Multilayer Organic (MLO(R)) High Pass Filters The MLO(R) High Pass Filters are low profile passive devices with best in class performance based on AVX's patented multilayer organic high density interconnect technology. The MLO(R) High pass filters utilize high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors, in a multilayer stack. This results in a high performance High Pass Filter design. MLO(R) High Pass Filters can support both a variety of frequency bands and multiple wireless standards, and are less than 1.0mm in thickness. All filters are expansion matched to most organic PCB materials, thereby resulting in improved reliability over standard silicon and ceramic devices. FEATURES APPLICATIONS * * * * * * * * * * * * * Wide Frequency Range Excellent Isolation Low Loss Expansion matched to PCB 50 Impedance Surface Mountable RoHS Compliant Mobile Communication GPS Vehicle location systems Wireless LANs Satellite Receivers Instrumentation LAND GRID ARRAY ADVANTAGES * * * * Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER HF 0B A 1550 A 7 00 Series High Pass Filters Case Size* 0A = 2616 0B = 3116 0C = 3416 0D = 4016 0F = 5021 Type Frequency in MHz Reliability Level A = Standard Termination 7 = Gold Packaging Code 00 = Waffle Pack or Tray LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. *Note: Other case sizes and frequencies available upon request. QUALITY INSPECTION TERMINATION Finished Parts are 100% electrically tested All finishes are compatible with automatic soldering technologies: Pb-free reflow, wave soldering, vapor phase, and manual soldering. OPERATING TEMPERATURE -55C to +85C ELECTRICAL SPECIFICATIONS AVX PN (Click on PN for full part specifications) Passband (GHz) HF0DA0740A700 HF0BA0850A700 HF0BA0930A700 HF0BA0950A700 HF0BA1440A700 HF0BA1500A700 HF0BA1540A700 HF0BA1550A700 HF0BA1840A700 0.74 - 1.55 0.85 - 1.99 0.93 - 1.66 0.95 - 2.05 1.44 - 2.94 1.50 - 2.89 1.54 - 3.19 1.55 - 3.13 1.84 - 2.83 Insertion Loss (dB) Typ. 0.82 0.75 0.84 0.85 0.63 0.73 0.81 0.82 0.85 MECHANICAL DIMENSIONS Case Size A 2616 B 3116 C 3416 D 4016 F 5021 011917 Length 0.2590.010 (6.5790.254) 0.3060.010 (7.7850.254) 0.3420.010 (8.6740.254) 0.4010.010 (10.1980.254) 0.5120.010 (12.9920.254) Max 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 Typical -3dB Cutoff Frequency (GHz) 0.65 0.77 0.83 0.85 1.30 1.38 1.39 1.41 1.66 Stopband Rejection Frequency (GHz) (DC - f) -20dB -30dB -40dB 0.57 0.55 0.54 0.69 0.66 0.64 0.73 0.71 0.70 0.75 0.73 0.66 1.14 1.12 1.09 1.23 1.20 1.18 1.25 1.22 1.20 1.27 1.24 1.22 1.50 1.46 1.44 Typ. VSWR Rated RF Power (W) 1.22:1 1.22:1 1.11:1 1.38:1 1.06:1 1.10:1 1.05:1 1.04:1 1.16:1 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 inches (mm) Width 0.1570.010 (3.9750.254) 0.1560.010 (3.9750.254) 0.1570.010 (3.9750.254) 0.1560.010 (3.9750.254) 0.2070.010 (5.2450.254) Varies Varies Varies Varies Varies - Height see part specification see part specification see part specification see part specification see part specification Click here to see detailed mechanical dimensions and pad layout. 