Intel® Server Chassis SR2400
Technical Product Specification
Intel order number C78845-001
Revision 2.0
February 2006
Enterprise Platforms and Services Marketing
Revision History Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
ii
Revision History
Date Revision
Number Modifications
Jan. 2004 0.52 Updated to reflect the Alpha hardware. First external release
July 2004 0.9 Added iLCP, updated diagrams, updated backplane info, updated riser card info,
increased over all detail.
September 2004 1.0 Final updates, and review. First non-NDA Release – Added content supporting
SE7320VP2, updated cooling section, updated regulatory section,
February 2006 2.0 Added DC power configuration. Corrected the single power module population
rule and the description of SATA drive ACTIVITY LED.
Intel® Server Chassis SR2400 Disclaimers
Revision 2.0
Intel order number C78845-001 iii
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product
is available. Verify with your local sales office that you have the latest datasheet before
finalizing a design.
The Intel® Server Chassis SR2400 may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata
are available on request.
This document and the software described in it is furnished under license and may only be used
or copied in accordance with the terms of the license. The information in this manual is
furnished for informational use only, is subject to change without notice, and should not be
construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or
liability for any errors or inaccuracies that may appear in this document or any software that may
be provided in association with this document.
Except as permitted by such license, no part of this document may be reproduced, stored in a
retrieval system, or transmitted in any form or by any means without the express written consent
of Intel Corporation.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2004.
Table of Contents Intel® Server Chassis SR2400
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Table of Contents
1. Product Overview.................................................................................................................1
1.1 Chassis Views .........................................................................................................1
1.2 Chassis Dimensions ................................................................................................2
1.3 System Components ...............................................................................................2
1.4 Hard Drive and Peripheral Bays .............................................................................. 4
1.5 Control Panel Options.............................................................................................. 5
1.6 Power Subsystem....................................................................................................6
1.7 System Cooling........................................................................................................7
1.8 Chassis Security ......................................................................................................7
1.9 Rack and Cabinet Mounting Options ....................................................................... 7
1.10 Front Bezel Features ...............................................................................................7
2. AC Power Subsystem ..........................................................................................................9
2.1 Mechanical Overview............................................................................................... 9
2.2 Power Module Population........................................................................................9
2.3 Handle and Retention Mechanism......................................................................... 10
2.4 Hot Swap Support.................................................................................................. 10
2.5 Airflow ....................................................................................................................10
2.6 Output Cable Harness ........................................................................................... 10
2.6.1 P1 – Baseboard Power Connector ........................................................................ 11
2.6.2 P2 – Processor Power Connector .........................................................................11
2.6.3 P3 – Power Signal Connector................................................................................ 12
2.6.4 P4 – Hard Drive / Backplane Power Connector..................................................... 12
2.6.5 P5 – Peripheral Power Connector ......................................................................... 12
2.7 AC Input Requirements .........................................................................................12
2.7.1 AC Inlet Connector ................................................................................................13
2.7.2 Efficiency ...............................................................................................................13
2.7.3 AC Input Voltage Specification ..............................................................................13
2.7.4 AC Line Dropout / Holdup......................................................................................13
2.7.5 AC Line Fuse ......................................................................................................... 14
2.7.6 AC Inrush...............................................................................................................14
2.7.7 AC Line Surge .......................................................................................................14
2.7.8 AC Line Transient Specification.............................................................................14
2.7.9 AC Line Fast Transient (EFT) Specification ..........................................................15
2.7.10 AC Line Leakage Current ...................................................................................... 15
2.8 DC Output Specification ........................................................................................15
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2.8.1 Power Supply Mating Connector ........................................................................... 15
2.8.2 Grounding ..............................................................................................................17
2.8.3 Standby Output / Standby Mode............................................................................17
2.8.4 Remote Sense ....................................................................................................... 17
2.8.5 Power Module Output Power / Currents ................................................................17
2.8.6 +12V Outputs Load Requirements ........................................................................18
2.8.7 DC/DC Converters Loading ...................................................................................18
2.8.8 DC/DC Converters Voltage Regulation .................................................................18
2.8.9 DC/DC Converters Dynamic Loading .................................................................... 19
2.8.10 DC/DC Converter Capacitive Loading ................................................................... 19
2.8.11 DC/DC Converters Closed Loop stability............................................................... 19
2.8.12 Common Mode Noise ............................................................................................19
2.8.13 DC/DC Converters Ripple / Noise .........................................................................19
2.8.14 Timing Requirements............................................................................................. 20
2.8.15 Residual Voltage Immunity in Standby Mode ........................................................ 21
2.9 Protection Circuits..................................................................................................21
2.9.1 Over-Current Protection (OCP)............................................................................21
2.9.2 Over Voltage Protection (OVP)............................................................................. 22
2.9.3 Over Temperature Protection (OTP).....................................................................23
2.10 SMBus Monitoring Interface ..................................................................................23
2.10.1 Hot Plug I2C Requirements ...................................................................................24
2.10.2 Power Supply Failure Communication................................................................... 24
2.10.3 LED Control ........................................................................................................... 24
3. DC Power Subsystem ........................................................................................................25
4. Cooling Subsystem............................................................................................................26
4.1 4+4 System Fan Module........................................................................................ 26
4.2 Fan Redundancy ...................................................................................................28
4.3 Air Flow Support ....................................................................................................29
4.3.1 Power Supply Zone ...............................................................................................29
4.3.2 Full Height Riser Zone ........................................................................................... 29
4.3.3 CPU / Memory / Low Profile PCI Zone .................................................................. 29
4.4 Drive Bay Population ............................................................................................. 30
5. Peripheral and Hard Drive Support...................................................................................31
5.1 Slimline Drive Bay.................................................................................................. 31
5.1.1 Floppy Drive Support ............................................................................................. 31
5.1.2 IDE Optical Drive Support...................................................................................... 32
5.2 Hard Disk Drive Bays............................................................................................. 35
5.2.1 Hot Swap Drive Trays............................................................................................ 35
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5.2.2 Fixed Mount Drive Trays........................................................................................36
5.3 Hot-Swap SCSI Backplane....................................................................................37
5.3.1 Hot-Swap SCSI Backplane Placement and Board Layout..................................... 37
5.3.2 SCSI Backplane Functional Architecture...............................................................38
5.3.3 SCSI Backplane Connector Definitions ................................................................. 40
5.3.4 Optional 6Th SCSI Drive ......................................................................................... 46
5.4 Hot-Swap SATA Backplane...................................................................................47
5.4.1 SATA Backplane Layout........................................................................................47
5.4.2 SATA Backplane Functional Architecture..............................................................48
5.4.3 LEDs ......................................................................................................................50
5.4.4 SATA Backplane Connectors ................................................................................ 51
5.4.5 Optional 6th SATA Drive Board Functional Architecture ........................................ 55
5.5 Optional Tape Drive or 6th Hard Drive Bay ............................................................ 56
6. Standard Control Panel .....................................................................................................57
6.1 Control Panel Buttons...........................................................................................57
6.2 Control Panel LED Indicators ................................................................................58
6.2.1 Power / Sleep LED ................................................................................................59
6.2.2 System Status LED................................................................................................ 59
6.2.3 Drive Activity LED ..................................................................................................60
6.2.4 System Identification LED...................................................................................... 60
6.3 Control Panel Connectors...................................................................................... 60
6.4 Internal Control Panel Assembly Headers............................................................. 61
7. Intel® Local Control Panel.................................................................................................63
7.1 LED Functionality...................................................................................................64
7.1.1 Power / Sleep LED ................................................................................................64
7.1.2 System Status LED................................................................................................ 64
7.1.3 Drive Activity LED ..................................................................................................65
7.1.4 System Identification LED...................................................................................... 65
7.2 Internal Control Panel Headers .............................................................................65
8. PCI Riser Cards and Assembly.........................................................................................68
8.1 PCI Riser Card Mechanical Drawings ...................................................................69
9. Supported Intel® Server Boards.......................................................................................71
9.1 Intel Server Board SE7520JR2.............................................................................. 71
9.1.1 Server Board SE7520JR2 SKU Availability ........................................................... 71
9.1.2 Server Board SE7520JR2 Feature Set.................................................................. 71
9.2 Intel Server Board SE7320VP2 ............................................................................. 75
9.2.1 Intel Server Board SE7320VP2 SKU Availability................................................... 75
9.2.2 Intel Server Board SE7320VP2 Feature Set .........................................................75
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Intel order number C78845-001 vii
10. Regulatory, Environmentals, and Specifications............................................................77
10.1 Product Regulatory Compliance ............................................................................77
10.1.1 Product Safety Compliance ................................................................................... 77
10.1.2 Product EMC Compliance .....................................................................................77
10.1.3 Product Regulatory Compliance Markings ............................................................ 78
10.2 Electromagnetic Compatibility Notices ..................................................................78
10.2.1 USA .......................................................................................................................78
10.2.2 FCC Verification Statement ................................................................................... 79
10.2.3 ICES-003 (Canada) ...............................................................................................79
10.2.4 Europe (CE Declaration of Conformity) ................................................................. 79
10.2.5 Japan EMC Compatibility ......................................................................................80
10.2.6 BSMI (Taiwan) ....................................................................................................... 80
10.2.7 Korean RRL Compliance .......................................................................................80
10.3 Replacing the Back up Battery ..............................................................................80
10.4 System Level Environmental Limits....................................................................... 81
10.5 Serviceability and Availability................................................................................. 81
10.6 Regulated Specified Components ......................................................................... 82
Appendix A: SR2400 Integration and Usage Tips..................................................................84
List of Figures Intel® Server Chassis SR2400
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List of Figures
Figure 1. Front View with optional Bezel....................................................................................... 1
Figure 2. Front View without Bezel (Shown with Standard Control Panel option) ........................ 1
Figure 3. Back View (Shown with 1+1 AC Power Supply Configuration)..................................... 1
Figure 4. Major Chassis Components (Shown with AC Power Supply Configuration) ................. 2
Figure 5. Back Panel Feature Overview (Shown with 1+1 AC Power Supply Configuration)....... 3
Figure 6. Front Panel Feature Overview.......................................................................................4
Figure 7. Control Panel Modules ..................................................................................................5
Figure 8. Standard Control Panel Overview .................................................................................5
Figure 9. LCD Contol Panel Overview ..........................................................................................6
Figure 10. Optional Front Bezel .................................................................................................... 8
Figure 11. Front Bezel Supporting Standard Control Panel.......................................................... 8
Figure 12. Front Bezel Supporting Intel Local Control Panel........................................................8
Figure 13. Mechanical Drawing for Dual (1+1 configuration) PS enclosure with PDB.................. 9
Figure 14. Power Module Edge Connector View ....................................................................... 16
Figure 15. Turn On/Off Timing (Power Supply/PDB combo Signals)......................................... 21
Figure 16. Fan Distribution Board Layout ...................................................................................26
Figure 17. Fan Module Assembly ...............................................................................................28
Figure 18. CPU Air Duct with Air Baffle ......................................................................................29
Figure 19. Drive Blank ................................................................................................................ 30
Figure 20. Optional Floppy Drive Configuration..........................................................................32
Figure 21. Hard Drive Tray Assembly.........................................................................................36
Figure 22. Fixed Drive Tray w/Blank........................................................................................... 36
Figure 23. Hot-Swap SCSI Backplane Layout ............................................................................ 37
Figure 24. SCSI Backplane Block Diagram ................................................................................38
Figure 25. SCSI I2C Block Diagram ...........................................................................................40
Figure 26. 80-pn SCA2 Connector.............................................................................................. 42
Figure 27. 68-pin SCSI Cable Connector .................................................................................. 43
Figure 28. SATA Backplane Layout............................................................................................48
Figure 29. SATA Backplane Functional Block Diagram.............................................................. 49
Figure 30. SATA Backplane I2C Block Diagram......................................................................... 50
Figure 31. Standard Control Panel Assembly Module ................................................................ 57
Figure 32. Control Panel Buttons................................................................................................57
Figure 34. Intel Local Control Panel Assembly Module .............................................................. 63
Figure 35. Intel Local Contol Panel Overview.............................................................................63
Figure 36. Full Height PCI-Express Riser Card .......................................................................... 69
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Figure 37. Full Height Passive PCI-X Riser Card ....................................................................... 69
Figure 38. Full Height Active PCI-X Riser Card .......................................................................... 70
Figure 39. Low Profile Passive PCI-X Riser Card....................................................................... 70
Figure 40. Intel® Server Board SE7520JR2 Board Layout......................................................... 73
Figure 41. Intel® Server Board SE7320VP2 Board Layout ........................................................ 76
List of Tables Intel® Server Chassis SR2400
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List of Tables
Table 1. Chassis Dimensions ....................................................................................................... 2
Table 2. Power Harness Cable Definitions .................................................................................10
Table 3. P1 Baseboard Power Connector .................................................................................. 11
Table 4. P2 Processor Power Connector.................................................................................... 11
Table 5. P3 Power Signal Connector..........................................................................................12
Table 6. P4 Hard Drive Interface Board Power Connector .........................................................12
Table 7. P5 HDD Power Connector ............................................................................................ 12
Table 8. AC Input Rating.............................................................................................................13
Table 9. AC Line Sag Transient Performance ............................................................................ 14
Table 10. AC Line Surge Transient Performance ....................................................................... 15
Table 11. Power Supply Edge Connector Slot Pinout ................................................................15
Table 12. Load Ratings............................................................................................................... 17
Table 13. +12V Outputs Load Ratings........................................................................................ 18
Table 14. DC/DC Converters Load Ratings................................................................................ 18
Table 15. Voltage Regulation Limits ..........................................................................................18
Table 16. Transient Load Requirements..................................................................................... 19
Table 17. Capacitive Loading Conditions ................................................................................... 19
Table 18. Ripple and Noise......................................................................................................... 20
Table 19. Turn On / Off Timing ...................................................................................................20
Table 20. Over Current Protection Limits / 240VA Protection..................................................... 22
Table 21. Power Module Over Current Protection Limit .............................................................22
Table 22. Over Voltage Protection Limits ...................................................................................22
Table 23. Power Module Over Voltage Protection Limits ...........................................................23
Table 24. LED Indicators ............................................................................................................ 24
Table 25. Individual Fan Pinout (J8B2, J6B1, J3B1, J1B1, J8A1, J6A1, J3A1, J1A1) .............. 26
Table 26. 24-pin Fan Control Connector Pinout (J3K6, J8C1) ................................................... 27
Table 27. 10-pin Fan Control Connector Pinout (J4l1, J7A1) ..................................................... 27
Table 28. 28-pin floppy connector Pinout (J4) ............................................................................31
Table 29. 4-pin floppy power connector Pinout (J3) ................................................................... 31
Table 30. 34-pin floppy connector Pinout (J2) ............................................................................32
Table 31. 50-pin Drive connector Pinout (J6) ............................................................................. 33
Table 32. 44-pin internal Drive Interposer-to-Backplane Connector Pinout (J6) ........................ 33
Table 33. 4-pin Drive Power Connector Pinout (J5) ...................................................................34
Table 34. 40-pin IDE Optical Drive Interposer-to-Baseboard connector Pinout (J1) .................. 35
Table 35. SCSI Backplane Layout Description ........................................................................... 38
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Table 36. SCSI Backplane Power Connector Pinout (J9)........................................................... 41
Table 37. 7-pin SCSI power connector Pinout (J1)..................................................................... 41
Table 38. 10-pin Redundant Fan Connector Pinout (J5) ............................................................ 41
Table 39. 80-pin SCA-2 SCSI Interface Pinout (J9, J2, J10, J11, J12) ...................................... 42
Table 40. Ultra2 (LVD) SCSI Connector Pinout (J8)................................................................... 43
Table 41. 100-pin Floppy / CP / CD-ROM / Video Connector Pinout (J6) .................................. 44
Table 42. 28-pin floppy connector Pinout (J15) ..........................................................................45
Table 43. 44-pin internal CD-ROM connector Pinout (J3) .......................................................... 45
Table 44. 50-pin SCSI Backplane to Control Panel Connector Pinout (J5) ................................ 46
Table 45. 6th Drive 7-pin Power Connector Pinout..................................................................... 46
Table 46. SATA Backplane Layout Reference Descriptions....................................................... 48
Table 47. SATA LED Function Definitions .................................................................................. 51
Table 48. SATA Backplane Power Connector Pinout................................................................. 51
Table 49. Option Board Power Connector Pin-out...................................................................... 51
Table 50. 4-pin SATA optional tape dirve power connector Pinout (J15) ................................... 52
Table 51. 10-pin Redundant Fan Connector Pinout (J5) ............................................................ 52
Table 52. 7-Pin SATA Connector Pinout (J2, J3, J4, J5, J6) ...................................................... 52
Table 53. 22-Pin SATA Connector Pinout (J7, J8, J9, J10, J11) ............................................... 53
Table 54. 100-pin Floppy/FP/IDE/Video Connector....................................................................53
Table 55. 50-pin Control Panel Connector..................................................................................54
Table 56. Contol Button and Intrusion Switch Functions ............................................................58
Table 57. Control Panel LED Functions...................................................................................... 58
Table 58. SSI Power LED Operation .......................................................................................... 59
Table 59. External USB Connectors (J1B1) ...............................................................................60
Table 60. Video Connector (J1A1).............................................................................................. 61
Table 61. 50-pin Control Panel Connector (J6B1) ...................................................................... 61
Table 62. Internal USB Header (J2B1) .......................................................................................62
Table 63. Control Panel LED Functions...................................................................................... 64
Table 64. SSI Power LED Operation .......................................................................................... 64
Table 65. 50-pin Control Panel Connector..................................................................................66
Table 66. Internal USB Header...................................................................................................66
Table 67. IPMI Header................................................................................................................ 67
Table 68. Internal NMI/Temp Sensor Header ............................................................................. 67
Table 69. Baseboard Layout Reference .....................................................................................74
Table 70. System Environmental Limits Summary .....................................................................81
List of Tables Intel® Server Chassis SR2400
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Intel® Server Chassis SR2400 Product Overview
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Intel order number C78845-001 1
1. Product Overview
The Intel® Server Chassis SR2400 is a 2U server chassis that is designed to support the Intel®
Server Board SE7520JR2 and Intel Server Board SE7320VP2. The baseboards and the chassis
have feature sets that are designed to support the high-density server market. This chapter
provides a high-level overview of the chassis features. Greater detail for each major chassis
component or feature is provided in the following chapters.
