

April 20, 2007

Waveforms

FIGURE 1. WAVEFORMS FOR CLOCKS

NOTE: All timing measurements are made at 1.5V, unless otherwise noted.

FIGURE 2. WAVEFORMS FOR READY SIGNALS (FOR ASYNCHRONOUS DEVICES)

tELEL

tELEH

tEHEL

tOHCH

tOHCL

tCLCH

tCHCL

tCLCL

tCLC50L

t5CHCL

t5CLCH

tOLCH

tCLPL

tPLPH

tPHPL

TCLPH

tYHYL

tEHYL

tYHEH

tCH1CH2

tCL2CL1

1.0V

3.5V

CLK AND CLK50

EFI I

OSC O

CLK O

CLK50 O

PCLK O

CSYNC I

CLK

RDY1, 2

AEN1, 2

ASYNC

READY

tR1VCH

tCLR1X

tA1VR1V

tR1VCL

tCLR1X

tRYLCL

tCLAYX

tRYHCH

tCLA1X

tAYVCL

HS-82C85RH

6FN3044.3

April 20, 2007

FIGURE 3. WAVEFORMS FOR READY SIGNALS (FOR SYNCHRONOUS DEVICES)

FIGURE 4. CLOCK STOP (F/C HIGH OR F/C LOW)

Waveforms (Continued)

CLK

RDY1, 2

AEN1, 2

ASYNC

READY

tCLR1X

tR1VCL

tA1VR1V

tR1VCL

tCLR1X

tRYLCL

tCLAYX

tRYHCH

tCLA1X

tAYVCL

tRSVCH

EFI

CLK

CLK50

PCLK

S2/STOP

RES

START

tSTOP

tCHSX

tSVCH

tCHSX

HS-82C85RH

7FN3044.3

April 20, 2007

FIGURE 5. CLOCK START (F/C HIGH)

FIGURE 6. CLOCK START (F/C LOW)

FIGURE 7. RESET TIMING (CLK RUNNING WITH F/C LOW - OSC MODE; CLK RUNNING - OR STOPPED WITH F/C HIGH EFI MODE)

Waveforms (Continued)

EFI

CLK

CLK50

PCLK

S2/STOP

RES

START

tSTART

START

OSC

CLK

CLK50

PCLK

tSHSL

tOST

CRYSTAL

OSCILLATOR

STARTUP TIME

8192

CYCLES

RES

CLK

RESET

tCLIL

tI1HCL

tCLIL

tI1HCL

tRST

tSHSL

HS-82C85RH

8FN3044.3

April 20, 2007

FIGURE 8. RESET TIMING OSCILLATOR STOPPED (F/C LOW)

NOTE: CLK, CLK50, PCLK remain in the high state until RES goes high and 8192 valid oscillator cycles have been registered by the HS-82C85RH

internal counter tOST time period). After RES goes high and CLK, CLK50, PCLK become active, the RESET output will remain high for a mini mum

of 16 CLK cycles (tRST).

FIGURE 9. SLO/FST TIMING OVERVIEW

FIGURE 10. FAST TO SLOW CLOCK MODE TRANSITION

NOTE: If tSFPC is not met on one edge of PCLK, SLO/FST will be recognized on the next edge of PCLK.

Waveforms (Continued)

RES

CLK

RESET tRST

tCLIL

8192

CYCLES

OSC

STARTUP

TIME

tOST

OSC

tSHSL

EFI OR OSC

PCLK

SLO/FST

CLK

CLK50

EFI OR OSC

PCLK

SLO/FST

CLK

CLK50

tSFPC tSFPC (NOTE)

195 EFI OR OSC CYCLES

(NOTE)

HS-82C85RH

9FN3044.3

April 20, 2007

FIGURE 11. SLOW TO FAST CLOCK MODE TRANSITION

NOTE: If tSFPC is not met on one edge of PCLK, SLO/FST will be recognized on the next edge of PCLK.

Waveforms (Continued)

EFI OR OSC

PCLK

SLO/FST

CLK

CLK50

tSFPC tSFPC (NOTE)

3 EFI PULSES

(NOTE)

FIGURE 12. CLOCK HIGH AND LOW TIME (USING X1, X2) FIGURE 13. CLOCK HIGH AND LOW TIME (USING EFI)

FIGURE 14. READY TO CLOCK (USING X1, X2) FIGURE 15. READY TO CLOCK (USING EFI)

† CL = 50pF

LOAD†

CLK

CLK50

F/C

CSYNC

15MHz

LOAD†

CLK

CLK50F/C

CSYNC

EFI

PULSE

GENERATOR

VDD

LOAD†

CLK

READY

AEN1

F/C

RDY2

AEN2

CSYNC

VDD

TRIGGER

PULSE

GENERATOR

OSC

15MHz

LOAD†

CLK

READY

EFI

F/C

AEN1

RDY2

AEN2

CSYNC

PULSE

GENERATOR VDD

TRIGGER

PULSE

GENERATOR

HS-82C85RH

10 FN3044.3

April 20, 2007

Burn-In Circuits

STATIC CONFIGURATION

NOTES:

5. R = 10kΩ ±10%.

6. VDD = 6.0V ±5%.

7. TA = 125°C Min.

8. Package Code: SZ (24 Lead DIP).

9. F0 is 50% duty cycle square wave pulse burst. F0 is left

low after pulse burst.

DYNAMIC CONFIGURATION

NOTES:

10. R = 10kΩ ±10%.

11. VDD = 6.0 V ±5% (Burn-In); VDD = 5.5V ±5% (Life Test).

12. TA = 125°C Min.

13. Package Code: SZ (24 Lead DIP).

14. F0 = 10kHz, 50% duty cycle.

15. F1 = F0/2; F2 = F1/2; F3 = F2/2, F4 = F3/2; F5 = F4/2.

VDD

LOAD

2.7kΩ

VDD

Irradiation Circuit

NOTES:

16. R = 47kΩ ±10%.

17. Pins tied to VSS (0V): Pin 9.

18. Pins with loads: 2, 5, 8, 10, 16, 18, 22.

19. Pins tied to VDD: 1, 3, 4, 6, 7, 11 - 15, 17, 19 - 21, 23, 24.

20. VDD = 5.5V ±0.5V.

LOAD

5.5V

LOAD

5.5V

2.7kΩ

HS-82C85RH

11 FN3044.3

April 20, 2007

Functional Description

The HS-82C85RH Static Clock Controller/Generator

provides simple and complete control of static CMOS

system operating modes. The HS-82C8 5RH can operate

with either an external crystal or an external frequency

source and can support full spee d, slow, stop-clock and

stop-oscillator operation. While it is directly compatible with

the Intersil HS -80C86RH CMOS 16-bit static

microprocessor, the HS-82C85RH ca n also be used for

general purpose system clock control.

Separate signals are provided on the HS-82C85RH for stop

and start control of the crystal oscillator and clock outputs. A

single control line determines fast (crystal/EFI frequency

divided by 3) or slow (crystal/EFI frequency divided by 768)

mode operation. A clock synchronization input is provided to

allow the use of multiple HS-82C85RHs in the same system.

The HS-82C85RH generates the proper HS-80C86RH reset

pulse, and it also handles all data transfer timing by

generating the HS-80C86RH ready signal.

Automatic maximum mode HS-80C86RH software HALT

instruction decode logic is present to ease the design of

software-based clock control systems and provides

complete software control of STOP mode operation.

Automatic minimum mode software HALT instruction

decoding can be easily implemented with a single 74HC74

device. Restart logic insures valid clock start-up and

complete synchronization of CLK, CLK50 and PCLK.

Static Operating Modes

The HS-82C85RH Static C lock Contro ller can be dynamically

set to operate in any one of four modes at any one time :

F AST , SLOW , STOP-CLOCK and STOP-OSCILLA TOR. Each

mode has distinct power and performance characteristics

which can be matched to the needs of a particular system at

a specific time (see Table 1).

Keep in mind that a single system may require all of these

operating modes at one time or another during normal

operation. A design need not be limited to a single operating

mode or a specific combination of modes. The appropriate

operating mode can be matched to the power-per formance

level needed at a specific time or in a particular

circumstance.

