Application Specification 114-13226 Low Insertion Force (LIF) Poke-In Connectors NOTE 02 JUL 08 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless _ otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and i illustrations are for identification only and are not drawn to scale. 1. INTRODUCTION This specification covers the requirements for application of LIF Poke-In Connectors for use on printed circuit (pc) board based LED strip lighting typically used for sign lighting. The connector accommodates 18 or 20 AWG solid copper wires; or 18 and 20 AWG prebond copper wires; or 18 AWG stranded copper wires. The low profile housing with flat top surface allows for vacuum pick-and-place application. The connector is packaged in tape and reel packaging per EIA-481. When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1. LIF SMT Poke-In Connector LIF Through-Hole Poke-In Connector (One-Position Shown, Two-Position Also Available) (Two-Position Shown, One-Position Also Available) LIF SMT Contact Tine Strip Poke-In Hole Through-Hole Length for Wire Contact Tine Indicator Figure 1 2. REFERENCE MATERIAL 2.1. Revision Summary S Initial release of document 2.2. Customer Assistance Reference Product Base Part Number 2008683 and Product Code L012 are representative of the LIF Poke-In Connector. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Tyco Electronics Representative or, after purchase, by calling Product Information at the number at the bottom of this page. 2.3. Drawings Customer Drawings for product part numbers are available from the service network. If there is a conflict between the information contained in the Customer Drawings and this specification or with any other technical documentation supplied, call the Product Information number at the bottom of this page. E 2008 Tyco Electronics Corporation, Harrisburg, PA All International Rights Reserved TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, TE logo and Tyco Electronics are trademarks. *Trademark. Other products, logos, and company names used are the property of their respective owners. visit our website at www.tycoelectronics.com 1 of 12 LOC B LIF Poke-In Connectors 114-13226 2.4. Manuals Manual 402-40 is available from the service network. This manual provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is included in the manual as required for information on soldering problems. 2.5. Specifications Design Objective 108-2284-1 provides expected product performance and test information for the LIF Poke-In Connector. Workmanship Specification 101-2 and Test Specification 109-11 provides solderability requirements and evaluation methods. 3. REQUIREMENTS 3.1. Safety Do not stack product shipping containers so high that the containers buckle or deform. 3.2. Limitations The connectors are designed to operate in a temperature range of -40_ to 105_C [-40_ to 221_F] 3.3. Material The housing is made of UL 94V-0 rated thermoplastic. The contacts are made of phosphorous bronze, under-plated with nickel, and plated overall with tin. 3.4. Storage A. Shelf Life The connectors should remain in the shipping containers until ready for use to prevent deformation. The connectors should be used on a first in, first out basis to avoid storage contamination that could adversely affect performance. B. Chemical Exposure Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in the contacts. Alkalies Amines Ammonia Carbonates Citrates Nitrites Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates 3.5. Wire Selection and Preparation These connectors will accept 18 and 20 AWG solid copper wire; 18 and 20 AWG prebond copper wire; and 18 AWG stranded copper wire. The table in Figure 2 provides wire selection for the LIF Poke-In Connectors. The wire strip length is 7.00 +1.00 mm for the poke-in cavity with an insulation diameter of <2.10 mm. See Figure 3. RECOMMENDED WIRE 18 AWG UL 1007-18 Solid 18 AWG UL 1007-18 (16) Prebond 18 AWG UL 1007-18 (16) Stranded 20 AWG UL 1007-20 Solid 20 AWG UL 1007-20 (7) Prebond Figure 2 NOTE If stranded or prebond wire is used, the strand count must be 16 strands or less. i NOTE When preparing stranded wire, it is recommended NOT to twist strands after stripping the insulation. The stranded wire will insert best if the strands are straight (or slightly twisted) as the wire is manufactured. i 2 of 12 Tyco Electronics Corporation Rev A LIF Poke-In Connectors 114-13226 Insulation Strip Length Strip Length Conductor Stranded Wire Solid Wire (Acceptable) (Acceptable) Stranded Wire Solid