Note: Support for some chassis features described in this document is dependent on which
server board is used and whether or not an Intel Management Module is installed in the system.
1.1 Chassis Views
Figure 1. Front View with optional Bezel
Figure 2. Front View without Bezel (Shown with Standard Control Panel option)
Figure 3. Back View (Shown with 1+1 AC Power Supply Configuration)
Product Overvi ew Intel® Server Chassis SR2400
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1.2 Chassis Dimensions
Table 1. Chassis Dimensions
Height 87.5 mm 3.445”
Width 430 mm 16.930”
Depth 672 mm 26.457”
Max. Weight 27.22 kg 60 Lbs
1.3 System Components
Figure 4. Major Chassis Components (Shown with AC Power Supply Configuration)
A. Power Supply Modules G Slim Line Drive Bay
B. Power Distribution Board H Front Bezel (Optional)
C. Riser Card Assembly I Chassis Handles
D. Processor Air Duct J Control Panel
E. Fan Module (Shown with redundant fan configuration option) K Hard Drive Bays
F. Air Baffle
A
C
D
E
H
J
G
K
K
K
F
I
I
B
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The I/O connector locations on the back of the chassis are pre-cut, so the use of an I/O shield is
not required. The supplied EMI gasket must be installed to maintain Electromagnetic
Interference (EMI) compliance levels.
Figure 5. Back Panel Feature Overvi ew (Shown with 1+1 AC Power Supply Configuration)
A Low Profile PCI Add-in Card Slots I Video Connector
B Full Height PCI Add-in Card Slots J USB 1 Connector
C Power Supply Modules (1+1 Configuration Shown) K USB 2 Connector
D PS2 Keyboard and Mouse Ports L Diagnostic Post Code LEDs
E RJ45 Serial B Port M Management NIC (IMM - Advanced
Edition required)
F NIC #1 Connector N External SCSI Channel B Connector
G NIC #2 Connector O Non-redundant Power Module Fans
H DB9 Serial A Port Cut-out
A
F
E D
C B
J I H G M
L
KNO
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1.4 Hard Drive and Peripheral Bays
The SR2400 is designed to support several different hard drive and peripheral configurations.
The system can be configured to support either hot swap SCSI or SATA drives, or can be
configured to support cabled SATA drives. Each drive configuration requires an orderable kit
which includes the necessary cables, drive trays and applicable backplane. The sixth bay,
labeled “B” in the diagram below, can optionally be configured to support a sixth hard drive or
3.5” Tape Drive.
The slim-line peripheral bay (A) is capable of supporting one of the following devices: CDROM,
DVD, DVD-CDR, floppy drive. If both an optical drive and floppy drive are required, an optional
kit can be purchased to convert the first 1” drive bay (D) to a floppy drive bay. The kit includes
the necessary cables and mounting tray.
Figure 6. Front Panel Feature Overview
A Slimline drive bay (Floppy or Optical)
B Optional 6th HDD Drive or Tape Drive Bay
C System Control Panel
D 1” Hard Drive Bay or optional Floppy Drive Bay
E 1” Hard Drive Bays x5
A
E
D
C
B
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1.5 Control Panel Options
The Server Chassis SR2400 can support either of two control panels: a Standard Control Panel
and an Intel® Local Control Panel with LCD support. The control panel assemblies are pre-
assembled and modular in design. The entire module assembly slides into a predefined slot in
the front of the chassis.
Figure 7. Control Panel Modules
The standard control panel supports several push buttons and status LEDs, along with USB and
video ports to centralize system control, monitoring, and accessibility to within a common
compact design. The following diagram overviews the layout and functions of the control panel.
Figure 8. Standard Control Panel Overview
A Power / Sleep Button G System Identification LED
B NIC #2 Activity LED H System Identification Button
C NIC #1 Activity LED I System Reset Button
D Power / Sleep LED J USB 2.0 Connector
E System Status LED K Recessed NMI Button (Tool Required)
F Hard Drive Activity LED L Video Connector
A
B C D E F
G
H
I
J
L K
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The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and LCD display
to provide system accessibility, monitoring, and control functions. The following diagram
provides an overview of this control panel.
Figure 9. LCD Contol Panel Overview
A LCD Display G NIC 2 Activity LED
B LCD Menu Control Buttons H NIC 1 Activity LED
C ID LED I Hard Drive Activity LED
D Power LED J System Reset Button
E System Power Button K USB 2.0 Port
F System Status LED L NMI Buttom (Tool Required)
M USB 2.0 Port
Note: The Intel Local Control Panel can only be used when either the Intel Management Module
Professional Edition or Advanced Edition is installed in the system.
1.6 Power Subsystem
The SR2400 can be configured with either an AC-input power subsystem or a DC-input power
subsystem.
The AC power subsystem consists of an integrated power share board and module enclosure
which is capable of housing up to two 700 Watt AC power supply modules supporting 1+0 or
redundant 1+1 power configurations. In a 1+1 redundant configuration, each power supply
module is hot swappable should one fail.
The AC power subsystem has several integrated management features including:
• Status LED on each power module
• Over temperature protection circuitry
Over voltage protection circuitry
L
A
B
C
DF E
I HGJ
K
M
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With the addition of Server Management Software, the AC power subsystem is capable of
supporting several system management features including:
• Remote Power On/Off
• Status Alerting
FRU Information Reporting
Each power supply module operates within the following voltage ranges and ratings:
• 100 - 127VAC∼ at 50/60 Hertz (Hz); 8.9A maximum
200 - 240VAC∼ at 50/60 Hz; 4.5A maximum
The DC power subsystem consists of a Power Distribution Board (PDB) and up to two 600 Watt
DC power supply modules supporting 1+0 or redundant 1+1 power configurations. In a 1+1
redundant configuration, each power supply module is hot swappable should one fail.
1.7 System Cooling
The SR2400 has support for up to eight system fans in a modular 4+4 configuration. The bank
of fans closest to the baseboard is the default configuration providing sufficient airflow for both
cabled drive and hot-swap drive system configurations when external ambient temperatures
remain within specified limits. With the addition of a SATA or SCSI backplane to supply power,
the optional second bank of fans can be used to give the system fan redundancy should a fan
fail. In addition to the eight system fans, each power supply module installed provides an
additional two non-redundant fans pulling air from inside the chassis out the back.
1.8 Chassis Security
The SR2400 provides support for a lockable front bezel and a chassis intrusion switch.
1.9 Rack and Cabinet Mounting Options
The Server Chassis SR2400 was designed to support 19” wide by up to 30” deep server
cabinets. The chassis supports either of two rack mount options: A fixed mount relay rack /
cabinet mount or a tool-less sliding rail kit. The fixed mount relay rack / cabinet mount kit can be
configured to support both 2-post racks and 4-post cabinets. The tool-less sliding rail kit is used
to mount the chassis into a standard (19” by up to 30” deep) EIA-310D compatible server
cabinet.
1.10 Front Bezel Features
The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow.
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Figure 10. Optional Front Bezel
Separate front bezels are available to support systems that use either a Standard Control Panel
or Intel Local Control Panel.
When the Standard Control Panel is used, light pipes on the backside of the front bezel allow
the system status LEDs to be monitored with the front bezel in the closed position. The front
bezel lock is provided to prevent unauthorized access to hard drives, peripheral devices and the
control panel.
Figure 11. Front Bezel Supporting Standard Control Panel
When the Intel Local Control Panel is used, the control panel module can be adjusted to extend
further out from the chassis face to allow the LCD panel to protrude from the front bezel.
Figure 12. Front Bezel Supporting Intel Local Control Panel
Intel® Server Chassis SR2400 AC Power Subsystem
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2. AC Power Subsystem
The AC power subsystem of the SR2400 consists of an integrated Power Distribution Board
(PDB) and Power Module Enclosure assembly, with support for up to two 700 Watt AC power
supply modules. The power subsystem can be configured to support a single module in a 1+0
non-redundant configuration, or dual modules in a 1+1 redundant power configuration. In a 1+1
configuration, a single failed power module can be hot-swapped with the system running. Either
configuration will support up to a maximum of 700 Watts of power.
This chapter provides technical details to the operation of the power supply module and power
subsystem.
2.1 Mechanical Overview
The drawing below displays the Power Distribution Board + Module Enclosure assembly
(100)
400 +/- 1.0
83.5 +/- 0.5
CAGE
109.0 +/- 0.5
CAGE
106.0 +/- 0.5
MODULE
40.0 +/- 0.5
MODULE
300 +/- 0.5
FLANGE DETAILS TDB
MAX TBD
(100)
400 +/- 1.0
83.5 +/- 0.5
CAGE
109.0 +/- 0.5
CAGE
106.0 +/- 0.5
MODULE
40.0 +/- 0.5
MODULE
300 +/- 0.5
FLANGE DETAILS TDB
MAX TBD
Figure 13. Mechanical Drawing for Dual (1+1 configuration) PS enclosure with PDB
2.2 Power Module Population
In single power module configurations, the power module must be inserted into the top slot of
the power module enclosure. System and Power Supply thermals are not affected, however the
non-operating slot must have the power supply blank installed.
AC Power Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
10
2.3 Handle and Retention Mechanism
Each power supply module includes a handle allowing for module insertion to or removal from
the module enclosure. Each module has a simple retention mechanism to hold the power
module in place once it is inserted. This mechanism will withstand the specified platform
mechanical shock and vibration requirements. The tab on the retention mechanism is colored
Green to indicate it is a hot swap touch point. The latch mechanism is designed in such a way,
so that it prevents inserting the module with the power cord plugged in. This will aid the hot
swapping procedure.
2.4 Hot Swap Support
Hot swapping a power supply module is the process of inserting and extracting a power supply
module from an operating power system. During this process the output voltages shall remain
within specified limits. Up to 2 power supply modules may be on a single AC line. The power
supply module can be hot swapped by the following method:
Extraction: on removal, the power cord is unplugged first, and then the power module is
removed. This could occur in standby mode or power-on mode.
Insertion: The module is inserted first and then the power cord is plugged in. The system and
the supply will power on into Standby Mode or Power-On Mode.
2.5 Airflow
Each power supply module incorporates two non-redundant 40mm fans for self cooling and is
also used for partial system cooling. When installed in the system, the fans will provide
approximately 15.5 CFM airflow at max load/ max temp in a 1+0 configuration, through the
power supply and min 10CFM to the system. The air used to cool the power module is pre-
heated from the system before being drawn through the power module.
2.6 Output Cable Harness
A cable harness from the power distribution board is used to provide the system with the various
power interconnects. The harness size, connectors, and pin outs are shown below. Listed or
recognized component appliance wiring material (AVLV2), CN,
Rated 85°C Min, 300Vdc Min shall be used for all output wiring.
Table 2. Power Harness Cable Definitions
From Length mm To
connector # No of
pins Description
Power Distribution Board 140, turn
90° P1 2x12 Baseboard Power Connector
Power Distribution Board 270 P2 2x4 Processor Power Connector
Power Distribution Board 240 P3 1x5 Power Signal Connector
Power Distribution Board 100 P4 2x3 Hard Drive / Backplane Power Connector
Power Distribution Board 100 P5 1x4 Peripheral Power Connector
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 11
2.6.1 P1 – Baseboard Power Connector
• Connector Housing: 24-pin Molex Mini-Fit Jr. 39-01-2240 or equivalent.
Contact: Molex 44476-1111 or equivalent
Table 3. P1 Baseboard Power Connector
PIN SIGNALS 18 AWG COLOR PIN SIGNAL 18 AWG
COLORS
1 +3.3 VDC Orange 13 +3.3 VDC Orange
2* +3.3 VDC Orange 14
-12 VDC Blue
3.3V RS Orange/white (24 AWG) 15 COM Black
3* COM (GND) Black 16 PS_ON# Green
COM Black (24 AWG) 17 COM Black
4* 5 VDC Red 18 COM Black
5V RS Red (24 AWG) 19 COM Black
5 COM Black 20 Reserved (-5V in ATX) N.C.
6 +5 VDC Red 21 +5 VDC Red
7 COM Black 22 +5 VDC Red
8 PWR OK Gray 23 +5 VDC Red
9 5VSB Purple 24 COM Black
10 +12 V3 Yellow / Blue Stripe
11 +12 V3 Yellow / Blue Stripe
12 +3.3 VDC Orange
* Remote Sense wire double crimped
2.6.2 P2 – Processor Power Connector
• Connector Housing: 8-pin Molex 39-01-2080 or equivalent
Contact: Molex 44476-1111 or equivalent
Table 4. P2 Processor Power Connector
PIN SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS
1 COM Black 5 +12 V1 Yellow / Black Stripe
2 COM Black 6 +12 V1 Yellow / Black Stripe
3 COM Black 7 +12 V2 Yellow / White Stripe
4 COM Black 8 +12 V2 Yellow / White Stripe
Note: the 12V remote sense should be connected just before the 240VA current sense resistors on the
PDB.
AC Power Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
12
2.6.3 P3 – Power Signal Connector
Connector housing: 5-pin Molex 50-57-9405 or equivalent
Contacts: Molex 16-02-0088 or equivalent
Table 5. P3 Power Signal Connector
PIN SIGNAL 24 AWG COLORS
1 SMBus Clock (SCL) White /Green Stripe
2 SMBus Data (SDL) White / Yellow Stripe
3 SMBAlert# White
4 ReturnS Black / White Stripe
5 3.3RS Orange / White Stripe
Notes:
1. It is recommended to use gold plated signal connector contacts on both the PDB
connector and the baseboard header.
2. If the server signal connector is unplugged, the PS/PDB-combo shall not shut down or
go into an OVP condition.
2.6.4 P4 – Hard Drive / Backplane Power Connector
Connector housing: 6 Pin Molex Mini-Fit Jr. PN# 39-01-2065
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476
Table 6. P4 Hard Drive Interface Board Power Connector
PIN SIGNAL 18 AWG Colors PIN SIGNAL 18 AWG Colors
1 COM Black 4 +12 V4 Yellow
2 COM Black 5 +12 V4 Yellow
3 5V Red 6 5VSB Purple
2.6.5 P5 – Peripheral Power Connector
Connector housing: Amp 1-480424-0 or equivalent
Contact: Amp 61314-1 or equivalent
Table 7. P5 HDD Power Connector
PIN SIGNAL 18 AWG Colors
1 +12 V4 Yellow
2 COM Black
3 COM Black
4 +5 VDC Red
2.7 AC Input Requirements
The power supply module incorporates universal power input with active power factor correction,
which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards.
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 13
2.7.1 AC Inlet Connector
The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 15A / 250VAC.
2.7.2 Efficiency
The power supply combo (PS+PDB) has a minimum efficiency of 80% at maximum load and
over 100-240VAC line voltage range to guarantee proper power supply cooling while mounted
in the system.
