TDA1010 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

File under Integrated Circuits, IC01 November 1982

INTEGRATED CIRCUITS

TDA1010A

6 W audio power amplifier in car

applications

10 W audio power amplifier in

mains-fed applications

November 1982 2

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed TDA1010A

The TDA1010A is a monolithic integrated class-B audio amplifier circuit in a 9-lead single in-line (SIL) plastic package.

The device is primarily developed as a 6 W car radio amplifier for use with 4 Ωand 2Ωload impedances. The wide supply

voltage range and the flexibility of the IC make it an attractive proposition for record players and tape recorders with

output powers up to 10 W.

Special features are:

•single in-line (SIL) construction for easy mounting

•separated preamplifier and power amplifier

•high output power

•low-cost external components

•good ripple rejection

•thermal protection

QUICK REFERENCE DATA

PACKAGE OUTLINE

9-lead SIL; plastic (SOT110B); SOT110-1; 1996 Sepetember 06.

Supply voltage range VP6 to 24 V

Repetitive peak output current IORM max. 3 A

Output power at pin 2; dtot = 10%

VP= 14,4 V; RL= 2 ΩPotyp. 6,4 W

VP= 14,4 V; RL= 4 ΩPotyp. 6,2 W

VP= 14,4 V; RL= 8 ΩPotyp. 3,4 W

VP= 14,4 V; RL= 2 Ω; with additional bootstrap resistor of 220 Ωbetween

pins 3 and 4 Potyp. 9 W

Total harmonic distortion at Po= 1 W; RL= 4 Ωdtot typ. 0,2 %

Input impedance

preamplifier (pin 8)  Zityp. 30 kΩ

power amplifier (pin 6)  Zityp. 20 kΩ

Total quiescent current at VP= 14,4 V Itot typ. 31 mA

Sensitivity for Po= 5,8 W; RL= 4 ΩVityp. 10 mV

Operating ambient temperature Tamb −25 to + 150 °C

Storage temperature Tstg −55 to + 150 °C

November 1982 3

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.1 Circuit diagram.

November 1982 4

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

HEATSINK DESIGN

Assume VP= 14,4 V; RL= 2 Ω; Tamb = 60 °C maximum; thermal shut-down starts at Tj= 150 °C. The maximum sine-wave

dissipation in a 2 Ωload is about 5,2 W. The maximum dissipation for music drive will be about 75% of the worst-case

sine-wave dissipation, so this will be 3,9 W. Consequently, the total resistance from junction to ambient

Since Rth j-tab = 10 K/W and Rth tab-h = 1 K/W,

Rth h-a = 23 −(10 +1) = 12 K/W.

Supply voltage VPmax. 24 V

Peak output current IOM max. 5 A

Repetitive peak output current IORM max. 3 A

Total power dissipation see derating curve Fig.2

Storage temperature Tstg −55 to +150 °C

Operating ambient temperature Tamb −25 to +150 °C

A.C. short-circuit duration of load during sine-wave drive; without heatsink at

VP= 14,4 V tsc max. 100 hours

Fig.2 Power derating curve.

Rth j-a Rth j-tab

=Rth tab-h Rth h-a

++ 150 60–

39,

---------------------- 23 K/W==

November 1982 5

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

D.C. CHARACTERISTICS

A.C. CHARACTERISTICS

Tamb = 25 °C; VP= 14,4 V; RL= 4 Ω; f = 1 kHz unless otherwise speciﬁed; see also Fig.3.

Supply voltage range VP6 to 24 V

Repetitive peak output current IORM <3A

Total quiescent current at VP= 14,4 V Itot typ. 31 mA

A.F. output power (see Fig.4) at dtot = 10%;

measured at pin 2; with bootstrap

VP= 14,4 V; RL= 2 Ω(note 1) Potyp. 6,4 W

VP= 14,4 V; RL= 4 Ω(note 1 and 2) Po> 5,9 W

typ. 6,2 W

VP= 14,4 V; RL= 8 Ω(note 1) Potyp. 3,4 W

VP= 14,4 V; RL= 4 Ω; without bootstrap Potyp. 5,7 W

VP= 14,4 V; RL= 2Ω; with additional bootstrapresistor of 220Ωbetween pins 3 and 4 Potyp. 9 W

Voltage gain

preamplifier (note 3) Gv1 typ. 24 dB

21 to 27 dB

power amplifier Gv2 typ. 30 dB

27 to 33 dB

total amplifier Gv tot typ. 54 dB

51 to 57 dB

Total harmonic distortion at Po= 1 W dtot typ. 0,2 %

Efﬁciency at Po= 6 W ηtyp. 75 %

Frequency response (−3 dB) B 80 Hz to 15 kHz

Input impedance

preamplifier (note 4)  Zityp. 30 kΩ

20 to 40 kΩ

power amplifier (note 5)  Zityp. 20 kΩ

14 to 26 kΩ

Output impedance of preampliﬁer; pin 7 (note 5)  Zotyp. 20 kΩ

14 to 26 kΩ

Output voltage preampliﬁer (r.m.s. value)

dtot < 1% (pin 7) (note 3) Vo(rms) > 0,7 V

Noise output voltage (r.m.s. value; note 6)

