YAGEO CORPORATION SMD INDUCTOR / BEADS
SMD Power Inductors STD1109 Series
Yageo SMD power inductors are best designed for noise / EMI / RFI lters for surface mounting ap-
plications.
These components contain tremendous electrode straight, solder heat resistance and outstanding
solderability. These products are specially designed for ow, reow and wave soldering required for
surface mounting applications.
ELECTRICAL CHARACTERISTICS
PART NO. INDUCTANCE DC RATED
(µH± 20%) * RESISTANCE CURRENT
(Ω) (A)Max.
STD1109T-100M-B-S 10 0.06 3.50
STD1109T-120M-B-S 12 0.07 3.40
STD1109T-150M-B-S 15 0.08 3.10
STD1109T-180M-B-S 18 0.09 3.00
STD1109T-220M-B-S 22 0.10 2.60
STD1109T-270M-B-S 27 0.11 2.40
STD1109T-330M-B-S 33 0.12 2.30
STD1109T-390M-B-S 39 0.14 2.10
STD1109T-470M-B-S 47 0.17 1.95
STD1109T-560M-B-S 56 0.19 1.85
STD1109T-680M-B-S 68 0.22 1.65
STD1109T-820M-B-S 82 0.25 1.50
STD1109T-101M-B-S 100 0.35 1.40
STD1109T-121M-B-S 120 0.40 1.30
STD1109T-151M-B-S 150 0.47 1.20
STD1109T-181M-B-S 180 0.63 1.00
STD1109T-221M-B-S 220 0.73 0.95
STD1109T-271M-B-S 270 0.97 0.90
STD1109T-331M-B-S 330 1.15 0.80
STD1109T-391M-B-S 390 1.30 0.75
STD1109T-471M-B-S 470 1.48 0.65
STD1109T-561M-B-S 560 1.90 0.60
STD1109T-681M-B-S 680 2.45 0.50
STD1109T-821M-B-S 820 2.55 0.48
STD1109T-102M-B-S 1000 3.00 0.46
STD1109T-122M-B-S 1200 3.50 0.35
Test Instruments : HP4261 RF Impedance for L, IDC Digital Multimeter SC-7401 for RDC
* Test at HP4263A 1KHz, 1Volt
APPLICATIONS
For high current applications.
Specially designed for high density surface applications.
Ideal for solder ow, reow and wave soldering applications.
SHAPES AND DIMENSIONS
Dimensions : mm
11.6
+0
11.6
+0
8.5
+0
3
+0
14.0
+0
2.55 2.55
6
FEATURES
Power supply, power ampliers
Switching regulators.
• Packaging: T: Tape and Reel
• Tolerance: M=±20%
• Note: YAGEO will start to release STD Series
inductors with lead-free terminals which
meet SONY SS-00259's criteria for lead-
free product in Q2 of 2004, and YAGEO
Internal No will be changed to “N” as
identication. Ex. STD1109T-100M-B-N
STD - -
PRODUCT IDENTIFICATION
International No.
Tolerance
Inductance
Packaging Style
Dimensions
Product Symbol
289
ELECTRICAL CHARACTERISTICS : LEAD-FREE & ROHS COMPLIANCE
PART NO. INDUCTANCE TEST FREQ Rdc IDC
(nH±20%) (MHZ) (Ω)Max (A)Max.
STD1109T-100 -B-N 10 1KHz, 1V 0.06 3.5
STD1109T-120 -B-N 12 1KHz, 1V 0.07 3.4
STD1109T-150 -B-N 15 1KHz, 1V 0.08 3.1
STD1109T-180 -B-N 18 1KHz, 1V 0.09 3
STD1109T-220 -B-N 22 1KHz, 1V 0.1 2.6
STD1109T-270 -B-N 27 1KHz, 1V 0.11 2.4
STD1109T-330 -B-N 33 1KHz, 1V 0.12 2.3
STD1109T-390 -B-N 39 1KHz, 1V 0.14 2.1
STD1109T-470 -B-N 47 1KHz, 1V 0.17 1.95
STD1109T-560 -B-N 56 1KHz, 1V 0.19 1.85
STD1109T-590 -B-N 68 1KHz, 1V 0.22 1.65
STD1109T-820 -B-N 82 1KHz, 1V 0.25 1.5
STD1109T-101 -B-N 100 1KHz, 1V 0.35 1.4
STD1109T-121 -B-N 120 1KHz, 1V 0.4 1.3
STD1109T-151 -B-N 150 1KHz, 1V 0.47 1.2
STD1109T-181 -B-N 180 1KHz, 1V 0.63 1
STD1109T-221 -B-N 220 1KHz, 1V 0.73 0.95
STD1109T-271 -B-N 270 1KHz, 1V 0.97 0.9
STD1109T-331 -B-N 330 1KHz, 1V 1.15 0.8
STD1109T-391 -B-N 390 1KHz, 1V 1.3 0.75
STD1109T-471 -B-N 470 1KHz, 1V 1.48 0.65
STD1109T-561 -B-N 560 1KHz, 1V 1.9 0.6
STD1109T-681 -B-N 680 1KHz, 1V 2.45 0.5
STD1109T-821 -B-N 820 1KHz, 1V 2.55 0.48
STD1109T-102 -B-N 1000 1KHz, 1V 3 0.46
STD1109T-122 -B-N 1200 1KHz, 1V 3.5 0.35
NOTE : -tolerance M=±20% / T=±30%
1.Operating temperature range -40°C~85°C
3.Inductance drop =10% typ.