2.7.3 AC Input Voltage Specification
The power supply module operates within all specified limits over the following input voltage
range, shown in the following table. Harmonic distortion of up to 10% of rated AC Input Voltage
must not cause the power supply to go out of specified limits. The power supply shall power off
on or after/below 75Vac ±5Vac range. The power supply shall start up on or before/above
85VAC ±4Vac. Application of an input voltage below 85VAC shall not cause damage to the
power supply, including a fuse blow.
Table 8. AC Input Rating
PA RAMETER MIN RATED MAX Start-up
Vac Power
Off
Vac
Max Input
AC Current
Max Rated
Input AC
Current
Line Voltage (110) 90Vrms 100-127 Vrms 140Vrms 85Vac ±4Vac 75Vac
±5Vac 9.9 Arms1,3 8.9Arms 4
Line Voltage (220) 180Vrms 200-240 Vrms 264Vrms - - 5.0 Arms2,3 4.5Arms 4
Frequency 47 Hz 50/60Hz 63 Hz
1 Maximum input current at low input voltage range shall be measured at 90Vac, at max
load.
2 Maximum input current at high input voltage range shall be measured at 180VAC, at
max load.
3 This is not to be used for determining agency input current markings.
4 Maximum rated input current is measured at 100VAC and 200VAC.
2.7.4 AC Line Dropout / Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC
line for any length of time. During an AC dropout of one cycle or less the power supply must
meet dynamic voltage regulation requirements over the rated load. An AC line dropout of one
cycle or less (20ms min) shall not cause any tripping of control signals or protection circuits (=
20ms holdup time requirement). If the AC dropout lasts longer than one cycle the power supply
should recover and meet all turn-on requirements. The power supply must meet the AC dropout
requirement over rated AC voltages, frequencies, and output loading conditions. Any dropout of
the AC line shall not cause damage to the power supply. The min holdup time requirement is as
follows:
20ms Min when tested under the following conditions: Max combined load = 600W, Line =
90Vac/47Hz,
18ms Min when tested under the following conditions: Max combined load = 650W, Line =
90Vac/47Hz, and 14ms Min when tested under the following conditions: Max combined load =
700W, Line = 90Vac/47Hz.
Note: The B+ bulk cap voltage shall not exceed 400Vpk at any time.
AC Power Subsystem Intel® Server Chassis SR2400
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Intel order number C78845-001
14
2.7.4.1 AC Line 5VSB Holdup
The 5VSB output voltage should stay in regulation under its full load (static or dynamic) during
an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in ON or OFF
state (PSON asserted or de-asserted).
2.7.5 AC Line Fuse
The power supply has a single line fuse, on the Line (Hot) wire of the AC input. The line fusing
is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush
current shall not cause the AC line fuse to blow under any conditions. All protection circuits in
the power supply shall not cause the AC fuse to blow unless a component in the power supply
has failed. This includes DC output load short conditions.
2.7.6 AC Inrush
The peak AC inrush current shall be less than 40A peak for one-quarter of the AC cycle and
less then the ratings of power supply’s critical AC input components, including: input fuse, bulk
caps, rectifiers, and surge limiting device. Also, a single inrush current disturbance I²t value
MUST NOT exceed 20% of the I²t rating of the power supply’s AC input fuse. The power supply
must meet the AC inrush current requirements for any rated AC voltage, during turn-on at any
phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after
AC dropout of any duration, and over the specified temperature range Top, (includes hot and
cold inrush).
2.7.7 AC Line Surge
The power supply is tested with the system for immunity to AC Ring Wave and AC
Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45:
1992.
The pass criteria include: No unsafe operation is allowed under any condition; all power supply
output voltage levels to stay within proper spec levels; No change in operating state or loss of
data during and after the test profile; No component damage under any condition.
2.7.8 AC Line Transient Specification
AC line transient conditions shall be defined as “sag” and “surge” conditions. “Sag” conditions
are also commonly referred to as “brownout”, these conditions will be defined as the AC line
voltage dropping below nominal voltage conditions. “Surge” will be defined to refer to conditions
when the AC line voltage rises above nominal voltage.
The power supply shall meet the requirements under the following AC line sag and surge
conditions.
Table 9. AC Line Sag Transient Performance
AC Line Sag (10sec interval between each sagging )
Duration Sag Operating AC Voltage Line Frequency Performance Criteria
Continuous 10% Nominal AC Voltage ranges 50/60Hz No loss of function or performance
0 to 1 AC
cycle 95% Nominal AC Voltage ranges 50/60Hz No loss of function or performance
> 1 AC cycle >30% Nominal AC Voltage ranges 50/60Hz Loss of function acceptable, self
recoverable
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 15
Table 10. AC Line Surge Transient Performance
AC Line Surge
Duration Surge Operating AC Voltage Line Frequency Performance Criteria
Continuous 10% Nominal AC Voltages 50/60Hz No loss of function or performance
0 to ½ AC
cycle 30% Mid-point of nominal AC
Voltages 50/60Hz No loss of function or performance
2.7.9 AC Line Fast Transient (EFT) Specification
The power supply meets the EN61000-4-5 directive and any additional requirements in
IEC1000-4-5:1995 and the Level 3 requirements for surge-withstand capability, with the
following conditions and exceptions:
• These input transients must not cause any out-of-regulation conditions, such as
overshoot and undershoot, nor must it cause any nuisance trips of any of the power
supply protection circuits.
• The surge-withstand test must not produce damage to the power supply.
The supply must meet surge-withstand test conditions under maximum and minimum
DC-output load conditions.
2.7.10 AC Line Leakage Current
The maximum leakage current to ground for each power supply module shall be not more then
3.5mA when tested at 240VAC.
2.8 DC Output Specification
2.8.1 Power Supply Mating Connector
The power distribution board provides an edge connector slot for each of the supported power
supply modules. Each power module has a keyed edge connector which is blind mated to the
edge connector slot of the PDB. The following table provides the pinout for both the connector
and slot.
Table 11. Power Supply Edge Connector Slot Pinout
Description Pin# Pin# Description
12VLS 1 70 PSON#
PWOK 2 69 PSKill
Reserved 3 68 SMBus SDA
Reserved 4 67 SMBus SCL
5VSB 5 66 Address A0
5VSB 6 65 Address A1
15Vcc (SB) 7 64 PSAlert#
ReturnS 8 63 12VS
Ground 9 62 Ground
Ground 10 61 Ground
Ground 11 60 Ground
Ground 12 59 Ground
Ground 13 58 Ground
Ground 14 57 Ground
Ground 15 56 Ground
Ground 16 55 Ground
Ground 17 54 Ground
Ground 18 53 Ground
70
1
36
35
AC Power Subsystem Intel® Server Chassis SR2400
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Intel order number C78845-001
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Description Pin# Pin# Description
Ground 19 52 Ground
Ground 20 51 Ground
Ground 21 50 Ground
Ground 22 49 Ground
Keying Notch
+12V 23 48 +12V
+12V 24 47 +12V
+12V 25 46 +12V
+12V 26 45 +12V
+12V 27 44 +12V
+12V 28 43 +12V
+12V 29 42 +12V
+12V 30 41 +12V
+12V 31 40 +12V
+12V 32 39 +12V
+12V 33 38 +12V
+12V 34 37 +12V
+12V 35 36 +12V
Figure 14. Power Module Edge Connector View
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 17
2.8.2 Grounding
The ground of the pins of the PDB output connectors provides the power return path. The
output connector ground pins are connected to safety ground (PDB enclosure).
2.8.3 Standby Output / Standby Mode
The 5VSB output shall be present when an AC input greater than the power supply turn-on AC
voltage is applied. Applying an external 5.25V to 5Vsb shall not cause the power supply to shut
down or exceed operating limits. When the external voltage is removed the voltage shall return
to the power supplies operating voltage without exceeding the dynamic voltage limits.
2.8.4 Remote Sense
The PDB 12V to 3.3V and 5V converters use remote senses to regulate out voltage drops in the
system for the +3.3V output. The remote sense output impedance to this DC/DC converter
must be greater than 200Ω. This is the value of the resistor connecting the remote sense to the
output voltage internal to the DC/DC converter. Remote sense must be able to regulate out of
up to 300mV drop on the +3.3V and 5V outputs. Also, the power supply ground return remote
sense (ReturnS) passes through the PDB and the output harness to regulate out ground drops
for its +12V and 5Vsb output voltages. The power supply uses remote sense (12VRS) to
regulate out drops up to the 240VA protection circuit on the PDB.
2.8.5 Power Module Output Pow er / Currents
The following table defines power and current ratings for the 700W continuous (810W pk) power
supply in 1+0 or 1+1 redundant configurations. The combined output power of both outputs
shall not exceed the rated output power. The power supply module must meet both static and
dynamic voltage regulation requirements for the minimum loading conditions. Also, the power
module shall be able to supply the listed peak currents and power for a minimum of 10 seconds.
Outputs are not required to be peak loaded simultaneously.
Table 12. Load Ratings
+12V +5Vsb
MAX Load 58.0A 2.0A
MIN DYNAMIC Load 5.0A 0.1A
MIN STATIC Load 1.0A 0A
PEAK Load (10 sec min) 67.0A 2.5A
Max Output Power (continuous), see note 1 12V x 58A = 696W max 5V x 2A = 10W max
Peak Output Power (for 10s min), see note 2 12V x 67A = 804W pk 5V x 2.5A = 12.5W pk
Note:
1. In reality, at max load the 12V output voltage is allowed to sag to –3%, which is 11.64V; so
the actual max power will then be: 11.64V x 58A = 675.12 W, and the same applies for
5VSB: 4.85Vx2A=9.7W; so total max continuous Power = 675.12+9.7=684.82W
2. In reality, at peak load the 12V output voltage is allowed to sag to –3%, which is 11.64V; so
the actual peak power will then be: 11.64V x 67A = 780 W; and the same applies to 5VSB:
4.85Vx2.5A=12.125W. The total peak power = 792 W pk.
AC Power Subsystem Intel® Server Chassis SR2400
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Intel order number C78845-001
18
2.8.6 +12V Outputs Load Requirements
This section describes the +12V output power requirements from the power distribution board
with a either single or dual ERP700W power supply module plugged into the input of the power
distribution board.
Note: The combined total power limit for all outputs is 700W max.
Table 13. +12V Outputs Load Ratings
+12V1/2/3/4 combined outpu t limit = 48A / 60A pk max
+12V1 +12V2 +12V3 +12V4
MAX Load 12.5A 12.5A 14A 10A
MIN Static / Dynamic Load 0.5 0.5 1.5A 1.5A
Peak load 15A 15A 17A 16A
Max Output Power, see note 1 12 x12.5 =150W 12 x12.5 =150W 12V x14A =168W 12V x10A =120W
2.8.7 DC/DC Converters Loading
The following table defines power and current ratings of 3 DC/DC converters located on the
PDB, each powered from the +12V rail. The 3 converters must meet both static and dynamic
voltage regulation requirements for the minimum and maximum loading conditions.
Note: 3.3V / 5V combined power limit: 140W max.
Table 14. DC/DC Converters Load Ratings
+12VDC Input DC/DC Converters
+3.3V Converter +5V Converter -12V Converter
MAX Load 24.0A 24.0A 0.5A
MIN Static / Dynamic Load 0.5A 0.5A 0A
Max Output Power, see note 1 3.3x24=79.2W 5x24=120W 0.5x12=6W
Notes:
1. The straight sum of the 3 max powers = 205.2W, but considering the 3.3/5V power limit, it
may be 140W +6W = 146W max combined power. In reality, at max load, each output voltage is
allowed to sag to Vmin, so the actual each max power will then be: for 3.3V: 3.2Vx24A =
76.8W, for 5V: 4.8Vx24A=115.2W; and for -12V: 11.4Vx0.5A=5.7W.
2.8.8 DC/DC Converters Voltage Regulation
The DC/DC converters’ output voltages must stay within the following voltage limits when
operating at steady state and dynamic loading conditions. All outputs are measured with
reference to the return remote sense signal (ReturnS). The 3.3V and 5V outputs are measured
at the remote sense point, all other voltages measured at the output harness connectors.
Table 15. Voltage Regulation Limits
Converter Output TOLERANCE MIN NOM MAX UNITS
+ 3.3VDC - 3% / +5% +3.20 +3.30 +3.465 VDC
+ 5VDC - 4% / +5% +4.80 +5.00 +5.25 VDC
+12VDC (12V1/2/3/4) -3%/ +5% +11.64 +12.00 +12.60 VDC
- 12VDC - 5% / +9% -11.40 -12.00 -13.08 VDC
5Vsb See PS spec, measured at the PDB harness connectors
Intel® Server Chassis SR2400 AC Power Subsystem
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2.8.9 DC/DC Converters Dynamic Loading
The output voltages shall remain within limits specified in the table above for the step loading
and capacitive loading specified in the following table. The load transient repetition rate shall be
tested between 50Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient
repetition rate is only a test specification.
Table 16. Transient Load Requirements
Output Max Δ Step Load Size Max Load Slew Rate Test capacitive Load
+ 3.3VDC 5.0A ( note 1) 0.5 A/μs 2000 μF
+ 5VDC 5.0A ( note 1) 0.5 A/μs 2000 μF
+12VDC (12V1/2/3/4) See the PS spec for details
- 12VDC Not rated Not rated 10 μF
+5Vsb See PS spec, measured at the PDB harness connectors As needed on PDB
Note 1: Min loads for Step loads on 3.3V and 5V outputs per table 3.
2.8.10 DC/DC Converter Capacitive Loading
The DC/DC converters shall be stable and meet all requirements with the following capacitive
loading ranges. Min capacitive loading applies to static load only.
Table 17. Capacitive Loading Conditions
Converter Output MIN MAX Units
+3.3VDC 10 10,000 μF
+5VDC 10 10,000 μF
-12VDC 1 100 μF
Note: Refer to the PS spec for the equivalent data on +12V output.
2.8.11 DC/DC Converters Closed Loop stability
Each DC/DC converter shall be unconditionally stable under all line/load/transient load
conditions. A minimum of: 45 degrees phase margin and -10dB-gain margin is required.
Closed-loop stability must be ensured at the maximum and minimum loads as applicable.
2.8.12 Common Mode Noise
The Common Mode noise on any output shall not exceed 350mV pk-pk over the frequency
band of 10Hz to 20MHz.
1. The measurement shall be made across a 100Ω resistor between each of DC outputs,
including ground,at the DC power connector and chassis ground (power subsystem
enclosure).
2. The test set-up shall use a FET probe such as Tektronix model P6046 or equivalent.
2.8.13 DC/DC Converters Ripple / Noise
The maximum allowed ripple/noise output of each DC/DC Converter is defined in the following
table. This is measured over a bandwidth of 0Hz to 20MHz at the PDB output connectors. A
10μF tantalum capacitor in parallel with a 0.1μF ceramic capacitor are placed at the point of
measurement.
AC Power Subsystem Intel® Server Chassis SR2400
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20
Table 18. Ripple and Noise
+3.3V Output +5V Output -12V Output
50mVp-p 50mVp-p 120mVp-p
2.8.14 Timing Requirements
These are the timing requirements for the PSM/PDB combo operation. The output voltages
must rise from 10% to within regulation limits (Tvout_rise) within 5 to 200ms, except for 5Vsb - it is
allowed to rise from 1.0 to 200ms. All outputs must rise monotonically.
The following table shows the timing requirements for the power supply/PDB combo being
turned on and off via the AC input, with PSON held low and the PSON signal, with the AC input
applied.
