$6&
$6&
Y $OOLDQFH6HPLFRQGXFWRU 3RI
)XQFWLRQDOGHVFULSWLRQ
The AS7C513 and the AS7C3513 are high performance CMOS 524,288-bit Static Random Access Memory (SRAM) devices organized as
32,768 words × 16 bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 12/15/20 ns with output enable access times (tOE) of 6, 7, 8 ns are ideal for high
performance applications. The chip enable input CE permits easy memory expansion with multiple-bank memory systems.
When C E is high, the de vices enter standby mode . The AS7C513 and AS7C3513 are guaranteed not to exceed 28/18 mW power consumption
in CM OS standby mode.
A write cycle is accomplished by asserting write enable (WE), (UB) and/or (LB), and chip enable (CE). Data on the input pins I/O0-I/O7,
and/or I/O8–I/O15, is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices
should drive I/O pins only after outputs have been disabled with output enable (OE ) or write enable (WE).
A read cycle is accompli shed by assert ing output enable (OE), ( UB) and (LB), and c hip e nable (C E), with wri te enable (WE) high. The chips
drive I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write enable is
active , or (UB) and (LB ), output drivers stay in high-impedance mode.
The devices provide multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be written and
read. LB controls the lower bits, I/O0–I/O7, and UB c ontrols the higher bits, I/O8–I/O15.
All chip inputs and outputs are TTL-compatible. The AS7C513 and AS7C3513 are packaged in common industry standard pac k ages.
$EVROXWHPD[LPXPUDWLQJV
NOTE: Stresses gre ater than those listed u nder Absolute Maxim um Rat ings ma y cause permanent damage to the de vice . T his is a st re ss rating only and functional oper-
ation of the device at these or any other conditions outside those indicated in the operational sections of this specification i s not implied. Exposure to absolute
maximum rating conditions fo r e xtended periods may affect reliability.
7UXWKWDEOH
Key: X = Don’t care; L = Low; H = High
Parameter Device Symbol Min Max Unit
Voltage on VCC relative to GND AS7C513 Vt1 –0.50 +7.0 V
AS7C3513 Vt1 –0.50 +5.0 V
Vol tage on any pin relative to GND Vt2 –0.50 VCC +0.50 V
Power diss ipa tion PD–1.0W
Stor age tem p erature ( plastic ) Tstg –65 +150 o C
Ambient temperature with VCC applied Tbias –55 +125 o C
DC current into outputs (low) IOUT –50mA
CE WE OE LB UB I/O0–I/O7 I/O8–I/O15 Mode
HXXXXHigh ZHigh ZStandby (I
SB, ISBI)
LHLLHD
OUT High Z Read I/O0–I/ O7 (ICC)
LHLHLHigh ZD
OUT Read I/O8–I/O15 (ICC)
LHLLLD
OUT DOUT Read I/ O0–I /O15 (ICC)
LLXLLD
IN DIN Write I/O0–I/O15 (ICC)
LLXLHD
IN High Z Write I/O0–I/O7 (ICC)
LLXHLHigh ZD
IN Write I/O8–I/O15 (ICC)
L
LH
XH
XX
HX
HHigh Z High Z Output disable (ICC)