"-N"FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER)
290
REEL DIMENSIONS
CB A
D
RECOMMENDED PATTERN
B
AC
Solder Land Inductor
TAPE MATERIAL
Carrier Tape : Polystyrene Cover Type : Polyethylene
160mm Min.
Blank Part
Cover Tape
Chip Mounting
Part
Blank
330mm Min.
Leader
TAPE DIMENSIONS
W
P0
P
P2 K0 K0
Plastic
Paper
E
D
TYPE TAPE RECOMMENDED REEL QUANTITY
DIMENSIONS PATTERN DIMENSIONS /REEL
K0 D E W P P0 P2 A B C A B C D
STD0804 5.4 1.55 1.75 24 16 4 2 4.0 9 4.5 330 100 13 24.4 750
STD1109 8.7 1.55 1.75 24 20 4 2 6 12~14 5 330 100 13 24.4 400
Dimensions : mm
TYPICAL INDUCTANCE ENERGY STORAGE VS. CURRENT
Test instruments : HP4191A RF Impedance Analyzer
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
0
60
120
90
150
30
1 1000 1000010010 100000
FREQUENCY (kHz)
L (uH)
Q vs. FREQUENCY CHARACTERISTICS
0
25
15
10
5
35
30
20
0 3 4 5 6 71 2 8
IDC (A)
L (uH)
15uH
10uH
33uH
15uH
10uH
33uH
291
STD SERIES RELIABILITY TEST
1-1 MECHANICAL PERFORMANCE
NO. ITEM SPECIFICATION TEST CONDITIONS
1-1-1 Vibration Appearance : No Damage Test device shall be soldered on the substrate.
L Change : within ±10% Oscillation Frequency : 10 to 55 to 10Hz for 1Min.
Q Change : within ±30% Amplitude : 1.5mm
RDC : within Specication Time : 2Hrs. for each Axis (X, Y & Z), Total 6Hrs.
1-1-2 Resistance to Appearance : No Damage Pre-heating : 150°C, 1Min.
Soldering Heat Solder Composition : Sn/Pb = 63/37
Solder Temperature : 260 ± 5°C
Immersion Time : 10 ± 1Sec.
1-1-3 Solderability The electrodes shall be at least 90% covered Pre-heating : 150°C, 1Min.
with new solder coating. Solder Composition : Sn/Pb = 63/37
Solder Temperature : 230 ± 5°C
Immersion Time : 4 ± 1Sec.
1-2 ENVIRONMENTAL PERFORMANCE
NO. ITEM SPECIFICATION TEST CONDITIONS
1-2-1 Temperature Shock Appearance : No Damage 10 Cycles (Air to Air) 1 Cycles shall Consist of :
L Change : within ±10% 30Min. Exposure to -55°C
L Change : within ±30% 30Min. Exposure to 125°C
RDC : within Specication 15Sec. Max. Transition between Temperatures
Measured after Exposure in the Room Condition for 24Hrs.
1-2-2 Temperature Cycle One Cycle
Step Temperature (°C) Time (Min.)
1 -25 ± 3 30
2 25 ± 2 3
3 85 ± 3 30
4 25 ± 2 3
Total : 100 Cycles
Measured after Exposure in the Room Condition for 24Hrs.
1-2-3 Humidity Resistance Temperature : 40 ± 2°C
Relative Humidity : 90 ~ 95%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
1-2-4 High Temperature Temperature : 85 ± 3°C
Resistance Relative Humidity : 20%
Applied Current : Rated Current
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
1-2-5 Low Temperature Temperature : -25 ± 3°C
Resistance Relative Humidity : 0%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
292
temperature °C
for: lead solder
for: lead-free solder
time:second
pre-heating
60 second
120 second 80 second
5~10 second
soldering natural cooling
260 °C
230 °C
160 °C
150 °C
RECOMMEND SOLDERING CONDITIONS
for:CL/ CLH/ SQV/ SMD power inductors/ SMD Chip Beads/ SMD Filters, Transformers, Current Sensors