Table 19. Turn On / Off Timing
Item Description MIN MAX UNITS
Tsb_on_delay Delay fr om AC being applied to 5VSB being within regulation. 1500
ms
Tvout_on All main outputs must be within regulation of each other within this time 50
ms
Tvout_off All main outputs must be leave regulation of each other within this time 70
ms
T5Vsb_rise 5Vsb Output voltage rise time 1.0 200
ms
Tvout_rise Output voltages rise time 5.0 200
ms
T ac_on_delay Delay fr om AC being applied to all output voltages being within regulation. 2500
ms
Tvout_holdup Time all output voltages stay within regulation after loss of AC. 21 ms
Tpwok_holdup Delay from loss of AC to de-assertion of PWOK 20 ms
Tpson_on_delay Delay from PSON# active to output voltages within regulation limits. 5 400
ms
T pson_pwok Delay from PSON# de-active to PWOK being de-assert ed. 50
ms
Tpwok_on Delay from output voltages within regulation limits to PWOK asserted at turn
on. 100 1000
ms
T pwok_off Delay from PWOK de-asserted to output voltages dropping out of regulation
limits. 1 ms
Tpwok_low Duration of PWOK being in the de-asserted state during an off/on cycle using
AC or the PSON signal. 100 ms
Tsb_vout Delay from 5Vsb being in regulation to O/Ps being in regulation at AC turn on. 50 1000
ms
T5Vsb_holdup Time the 5Vsb output voltage stay s within regulation after loss of AC. 70 ms
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 21
Figure 15. Turn On/Off Timing (Power Supply/PDB combo Signals)
2.8.15 Residual Voltage Immunity in Standby Mode
Each DC/DC converter is immune to any residual voltage placed on its respective output
(typically a leakage voltage through the system from standby output) up to 1000mV. This
residual voltage shall not have any adverse effect on each DC/DC converter, such as: no
additional power dissipation or over-stressing / over-heating any internal components or
adversely affecting the turn-on performance (no protection circuits tripping during turn on).
While in Stand-by mode, at no load condition, the residual voltage on each DC/DC converter
output shall not exceed 100mV.
2.9 Protection Circuits
Protection circuits inside the PDB and the power supply module shall cause either the power
supply’s main +12V output to shutdown, which in turn shuts down the other 3 outputs on the
PDB or first shut down any of the 3 outputs on the PDB, which in turn also shuts down the entire
power supply combo. If the power supply latches off due to a protection circuit tripping, an AC
cycle OFF for 15sec min and a PSON# cycle HIGH for 1sec shall be able to reset the power
supply and the PDB.
2.9.1 Over-Current Protection (OCP)
Each DC/DC converter output on PDB shall have individual OCP protection circuits. The
PS+PDB combo shall shutdown and latch off after an over current condition occurs. This latch
shall be cleared by toggling the PSON# signal or by an AC power interruption. The following
table provides the over current limits. The values are measured at the PDB harness connectors.
The DC/DC converters shall not be damaged from repeated power cycling in this condition.
Also, the +12V output from the power supply is divided on the PDB into 4 channels and each is
limited to 240VA of power. There shall be current sensors and limit circuits to shut down the
entire PS+PDB combo if the limit is exceeded. The limits are listed below.
AC Power Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
22
Table 20. Over Current Protection Limits / 240VA Protection
Output Voltage MIN OCP TRIP LIMITS MAX OCP TRIP LIMITS
+3.3V 150% min (= 36A min) 187% max (= 45A max)
+5V 150% min (= 36A min) 187% max (= 45A max)
-12V 125% min (= 0.625A min) 560% max (= 2.8A max)
+12V1 120% min (= 18.0A min) 20A max (= 240VA max)
+12V2 120% min (= 18.0A min) 20A max (= 240VA max)
+12V3 111% min (= 19.0A min) 20A max (= 240VA max)
+12V4 112% min (= 18.0A min) 20A max (= 240VA max)
+5VSB See PS spec
The power supply module has a current limit to prevent the +12V and 5VSB outputs from
exceeding the values shown below. If the current limits are exceeded, the power supply module
shall shutdown and latch off. The latch will be cleared by toggling the PSON# signal or by an
AC power interruption. The power supply shall not be damaged from repeated power cycling in
this condition. 5VSB shall be protected under over-current or shorted conditions, so that no
damage can occur to the power supply.
Table 21. Power Module Over Current Protection Limit
Output Voltage OCP LIMITS
+12V 120% min (= 70.0A min); 140% max (= 80.0A max)
+5Vsb 120% min (= 2.4A min); 300% max (= 6.0A max)
2.9.2 Over Voltage Protection (OVP)
Each DC/DC converter output from the PDB has individual OVP protection circuits built in and is
locally sensed. The PS+PDB combo shall shutdown and latch off after an over voltage
condition occurs. This latch is cleared by toggling the PSON# signal or by an AC power
interruption. The following table provides the over voltage limits. The values are measured at
the PDB harness connectors. The voltage shall never exceed the maximum levels when
measured at the power pins of the output harness connector during any single point of fail. The
voltage shall never trip any lower than the minimum levels when measured at the power pins of
the PDB connector.
Table 22. Over Voltage Protection Limits
Output Voltage OVP MIN (V) OVP MAX (V)
+3.3V 4.0 4.5
+5V 5.7 6.5
-12V -13.5 -14.5
+12V1/2/3/4 See PS spec
The power supply module over voltage protection shall be locally sensed. The power supply
module will shutdown and latch off after an over voltage condition occurs. This latch can be
cleared by toggling the PSON# signal or by an AC power interruption. The following table
provides the over voltage limits for the power supply module. The values are measured at the
output of the power module’s connectors. The voltage shall never exceed the maximum levels
when measured at the power pins of the power module connector during any single point of fail.
The voltage shall never trip any lower than the minimum levels when measured at the power
pins of the power module connector.
Intel® Server Chassis SR2400 AC Power Subsystem
Revision 2.0
Intel order number C78845-001 23
Table 23. Power Module Over Voltage Protection Limits
Output Voltage OVP MIN (V) OVP MAX (V)
+12V 13.0 14.0
+5Vsb 5.7 6.5
2.9.3 Over Temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shutdown. When
the power supply temperature drops to within specified limits, the power supply shall restore
power automatically, while the 5VSB remains always on. The OTP trip level shall have a
minimum of 4°C of ambient temperature hysteresis, so that the power supply will not oscillate on
and off due to temperature recovery condition. The power supply shall alert the system of the
OTP condition via the power supply FAIL signal and the PWR LED.
2.10 SMBus Monitoring Interface
The PS+PDB combo provides a monitoring interface to the system over a server management
bus. The SMBus pull-ups are located on the motherboard.
This shall provide power monitoring, failure conditions, warning conditions, and FRU data. Two
pins have been reserved on the connector to provide this information. One pin is the Serial
Clock (PSM Clock). The second pin is used for Serial Data (PSM Data). Both pins are bi-
directional and are used to form a serial I2C bus. For redundant power supplies: The device(s)
in the power supply shall be located at an address(s) determined by address pins A0 and A1.
The circuits inside the power supply shall be powered from the 5VSB bus and grounded to
ReturnS (remote sense return). For redundant power supplies the device(s) shall be powered
from the system side of the OR-ing device. The EEPROM for FRU data in each power supply is
hard wired to allow writing data to the device.
There are two usage modes depending on the system. The system shall control the usage
mode by setting the Usage Mode bit.
• Default Mode: In this mode, the LEDs and registers must automatically clear when a
warning event has occurred, because there is no software, BIOS, or other agent that will
access the power supply via SMBus to do any clearing.
• Intelligent Mode: A system management controller or BIOS agent exists that can read
and clear status. In this mode, the LEDs and registers should latch when a warning
event occurs so that the system and user can read their status before it changes during
transient events. There should also be a mechanism to allow the system management
or BIOS to ‘force’ the LED states in order to identify which power supply should be
replaced.
Critical events will cause the power supply to shutdown and latch the LED and SMBAlert signal
no matter what mode the power supply is in: “default mode” or “intelligent mode”.
Warning events latch the LED and SMBAlert signal when in “intelligent” mode. If in the “default
mode”, the LED and SMBAlert signal will de-assert as soon as the condition driving the event
clears.
For redundant 1+1 configuration: If the power supply has failed due to an open AC fuse and
therefore has no input power, the LED and SMBAlert signal must still operate with another
operating power supply in parallel. Therefore, these circuits must be powered from the output
side of the 5VSB OR-ing device.
AC Power Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
24
For non-redundant 1+0 configuration: If the power supply fails due to over temperature
shutdown, over current shutdown, over power shutdown, or fan failure: the LED, SMBAlert
signal, and critical event registers, shall still operate correctly. If the supply fails due to loss of
AC or open fuse, then the LED and signals will have no power and therefore will not operate.
2.10.1 Hot Plug I2C Requirements
Since the redundant power supplies will be asynchronously installed and powered-on in a
system, the SMBus devices on the supply need to be tolerant of joining the SMBus in the middle
of a SMBus transaction and ignore bus activity after being powered on until a valid start of
transaction is seen.
2.10.2 Power Supply Failure Communication
Here, there is no failure signal from the power supply to the PDB. The SMBus Alert signal will
assert if something (critical or warning) is going wrong with the power supply. Then the system
will need to poll the power supply via the SMBus to see what type of warning or failure condition
has occurred.
2.10.3 LED Control
There shall be two bits to control the power supply LEDs. One bit forces the Amber LED ON
and Green LED OFF. Another bit forces the Amber LED to blink at 1Hz and the Green LED
OFF. Writing a 1b to these bits forces the LEDs to these states. Writing a 0b allows control of
the LED back to the power supply.
There will be a single bi-color LED to indicate power supply status. The LED operation is
defined below.
Table 24. LED Indicators
Power Supply Condition Bi-Color LED
No AC power to all power supplies OFF
No AC power to this PSU only (for 1+1 configuration)
or
Power supply critical event causing a shutdown:
failure, fuse blown (1+1 only), OCP, OVP, Fan Failed
AMBER
Power supply warning events where the power supply continues to operate:
high temp, high power, high current, slow fan. 1Hz Blink AMBER
AC present / Only 5VSB on (PS Off) 1Hz Blink GREEN
Output ON and OK GREEN
The LED is visible on the rear panel of each installed power supply module.
There shall be bits that allow the LED state to be forced via SMBus. The following capabilities
are required:
• Force Amber ON for failure conditions.
• Force Amber 1Hz Blink for warning conditions.
• No Force (LED state follows power supply present state)
The power-on default should be ‘No Force’. The default is restored whenever PSON transitions
to assert.
Intel® Server Chassis SR2400 DC Power Subsystem
Revision 2.0
Intel order number C78845-001 25
3. DC Power Subsystem
The DC power subsystem of the SR2400 consists of a Power Distribution Board (PDB) and up
to two 600 Watt DC power supply modules. The power subsystem can be configured to support
a single module in a 1+0 non-redundant configuration, or dual modules in a 1+1 redundant
power configuration. In a 1+1 configuration, a single failed power module can be hot-swapped
with the system running. Either configuration will support up to a maximum of 600 Watts of
power.
The PDB and the 600 Watt DC power supply module are identical to the ones used in Intel®
Carrier Grade Server TIGI2U. For technical details, refer to TIGI2U PDB specification and
TIGI2U DC Power Supply specification.
Cooling Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
26
4. Cooling Subsystem
A 4+4 system fan module, the power supply fans, air baffle, CPU air duct and drive bay
population are the necessary components to provide the system with the necessary air flow and
air pressure to maintain the system’s thermals when operating at or below maximum specified
thermal limits. See Table 70. System Environmental Limits.
4.1 4+4 System Fan Module
The primary airflow for the system is provided by a removable plastic fan housing which secures
up to eight 60mm x 38mm multi-speed fans.
Eight 6-pin connectors on the fan distribution board provide each fan with power and
tachometer output, allowing it to be monitored independently by server management software.
The following table provides the pin-out for the connectors on each fan and corresponding
header on the fan distribution board.
Table 25. Individual Fan Pinout (J8B2, J6B1, J3B1, J1B1, J8A1, J6A1, J3A1, J1A1)
Pin Signal Name Description
1 Speed Control Control the fan speed
2 Err LED Show the fan active status
3 Tachometer Two pulse per revolution speed monitor
4 GND Ground return
5 GND Ground return
6 Reserved Reserved
Figure 16. Fan Distribution Board Layout
There are two fan control connectors located on the fan distribution board. The 24-pin connector,
found on the side of the board closest to the baseboard, is cabled to a matching connector on
the baseboard. This connector provides power and fan speed control to the first four fans and
provides management pins for all eight fans. The 2x5 connector found on the opposite edge of
the board is used to provide power and fan speed control for the optional remaining bank of four
fans and is cabled to either the SCSI or SATA backplane. The following tables provide the pin-
out for each of the two fan control connectors.
Intel® Server Chassis SR2400 Cooling Subsystem
Revision 2.0
Intel order number C78845-001 27
Table 26. 24-pin Fan Control Connector Pinout (J3K6, J8C1)
24-pin connector on Baseboard (J3K6) 24-pin connector on FDB (J8C1)
Pin Signal Name Pin Signal Name
1 BB_LED_FAN4_R 1 BB_LED_FAN6_R
2 BB_LED_FAN2_R 2 BB_LED_FAN8_R
3 BB_LED_FAN3_R 3 BB_LED_FAN5_R
4 BB_LED_FAN1_R 4 BB_LED_FAN7_R
5 FAN_TACH_8 5 FAN_SPEED_CNTL2
6 FAN_TACH_4 6 FAN_SPEED_CNTL2
7 FAN_TACH_7 7 FAN_SPEED_CNTL1
8 FAN_TACH_3 8 FAN_SPEED_CNTL2
9 FAN_TACH_6 9 GND
10 FAN_TACH_2 10 GND
11 FAN_TACH_5 11 GND
12 FAN_TACH_1 12 GND
13 GND 13 FAN_TACH_1
14 GND 14 FAN_TACH_5
15 GND 15 FAN_TACH_2
16 GND 16 FAN_TACH_6
17 FAN_SPEED_CNTL2 17 FAN_TACH_3
18 FAN_SPEED_CNTL1 18 FAN_TACH_7
19 FAN_SPEED_CNTL2 19 FAN_TACH_4
20 FAN_SPEED_CNTL2 20 FAN_TACH_8
21 BB_LED_FAN7_R 21 BB_LED_FAN1_R
22 BB_LED_FAN5_R 22 BB_LED_FAN3_R
23 BB_LED_FAN8_R 23 BB_LED_FAN2_R
24 BB_LED_FAN6_R 24 BB_LED_FAN4_R
Table 27. 10-pin Fan Control Connector Pinout (J4l1, J7A1)
10-pin connecto r o n Backplane (J4L1) 10-pin connector on FDB (J7A1)
Pin Signal Name Pin Signal Name
1 BP_FAN_SPEED_CNTL1 1 BP_FAN_SPEED_CNTL1
2 FAN_PRESENT 2 FAN_PRESENT
3 GND 3 GND
4 GND 4 GND
5 BP_FAN_SPEED_CNTL2 5 BP_FAN_SPEED_CNTL2
6 GND 6 GND
7 BP_FAN_SPEED_CNTL2 7 BP_FAN_SPEED_CNTL2
8 GND 8 GND
9 BP_FAN_SPEED_CNTL2 9 BP_FAN_SPEED_CNTL2
10 Key 10 Key
The system fan module has been designed for ease of use and has support for several
management features that can be utilized by the baseboard management system.
• Each fan is designed for tool-less insertion to or removal from the fan module. However,
the fans are not hot swappable. The server must be turned off before a fan can be
replaced.
• Each fan within the module is capable of supporting multiple speeds. If the internal
ambient temperature of the system exceeds the value programmed into the thermal
sensor data record (SDR), the Baseboard Management Controller (BMC) firmware will
increase the speed for all the fans within fan module.
Cooling Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
28
• Each fan connector within the module supplies a tachometer signal allowing for
baseboard management to monitor the status of each fan. If one of the fans should fail,
the remaining fans will increase their rotation and attempt to maintain the thermal
requirements of the system.
• Each fan within the module is equipped with a failure LED. In the event of a fan failure,
the failure LED on the failing fan can be illuminated by baseboard management. Note:
the fan failure LED functionality is only supported when the system is configured with an
Intel® Management Module (IMM).
Default Fan Bank
Optional Fan Bank
Power Connect from
Backplane
Fault LED Air Flow
Default Fan Bank
Optional Fan Bank
Power Connect from
Backplane
Fault LED Air Flow
Figure 17. Fan Module Assembly
4.2 Fan Redundancy
By default, the Server Chassis SR2400 comes with four system fans. Under normal operating
conditions, these fans provide enough cooling for the system but offer no fan redundancy. If a
fan should fail, the system may heat up beyond its thermal limits causing the system to
shutdown.
The fan module is designed to support an additional four system fans, supporting a 4+4 fan
configuration. In systems configured with an Intel Management Module, fan redundancy is
supported in the event of a fan failure. Should a fan fail, the remaining seven system fans will
speed up providing adequate cooling to the system. This redundancy model will allow for a
single fan failure only. Should a second fan fail, fan redundancy is lost and the system may
heat up beyond its thermal limits. A failed fan should be replaced as soon as possible.
With no Intel Management Module installed, a 4+4 fan configuration can be used but is not
recommended due to increased acoustics. Fans will operate faster with little cooling benefit. In
this configuration there is no fan redundancy. Should any of the eight fans fail, the system may
heat up beyond its thermal limits.