Reset Logic

The HS-82C85RH reset logic provides a Schmitt trigge r

input (RES) and a synchronizing flip-flop to generate there

set timing. The reset signal is synchronized to the falling

edge of CLK. A simple RC network can be used to provide

power-on reset by utilizing this function of the HS-82C85RH.

When in the crystal oscillator (F/C = LOW) or the EFI

(F/C = HIGH) mode, a LOW state on the RES input will set

the RESET output to the HIGH state. It will also restart the

oscillator circuit if it is in the idle state. The RESET output is

guaranteed to stay in the HIGH state for a minimum of 16

CLK cycles after a low-to-high transition of the RES input.

An oscillator restart count sequence w ill not be disturbed by

RESET if this count is already in progress. After the restart

counter expires, the RESET output will stay HIGH at least

for 16 periods of CLK before going LOW. RESET can be

kept high beyond this time by a continuing low input on the

RES input.

If F/C is low (crystal oscillator mode), a low state on RES

starts the crystal oscillator circuit. The stopped outputs

remain inactive, until the oscillator signal amplitude reaches

the X1 Schmitt trigger input threshold voltage and 8192

cycles of the crystal oscillator output are counted by an

internal counter. After this count is complete, the stopped

outputs (CLK, CLK50, PCLK) start cleanly with the proper

phase relationships.

This 8192 count requirement insures that the CLK, CLK50

and PCLK outputs will meet minimum clock requirements

and will not be affected by unstable oscillator characteristics

which may exist during the oscillator start-up sequence. This

sequence is also followed when a START command is

issued while the HS-82C85RH oscillator is stopped.

TABLE 1. STATIC SYSTEM OPERATING MODE CHARACTERISTICS

OPERATING

MODE DESCRIPTION POWER LEVEL PERFORMANCE

Stop-Oscillator All system clocks and main clock

oscillator are stopped Maximum savings Slowest response due to oscillator restart

time

S top-Clock System CPU and peripherals clocks stop

but main clock oscillator continues to run

at rated frequency

Reduced system power Fast restart - no oscillator restart time

Slow System CPU clocks are slowed while

peripheral clock and main clock oscillator

run at rated frequency

Power dissipation slightly higher than

Stop-Clock Continuous operat ion at low frequency

Fast All clocks and oscillators run at rated

frequency Highest power Fastest response

HS-82C85RH

12 FN3044.3

April 20, 2007

Oscillator/Clock Start Control

Once the oscillator is stopped (or committed to stop) or at

power-on, the restart sequence is initiated by a HIGH state

on STAR T or LOW state on RES. If F/C is HIGH, then restart

occurs immediate ly after the START or RES input is

synchronized internally. This insures that stopped outputs

(CLK, PCLK, OSC and CLK50) start cleanly with the proper

phase relationship.

If F/C is low (crystal oscillator mode), a HIGH state on the

START input or a low state on RES causes the crystal

oscillator to be restarted. The stopped outputs remain

stopped, until the oscillator sign al amplitude reaches the X1

Schmitt trigger input threshold voltage and 8192 cycles of

the crystal oscillator output are counted by an internal

counter. After this count is complete, the stopped outputs

(CLK, CLK50, PCLK) start cleanly with the proper phase

relationships.

Typically, any input signal which meets the START input

timing requirements can be used to start the HS-82C85RH.

In many cases, this would be the INT output from an

HS-82C59A CMOS Priority Interrupt Controller

(see Figure 16). This output, which is ac tive high, can be

connected to both the HS-82C85RH START pin and to the

INTR input on the microprocessor.

When the INT output becomes active (as a result of a

“restart” IRQ or a system reset), the oscillator/clock circuit on

the HS-82C85RH will restart. Upon completion of the

appropriate restart sequence, the CLK signal to the CPU will

become active . The CPU can then respond to the still-

pending interrupt request.

Oscillator/Clock Stop Control

The S0, S1, and S2/STOP control lines determine when the

HS-82C85RH clock outputs or oscillator will stop. These

three lines are designed to connect directly to the MAXimum

mode HS-80C86RH status lines as shown in Figure 17.