1 Multilayer Organic (MLO(R)) HF0DA0740A700 ELECTRICAL SPECIFICATIONS Passband 0.74 - 1.55 GHz 0.74 - 1.55 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.82 dB 0.65 GHz 1.22:1 Max Typ Typ Typ DC - 0.57 GHz DC - 0.55 GHz DC - 0.54 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE D Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 2 8 10 Frequency (GHz) 0.56 0.57 0.59 0.65 0.66 0.68 0.72 0.84 1.31 1.60 1.80 Insertion Loss (dB) -40.71 -30.83 -20.06 -2.94 -1.99 -1.47 -1.00 -0.49 -0.50 -1.01 -1.54 VSWR (:1) 15.44 13.46 10.11 1.86 1.41 1.23 1.23 1.17 1.72 2.43 3.11 Return to Electrical Specifications Return Loss (dB) -1.13 -1.29 -1.72 -10.45 -15.43 -19.71 -19.77 -21.97 -11.53 -7.60 -5.80 011917 Multilayer Organic (MLO(R)) HF0BA0850A700 ELECTRICAL SPECIFICATIONS Passband 0.85 - 1.99 GHz 0.85 - 1.99 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.75 dB 0.77 GHz 1.22:1 Max Typ Typ Typ DC - 0.69 GHz DC - 0.66 GHz DC - 0.64 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 011917 8 10 Frequency (GHz) 0.66 0.68 0.70 0.77 0.78 0.80 0.82 0.91 1.59 2.05 2.45 Insertion Loss (dB) -44.02 -32.23 -21.32 -2.77 -2.00 -1.41 -0.98 -0.48 -0.51 -1.02 -1.50 VSWR (:1) 18.26 15.55 11.84 1.83 1.47 1.25 1.18 1.15 2.00 2.70 3.35 Return to Electrical Specifications Return Loss (dB) -0.95 -1.12 -1.47 -10.67 -14.42 -19.13 -21.64 -23.37 -9.56 -6.75 -5.35 3 Multilayer Organic (MLO(R)) HF0BA0930A700 ELECTRICAL SPECIFICATIONS Passband 0.93 - 1.66 GHz 0.93 - 1.66 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.84 dB 0.83 GHz 1.11:1 Max Typ Typ Typ DC - 0.73 GHz DC - 0.71 GHz DC - 0.70 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 4 8 10 Frequency (GHz) 0.72 0.74 0.76 0.83 0.84 0.86 0.91 1.05 1.54 2.11 2.63 Insertion Loss (dB) -41.71 -30.87 -20.73 -2.85 -1.93 -1.49 -1.00 -0.50 -0.51 -1.00 -1.52 VSWR (:1) 16.59 13.77 10.70 1.76 1.34 1.17 1.09 1.04 1.60 2.41 3.12 Return to Electrical Specifications Return Loss (dB) -1.05 -1.26 -1.63 -11.18 -16.75 -22.20 -27.56 -33.61 -12.07 -7.67 -5.76 011917 Multilayer Organic (MLO(R)) HF0BA0950A700 ELECTRICAL SPECIFICATIONS Passband 0.95 - 2.05 GHz 0.95 - 2.05 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.85 dB 0.85 GHz 1.38:1 Max Typ Typ Typ DC - 0.75 GHz DC - 0.73 GHz DC - 0.66 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 011917 8 10 Frequency (GHz) 0.74 0.75 0.78 0.85 0.86 0.87 0.89 0.93 1.06 2.11 5.98 Insertion Loss (dB) -40.95 -30.30 -20.40 -2.88 -2.50 -1.95 -1.47 -1.00 -0.50 -1.00 -1.57 VSWR (:1) 14.80 13.06 10.06 2.06 1.88 1.64 1.44 1.32 1.17 2.48 1.89 Return to Electrical Specifications Return Loss (dB) -1.18 -1.33 -1.73 -9.21 -10.28 -12.33 -14.87 -17.32 -21.95 -7.42 -10.23 5 Multilayer Organic (MLO(R)) HF0BA1440A700 ELECTRICAL SPECIFICATIONS Passband 1.44 - 2.94 GHz 1.44 - 2.94 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.63 dB 1.30 GHz 1.06:1 Max Typ Typ Typ DC - 1.14 GHz DC - 1.12 GHz DC - 1.09 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 6 8 10 Frequency (GHz) 1.15 1.17 1.20 1.30 1.31 1.32 1.34 1.40 1.49 2.66 3.03 Insertion Loss (dB) -42.44 -30.50 -20.36 -2.90 -2.24 -1.80 -1.39 -0.99 -0.49 -0.50 -0.81 VSWR (:1) 19.73 15.68 11.34 1.78 1.48 1.29 1.12 1.06 1.13 1.97 2.45 Return to Electrical Specifications Return Loss (dB) -0.88 -1.11 -1.54 -11.01 -14.20 -17.99 -24.83 -30.83 -24.50 -9.72 -7.54 011917 Multilayer Organic (MLO(R)) HF0BA1500A700 ELECTRICAL SPECIFICATIONS Passband 1.50 - 2.89 GHz 1.50 - 2.89 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.73 dB 1.38 GHz 1.10:1 Max Typ Typ Typ DC - 1.23 GHz DC - 1.20 GHz DC - 1.18 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 011917 8 10 Frequency (GHz) 1.22 