Intel® Server Chassis SR2400 Cooling Subsystem
Revision 2.0
Intel order number C78845-001 29
4.3 Air Flow Support
To control airflow within the system, the Server Chassis SR2400 uses a combination air baffle
and CPU Air Duct to isolate and direct airflow to three critical areas or zones: the Power Supply
Zone, the Full Height PCI Zone, and the CPU/Memory/Low Profile PCI Zone.
4.3.1 Power Supply Zone
An air baffle is used to isolate the air flow of the main system board zones from the zone directly
behind the power supply. As the power supply fans pull pre-heated air through the power
supply from inside the chassis, the zone behind it must remain as cool as possible by drawing
air from the leftmost drive bays only.
4.3.2 Full Height Riser Zone
The Full Height Riser zone is the area between the power supply and the full height riser card of
the riser assembly. The air flow through this area is generated by FAN4 of the fan module in a
non-redundant fan configuration. In a redundant fan configuration, the air flow for this zone is
provided by FAN4 and FAN8. Air is drawn from the drive bay area through the fan and pushed
out of the system through ventilation holes the back side of the chassis.
4.3.3 CPU / Memory / Low Profile PCI Zone
The CPU / Memory / Low Profile PCI zone is the area between the Low Profile Riser card of the
riser assembly and the right chassis wall. In a non-redundant fan configuration, the air flow for
this zone is generated by system fans FAN1, FAN2, and FAN3 of the fan module. In a
redundant fan configuration, the air flow for this zone is provided by system fans FAN1 and
FAN5, FAN2 and FAN6, and FAN3 and FAN7. Air is drawn from the drive bay area, through the
fans, directed through the CPU Air Duct, and out through ventilation holes on both the back wall
and rear side wall of the chassis.
The CPU Air duct is used to direct air flow through the processor heat sinks for both single and
dual processor configurations. For single processor configurations, a flexible air baffle is
attached to the air duct as shown in the following diagram.
Figure 18. CPU Air Duct with Air Baffle
Operating a single processor configuration without the air baffle installed will result in the
processor over heating and may cause the system to shutdown.
Cooling Subsystem Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
30
4.4 Drive Bay Population
To maintain the proper air pressure within the system, all hard drive bays must be populated
with either a hard drive, or drive blank.
Figure 19. Drive Blank
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 31
5. Peripheral and Hard Drive Support
The SR2400 server chassis can be configured to support several different types of hard drive
and peripheral configurations. The chassis can support up to five hard disk drives, a slim-line
optical or floppy drive, and an optional 6th hard drive or tape drive.
5.1 Slimline Drive Bay
The chassis provides a slim-line drive bay that can be configured for either CDROM, DVD, or
Floppy drives with or without the presence of a backplane. The peripheral drives are mounted
on a tool-less tray which allows for easy installation into and removal from the chassis. Once
inserted into the chassis, the assembly locks into place. For removal, the chassis top cover
must be removed and the locking latch disengaged.
5.1.1 Floppy Drive Support
A slim-line floppy drive can be supported in multiple system configurations.
5.1.1.1 Floppy Drive Use with Installed Backplane
When either a SCSI or SATA backplane is installed, the slim-line floppy drive is cabled directly
to a connector on the backplane. The following table defines the 28-pin connector which
supplies both power and IO signals.
Table 28. 28-pin floppy connector Pinout (J4)
Pin Name Pin Name
1 P5V 15 GND
2 FD_INDEX_L 16 FD_WDATA_L
3 P5V 17 GND
4 FD_DS0_L 18 FD_WGATE_L
5 P5V 19 GND
6 FD_DSKCHG_L 20 FD_TRK0_L
7 Unused 21 GND
8 Unused 22 FD_WP_L
9 2M_MEDIA 23 GND
10 FD_MTR0_L 24 FD_RDATA_L
11 Unused 25 GND
12 FD_DIR_L 26 FD_HDSEL_L
13 FD_DENSEL0 27 GND
14 FD_STEP_L 28 GND
5.1.1.2 Floppy Drive Use with No Backplane Present
When no backplane is present, an interposer card is attached to the floppy drive providing
power and IO interconnects between the drive, power supply and baseboard. The interposer
card has three connectors; the first has 28 pins which is mated directly to the drive. The pinout
for this connector is defined in the previous table. The second connector has 4 pins and is
cabled to the 2x3 pin power lead from the power supply. This connector has the following
pinout.
Table 29. 4-pin floppy power connector Pinout (J3)
Pin Name
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
32
1 P12V
2 GND
3 GND
4 P5V
The power cable for the floppy drive is included in the Cabled Drive Accessory kit.
The third connector has 34 pins and is cabled to the legacy floppy connector on the baseboard.
This connector has the following pinout.
Table 30. 34-pin floppy connector Pinout (J2)
Name Pin Pin Name
GND 1 2 FD_DENSEL0
GND 3 4 2M_MEDIA
GND 5 6 FD_DRATE0_L
GND 7 8 FD_INDEX_L
GND 9 10 FD_MTR0_L
GND 11 12 FD_DS1_L
GND 13 14 FD_DS0_L
GND 15 16 FD_MTR1_L
Unused 17 18 FD_DIR_L
GND 19 20 FD_STEP_L
GND 21 22 FD_WDATA_L
GND 23 24 FD_WGATE_L
GND 25 26 FD_TRK0_L
Unused 27 28 FD_WP_L
GND_FDD 29 30 FD_RDATA_L
GND 31 32 FD_HDSEL_L
MSEN0 33 34 FD_DSKCHG_L
5.1.1.3 Optional Floppy Drive Configuration
For system configurations that require both Optical and Floppy drives, where using a USB
Floppy or USB CDROM is not desired or feasible, an accessory kit is available which allows a
slim-line floppy drive to be mounted into the hard drive bay directly beneath the slim-line bay as
shown in the following diagram.
Figure 20. Optional Floppy Drive Configuration
5.1.2 IDE Optical Drive Support
A slim-line IDE CDROM or DVD drive can be supported in different system configurations as
defined in the following sub-sections.
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 33
5.1.2.1 Optical Drive Use with Installed Backplane
When either a SCSI or SATA backplane is installed, an interposer card is attached to the drive
providing the interface to the backplane. The interposer has two connectors; the first has 50
pins and plugs directly into the back of the drive. The following table defines the 50-pin
connector which supplies both power and IO signals.
Table 31. 50-pin Drive connector Pinout (J6)
Name Pin Pin Name
RSV_LCM 1 2 RSV_RCM
RSV_GND 3 4 GND
RST_IDE_S_L 5 6 IDE_SDD<8>
IDE_SDD<7> 7 8 IDE_SDD<9>
IDE_SDD<6> 9 10 IDE_SDD<10>
IDE_SDD<5> 11 12 IDE_SDD<11>
IDE_SDD<4> 13 14 IDE_SDD<12>
IDE_SDD<3> 15 16 IDE_SDD<13>
IDE_SDD<2> 17 18 IDE_SDD<14>
IDE_SDD<1> 19 20 IDE_SDD<15>
IDE_SDD<0> 21 22 IDE_SDDREQ
GND 23 24 IDE_SDIOR_L
IDE_SDIOW_L 25 26 GND
IDE_SIORDY 27 28 IDE_SDDACK_L
IRQ_IDE_S 29 30 NC_IDEIO16_L
IDE_SDA<1> 31 32 NC_CBL_DET_S
IDE_SDA<0> 33 34 IDE_SDA<2>
IDE_SDCS0_L 35 36 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 37 38 P5V
P5V 39 40 P5V
P5V 41 42 P5V
GND 43 44 GND
GND 45 46 GND
IDEP_ALE_H 47 48 GND
49 50
52 Unused (50 pin or 52 pin)
The second connector located on the opposite side of the PCB from the first, has 44 pins and is
cabled directly to a matching connector on the backplane. The pinout for this connector is
defined in the following table.
Table 32. 44-pin internal Drive Interposer-to-Backplane Connector Pinout (J6)
Name Pin Pin Name
RST_IDE_S_L 1 2 GND
IDE_SDD<7> 3 4 IDE_SDD<8>
IDE_SDD<6> 5 6 IDE_SDD<9>
IDE_SDD<5> 7 8 IDE_SDD<10>
IDE_SDD<4> 9 10 IDE_SDD<11>
IDE_SDD<3> 11 12 IDE_SDD<12>
IDE_SDD<2> 13 14 IDE_SDD<13>
IDE_SDD<1> 15 16 IDE_SDD<14>
IDE_SDD<0> 17 18 IDE_SDD<15>
GND 19 20 Unused
IDE_SDDREQ 21 22 GND
IDE_SDIOW_L 23 24 GND
IDE_SDIOR_L 25 26 GND
IDE_SIORDY 27 28 IDEP_ALE_H
IDE_SDDACK_L 29 30 GND
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
34
Name Pin Pin Name
IDE_IDE_S 31 32 NC_IDEIO16_L
IDE_SDA<1> 33 34 IDE_CBL_DET_S
IDE_SDA<0> 35 36 IDE_SDA<2>
IDE_SDCS0_L 37 38 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 39 40 GND
P5V 41 42 GND
P5V 43 44 P5V
5.1.2.2 IDE Optical Drive Use with No Backplane Present
When no backplane is present, an interposer card is attached to the drive providing the
interface to the baseboard and power. The interposer card has three connectors; the first has
50 pins and is plugged directly into the drive connector. The pinout for this 50 pin connector is
defined in the previous sub-section. The second connector has 4 pins and is cabled to the 2x3
pin power cable from the power supply. This connector has the following pinout.
Table 33. 4-pin Drive Power Connector Pinout (J5)
Pin Name
1 P12V
2 GND
3 GND
4 P5V
Note: The power cable adapter used to connect the drive to the power cable from the power
supply is included in the Cabled Drive Accessory kit.
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 35
The third connector has 40 pins and is cabled to the legacy IDE connector on the baseboard.
This connector has the following pinout.
Table 34. 40-pin IDE Optical Drive Interposer-to-Baseboard connector Pinout (J1)
Name Pin Pin Name
RST_IDE_S_L 1 2 GND
IDE_SDD<7> 3 4 IDE_SDD<8>
IDE_SDD<6> 5 6 IDE_SDD<9>
IDE_SDD<5> 7 8 IDE_SDD<10>
IDE_SDD<4> 9 10 IDE_SDD<11>
IDE_SDD<3> 11 12 IDE_SDD<12>
IDE_SDD<2> 13 14 IDE_SDD<13>
IDE_SDD<1> 15 16 IDE_SDD<14>
IDE_SDD<0> 17 18 IDE_SDD<15>
GND 19 20 Unused
IDE_SDDREQ 21 22 GND
IDE_SDIOW_L 23 24 GND
IDE_SDIOR_L 25 26 GND
IDE_SIORDY 27 28 IDEP_ALE_H
IDE_SDDACK_L 29 30 GND
IDE_IDE_S 31 32 NC_IDEIO16_L
IDE_SDA<1> 33 34 IDE_CBL_DET_S
IDE_SDA<0> 35 36 IDE_SDA<2>
IDE_SDCS0_L 37 38 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 39 40 GND
5.2 Hard Disk Drive Bays
The Server Chassis SR2400 can be configured to support 5 (default) + 1 optional hot swap
SCSI or SATA hard disk drives or 3 SATA cabled hard disk drive configurations. For hot swap
drive configurations, 3.5” x 1” hard disk drives are mounted to hot swap drive trays for easy
insertion to or extraction from the drive bay. For cabled drive configurations, the SATA hard
drives are mounted to a fixed mount drive tray which is only removable when detached from
inside the chassis.
5.2.1 Hot Swap Drive Trays
In a hot swap configuration, each hard drive must be mounted to a hot swap drive tray, making
insertion and extraction of the drive from the chassis very simple. Each drive tray has its own
dual purpose latching mechanism which is used to both insert/extract drives from the chassis
and lock the tray in place. Each drive tray supports a light pipe providing a drive status indicator,
located on the backplane, to be viewable from the front of the chassis.
Note: Depending on the controller used, SATA hard disk drives may not report errors using the
drive’s status indicator.
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
36
OM11684
C
E
A
B
D
Figure 21. Hard Drive Tray Assembly
A. Hard Drive
B. Drive Carrier
C. Side Rail
D. Mounting Screw
E. Hard Drive Connector
5.2.2 Fixed Mount Drive Trays
In a cabled SATA drive configuration, each hard drive must be mounted to a fixed mount drive
tray. The tray is designed to slide into the drive bay and lock into place. To remove the drive,
the chassis must be opened to disengage the drive tray latch from the bay.
Figure 22. Fixed Drive Tray w/Blank
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
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5.3 Hot-Swap SCSI Backplane
The Server Chassis SR2400 supports a multifunctional SCSI Backplane, designed around the
QLogic® GEM359 enclosure management controller and provides the following feature set and
functionality:
• QLogic® GEM359 enclosure management controller
o External non-volatile Flash ROM
o Two I2C interfaces
o Low Voltage Differential (LVD) SCSI Interface
o SCSI-3 compatible
o Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE) specification,
version 1.00 and addendum
o Compliance with Intelligent Platform Management Interface (IPMI)
• Five SCA-2 compatible hot-swap SCSI connectors
• Designed to support an optional 6th SCSI hard drive, or power for a tape drive.
• Onboard LVD SCSI Termination – SPI-4 compatible
• Temperature Sensor
• FRU EEPROM
• One 2x3-pin Power Connector
• Fan Control Connector
• Slim-line IDE Connector for optical drive support
• Slim-line Floppy Drive Connector
• Control Panel Connector
• Provides a pathway for floppy, control panel, IDE, and video signals from the baseboard
to the appropriate connectors
5.3.1 Hot-Swap SCSI Backplane Placement and Board Layout
The Hot-Swap SCSI Backplane installs on the back side of the hot-swap drive bay inside the
chassis. Alignment features on the chassis and backplane assembly make for easy tool-less
installation. The following diagram shows the layout of components and connectors on the Hot-
swap SCSI Backplane printed circuit board.
Figure 23. Hot-Swap SCSI Backplane Layout
A B C E
D
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Note: To prevent the backplane from flexing when installing or removing hard drives from the
drive bay, the system top cover must be on the system. Having the top cover installed will
ensure the drives attach securely to the drive connectors on the backplane.
Table 35. SCSI Backplane Layout Description
Reference Description
A Floppy Drive Connector
B IDE Optical Drive Connector
C SCA2 Hard Drive Connectors
D 6th Drive Insert (optional)
E Control Panel Connector
5.3.2 SCSI Backplane Functional Architecture
The following figure shows the functional blocks of the hot-swap SCSI backplane. This section
provides a high-level description of the functionality distributed between them.
Figure 24. SCSI Backplane Block Diagram
5.3.2.1 Enclosure Management Controller
The QLogic® GEM359 is an enclosure management controller for the SCSI backplane and
monitors various aspects of a storage enclosure. The chip provides in-band SAF-TE and SES
management through the SCSI interface. The GEM359 also supports the IPMI specification by
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
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providing management data to a baseboard management controller through the 100-pin
connector.
The GEM359 comes in a 144-pin Low profile Quad Flat Pack package and operates from 3.3V
and has an input clock frequency of 10MHz. It has general input and output pins that allow
customization. Some of these GPIOs are used for drive detection and power controller
enable/disable functionality.
5.3.2.1.1 SCSI Interface
The GEM359 supports LVD SCSI operation through 8-bit asynchronous SCSI data transfers.
The following SCSI Command Set is supported:
• Inquiry
• Read Buffer
• Write Buffer
• Test Unit Ready
• Request Sense
• Send Diagnostic
• Receive Diagnostic
The GEM359 supports the following SAF-TE Command Set:
• Read Enclosure Configuration
• Read Enclosure Status
• Red Device Slot Status
• Read Global Flags
• Write Device Slot Status
• Perform Slot Operation
5.3.2.1.2 I2C Serial Bus Interface
The GEM359 supports two independent I2C interface ports with bus speeds of up to 400Kbits.
The I2C core incorporates 8-bit FIFOs for data transfer buffering. The I2C bus supports the
National® LM75 or equivalent I2C -based temperature sensors. This enables actual temperature
value readings to be returned to the host. The Intelligent Platform Management Bus (IPMB) is
supported through I2C port 1.
The figure below provides a block diagram of the I2C bus connection implemented on the SCSI
HSBP.