Wire (Non-Acceptable) (Non-Acceptable) Must be Cut 90 Figure 3 3.6. Wire Termination The receptacles must be terminated according to the instructions packaged with the tooling. A. Workmanship CAUTION The housing must not be damaged in any way. There shall be no bending of the contacts. There shall be no exposed copper wire or broken or bent conductor strands. ! B. Conductor Insertion All wires must be pushed firmly inside the contact wire openings. The wires must be fully inserted so that the wire insulation is inserted into and surrounded by the end of the housing. Refer to Figure 4. C. Wire Termination Depth The required wire termination depth is achieved when the wire, with insulation stripped to 7.00 +1.00 mm, has bottomed in the connector housing. Refer to Figure 4. Poke-In Connector Wire Bottomed in Connector Housing Insulation Inside Insulation Barrel Wire Stop Figure 4 Rev A Tyco Electronics Corporation 3 of 12 LIF Poke-In Connectors 114-13226 3.7. Strain Relief It is recommended that a means be provided to support the wire bundle extending away from the connector to prevent inadvertent application of high force to the wire bundle from transmitting into the wire/connector interface. When the wire/connector interface is expected to be exposed to a force greater than 22 N [5.0 lbs], an external strain relief is recommended. An external strain relief is also recommended for 18 AWG 16-stranded wire. The suggested strain relief method is to use a cable tie and anchor. Refer to Figure 5. 20 mm Min. Recommended Cable Tie 2-160965-1 Recommended Anchor 2-100691-1 Poke-In Connector (Typ) Strain Relief (Cable Tie with Anchor) Figure 5 3.8. PC Board A. Material and Thickness Common pc board materials may be used such as glass epoxy (FR-4 or G-10), Aluminum-clad pc boards and flex circuits. The pc board thickness may vary to suit the end use thickness. B. Tolerance Maximum allowable bow of the pc board shall be 0.10 mm over the length of the connector. CAUTION Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and ! would not provide long-term performance for the connector. C. Pads The pc board circuit pads must be solderable in accordance with Test Specification 109-11 (Test Method A, non-activated rosin flux). D. Layout The pc board layout must be designed using the dimensions provided on the customer drawing for the specific connector. The recommended pc board layout is shown in Figure 6. 4 of 12 Tyco Electronics Corporation Rev A LIF Poke-In Connectors 114-13226 LIF SMT PC Board Layout LIF Through-Hole PC Board Layout 15.00 7.10 3.00 9.20 3.50 1.00 2.00 (Typ) 4.00 1.50 Plated Through-Hole (4 Plc) NOTE One-Position Shown, Two-Position Dimensions i are the Same and Placed on 4 mm Centers Figure 6 E. PC Board Hole Dimensions The finished hole size for through-hole applications must meet the dimensional requirements provided in Figure 7. 1.57 +0.18 Board Thickness Tin Thickness (As Required) 1.50 + 0.10 Dia of Finished Hole After Plating EEE I I EEE I I EEE I I EEE I I EEE I I I 2.00 Min Pad II EEEE I EEEE II I EEEE II I EEEE II I EEEE II I EEEE Diameter Copper Thickness (As Required) (Maximum Hardness of Copper to be 150 Knoop) Drilled Hole Diameter (As Required) Figure 7 3.9. Spacing The connector is able to be placed side-by-side on the pc board when pads are placed on 4.0 mm centers. See Figure 8. CAUTION Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact tines. ! Rev A Tyco Electronics Corporation 5 of 12 LIF Poke-In Connectors 114-13226 0.20-0.00 Min LIF Poke-In Connector NOTE One-Position Shown, Two-Position Dimensions i are the Same 4.00 Figure 8 3.10. Connector Placement A. SMT Connectors This product is packaged in tape and reel packaging per EIA-481. Robotic/gripper placement requires total equipment accuracy of 0.13 mm to locate the connector for insertion. This includes gripper and fixture tolerances, as well as equipment repeatability. Insertion location will be programmed by a simple pantograph/template system or software package. Optimally, the contact solder tines should be centered on the pc board pads. However, slight misalignment is permissible for the performance classifications specified in Association of Connecting Electronics Industries (IPC)-S-815, "General Requirements for Soldering Electronic Interconnection." See Figure 9. Contact Solder Tine Overhang Permissible Per IPC-S-815 PC Board Optimum Placement of Contact Solder Tine Centered on Circuit Pad Figure 9 B. Through-Hole Connectors When placing connectors on the pc board, the contacts must be aligned and started into the matching holes before seating the connector onto the pc board. After the connector is seated, the standoffs must be flush to the pc board. Refer to Figure 10. 