When used in this configuration, the HS-82C85RH will

automatically recognize a software HALT command from the

HS-80C86RH and stop the system clocks or oscillator. This

allows complete software control of the STOP function.

If the HS-80C86RH is used in the MINimum mode, the

HS-82C85RH can be controlled using the S2/STOP input

(with S0 and S1 held high). This can be done using the

circuit shown in Figure 18. Since the HS-80C86RH, when

executing a halt instruction in minimum mode, issues a

single ALE pulse with no corresponding bus signals (DEN

remains high), the ALE pulse will be clocked through the

74HC74 and put the HS-82C85RH into stop mode.

HS-82C59A

INT

HS-82C85RH

CLK

HS-80C86RH

START CLK

INTR

FIGURE 16. ST ART CONTROL USING HS-82C59ARH

INTERRUPT CONTROLLER

MIN/MAX

S2/STOP

HS-80C86RH HS-82C85RH

FIGURE 17. STOP CONTROL USING HS-80C86RH MAXIMUM

MODE STATUS LINES

HS-80C86RH

MICROPROCESSOR

ALE

DEN

RESET

MIN/MAX

HS-82C85RH

CLOCK CONTROLLER/

CLK

RESET

GENERATOR

S2/STOP

1D 1Q 2D 2Q 3D 3Q 4D

VDD

CLK

74HC74 QUAD D FLIP-FLOP WITH CLEAR

CLR

TO HS-80C86RH

AND PERIPHERALS

VDD

FIGURE 18. STOP CONTROL USING HS-80C86RH IN MINIMUM MODE

HS-82C85RH

13 FN3044.3

April 20, 2007

The HS-82C85RH st atus in put s S2/STOP, S1, S0 are

sampled on the rising edge of CLK. The oscillato r (F/C LOW

only) and clock outputs are stopp ed by S2/STOP, S1, S0

being in the LHH state on a low-to-high transition of CLK. This

LHH state must follo w a p assive HHH state occurring on the

previous low-to-high CLK transition. C LK and CLK50 will stop

in the logic HIGH st ate af ter two additiona l comp lete cycles of

CLK. PCLK stops in it s curren t st ate (HIGH or LOW). This is

true for both SLOW and FAST mode operati on.

S top-Oscillator Mode

When the HS-82C85RH is stopped while in the crystal mode

(F/C LOW), the oscillator, in addition to all system clock signals

(CLK, CLK50 and PCLK), are stopped. CLK and CLK50 stop in

the high state. PCLK stops in its current state (high or low).

With the oscillator stopped, HS-82C85RH power drops to it s

lowest level. All clocks and oscillators are stopped. All

devices in the system which are driven by the HS-82C85RH

go into the lowest power standby mode. The HS-82C85RH

also goes into standby and requires a power supply current

of less than 100mA.

Stop-Clock Mode

When the HS-82C85RH is in the EFI mode (F/C HIGH) and

a STOP command is issued, all system clock signals (CLK,

CLK50 and PCLK) are stopped. CLK and CLK50 stop in the

high state. PCLK stops in its current state (high or low).

The HS-82C85RH can also provide its own EFI source

simply by connecting the OSC output to the EFI input and

pulling the F/C input HIGH. This puts the HS-82C85RH into

the External Frequency Mode usi ng its own oscillato r as an

external source signal (see Figure 19). In this configuration,

when the HS-82C85RH is stopped in the EFI mode, the

oscillator continues to run. Only the clocks to the CPU and

peripherals (CLK, CLK50 and PCLK) are stoppe d.

Clock Slow/Fast Operation

The SLO/FST input determines whether the CLK and CLK50

outputs run at full speed (crystal or EFI frequency divided by 3)

or at slow speed (crystal or EFI frequency divided by 768) (see

Figure 20). When in the SLOW mode, HS-82C85RH stop-clock

and stop-oscillator functions operate in the same manner as in

the FAST mode, and the frequency of PCLK is unaffected.