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
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Figure 25. SCSI I2C Block Diagram
5.3.2.1.3 Temperature Sensor
The SCSI HSBP provides a National* LM75 or equivalent temperature sensor with over-
temperature detector. The host can query the LM75 at any time to read the temperature. The
host can program both the temperature alarm threshold and the temperature at which the alarm
condition goes away.
The temperature sensor has the I2C address of 0x90 on GEM359’s Port 0.
5.3.2.1.4 Serial EEPROM
The SCSI HSBP provides an Atmel* 24C02 or equivalent serial EEPROM for storing the FRU
information. The 24C02 provides 2048 bits of serial electrically erasable and programmable
read-only
The seriall EEPROM has the I2C addres of 0xA6 on GEM359’s Port 0.
5.3.2.1.5 External Memory Device
The SCSI HSBP contains a non-volatile 16K Top Boot Block, 4Mbit Flash memory device that
stores the configuration data and operating firmware executed by the GEM359’s internal CPU.
The Flash memory operates off the 3.3V rail and housed in a 48-pin TSOP Type 1 package.
5.3.2.1.6 Drive Activity / Fault LEDs
The SCSI backplane provides Drive Activity/Fault LED Indicators, mounted near each SCA-2
connector. The driving circuitry is entirely contained on the backplane. The SCSI HD itself drives
the ACTIVITY LED whenever the drive gets accessed. The GEM359 controller drives the
FAULT LED whenever an error condition, as defined by the FW, gets detected.
5.3.3 SCSI Backplane Connector Definitions
As a multifunctional board, several different connectors can be found on the SCSI backplane.
This section defines the purpose and pin-out associated with each connector.
5.3.3.1 Power Connectors
The SCSI backplane provides power to the six drive bays supporting up to six hard drives or five
hard drives and an optional type drive. The SCSI backplane also provides 5VSB to the optional
Intel Local Control Panel.
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A 6-pin power cable from the power supply harness is routed to the backplane and plugs into a
2x3 shrouded plastic PC power connector. The following table provides the connector pinout.
Table 36. SCSI Backplane Power Connector Pinout (J9)
Pin Name Pin Name
1 GND 4 P12V
2 GND 5 P12V
3 P5V 6 P5V_STBY
To support an optional tape drive or 6th SCSI hard drive, a cable is routed from a 7-pin
connector on the backplane to either the tape drive or the optionally installed 6th drive add-in
board. This connector routes both power and LED control to these devices. The following table
provides the pin-out to the 1x7 un-shrouded header.
Table 37. 7-pin SCSI power connector Pinout (J1)
Pin Name
1 P12V
2 GND
3 GND
4 P5V
5 SCSI5_MATED_L
6 GND
7 HD5_ACT_LED_L
5.3.3.2 Redundant Fan Power Connector
The SCSI backplane provides two pulse width modulated (PWM) power outputs to control the
optional bank of four system fans. Two control PWM inputs are generated from the baseboard’s
LM93 health monitor IC and routed through the high density 100 pin Front Panel/Floppy/IDE flex
circuit interface. Two high frequency PWM amplifying circuits are located on the backplane and
the output is routed to a 2X5 pin header for the bank of redundant fans.
Table 38. 10-pin Redundant Fan Connector Pinout (J5)
Pin Name Pin Name
1 FAN_SPEED_CTL_1 2 R_FAN_PRESENT
3 GND 4 GND
5 FAN_SPEED_CTL_2 6 GND
7 FAN_SPEED_CTL_2 8 GND
9 FAN_SPEED_CTL_2 10 KEY
PWM 1 supports one system fan with max current of 1.7A. PWM 2 supports up to three system
fans with max current limit of 5.0A.
5.3.3.3 SCA2 Hot-Swap Connectors
The SCSI Backplane provides five hot-swap SCA2 connectors that provide power and SCSI
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signals using a single connector. An optional sixth drive connector can be added by installing
the 6th Drive Option Kit. Each SCA drive attaches to the backplane using one of these
connectors.
Figure 26. 80-pn SCA2 Connector
Table 39. 80-pin SCA-2 SCSI Interface Pinout (J9, J2, J10, J11, J12)
Signal Name Pin Pin Signal Name
GND 41 1 P12V
GND 42 2 P12V
GND 43 3 P12V
SCSI_MATED 44 4 P12V
NC_3V_CHG 45 5 NC_3V_1
BP_SCSI_DIFSNS 46 6 NC_3V_2
BP_SCSI_D11P 47 7 BP_SCSI_D11N
BP_SCSI_D10P 48 8 BP_SCSI_D10N
BP_SCSI_D9P 49 9 BP_SCSI_D9N
BP_SCSI_D8P 50 10 BP_SCSI_D8N
BP_SCSI_IOP 51 11 BP_SCSI_ION
BP_SCSI_REQP 52 12 BP_SCSI_REQN
BP_SCSI_CDP 53 13 BP_SCSI_CDN
BP_SCSI_SELP 54 14 BP_SCSI_SELN
BP_SCSI_MSGP 55 15 BP_SCSI_MSGN
BP_SCSI_RSTP 56 16 BP_SCSI_RSTN
BP_SCSI_ACKP 57 17 BP_SCSI_ACKN
BP_SCSI_BSYP 58 18 BP_SCSI_BSYN
BP_SCSI_ATNP 59 19 BP_SCSI_ATNN
BP_SCSI_DP0P 60 20 BP_SCSI_DP0N
BP_SCSI_D7P 61 21 BP_SCSI_D7N
BP_SCSI_D6P 62 22 BP_SCSI_D6N
BP_SCSI_D5P 63 23 BP_SCSI_D5N
BP_SCSI_D4P 64 24 BP_SCSI_D4N
BP_SCSI_D3P 65 25 BP_SCSI_D3N
BP_SCSI_D2P 66 26 BP_SCSI_D2N
BP_SCSI_D1P 67 27 BP_SCSI_D1N
BP_SCSI_D0P 68 28 BP_SCSI_D0N
BP_SCSI_DP1P 69 29 BP_SCSI_DP1N
BP_SCSI_D15P 70 30 BP_SCSI_D15N
BP_SCSI_D14P 71 31 BP_SCSI_D14N
BP_SCSI_D13P 72 32 BP_SCSI_D13N
BP_SCSI_D12P 73 33 BP_SCSI_D12N
SCSI_MATED 74 34 P5V
GND 75 35 P5V
GND 76 36 P5V
HD_ACT_LED_L 77 37 Unused
Unused 78 38 GND
Unused 79 39 Unused
Unused 80 40 Unused
GND B2 B1 GND
The HSBP provides active termination, termination voltage, a reset-able fuse, and a protection
diode for each SCSI channel. By design, the on-board termination cannot be disabled.
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5.3.3.4 Serverboard to SCSI Interconnect
A 68-pin SCSI cable is used to interface the SCSI backplane with either the on-board SCSI
channel of the server board or an add-in PCI SCSI controller.
Figure 27. 68-pin SCSI Cable Connector
Table 40. Ultra2 (LVD) SCSI Connector Pinout (J8)
Name Pin Pin Name
BP_SCSI_D12P A1 B1 BP_SCSI_D12N
BP_SCSI_D13P A2 B2 BP_SCSI_D13N
BP_SCSI_D14P A3 B3 BP_SCSI_D14N
BP_SCSI_D15P A4 B4 BP_SCSI_D15N
BP_SCSI_DP1P A5 B5 BP_SCSI_DP1N
BP_SCSI_D0P A6 B6 BP_SCSI_D0N
BP_SCSI_D1P A7 B7 BP_SCSI_D1N
BP_SCSI_D2P A8 B8 BP_SCSI_D2N
BP_SCSI_D3P A9 B9 BP_SCSI_D3N
BP_SCSI_D4P A10 B10 BP_SCSI_D4N
BP_SCSI_D5P A11 B11 BP_SCSI_D5N
BP_SCSI_D6P A12 B12 BP_SCSI_D6N
BP_SCSI_D7P A13 B13 BP_SCSI_D7N
BP_SCSI_DP0P A14 B14 BP_SCSI_DP0N
GND A15 B15 GND
BP_SCSI_DIFSNS A16 B16 GND
TERMI_PWR A17 B17 TERMI_PWR
TERMI_PWR A18 B18 TERMI_PWR
Unused A19 B19 Unused
GND A20 B20 GND
BP_SCSI_ATNP A21 B21 BP_SCSI_ATNN
GND A22 B22 GND
BP_SCSI_BSYP A23 B23 BP_SCSI_BSYN
BP_SCSI_ACKP A24 B24 BP_SCSI_ACKN
BP_SCSI_RSTP A25 B25 BP_SCSI_RSTN
BP_SCSI_MSGP A26 B26 BP_SCSI_MSGN
BP_SCSI_SELP A27 B27 BP_SCSI_SELN
BP_SCSI_CDP A28 B28 BP_SCSI_CDN
BP_SCSI_REQP A29 B29 BP_SCSI_REQN
BP_SCSI_IOP A30 B30 BP_SCSI_ION
BP_SCSI_D8P A31 B31 BP_SCSI_D8N
BP_SCSI_D9P A32 B32 BP_SCSI_D9N
BP_SCSI_D10P A33 B33 BP_SCSI_D10N
BP_SCSI_D11P A34 B34 BP_SCSI_D11N
5.3.3.5 Server Board to Floppy/CP/IDE/Video Interface
As a multifunctional board, the SCSI backplane provides a pathway for Floppy Disk, Control
Panel and CD-ROM signals from the server board to connector interfaces for each of the
devices. The baseboard and backplane have matching 100-pin high density connectors which
are attached using a mylar flex cable. The following table provides the pin-out for the 100-pin
connector.
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Table 41. 100-pin Floppy / CP / CD-ROM / Video Connector Pinout (J6)
Pin Name Pin Name
A1 GND B1 V_IO_VSYNC_BUFF_FP_L
A2 V_IO_RED_CONN_FP B2 V_IO_HSYNC_BUFF_FP_L
A3 V_IO_GREEN_CONN_FP B3 1_WIRE_BUS
A4 V_IO_BLUE_CONN_FP B4 EMP_DCD2_L
A5 VIDEO_IN_USE B5 EMP_CTS2_L
A6 EMP_DTR2_L B6 EMP_SOUT2
A7 EMP_RTS2_L B7 EMP_IN_USE
A8 EMP_SIN2 B8 NIC2_ACT_LED_L
A9 EMP_DSR2_L B9 NIC2_LINK_LED_R_L
A10 FP_NMI_BTN_L B10 FP_CHASSIS_INTRU
A11 GND B11 PB1_I2C_5VSB_SCL
A12 FP_ID_SW_L B12 PB1_I2C_5VSB_SDA
A13 FAULT_LED_5VSB_P B13 NIC1_ACT_LED_L
A14 FP_RST_BTN_L B14 NIC1_LINK_LED_R_L
A15 HDD_FAULT_LED_R_L B15 FP_ID_LED_R_L
A16 FP_PWR_BTN_L B16 IPMB_I2C_5VSB_SCL
A17 HDD_LED_ACT_R_L B17 P5V_STBY
A18 HDD_LED_5V_A B18 FP_SYS_FLT_LED2_R_L
A19 IMPB_I2C_5VSB_SDA B19 FP_SYS_FLT_LED_R_L
A20 GND B20 FP_PWR_LED_R_L
A21 FP_PWR_LED_5VSB B21 RST_IDE_S_L
A22 RST_P6_PWRGOOD B22 FD_HDSEL_L
A23 FD_DSKCHG_L B23 FD_RDATA_L
A24 FD_WPD_L B24 FD_WDATA_L
A25 FD_TRK0_L B25 FD_STEP_L
A26 FD_WGATE_L B26 FD_MTR0_L
A27 FD_DIR_L B27 FD_DENSEL0
A28 FD_DS0_L B28 FD_INDEX_L
A29 GND B29 IDE_SDD<8>
A30 IDE_SDD<7> B30 IDE_SDD<9>
A31 IDE_SDD<6> B31 IDE_SDD<10>
A32 IDE_SDD<5> B32 IDE_SDD<11>
A33 IDE_SDD<4> B33 IDE_SDD<12>
A34 IDE_SDD<3> B34 IDE_SDD<13>
A35 IDE_SDD<2> B35 IDE_SDD<14>
A36 IDE_SDD<1> B36 IDE_SDD<15>
A37 IDE_SDD<0> B37 IDE_SDDREQ
A38 GND B38 IDE_SDIOW_L
A39 IDE_SDDACK_L B39 IDE_SDIOR_L
A40 IDE_SDA<1> B40 IDE_SIORDY
A41 IDE_SDA<0> B41 IRQ_IDE_S
A42 IDE_SDCS0_L B42 IDE_SDA<2>
A43 IDE_SEC_HD_ACT_L B43 IDE_SDCS1_L
A44 GND B44 FAN_PWM1
A45 Reserved B45 R_FAN_PRESENT
A46 Reserved B46 Reserved
A47 Reserved B47 Reserved
A48 Reserved B48 Reserved
A49 FAN_PWM2 B49 Reserved
A50 P5V_STBY B50 GND
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5.3.3.6 Floppy Drive Connector
With a slim-line floppy drive installed into either the slim-line drive bay or the optionally installed
floppy drive kit located in one of the hard drive bays, the floppy cable is routed to a 28-pin
connector on the backplane. The following table provides the pin-out for the floppy connector.
Table 42. 28-pin floppy connector Pinout (J15)
Pin Name Pin Name
1 P5V 15 GND
2 FD_INDEX_L 16 FD_WDATA_L
3 P5V 17 GND
4 FD_DS0_L 18 FD_WGATE_L
5 P5V 19 GND
6 FD_DSKCHG_L 20 FD_TRK0_L
7 Unused 21 GND
8 Unused 22 FD_WP_L
9 23 GND
10 FD_MTR0_L 24 FD_RDATA_L
11 Unused 25 GND
12 FD_DIR_L 26 FD_HDSEL_L
13 FD_DENSEL0 27 GND
14 FD_STEP_L 28 GND
5.3.3.7 Internal IDE Optical Drive Connector
With an IDE Optical drive installed in the slim-line drive bay, the drive cable is routed from a
connector on the drive interposer card to a 44-pin connector on the backplane. This connector
houses pins for both power and IO signals. The following table provides the connector pinout.
Table 43. 44-pin internal CD-ROM connector Pinout (J3)
Name Pin Pin Name
RST_IDE_S_L 1 2 GND
IDE_SDD<7> 3 4 IDE_SDD<8>
IDE_SDD<6> 5 6 IDE_SDD<9>
IDE_SDD<5> 7 8 IDE_SDD<10>
IDE_SDD<4> 9 10 IDE_SDD<11>
IDE_SDD<3> 11 12 IDE_SDD<12>
IDE_SDD<2> 13 14 IDE_SDD<13>
IDE_SDD<1> 15 16 IDE_SDD<14>
IDE_SDD<0> 17 18 IDE_SDD<15>
GND 19 20 Unused
IDE_SDDREQ 21 22 GND
IDE_SDIOW_L 23 24 GND
IDE_SDIOR_L 25 26 GND
IDE_SIORDY 27 28 IDEP_ALE_H
IDE_SDDACK_L 29 30 GND
IDE_IDE_S 31 32 NC_IDEIO16_L
IDE_SDA<1> 33 34 IDE_CBL_DET_S
IDE_SDA<0> 35 36 IDE_SDA<2>
IDE_SDCS0_L 37 38 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 39 40 GND
P5V 41 42 GND
P5V 43 44 P5V
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5.3.3.8 Control Panel Interface Connector
The SCSI backplane provides a pathway for control panel signals from the high density 100-pin
connector to a 50-pin control panel connector. The pin-out for the connector is shown in the
following table.