6 of 12 Tyco Electronics Corporation Rev A LIF Poke-In Connectors 114-13226 Poke-In Connector (Typ) Standoffs Flush with PC Board PC Board Figure 10 3.11. Soldering Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts according to the following. The connectors should be soldered using vapor phase reflow (VPR), double-sided, non-focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should conform to the Workmanship Specification 101-21 and IPC-S-815. A. Flux Selection Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is compatible with the connectors is provided in Figure 11. FLUX TYPE ACTIVITY RESIDUE Type RMA (Mildly Activated) Mild Noncorrosive COMMERCIAL DESIGNATION KESTERY ALPHAU 185/197 611 YTrademark of MacDonald & Co. U Designation of Alpha Metals Inc. Figure 11 B. Connectors with LIF SMT Contacts 1. Solderability The pc board pads must be solderable in accordance with Test Specification 109-11 (Test Method A, non-activated rosin flux) and all other requirements for surface mount contacts specified in this document. 2. Solder Paste Characteristics a. b. c. d. e. f. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5 Flux incorporated in the paste shall be rosin, mildly active (RMA) type. Paste will be at least 80% solids by volume. Mesh designation -200 to +325 (74 to 44 square micron openings, respectively). Minimum viscosity of screen print shall be 5 10% cp (centipoise). Minimum viscosity of stencil print shall be 7.5 10% cp (centipoise). 3. Solder Volume NOTE i Solder paste volumes are required as follows (calculated per 50% solids content). Paste volume may vary depending on the composition. Solder volume for each LIF SMT Poke-In Connector must be according to the following: 1.75 mm3 per contact solder tine Rev A Tyco Electronics Corporation 7 of 12 LIF Poke-In Connectors 114-13226 4. Stencil The stencil aperture shall be determined by the circuit pad size and stencil thickness. It may be any shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will need a larger aperture to maintain the given volume of solder paste. See Figure 12. NOTE The stencil layouts illustrated apply to the top (connector) side (unless otherwise noted) of the pc board. For any other variations, refer to the pc board mounting configurations on the appropriate customer drawing to determine i modifications necessary to the solder stencils in Figure 12. CAUTION All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create a short, or wick solder away from the solder tines, producing a weak solder joint. ! CAUTION If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will not sit on the solder deposit. ! 2.00 (Typ) NOTE One-Position Shown, Two-Position Dimensions are the Same and Placed i 3.50 (Typ) on 4 mm Centers 15.00 7.10 Figure 12 5. Solder Mask Solder mask is recommended between all pads when soldering connectors with surface mount contacts to minimize solder bridging between pads. The mask must not exceed the height of the pad by more than 0.05 mm. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the contact solder tines. Those most suitable are Liquid Photo Imageable and Dry Film. CAUTION Since the connector may rest on top of the solder mask, an excessively high mask will allow too much space between the lead and pad for a good solder joint. A solder joint under these conditions would be weak and would not provide ! 8 of 12 long-term performance for the connector. Tyco Electronics Corporation Rev A LIF Poke-In Connectors 114-13226 6. Process Connectors with surface mount contacts should be soldered using vapor phase (VPR), double-sided, non-focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with the reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be conducted under actual manufacturing conditions to ensure product and process compatibility. These connectors will withstand the temperature and exposure time specified in Figure 13. SOLDERING PROCESS TEMPERATURE (Max) IR 220 C [428 F] TIME (At Max Temperature) _ _ Figure 13 3 Minutes The lead-free reflow profile is shown in Figure 14. Kester Lead-Free Reflow Profile Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5 300 C 250 C Peak Temperature 235 -255 C 200 C 150 C <2.5 C/Second 100 C Soaking Zone Reflow Zone (2.0 Minutes Max) Time Above 217 C 60-90 Seconds Typ (90 Seconds Max) 40-70 Seconds Typ Pre-Heating Zone 50 C (2.0 -4.0 Minutes Max) 0 C 0 30 60 90 120 150 180 210 240 270 300 Time (Seconds) Figure 14 C. Connectors with LIF Through-Hole Contacts 1. Solderability All solder joints should conform to those specified in Workmanship Specification 101-21 and all other requirements for through-hole contacts specified in this document 2. Process Connectors with through-hole contacts can be soldered using wave soldering or equivalent soldering techniques. It is recommended using lead-free or SN100C solder for these connectors. The temperature and exposure time shall be as specified in Figure 15. SOLDERING PROCESS TEMPERATURE (Max) Wave 260 C [500 F] _ _ TIME (At Max Temperature) 3 Seconds Figure 15 Rev A Tyco Electronics Corporation 9 of 12 LIF Poke-In Connectors 114-13226 D. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Common cleaning solvents that will not affect the connectors or assemblies for the times and temperatures provided without any adverse effects on the connector assembly are listed in Figure 16. DANGER Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco Electronics does not recommend them because of the harmful occupational and environmental effects. Both are carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer. NOTE If you have a particular solvent that is not listed, contact Tyco Electronics Tooling Assistance Center or Product Information at the number on the bottom of page 1. i CLEANER NAME TIME TYPE Alpha 2110H (Mi (Minutes) ) TEMPERATURES (Maximum) CELSIUS FAHRENHEIT Aqueous 1 132 270 Solvent 5 100 212 Butyl CarbitolD Solvent 1 Isopropyl Alcohol Solvent 5 100 212 Kester 5778s Aqueous 5 100 212 Aqueous 5 100 212 Aqueous 5 100 212 Loncoterge 530D Aqueous 5 100 212 Terpene Solvent Solvent 5 100 212 Bioact EC-7z Kester 5779s Loncoterge 520D H Product of Fry's Metals, Inc. z Product of Petroferm, Inc. D Product of Union Carbide Corp. Room Ambient s Product of Litton Systems, Inc. Figure 16 E. Drying CAUTION Excessive temperatures may cause housing and plating degradation. ! When drying cleaned assemblies and pc boards, temperatures to which the connectors are subject should not exceed 220_C [492_F] for more than 3 minutes. 3.12. Checking Installed Connector All solder joints should comply with Tyco Electronics Workmanship Specification 101-21. For typical fillets for surface mount and through-hole tine requirements, refer to Figure 17. 3.13. Removal and Repair If needed, the wire can be removed from the connector by first cutting the wire at approximately 50.8 mm from the connector, and then rotating the wire to cause the wire to "thread out" of the connector. Replacement wire must be newly cut and insulation stripped to 7.00 +1.00 mm. NOTE Replacement wire must be of the same size or of a larger size than the wire previously removed. i 10 of 12 Tyco Electronics Corporation Rev A LIF Poke-In Connectors 114-13226 LIF SMT Poke-In Connector Soldered on PC Board Solder Fillet PC Board (Ref) Pad Length Pad Width PC Board (Ref) Solder Joints Evenly Formed Around Contact Tines Figure 17 4. QUALIFICATIONS LIF Poke-In Connectors are Component Recognized by Underwriters Laboratories, Inc. in File E28476, Volume 39, and have been Investigated to CSA International by UL. 5. TOOLING 5.1. Robotic Equipment The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the connectors. This includes gripper and fixture tolerances as well as equipment repeatability. NOTE Automatic machine placement is recommended for connectors instead of manual placement with surface mount contacts. i 5.2. PC Board Support For automatic machine placement, a pc board support must be used to prevent bowing of the pc board during the placement of connectors. It should have flat surfaces with holes or a channel large enough and deep enough to receive any protruding components. The pc board support must be customer made. Rev A Tyco Electronics Corporation 11 of 12 LIF Poke-In Connectors 114-13226 6. VISUAL AID Figure 18 shows a typical application of LIF Poke-in Connectors. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. CONTACT TINE SHOULD BE VISUALLY CENTERED ON PAD WIRES MUST BE FULLY BOTTOMED IN CONNECTOR HOUSING CABLE TIE AND ANCHOR MUST BE CORRECTLY PLACED ON WIRES SOLDER FILLET MUST BE FORMED EVENLY AROUND SOLDER TINE STANDOFFS MUST BE SEATED ON PC BOARD CONNECTOR HOUSING MUST NOT BE DAMAGED OR CRACKED SOLDER MUST BE EVENLY FORMED AROUND ALL CONTACT SOLDER TINES WITH NO VISIBLE SKIPS OR VOIDS FIGURE 18. VISUAL AID 12 of 12 Tyco Electronics Corporation Rev A