The SLOW mode allows the CPU and the system to operate

at a reduced rate which, in turn, reduces system power. For

example, the operating power for the HS-80C86RH CPU is

10mA/MHz of clock frequency. When the SLOW mode is

used in a typical 5MHz system, CLK and CLK50 run at

approximately 20kHz. At this reduced frequen cy, the

average operating current of the CPU drops to 200mA.

Adding the HS-80C86RH 500mA standby current brings the

total current to 700mA.

While the CPU and peripherals run slower and the

HS-82C85RH CLK and CLK50 outputs switch at a reduced

frequency , the main HS-82C85RH oscillator is still running at

the maximum frequency (determined by the crystal or EFI

input frequency.) Since CMOS power is directly related to

operating frequency, HS-82C85RH power supply current will

typically be reduced by 25% - 35%.

EFI

F/C

S2/STOP

OSC

START

VDD

START

CONTROL

STOP

CONTROL

FIGURE 19. STOP-CLOCK MODE IN EFI MODE WIT H

OSCILLATOR AS FREQUENCY SOURCE

EFI OR OSC

PCLK

SLO/FST

CLK

CLK50

FIGURE 20. SLOW/FAST TIMING OVERVIEW

HS-82C85RH

14 FN3044.3

April 20, 2007

Internal logic requires that the SLO/FST pin be held low for

at least 195 oscillator or EFI clock pulses before the SLOW

mode command is recognized. This requirement elimin ates

unwanted FAST-to-SLOW mode frequency changes which

could be caused by glitches or noise spikes.

To guarantee FAST mode recognition, the SLO/FST pin

must be held high for at least 3 OSC or EFI pulses. The

HS-82C85RH will begin FAST mode operation on the next

PCLK edge after FAST command recognition. Proper CLK

and CLK50 phase relationships are maintained and

minimum pulse width specifications are met.

FAST-to-SLOW or SLOW-to-FAST mode changes will occur

on the next rising or falling edge of PCLK. It is important to

remember that the transition time for operating frequency

changes, which are dependent upon PCLK, will vary with the

HS-82C85RH oscillator or EFI frequency.

Slow/Fast Mode Control

The HS-82C55ARH programmable peripheral interface can

be used to provide slow/fast mode control by connecting one

of the port pins directly to the SLO/FST pin (see Figure 21).

With the port pin configured as an output, software control of

the SLO/FST pin is provided by simply writing a logical one

(FAST mode) or logical zero (SLOW Mode) to the

corresponding port. PORT C is well-suited for this function

due to its bit set and reset capabilities.

Alternate Operating Mod es

Using alternate modes of operation (slow, stop-clock, stop-

oscillator) will reduce the average system operating power

dissipation in a static CMOS system (see Table 2). This does

not mean that system speed or throughput must be reduced.

When used appropriately, the slow, stop-clock, stop-

oscillator modes can make your design more power-efficient

while maintaining maximum system performance.

Oscillator

The oscillator circuit of the HS-82C85RH is designed

primarily for use with an external parallel resonant,

fundamental mode crystal from which the basic operating

frequency is derived. The crystal frequency must be three

times the required CPU clock. X1 and X2 are the two crystal

input connections. The output of the oscillator is buffered

and available at the OSC output (pin 18) for generation of

other system timing signals.

For the most stable operation of the oscillator (OSC) output

circuit, two capacitors (C1 = C2) are recommended.

Capacitors C1 and C2 are chosen such that their combined

capacitance matches the load capacitance as specified by

the crystal manufacturer. This insures operation within the

frequency tolerance specified by the crystal manufacturer.

The crystal/capacitor configuration and the formula used to

determine the capacitor values are shown in Figure 22.

Crystal Specifications are shown in Table 3. For additional

information on crystal operation, see Intersil publication Tech

Brief 47.