Table 44. 50-pin SCSI Backplane to Control Panel Connector Pinout (J5)
Description Pin # Pin # Description
V_IO_RED_CONN_FP 1 2 GND
V_IO_GREEN_CONN_FP 3 4 GND
V_IO_BLUE_CONN_FP 5 6 GND
V_IO_HSYNC_BUFF_FP_L 7 8 GND
V_IO_VSYNC_BUFF_FP_L 9 10 GND
VIDEO_IN_USE 11 12 1_WIRE_BUS
EMP_DTR2_L 13 14 EMP_DCD2_L
EMP_RTS2_L 15 16 EMP_CTS2_L
EMP_SIN2_L 17 18 EMP_SOUT2
EMP_DSR2_L 19 20 EMP_IN_USE
FP_NMI_BTN_L 21 22 Unused
NIC2_ACT_LED_L 23 24 NIC2_LINK_LED_R_L
FP_ID_SW_GND 25 26 FP_CHASSIS_INTRU
FP_ID_SW_L 27 28 BP_I2C_SCL
GND 29 30 BP_I2C_SDA
FP_RST_BTN_L 31 32 NIC1_ACT_LED_L
HDD_FAULT_LED_R_L 33 34 NIC1_LINK_LED_R_L
FP_PWR_BTN_L 35 36 FP_ID_LED_R_L
IPMB_I2C_5VSB_SCL 37 38 GND
IPMB_I2C_5VSB_SDA 39 40 HDD_LED_5V_A
FP_PWER_LED_R_L 41 42 FAULT_LED_5VSB_P
FP_PWR_LED_5VSB 43 44 FP_SYS_FLT_LED2_R_L
RST_P6_PWRGOOD 45 46 FP_SYS_FLT_LED_R_L
HDD_LED_ACT_R_L 47 48 P5V
PWR_LCD_5VSB 49 50 PWR_LCD_5VSB
5.3.4 Optional 6Th SCSI Drive
The SCSI Backplane is capable of supporting a 6th SCSI hard drive with the addition of an
optionally installed backplane add-in board. The 6th drive add-in board assembly consists of a
PCB with power and interface connectors, and a mounting bracket allowing for the add-in card
to slide into a fitted cut out on the existing backplane.
Using a standard SCA2 type connector, the 6th SCSI hard drive is fully hot swappable.
When the 6th drive add-in card is installed, the SCSI cable from the serverboard is routed to the
lower of two 68 pin connectors on the backside of the add-in card. Then a second custom cable
is routed from the second (upper) 68-pin connector to a matching connector on the backplane.
See the SCSI Connector tables found early in this chapter for details on the pinout definition for
each of the connectors.
Power for the 6th hard drive is provided by attaching a seven wire cable from the backplane to a
matching connector on the add-in board. The following table provides the pinout for the 7-pin
power connector.
Table 45. 6th Drive 7-pin Power Connector Pinout
Pin Name
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1 P12V
2 GND
3 GND
4 P5V
5 SCSI5_MATED_L
6 GND
7 HD5_ACT_LED_L
The entire 6th Drive assembly, including: PCB, bracket, power cable, and SCSI BP to Add-in
Board cable are available in on optional accessory kit.
5.4 Hot-Swap SATA Backplane
The SR2400 server chassis supports a multifunctional SATA Backplane designed around the
QLogic* GEM424 enclosure management controller. The following features and functions are
supported:
• QLogic® GEM424 enclosure management controller
o External non-volatile SEEPROMs
o Three I2C interfaces
o SATA and SATA-II extension compatible
o Compliance with SATA Accessed Fault Tolerant Enclosures (SAF-TE) specification,
version 1.00 and addendum
o Compliance with Intelligent Platform Management Interface 1.5 (IPMI)
• Support for up to five hot swap SATA Drives
• Designed to support an optional 6th hot swap SATA hard drive or power for a tape drive.
• Temperature Sensor
• FRU EEPROM
• One 2 x 3-pin Power Connector
• Fan Control Connector
• Slim-line IDE Connector for optical drive support
• Slim-line Floppy Drive Connector
• Control Panel Connector
• Drive Status LEDs
• Provides a pathway for floppy, control panel, IDE, and video signals from the baseboard
to the appropriate connectors
5.4.1 SATA Backplane Layout
The Hot-Swap SATA Backplane installs on the back side of the hot-swap drive bay inside the
chassis. Alignment features on the chassis and backplane assembly make for easy tool-less
installation. The following diagram shows the layout of components and connectors found on
the board.
A CDB E
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
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Figure 28. SATA Backplane Layout
Table 46. SATA Backplane Layout Reference Descriptions
Reference Description
A Floppy Drive Connector
B IDE Optical Drive Connector
C Hot Swap SATA Drive Connectors
D 6th Hot Swap SATA Drive Add-in Module (Optional)
E 50-Pin Control Panel Connector
Note: To prevent the backplane from flexing when installing or removing hard drives from the
drive bay, the system top cover must be on the system. Having the top cover installed will
ensure the drives attach securely to the drive connectors on the backplane.
5.4.2 SATA Backplane Functional Architecture
The figure below shows the functional blocks of the SATA backplane.
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Figure 29. SATA Backplane Functional Block Diagram
5.4.2.1 Enclosure Management Controller
The QLogic* GEM424 is an enclosure management controller for the SATA backplane and
monitors various aspects of a storage enclosure. The chip provides in-band SAF-TE and SES
management through the SATA Host I2C interface. The GEM424 also supports the IPMI
specification by providing management data to a baseboard management controller through the
IPMB via the 100-pin connector.
The GEM424 comes in a 80-pin Thin Quad Flat Pack (TQFP) package and operates from 3.3V
and input clock frequency of 20MHz. It has general input and output pins that allow for
customization. These GPIOs are used for hardware drive detection and driving FAULT and
ACTIVITY LEDs.
5.4.2.1.1 SATA Interface
The GEM424 implements SAF-TE over the HBA I2C interface, and supports the following SAF-
TE Command Set:
• Read Enclosure Configuration
• Read Enclosure Status
• Red Device Slot Status
• Read Global Flags
• Write Device Slot Status
• Perform Slot Operation
5.4.2.1.2 I2C Serial Bus Interface
The GEM424 supports two independent I2C interface ports with bus speeds of up to 400Kbits.
The I2C core incorporates 8-bit FIFOs for data transfer buffering. The I2C bus supports the
National* LM75 or equivalent I2C -based temperature sensors. This enables actual temperature
value readings to be returned to the host. The Intelligent Platform Management Bus (IPMB) is
supported through I2C port 0.
The figure below provides a block diagram of I2C bus connection implemented on the SR2400
2U SATA HSBP.
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Figure 30. SATA Backplane I2C Block Diagram
5.4.2.2 Temperature Sensor
The SATA HSBP uses a National® LM75 or equivalent temperature sensor with over-
temperature detector. The host can query the LM75 at any time to read the temperature.
The temperature sensor has the I2C address of 0x90h on GEM424’s Port 0.
5.4.2.3 Serial EEPROM
The SATA HSBP uses an Atmel* 24C02 or equivalent serial EEPROM for storing the FRU
information. The 24C02 provides 2048 bits of serial electrically erasable and programmable
read-only
The serial EEPROM has the I2C addres of 0xA6h on GEM424’s Port 1.
5.4.2.4 External Memory Device
The SATA HSBP uses non-volatile 32K and 64K Serial EEPROM devices for Boot and Run-
Time/Configuration code storage respectively. These devices reside on the GEM424’s private
I2C bus.
The SEEPROMs operate off the 5.0V rail and are housed in 8-pin SOIC packages
5.4.3 LEDs
The SATA HSBP contains a green ACTIVITY LED and an amber FAULT LED for each of the
six drive connectors. The ACTIVITY LED is driven by both the GEM424 controller and SATA
drives themselves using pin 11 on the connector. Therefore systems with newer SATA drives
supporting pin 11 can support drive activity regardless of what SATA controller is used. The
FAULT LED is driven by the GEM424 controller whenever an error condition is detected.
Activity and Fault LED functions are only available when a SATA host controller that supports
the SAF-TE protocol over I2C is connected to the SR2400 2U SATA HSBP via the SATA Host
I2C connector, J7M3.
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 51
Table 47. SATA LED Function Definitions
STATUS LED DEFINITION
GREEN ON HDD Activity
AMBER ON HDD Fault
AMBER Blinking Rebuild in Progress
5.4.4 SATA Backplane Connectors
As a multifunctional board, several different connectors can be found on the SATA backplane.
This section defines the purpose and pin-out associated with each connector.
5.4.4.1 Power Connectors
The SATA backplane provides power to the six drive bays supporting up to six hard drives or
five hard drives and an optional type drive. The SCSI backplane also provides 5VSB to the
optional LCD control panel assembly.
A 6-pin power cable from the power supply harness is routed to the backplane and plugs into a
2x3 shrouded plastic PC power connector. The following table provides the connector pinout.
Table 48. SATA Backplane Power Connector Pinout
Pin Name Pin Name
1 GND 4 P12V
2 GND 5 P12V
3 P5V 6 P5V_STBY
The SATA HSBP has one connector that allows integration of the 2U SATA Option Board into
the HSBP. This connector provides power from the HSBP to the Option board and Drive
presence detect and HDD5 Activity from the option board back to the HSBP.
The following table defines the pin-out of the 2U SATA Option Board power connector J2L1.
Table 49. Option Board Power Connector Pin-out
Pin Signal Name Definition
1 SCSI5+12V 12V power to SATA HD5
2 GND Ground
3 GND Ground
4 SCSI5+5V 5V power to SATA HD5
5 HD5_PRESENT SATA HD5 Presence Detect
6 GND Ground
7 HDD5_ACT_LED_L SATA HD5 Activity (driven directly from HDDs
that support the feature)
To support an optional tape drive, a power cable is routed from a 4-pin connector on the
backplane to the tape drive. The following table provides the pin-out for this connector.
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
52
Table 50. 4-pin SATA optional tape dirve power connector Pinout (J15)
Pin Name
1 P12V
2 GND
3 GND
4 P5V
The power cable for this connector is provided with the Tape Drive Accessory Kit.
5.4.4.2 Redundant Fan Power Connector
The SATA backplane provides two pulse width modulated (PWM) power outputs to control the
optional bank of four system fans. Two control PWM inputs are generated from the baseboard’s
LM93 health monitor IC and routed through the high density 100 pin Control Panel/Floppy/IDE
flex circuit interface. Two high frequency PWM amplifying circuits are located on the backplane
and the output is routed to a 2X5 pin header for the bank of redundant fans.
Table 51. 10-pin Redundant Fan Connector Pinout (J5)
Pin Name Pin Name
1 FAN_SPEED_CTL_1 2 R_FAN_PRESENT
3 GND 4 GND
5 FAN_SPEED_CTL_2 6 GND
7 FAN_SPEED_CTL_2 8 GND
9 FAN_SPEED_CTL_2 10 KEY
PWM 1 supports one system fan with max current of 1.5A. PWM 2 supports up to three system
fans with max current limit of 4.5A
5.4.4.3 SATA Connectors
The SATA backplane has five 7-pin SATA connectors. These connectors relay SATA signals
from the baseboard to the ATA drives. Each connector is used for a separate SATA channel
and is configured as a bus master. The following table provides the connector pinout.
Table 52. 7-Pin SATA Connector Pinout (J2, J3, J4, J5, J6)
Pin Name
1 GND
2 DRV_RX_P
3 DRV_RX_N
4 GND
5 DRV_TX_P
6 DRV_TX_N
7 GND
8 GND
9 GND
5.4.4.4 Hot-Swap SATA Connectors to Drive
The SATA drive interface combines both SATA and power signals into a single connector. The
pin-out of the drive interface connector is the same as a standard ATA and power connector.
The following table provides the pinout.
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 53
Table 53. 22-Pin SATA Connector Pinout (J7, J8, J9, J10, J11)
Name Pin Pin Name
GND 1 13 GND
DRV_RX_P 2 14 SCSI+5V
DRV_RX_N 3 15 SCSI+5V
GND 4 16 SCSI+5V
DRV_TX_P 5 17 GND
DRV_TX_N 6 18 Unused
GND 7 19 GND
P3V3 8 20 SCSI+12V
P3V3 9 21 SCSI+12V
P3V3 10 22 SCSI+12V
GND 11 23 GND
GND 12 24 GND
5.4.4.5 Baseboard to Floppy/FP/IDE/Video Interface
As a multifunctional board, the SATA backplane provides a pathway for Floppy Disk, Control
Panel and CD-ROM signals from the server board to connector interfaces for each of the
devices. The server board and backplane have matching 100-pin high density connectors which
are attached using a mylar flex cable. The following table provides the pin-out for the 100-pin
connector.
Table 54. 100-pin Floppy/FP/IDE/Video Connector
Pin Name Pin Name
A1 GND B1 V_IO_VSYNC_BUFF_FP_L
A2 V_IO_RED_CONN_FP B2 V_IO_HSYNC_BUFF_FP_L
A3 V_IO_GREEN_CONN_FP B3 1_WIRE_BUS
A4 V_IO_BLUE_CONN_FP B4 EMP_DCD2_L
A5 VIDEO_IN_USE B5 EMP_CTS2_L
A6 EMP_DTR2_L B6 EMP_SOUT2
A7 EMP_RTS2_L B7 EMP_IN_USE
A8 EMP_SIN2 B8 NIC2_ACT_LED_L
A9 EMP_DSR2_L B9 NIC2_LINK_LED_R_L
A10 FP_NMI_BTN_L B10 FP_CHASSIS_INTRU
A11 GND B11 PB1_I2C_5VSB_SCL
A12 FP_ID_SW_L B12 PB1_I2C_5VSB_SDA
A13 FAULT_LED_5VSB_P B13 NIC1_ACT_LED_L
A14 FP_RST_BTN_L B14 NIC1_LINK_LED_R_L
A15 HDD_FAULT_LED_R_L B15 FP_ID_LED_R_L
A16 FP_PWR_BTN_L B16 IPMB_I2C_5VSB_SCL
A17 HDD_LED_ACT_R_L B17 P5V_STBY
A18 HDD_LED_5V_A B18 FP_SYS_FLT_LED2_R_L
A19 IMPB_I2C_5VSB_SDA B19 FP_SYS_FLT_LED_R_L
A20 GND B20 FP_PWR_LED_R_L
A21 FP_PWR_LED_5VSB B21 RST_IDE_S_L
A22 RST_P6_PWRGOOD B22 FD_HDSEL_L
A23 FD_DSKCHG_L B23 FD_RDATA_L
A24 FD_WPD_L B24 FD_WDATA_L
A25 FD_TRK0_L B25 FD_STEP_L
A26 FD_WGATE_L B26 FD_MTR0_L
A27 FD_DIR_L B27 FD_DENSEL0
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
54
Pin Name Pin Name
A28 FD_DS0_L B28 FD_INDEX_L
A29 GND B29 IDE_SDD<8>
A30 IDE_SDD<7> B30 IDE_SDD<9>
A31 IDE_SDD<6> B31 IDE_SDD<10>
A32 IDE_SDD<5> B32 IDE_SDD<11>
A33 IDE_SDD<4> B33 IDE_SDD<12>
A34 IDE_SDD<3> B34 IDE_SDD<13>
A35 IDE_SDD<2> B35 IDE_SDD<14>
A36 IDE_SDD<1> B36 IDE_SDD<15>
A37 IDE_SDD<0> B37 IDE_SDDREQ
A38 GND B38 IDE_SDIOW_L
A39 IDE_SDDACK_L B39 IDE_SDIOR_L
A40 IDE_SDA<1> B40 IDE_SIORDY
A41 IDE_SDA<0> B41 IRQ_IDE_S
A42 IDE_SDCS0_L B42 IDE_SDA<2>
A43 IDE_SEC_HD_ACT_L B43 IDE_SDCS1_L
A44 GND B44 FAN_PWM1
A45 FAN5_TACH B45 R_FAN_PRESENT
A46 FAN6_TACH B46 FAN5_ERR_LED
A47 FAN7_TACH B47 FAN6_ERR_LED
A48 FAN8_TACH B48 FAN7_ERR_LED
A49 FAN_PWM2 B49 FAN8_ERR_LED
A50 P5V_STBY B50 GND
5.4.4.6 Control Panel Interface Connector
The SATA backplane provides a pathway for control panel signals from the 100-pin connector to
the control panel (FP) connector. The pinout for the FP connector is shown in the following table.