1.24 1.27 1.38 1.39 1.40 1.42 1.46 1.59 2.58 2.98 Insertion Loss (dB) -40.43 -31.14 -21.08 -2.78 -2.47 -2.00 -1.54 -0.96 -0.50 -0.51 -1.00 VSWR (:1) 18.30 15.19 11.42 1.76 1.61 1.39 1.18 1.01 1.13 1.88 2.57 Return to Electrical Specifications Return Loss (dB) -0.95 -1.15 -1.53 -11.20 -12.57 -15.68 -21.55 -48.69 -24.03 -10.31 -7.14 7 Multilayer Organic (MLO(R)) HF0BA1540A700 ELECTRICAL SPECIFICATIONS Passband 1.54 - 3.19 GHz 1.54 - 3.19 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.81 dB 1.39 GHz 1.05:1 Max Typ Typ Typ DC - 1.25 GHz DC - 1.22 GHz DC - 1.20 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 8 8 10 Frequency (GHz) 1.24 1.26 1.29 1.39 1.40 1.42 1.44 1.50 1.74 2.58 3.29 Insertion Loss (dB) -40.05 -30.13 -21.26 -2.76 -2.48 -1.90 -1.47 -0.98 -0.50 -0.49 -1.00 VSWR (:1) 17.32 14.67 11.80 1.72 1.58 1.30 1.13 1.08 1.21 1.64 2.45 Return to Electrical Specifications Return Loss (dB) -1.00 -0.83 -1.48 -11.51 -12.93 -17.73 -24.33 -28.20 -20.41 -12.28 -7.53 011917 Multilayer Organic (MLO(R)) HF0BA1550A700 ELECTRICAL SPECIFICATIONS Passband 1.55 - 3.13 GHz 1.55 - 3.13 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.82 dB 1.41 GHz 1.04:1 Max Typ Typ Typ DC - 1.27 GHz DC - 1.24 GHz DC - 1.22 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 011917 8 10 Frequency (GHz) 1.25 1.27 1.31 1.41 1.42 1.43 1.45 1.51 1.72 2.71 3.36 Insertion Loss (dB) -41.30 -31.03 -20.16 -2.91 -2.40 -1.92 -1.45 -0.99 -0.49 -0.49 -1.00 VSWR (:1) 15.75 14.03 10.15 1.76 1.51 1.29 1.07 1.06 1.16 1.67 2.45 Return to Electrical Specifications Return Loss (dB) -1.10 -1.24 -1.72 -11.22 -13.82 -17.98 -28.85 -30.28 -22.40 -11.98 -7.52 9 Multilayer Organic (MLO(R)) HF0BA1840A700 ELECTRICAL SPECIFICATIONS Passband 1.84 - 2.83 GHz 1.84 - 2.83 GHz -3dB Cutoff VSWR Stopband 20 dB 30 dB 40 dB Dimension Thickness Rated RF Power Power 1.2 dB 0.85 dB 1.66 GHz 1.16:1 Max Typ Typ Typ DC - 1.50 GHz DC - 1.46 GHz DC - 1.44 GHz Min Min Min <0.022 Inches Max 2 Watts Max DIMENSIONS - CASE SIZE B Inches (mm) Bottom View Side View <0.022 (0.559) Click here to see detailed physical dimensions and pad layout. Typical Frequency Response Insertion Loss (dB) 0 -20 -40 -60 S21 S11 -80 0 2 4 6 8 10 Frequency (GHz) TYPICAL PERFORMANCE AT 25C VSWR VSWR 1000 100 10 1 0 2 4 6 Frequency (GHz) 10 8 10 Frequency (GHz) 1.49 1.51 1.55 1.66 1.67 1.68 1.71 1.78 2.05 2.52 2.92 Insertion Loss (dB) -40.48 -30.10 -20.49 -2.96 -2.40 -1.91 -1.47 -0.99 -0.50 -0.51 -1.01 VSWR (:1) 18.71 14.76 11.54 1.68 1.39 1.14 1.08 1.19 1.18 1.53 2.25 Return to Electrical Specifications Return Loss (dB) -0.93 -1.18 -1.51 -11.96 -15.74 -23.43 -28.50 -21.24 -21.65 -13.64 -8.31 011917 Multilayer Organic (MLO(R)) Filters Detailed Mechanical Specifications, Pad Layout and Mounting Recommendations 011917 11 Multilayer Organic (MLO(R)) High Pass Filters MECHANICAL SPECIFICATIONS - CASE SIZE A Dimensions in inches (mm) Tolerances are 0.002 (0.05), unless noted. All contact areas are gold plated, including I/O pads. Blue pads denote I/O pads, gray pads denote ground pads RECOMMENDED PCB LAYOUT Dimensions in inches (mm). Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness. Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground. Blue pads denote I/O pads, gray pads denote ground pads. DXF Files available upon request. 