HS-82C85RH

CLOCK

CONTROLLER

GENERATOR

CLK

SLO/FST

CLK

D0 - 8

HS-80C86RH

μPROCESSOR

HS-82C55RH

PERIPHERAL

INTERFACE

PC0

FIGURE 21. SLOW/F AST MODE CONTROL USING

HS-82C55RH PERIPHERAL INTERFACE

TABLE 2. TYPICAL SYSTEM POWER SUPPLY CURRENT

FOR STATIC CMOS OPERATING MODES

FAST SLOW STOP-

CLOCK STOP-

OSC

CPU Frequency 5MHz 20kHz DC DC

XTAL Frequency 15MHz 15MHz 15MHz DC

IDD

HS-80C86RH 50mA 2.5mA 250μA 250μA

HS-82C85RH 24.7mA 16.9mA 14.1mA 24.4μA

HS-82C08RH 1.0mA 10.0μA1.0μA1.0μA

82C82 1.7mA 6.5mA 1.0μA1.0μA

HS-82C54RH 943.0μA 915.0μA1.0μA1.0μA

HS-82C55ARH 3.2μA1.2μA1.0μA1.0μA

74HCXX + Other 2.9mA 110.0μA 90.0μA 90.0μA

HS-65262RH 4.0mA 50.0μA 10.0μA 10.0μA

HS-6617RH 6.3mA 52.5μA 12.0μA 12.0μA

NOTE: All measurements taken at room temperature, VDD = +5.0V.

Power supply current levels will be dependent upon system

configuration and frequency of operation.

CRYSTAL

2.4MHz - 15MHz

CT C1 C2•

C1 C2+

---------------------- (Including stray capacitance)=

FIGURE 22. CRYSTAL CONNECTION

HS-82C85RH

15 FN3044.3

April 20, 2007

Frequency Source Selection

The F/C input is a strapping pin that selects either the crystal

oscillator or the EFI input as the source frequency for clock

generation. If the EFI input is selected as the source, the

oscillator section (OSC output) can be used independently

for another clock source. If a crystal is not used, then crystal

input X1 (pin 23) must be tied to VDD or GND and X2 (pin

22) should be left open. If the EFI mode is not used, then EFI

(pin 20) should be tied to VDD or GND.

Clock Generator

The clock generato r consists of two synchronous divide-by-

three counters with special clear inputs that inhibit the

counting. One counter generates a 33% duty cycle

waveform (CLK) and the other generates a 50% duty cycle

waveform (CLK50). These two counters are negative -edge

synchronized, with the low-going transitions of both

waveforms occurring on the same oscillator transition. The

CLK and CLK50 output frequencies are one-third of the base

input frequency when SLO/FST is high and are equal to the

base input frequency divided by 768 when SLO/FST is low.

The CLK output is a 33% duty cycle clock signal designed to

drive the HS-80C86RH microprocessor directly. CLK50 has

a 50% duty cycle output synchronous with CLK, designed to

drive coprocessors and peripherals requiring a 50% du ty

cycle clock.

PCLK is a peripheral clock signal with an output frequency

equal to the oscillator or EFI frequency divided by 6. PCLK

has a 50% duty cycle. PCLK is unaf fected by SLO/FST. When

the HS-82C85RH is placed in the ST OP mode, PCLK will

remain in its current st ate (logi c high or logic low ) until a RES

or START command restart s the HS-82C85RH clock circui try.

PCLK is negative-edge synchronized with C LK and CLK50.

Since PCLK continues to run at the same frequency regardless

of the state of the SLO/FST pin, it can be used by other devices

in the system which need a fi xed high frequency clock. For

example, PCLK could be used to clock an HS-82C54RH

programmable interval timer to produce a real-time clock for the

system or as a baud rate generator to maintain serial data

communications during SLOW mode operation.

Clock Synchronization

The clock synchronization (CSYNC) input allows the output

clocks to be synchronized with an external event (such as

another HS-82C85RH clock signal). CSYNC going active

causes all clocks (CLK, CLK50 and PCLK) to stop in the

HIGH state.

It is necessary to synchronize the CSYNC input to the EFI

clock using two flip-flops as shown in Figure 23. Multiple

external flip-flops are necessary to minimize the occurrence

of metastable (or indeterminate) states.

Ready Synchronization

Two RDY input s (R DY1 , RDY2) are provi d e d to

accommodate two system buses. Each RDY input is

qualified by its corresponding AEN input (AEN1, AEN2).

