1www.semtech.com
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Bidirectional TVS Array
for Protection of Four Lines
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Bidirectional protection
Small SO-8 package
Protects four I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Description Features
Schematic & PIN Configuration
Revision 08/15/06
Applications
Mechanical Characteristics
The SMDAxxC series of TVS arrays are designed to
provide bidirectional protection for sensitive electronics
from damage or latch-up due to ESD, lightning and
other voltage-induced transient events. Each device
will protect four data or I/O lines. They are available
with operating voltages of 5V, 12V, 15V and 24V.
TVS diodes are solid-state devices designed specifically
for transient suppression. They offer desirable charac-
teristics for board level protection including fast re-
sponse time, low operating and clamping voltage and
no device degradation. The low profile SO-8 package
allows the user to protect up to four independent lines
with one package. The SMDAxxC series is suitable
protection for sensitive semiconductors components
such as microprocessors, ASICs, transceivers, trans-
ducers, and CMOS memory.
The SMDAxxC series devices may be used to meet the
ESD immunity requirements of IEC 61000-4-2, level 4
for air and contact discharge.
SO-8 (Top View)
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Data and I/O Lines
Microprocessor based equipment
Notebooks, Desktops, and Servers
Instrumentation
LAN/WAN equipment
Peripherals
Serial and Parallel Ports
1
2
3
45
6
7
8
2 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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3 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
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Electrical Characteristics (Continued)
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PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve
Pulse Waveform
ESD Pulse Waveform (IEC 61000-4-2)
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or I
PP
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - PPP (kW)
IEC 61000-4-2 Discharge Parameters
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0
10
20
30
40
50
60
70
80
90
100
110
0 5 10 15 20 25 30
Time (µs)
Percent of I PP
e-t
td = IPP/2
Waveform
Parameters:
tr = 8µs
td = 20µs
5 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Circuit Diagram
I/O Line Protection
Device Connection for Protection of Four Data Lines
The SMDAxxC series of devices are designed to protect
up to four data lines. The devices are connected as
follows:
zThe SMDAxxC are bidirectional devices and are
designed for use on lines where the normal operat-
ing voltage is above and below ground. Pins 1, 2,
3, and 4 are connected to the protected lines.
Pins 5, 6, 7, and 8 are connected to ground. Since
the device is electrically symmetrical, these connec-
tions may be reversed. The ground connections
should be made directly to the ground plane for
best results. The path length is kept as short as
possible to reduce the effects of parasitic induc-
tance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
1
2
3
45
6
7
8
Ground
From Connector
To Protected
Device
Typical Connection
1
2
3
45
6
7
8
Applications Information
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PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Land Pattern - SO-8
Outline Drawing - SO-8
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PLANE
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
REFERENCE JEDEC STD MS-012, VARIATION AA.
4.
.050 BSC
.236 BSC
8
.010
.150
.189
.154
.193
.012 -
8
0.25
1.27 BSC
6.00 BSC
3.90
4.90
-
.157
.197
3.80
4.80
.020 0.31
4.00
5.00
0.51
(.041)
.004
.008
-
.028
-
-
-
-
0°
.016
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.004
.053
8° 0°
0.20
0.10
-8°
0.40
0.17
1.25
0.10
.041
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.065
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1.35
(1.04)
0.72
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1.04
0.25
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0.25
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A
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DIM MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
E
(.205) (5.20)
Z
G
Y
P
(C) 3.00
.118
1.27
.050
0.60.024
2.20.087
7.40.291
X
INCHES
DIMENSIONS
Z
P
Y
X
DIM
C
G
MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.
2.
7 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
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Ordering Information