RS= 0 ΩVn(rms) typ. 0,3 mV

RS= 8,2 kΩVn(rms) typ. 0,7 mV

< 1,4 mV

Ripple rejection at f = 1 kHz to 10 kHz (note 7) RR > 42 dB

at f = 100 Hz; C2 = 1 µF RR > 37 dB

Sensitivity for Po= 5,8 W Vityp. 10 mV

Bootstrap current at onset of clipping; pin 4 (r.m.s. value) I4(rms) typ. 30 mA

November 1982 6

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Notes

1. Measured with an ideal coupling capacitor to the speaker load.

2. Up to Po≤3 W : dtot ≤1%.

3. Measured with a load impedance of 20 kΩ.

4. Independent of load impedance of preamplifier.

5. Output impedance of preamplifier (ZΟ) is correlated (within 10%) with the input impedance (Zi) of the power

amplifier.

6. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave).

7. Ripple rejection measured with a source impedance between 0 and 2 kΩ(maximum ripple amplitude: 2 V).

8. The tab must be electrically floating or connected to the substrate (pin 9).

Fig.3 Test circuit.

November 1982 7

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig. 5 See next page.

Total harmonic distortion in the circuit of Fig.3 as a function of the output power with the load impedance as a parameter;

typical values. Solid lines indicate the power across the load, dashed lines that available at pin 2 of the TDA1010.

RL= 2 Ω(1) has been measured with an additional 220 Ωbootstrap resistor between pins 3 and 4. Measurements were

made at f = 1 kHz, VP= 14,4 V.

Fig.4 Output power of the circuit of Fig.3 as a function of the supply voltage with the load impedance as a

parameter; typical values. Solid lines indicate the power across the load, dashed lines that available at pin

2 of the TDA1010. RL= 2 Ω(1) has been measured with an additional 220 Ωbootstrap resistor between

pins 3 and 4. Measurements were made at f = 1 kHz, dtot = 10%, Tamb = 25 °C.

November 1982 8

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.5 For caption see preceding page.

Fig.6 Frequency characteristics of the circuit of Fig.3 for three values of load impedance; typical values.

Porelative to 0 dB = 1 W; VP= 14,4 V.

November 1982 9

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.7 Total power dissipation (solid lines) and the efficiency (dashed lines) of the circuit of Fig.3 as a function of

the output power with the load impedance as a parameter (for RL= 2 Ωan external bootstrap resistor of

220 Ωhas been used); typical values. VP= 14,4 V; f = 1 kHz.

November 1982 10

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.8 Thermal resistance from heatsink to ambient of a 1,5 mm thick bright aluminium heatsink as a function of

the single-sided area of the heatsink with the total power dissipation as a parameter.

November 1982 11

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

APPLICATION INFORMATION

Fig.9 Complete mono audio amplifier of a car radio.

November 1982 12

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.10 Track side of printed-circuit board used for the circuit of Fig.9; p.c. board dimensions 92 mm ×52 mm.

Fig.11 Component side of printed-circuit board showing component layout used for the circuit of Fig.9.

November 1982 13

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.12 Complete stereo car radio amplifier.

November 1982 14

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.13 Track side of printed-circuit board used for the circuit of Fig.12; p.c. board dimensions 83 mm ×65 mm.

November 1982 15

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.14 Component side of printed-circuit board showing component layout used for the circuit of Fig.12.

Balance control is not on the p.c. board.

November 1982 16

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.15 Channel separation of the circuit of Fig.12 as a function of the frequency.

Fig.16 Power supply of circuit of Fig.17.

November 1982 17

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.17 Complete mains-fed ceramic stereo pick-up amplifier; for power supply see Fig.16.

November 1982 18

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.18 Track side of printed-circuit board used for the circuit of Fig.17 (Fig.16 partly); p.c. board dimensions

169 mm ×118 mm.

November 1982 19

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.19 Component side of printed-circuit board showing component layout used for the circuit of Fig.17

(Fig.16 partly).

November 1982 20

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

Fig.20 Channel separation of the circuit of Fig.18 as a function of frequency.

November 1982 21

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications TDA1010A

PACKAGE OUTLINE

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1.0

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 92-11-17

95-02-25

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1

November 1982 22

Philips Semiconductors Product speciﬁcation

6 W audio power ampliﬁer in car

applications TDA1010A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.