Reception of a valid RDY signal causes the HS-82C85RH to

output READY high, info rming the HS-80C86RH that the

pending data transfer may be concluded (see HS-80C86RH

data sheet system timing).

Synchronization is required for all asynchronous active-

going edges of either RDY input to guarantee that the RDY

set up and hold times are met. Inactive-going edges of RDY

in normally ready systems do not require synchronization but

must satisfy RDY setup and hold as a matter of proper

system design.

The ASYNC input defines two modes of RDY

synchronization operation. When ASYNC is LOW, two

stages of synchronization are provided for active RDY input

signals. Positive-going asynchronous RDY inputs will first be

synchronized to flip-flop one at the rising edge of CLK

(requiring a setup time TR1VCH) and then synchronized to

flip-flop two at the next falling edge of CLK, after which time

the READY output will go HIGH.

Negative-going asynchronou s RDY inputs will be

synchronized directly to flip-flop two at the falling edge of

CLK, after which time the RDY output will go inactive. This

mode of operation is intended for use by asynchronous

(normally not ready) devices in the system which cannot be

guaranteed by design to meet the required RDY setup timing

(TR1VCL) on each bus cycle.

When ASYNC is high or left open, the first RDY flip-flop is

bypassed in the RDY synchronization logic. RDY inputs are

synchronized by flip-flop two on the falling edge of CLK

before they are presented to the processor. This mode is

available for synchronous devices that can be guaranteed to

meet the required RDY setup time. ASYNC can be changed

on every bus cycle to select the appropriate mode of

synchronization for each device in the system.

TABLE 3. CRYSTAL SPECIFICATIONS

PARAMETER TYPICAL CRYSTAL SPECIFICATION

Frequency 2.4MHz to 15MHz

Type of Operation Parallel Resonant, Fund. Mode

Load Capacitance 20pF or 32pF

R Series (Max) 56Ω (f = 15MHz, CL = 32pF),

105Ω (f = 15MHz, CL = 20pF)

EFI

CSYNC

(TO OTHER

HS-82C85RH

EFI

CLK

SYNCH

CSYNC WITH HS-82C85RH(s)

FIGURE 23. CSYNC SYNCHRONIZATION METHODS

HS-82C85RHs)

HS-82C85RH

16 FN3044.3

April 20, 2007

Die Characteristics

DIE DIMENSIONS:

2770μm x 3130μm x 483μm ±25μm

INTERFACE MATERIALS:

Glassivation:

Type: SiO2

Thickness: 8kÅ ±1kÅ

Top Metallization:

Type: Al/Si

Thickness: 11kÅ ±2kÅ

Substrate:

Radiation Hardened Silicon Gate,

Dielectric Isolation

Backside Finish:

Silicon

ASSEMBLY RELATED INFORMATION:

Substrate Potential:

Unbiased (DI)

ADDITIONAL INFORMATION:

Worst Case Current Density:

1.6 x 104 A/cm2

Metallization Mask Layout HS-82C85RH

(3) AEN1

(2) PCLK

(1) CSYNC

(24) VDD

(23) X1

(22) X2

(21) ASYNC

RDY1 (4)

READY (5)

RDY2 (6)

AEN2 (7)

CLK (8)

GND (VSS)(9)

CLK50 (10)

START (11)

SLO/FST (12)

S0 (13)

S1 (14)

S2/STOP (15)

(20) EFI

(19) F/C

(18) OSC

(17) RES

(16) RESET

HS-82C85RH

17 FN3044.3

April 20, 2007

HS-82C85RH

Ceramic Metal Seal Flatpack Packages (Flatpack)

NOTES:

1. Index area: A notch or a pin one identification mark shall be locat-

ed adjacent to pin one and shall be located within the shaded

area shown. The manufacturer’s identification shall not be used

as a pin one identification mark. Alternately, a tab (dimension k)

may be used to identify pin one.

2. If a pin one identification mark is used in addition to a tab, the lim-

its of dimension k do not apply.

3. This dimension allows for off-center lid, meniscus, and glass

overrun.