12 Return to Electrical Specifications 011917 Multilayer Organic (MLO(R)) High Pass Filters MECHANICAL SPECIFICATIONS - CASE SIZE B Dimensions in inches (mm) Tolerances are 0.002 (0.05), unless noted. All contact areas are gold plated, including I/O pads. Blue pads denote I/O pads, gray pads denote ground pads RECOMMENDED PCB LAYOUT Dimensions in inches (mm). Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness. Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground. Blue pads denote I/O pads, gray pads denote ground pads. DXF Files available upon request. 011917 Return to Electrical Specifications 13 Multilayer Organic (MLO(R)) High Pass Filters MECHANICAL SPECIFICATIONS - CASE SIZE C Dimensions in inches (mm) Tolerances are 0.002 (0.05), unless noted. All contact areas are gold plated, including I/O pads. Blue pads denote I/O pads, gray pads denote ground pads RECOMMENDED PCB LAYOUT Dimensions in inches (mm). Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness. Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground. Blue pads denote I/O pads, gray pads denote ground pads. DXF Files available upon request. 14 Return to Electrical Specifications 011917 Multilayer Organic (MLO(R)) High Pass Filters MECHANICAL SPECIFICATIONS - CASE SIZE D Dimensions in inches (mm) Tolerances are 0.002 (0.05), unless noted. All contact areas are gold plated, including I/O pads. Blue pads denote I/O pads, gray pads denote ground pads RECOMMENDED PCB LAYOUT Dimensions in inches (mm). Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness. Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground. Blue pads denote I/O pads, gray pads denote ground pads. DXF Files available upon request. 011917 Return to Electrical Specifications 15 Multilayer Organic (MLO(R)) High Pass Filters MECHANICAL SPECIFICATIONS - CASE SIZE F Dimensions in inches (mm) Tolerances are 0.002 (0.05), unless noted. All contact areas are gold plated, including I/O pads. Blue pads denote I/O pads, gray pads denote ground pads RECOMMENDED PCB LAYOUT Dimensions in inches (mm). Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness. Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground. Blue pads denote I/O pads, gray pads denote ground pads. DXF Files available upon request. 16 Return to Electrical Specifications 011917 Multilayer Organic (MLO(R)) High Pass Filters MOUNTING RECOMMENDATIONS AUTOMATED SMT ASSEMBLY Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO(R) devices onto the PCB. The following section describes the guidelines for automated SMT assembly of MLO(R) RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLO(R) RF devices onto the PCB. SMT REFLOW PROFILE may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO(R) devices onto the PCB. In all cases, a temperature gradient of 3C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time tp Tp Critical Zone TL to Tp Ramp-up Temperature TL tL Ts max Ts min Ramp-down ts Preheat 25 t 25C to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Ramp-up rate (Tsmax to Tp Preheat temperature (Ts min to Ts max) Preheat time (ts) Time above TL, 217C (tL) Peak temperature (Tp) Time within 5C of peak temperature (tp) Ramp-down rate Time 25C to peak temperature 011917 Pb free, Convection, IR/Convection 3C/second max. 150C to 200C 60 - 180 seconds 60 - 120 seconds 260C 10 - 20 seconds 4C/second max. 6 minutes max. Return to Electrical Specifications 17