4. Dimensions b1 and c1 apply to lead base metal only. Dimension

M applies to lead plating and finish thickness. The maximum lim-

its of lead dimensions b and c or M shall be measured at the cen-

troid of the finished lead surfaces, when solder dip or tin plate

lead finish is applied.

5. N is the maximum number of terminal positions.

6. Measure dimension S1 at all four corners.

7. For bottom-brazed lead packages, no organic or polymeric mate-

rials shall be molded to the bottom of the package to cover the

leads.

8. Dimension Q shall be measured at the point of exit (beyond the

meniscus) of the lead from the body. Dimension Q minimum

shall be reduced by 0.0015 inch (0.038mm) maximum when sol-

der dip lead finish is applied.

9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

10. Controlling dimension: INCH.

-D-

-C-

0.004 H A - B

S S

-A- -B-

0.036 H A - B

S S

SEATING AND

LE2

E3 E3

BASE PLANE

-H-

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

PIN NO. 1

ID AREA

K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B)

24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.045 0.115 1.14 2.92 -

b 0.015 0.022 0.38 0.56 -

b1 0.015 0.019 0.38 0.48 -

c 0.004 0.009 0.10 0.23 -

c1 0.004 0.006 0.10 0.15 -

D - 0.640 - 16.26 3

E 0.350 0.420 9.14 10.67 -

E1 - 0.450 - 11.43 3

E2 0.180 - 4.57 - -

E3 0.030 - 0.76 - 7

e 0.050 BSC 1.27 BSC -

k 0.008 0.015 0.20 0.38 2

L 0.250 0.370 6.35 9.40 -

Q 0.026 0.045 0.66 1.14 8

S1 0.005 - 0.13 - 6

M - 0.0015 - 0.04 -

N24 24-

Rev. 0 5/18/94

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of Intersi l or it s sub sidi aries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN3044.3

April 20, 2007

HS-82C85RH

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)

NOTES:

1. Index area: A notch or a pin one identification mark shall be locat-

ed adjacent to pin one and shall be located within the shaded

area shown. The manufacturer’s identification shall not be used

as a pin one identification mark.

2. The maximum limits of lead dimensions b and c or M shall be

measured at the centroid of the finished lead surfaces, when

solder dip or tin plate lead finish is applied.

3. Dimensions b1 and c1 apply to lead base metal only. Dimension

M applies to lead plating and finish thickness.

4. Corner leads (1, N, N/2, and N/2+1) may be configured with a

partial lead paddle. For this configuration dimension b3 replaces

dimension b2.

5. Dimension Q shall be measured from the seating plane to the

base plane.

6. Measure dimension S1 at all four corners.

7. Measure dimension S2 from the top of the ceramic body to the

nearest metallization or lead.

8. N is the maximum number of terminal positions.

9. Braze fillets shall be concave.

10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

11. Controlling dimension: INCH.

bbb C A - B

SEATING

BASE

PLANE

-D-

-A-

-C-

-B-

aaa CA - BM DS S

ccc CA - BMDS S

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

eA/2

D24.6 MIL-STD-1835 CDIP2-T24 (D-3, CONFIGURATION C)

24 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A - 0.225 - 5.72 -

b 0.014 0.026 0.36 0.66 2

b1 0.014 0.023 0.36 0.58 3

b2 0.045 0.065 1.14 1.65 -

b3 0.023 0.045 0.58 1.14 4

c 0.008 0.018 0.20 0.46 2

c1 0.008 0.015 0.20 0.38 3

D - 1.290 - 32.77 -

E 0.500 0.610 12.70 15.49 -

e 0.100 BSC 2.54 BSC -

eA 0.600 BSC 15.24 BSC -

eA/2 0.300 BSC 7.62 BSC -

L 0.120 0.200 3.05 5.08 -

Q 0.015 0.075 0.38 1.91 5

S1 0.005 - 0.13 - 6

S2 0.005 - 0.13 - 7

α90o105o90o105o-

aaa - 0.015 - 0.38 -

bbb - 0.030 - 0.76 -

ccc - 0.010 - 0.25 -

M - 0.0015 - 0.038 2

N24 248

Rev. 0 4/94