Table 55. 50-pin Control Panel Connector
Description Pin # Pin # Description
V_IO_RED_CONN_FP 1 2 GND
V_IO_GREEN_CONN_FP 3 4 GND
V_IO_BLUE_CONN_FP 5 6 GND
V_IO_HSYNC_BUFF_FP_L 7 8 GND
V_IO_VSYNC_BUFF_FP_L 9 10 GND
VIDEO_IN_USE 11 12 1_WIRE_BUS
EMP_DTR2_L 13 14 EMP_DCD2_L
EMP_RTS2_L 15 16 EMP_CTS2_L
EMP_SIN2_L 17 18 EMP_SOUT2
EMP_DSR2_L 19 20 EMP_IN_USE
FP_NMI_BTN_L 21 22 Unused
NIC2_ACT_LED_L 23 24 NIC2_LINK_LED_R_L
FP_ID_SW_GND 25 26 FP_CHASSIS_INTRU
FP_ID_SW_L 27 28 BP_I2C_SCL
GND 29 30 BP_I2C_SDA
FP_RST_BTN_L 31 32 NIC1_ACT_LED_L
HDD_FAULT_LED_R_L 33 34 NIC1_LINK_LED_R_L
FP_PWR_BTN_L 35 36 FP_ID_LED_R_L
IPMB_I2C_5VSB_SCL 37 38 GND
IPMB_I2C_5VSB_SDA 39 40 HDD_LED_5V_A
FP_PWER_LED_R_L 41 42 FAULT_LED_5VSB_P
FP_PWR_LED_5VSB 43 44 FP_SYS_FLT_LED2_R_L
RST_P6_PWRGOOD 45 46 FP_SYS_FLT_LED_R_L
HDD_LED_ACT_R_L 47 48 Unused
PWR_LCD_5VSB 49 50 PWR_LCD_5VSB
Intel® Server Chassis SR2400 Peripheral and Hard Drive Support
Revision 2.0
Intel order number C78845-001 55
5.4.5 Optional 6th SATA Drive Board Functional Architecture
The SATA Backplane is capable of supporting a 6th SATA hard drive with the addition of an
optionally installed backplane add-in board. The 6th drive add-in board assembly consists of a
PCB with power and interface connectors, and a mounting bracket allowing for the add-in card
to slide into a fitted cut out on the existing backplane.
The 6th SATA hard drive is fully hot swappable. The 6th drive add-in card has similar drive
connectors to those of the SATA backplane.
Peripheral and Hard Drive Support Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
56
5.5 Optional Tape Drive or 6th Hard Drive Bay
For system configurations that require either a Tape Drive or a 6th hard disk drive, a dual
purpose drive bay is available. By default this drive bay is covered by two face plates as shown
in the following diagram. The drive bay is located next to the control panel.
To configure a 6th hard drive, the lower face plate is removed and the appropriate 6th hard drive
accessory kit is installed. The accessory kit consists of the following components: hot-swap
drive tray, SCSI or SATA Add-in Board, power cable, and interface cable.
To install a 3.5” tape drive, both face plates are removed and the optional tape drive kit is
installed. The tape drive kit consists of a drive tray, power cable, and round SCSI cable.
Note: To remove the tape drive tray from the chassis, a spring latch located inside the chassis
on the back right side of the carrier must be released to allow the drive tray to slide free. Do not
attempt to pull out the drive tray without first releasing the spring latch. Doing so may damage
the plastic faceplate.
Intel® Server Chassis SR2400 Standard Control Panel
Revision 2.0
Intel order number C78845-001 57
6. Standard Control Panel
The standard control panel supports several push buttons and status LEDs, along with USB and
video ports to centralize system control, monitoring, and accessibility to within a common
compact design.
The control panel assembly comes pre-assembled and is modular in design. The control panel
assembly module slides into a predefined slot on the front of the chassis. Once installed,
communication to the baseboard can be achieved by either attaching a 50-pin cable to a hot-
swap backplane, or if cabled drives are used, can be connected directly to the baseboard. In
addition, a USB cable is routed to a USB port on the baseboard.
Figure 31. Standard Control Panel Assembly Module
6.1 Control Panel Buttons
The standard control panel assembly houses several system control buttons. Each of their
functions is listed in the table below.
Figure 32. Control Panel Buttons
Standard Control Panel Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
58
Table 56. Contol Button and Intrusion Switch Functions
Reference Feature Function
A Power / Sleep
Button Toggles the system power on/off. This button also functions as a Sleep Button if
enabled by an ACPI-compliant operating system.
B ID Button Toggles the front panel ID LED and the baseboard ID LED on/off. The baseboard
ID LED is visible through the rear of the chassis and allows you to locate the server
you’re working on from behind a rack of servers.
C Reset Button Reboots and initializes the system.
D NMI Button Pressing the recessed button with a paper clip or pin puts the server in a halt state
for diagnostic purposes and allows you to issue a non-maskable interrupt. After
issuing the interrupt, a memory download can be performed to determine the cause
of the problem.
6.2 Control Panel LED Indicators
The control panel houses six LEDs, which are viewable with or without the front bezel to display
the system’s operating state.
The following table identifies each LED and describes their functionality.
Table 57. Control Panel LED Functions
LED Color State Description
Green On NIC Link NIC1 / NIC2
Activity Green Blink NIC Activity
On Legacy power on / ACPI S0 state Green Blink 1,4 Sleep / ACPI S1 state
Power / Sleep
(on standby power) Off Off Power Off / ACPI S4 or S5 state
On Running / normal operation Green Blink 1,2 Degraded
On Critical or non-recoverable condition. Amber Blink 1,2 Non-critical condition.
System Status
(on standby power)
Off Off POST / system stop.
Green Random
blink Provides an indicator for disk activity .
Disk Activity Off Off
3 No hard disk activity
Blue Blink Identify active via command or button.
System Identification Off Off No Identification.
Notes:
NIC1 and NIC2
Activit
y
LEDs
Power and
Sleep LED
System Status
LED Hard Drive
Activit
y
LED
System
Identify LED
Figure 33. Control Panel LEDs
Intel® Server Chassis SR2400 Standard Control Panel
Revision 2.0
Intel order number C78845-001 59
1. Blink rate is ~1 Hz with at 50% duty cycle.
2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green
LED is off.
3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).
4. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down
without going through BIOS, the LED state in effect at the time of power off will be restored when the system
is powered on until the BIOS clears it. If the system is not powered down normally, it is possible that the
Power LED will be blinking at the same time that the system status LED is off due to a failure or
configuration change that prevents the BIOS from running.
The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are
located on the baseboard.
6.2.1 Power / Sleep LED
Table 58. SSI Power LED Operation
State Power Mode LED Description
Power Off Non-ACPI Off System power is off, and the BIOS has not initialized the chipset.
Power On Non-ACPI On System power is on, but the BIOS has not yet initialized the chipset.
S5 ACPI Off Mechanical is off, and the operating system has not saved any context to the
hard disk.
S4 ACPI Off Mechanical is off. The operating system has saved context to the hard disk.
S3-S1 ACPI Slow blink 1 DC power is still on. The operating system has saved context and gone into a
level of low-power state.
S0 ACPI Steady on System and the operating system are up and running.
Notes:
1. Blink rate is ~ 1Hz with at 50% duty cycle.
6.2.2 System Status LED
Note: Some of the following status conditions may or may not be reported if the system is not
configured with an Intel Management Module. Refer to the baseboard technical product
specification for details.
6.2.2.1 Critical Conditions
A critical condition is any critical or non-recoverable threshold crossing associated with the
following events:
• Temperature, voltage, or fan critical threshold crossing.
• Power subsystem failure. The BMC asserts this failure whenever it detects a power
control fault (e.g., the BMC detects that the system power is remaining ON even though
the BMC has deserted the signal to turn off power to the system.
• A hot-swap backplane would use the Set Fault Indication command to indicate when one
or more of the drive fault status LEDs are asserted on the hot-swap backplane.
• The system is unable to power up due to incorrectly installed processor(s), or processor
incompatibility.
• Satellite controller sends a critical or non-recoverable state, via the Set Fault Indication
command to the BMC.
• Critical event logging errors, including: System Memory Uncorrectable ECC error, and
fatal / uncorrectable bus errors such as PCI SERR and PERR.
Standard Control Panel Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
60
6.2.2.2 Non-Critical Conditions
A non-critical condition is threshold crossing associated with the following events:
• Temperature, voltage, or fan non-critical threshold crossing
• Chassis intrusion
• Satellite controller sends a non-critical state, via the Set Fault Indication command, to
the BMC.
• Set Fault Indication command from system BIOS. The BIOS may use the Set Fault
Indication command to indicate additional ‘non-critical’ status such as a system memory
or CPU configuration changes.
6.2.2.3 Degraded Conditions
A degraded condition is associated with the following events:
• Non-redundant power supply operation. This applies only when the BMC is configured
for a redundant power subsystem.
• One or more processors are disabled by Fault Reliant Booting (FRB) or BIOS.
• BIOS has disabled or mapped out some of the system memory.
6.2.3 Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the onboard hard disk
controllers. The server board SE7520JR2 also provides a header giving access to this LED for
add-in controllers.
6.2.4 System Identification LED
The blue system identification LED is used to help identify a system for servicing. This is
especially useful when the system is installed when in a high density rack or cabinet that is
populated with several similar systems. The system ID LED will blink when the System ID
button on the control panel is pressed or it can be illuminated remotely through server
management software.
6.3 Control Panel Connectors
The control panel has two external I/O connectors:
• One USB port
• One VGA video port
The following tables provide the pin-outs for each connectors.
Table 59. External USB Connectors (J1B1)
Pin # Description
1 PWR_FP_USB2
2 USB_DN2_FP_R
3 USB_DP2_FP_R
4 GND
5 GND
6 GND
7 GND
Intel® Server Chassis SR2400 Standard Control Panel
Revision 2.0
Intel order number C78845-001 61
Table 60. Video Connector (J1A1)
Description Pin # Pin # Description
VGA_RED 1 9 GND
VGA_GREEN 2 10 GND
VGA_BLUE 3 11 Unused
Unused 4 12 VGA_DDCDAT
GND 5 13 VGA_HSYNC_L
GND 6 14 VGA_VSYNC_L
VGA_INUSE_L 7 15 VGA_DDCCLK
GND 8 16 GND
17 GND
If a monitor is connected to the control panel video connector, the rear video port on the server
board will be disabled and the control panel video will be enabled. The video source is the
same for both connectors and is switched between the two, with the control panel having priority
over the rear video. This provides for easy front accessibility to the server.
6.4 Internal Control Panel Assembly Headers
The Control Panel interface board has two internal headers:
A 50-pin header provides control and status information to/from the server board. Using a 50-pin
flat cable, the header can either be connected to a matching connector on a hot swap
backplane or, in cabled drive configurations, can be connected to a matching connector on the
baseboard.
A 10-pin header is used to provide USB support to the control panel. The round 10-pin cable is
routed from the control panel assembly to a matching connector on the baseboard.
The following tables provide the pin-outs for both types of connectors.
Table 61. 50-pin Control Panel Connector (J6B1)
Description Pin # Pin # Description
PWR_LCD_5VSB 2 1 PWR_LCD_5VSB
HDD_LED_ACT_R_L 4 3 Unused
RST_P6_PWRGOOD 6 5 FP_SYS_FLT_LED1_R_L
P5V_STBY 8 7 FP_SYS_FLT_LED2_R_L
FP_PWR_LED_R_L 10 9 P5V_STBY
IPMB_5VSB_SDA 12 11 P3V3
IPMB_5VSB_SCL 14 13 GND
FP_PWR_BTN_L 16 15 FP_ID_LED_R_L
HDD_FAULT_LED_R_L 18 17 NIC2_LINK_LED_R_L
FP_RST_BTN_L 20 19 NIC2_ACT_LED_L
GND 22 21 BP_I2C_5V_SDA
FP_ID_SW_L 24 23 BP_I2C_5V_SCL
NIC1_ACT_LED_L 26 25 FP_CHASSIS_L
FP_NMI_BTN_L 28 27 NIC1_LINK_LED_R_L
EMP_DSR2_L 30 29 GND
EMP_SIN2 32 31 EMP_INUSE_L
EMP_RTS2_L 34 33 EMP_SOUT2
EMP_DTR2_L 36 35 EMP_CTS2_L
VGA_INUSE_L 38 37 EMP_DCD2_L
VGA_VSYNC_FP_L 40 39 1_WIRE_BUS
VGA_HSYNC_FP_L 42 41 GND
VGA_BLUE_FP 44 43 GND
VGA_GREEN_FP 46 45 GND
Standard Control Panel Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
62
Description Pin # Pin # Description
VGA_RED_FP 48 47 GND
50 49 GND
A 10-pin USB header provides control for one USB port from the server board.
Table 62. Internal USB Header (J2B1)
Pin # Description
1 PWR_FP_USB2
2 PWR_FP_USB3
3 USB_DP2_FP
4 USB_DN2_FP
5 USB_DP3_FP
6 USB_DN3_FP
7 GND
8 GND
9 TP_USB0_P9
10 TP_USB0_P10
Intel® Server Chassis SR2400 Intel® Local Control Panel
Revision 2.0
Intel order number C78845-001 63
7. Intel® Local Control Panel
The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and LCD display
to provide system accessibility, monitoring, and control functions. The control panel assembly
is pre-assembled and is modular in design. The module slides into a slot on the front of the
chassis and is designed so that it can be adjusted for use with or without an outer front bezel.
Figure 34. Intel Local Control Panel Assembly Module
Note: The Intel Local Control Panel can only be used when either the Intel Management Module
Professional Edition or Advanced Edition is installed in the system.
The following diagram provides an overview of the control panel features.
Figure 35. Intel Local Contol Panel Overview
A LCD Display I System Status LED
B LCD Menu Control Button – Up J NIC 2 Activity LED
C LCD Menu Control Button – Down K NIC 1 Activity LED
D LCD Menu Control Button – Previous Option L Hard Drive Activity LED
E LCD Menu Control Button – Previous Page M System Reset Button
F ID LED N USB 2.0 Port
G Power LED O NMI Buttom (Tool Required)
H System Power Button P USB 2.0 Port
Intel® Local Control Panel Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
64
7.1 LED Functionality
The following table identifies each LED and describes their functionality.
Table 63. Control Panel LED Functions
LED Color State Description
Green On NIC Link NIC1 / NIC2
Activity Green Blink NIC Activity
On Legacy power on / ACPI S0 state Green Blink 1,4 Sleep / ACPI S1 state
Power / Sleep
(on standby power) Off Off Power Off / ACPI S4 or S5 state
On Running / normal operation Green Blink 1,2 Degraded
On Critical or non-recoverable condition. Amber Blink 1,2 Non-critical condition.
System Status
(on standby power)
Off Off POST / system stop.
Green Random
blink Provides an indicator for disk activity .
Disk Activity Off Off
3 No hard disk activity
Blue Blink Identify active via command or button.
System Identification Off Off No Identification.
Notes:
1. Blink rate is ~1 Hz with at 50% duty cycle.
2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green
LED is off.
3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).
4. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down
without going through BIOS, the LED state in effect at the time of power off will be restored when the system
is powered on until the BIOS clears it. If the system is not powered down normally, it is possible that the
Power LED will be blinking at the same time that the system status LED is off due to a failure or
configuration change that prevents the BIOS from running.
The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are
located on the server board SE7520JR2.
7.1.1 Power / Sleep LED
Table 64. SSI Power LED Operation
State Power Mode LED Description
Power Off Non-ACPI Off System power is off, and the BIOS has not initialized the chipset.
Power On Non-ACPI On System power is on, but the BIOS has not yet initialized the chipset.
S5 ACPI Off Mechanical is off, and the operating system has not saved any context to the
hard disk.
S4 ACPI Off Mechanical is off. The operating system has saved context to the hard disk.
S3-S1 ACPI Slow blink 1 DC power is still on. The operating system has saved context and gone into a
level of low-power state.
S0 ACPI Steady on System and the operating system are up and running.
Notes:
1. Blink rate is ~ 1Hz with at 50% duty cycle.
7.1.2 System Status LED
7.1.2.1 Critical Conditions
A critical condition is any critical or non-recoverable threshold crossing associated with the
following events:
Intel® Server Chassis SR2400 Intel® Local Control Panel
Revision 2.0
Intel order number C78845-001 65
• Temperature, voltage, or fan critical threshold crossing.
• Power subsystem failure. The BMC asserts this failure whenever it detects a power
control fault (e.g., the BMC detects that the system power is remaining ON even though
the BMC has deserted the signal to turn off power to the system.
• A hot-swap backplane would use the Set Fault Indication command to indicate when one
or more of the drive fault status LEDs are asserted on the hot-swap backplane.
• The system is unable to power up due to incorrectly installed processor(s), or processor
incompatibility.
• Satellite controller sends a critical or non-recoverable state, via the Set Fault Indication
command to the BMC.
• Critical event logging errors, including: System Memory Uncorrectable ECC error, and
fatal / uncorrectable bus errors such as PCI SERR and PERR.
7.1.2.2 Non-Critical Conditions
A non-critical condition is threshold crossing associated with the following events:
• Temperature, voltage, or fan non-critical threshold crossing
• Chassis intrusion
• Satellite controller sends a non-critical state, via the Set Fault Indication command, to
the BMC.
• Set Fault Indication command from system BIOS. The BIOS may use the Set Fault
Indication command to indicate additional ‘non-critical’ status such as a system memory
or CPU configuration changes.
7.1.2.3 Degraded Conditions
A degraded condition is associated with the following events:
• Non-redundant power supply operation. This applies only when the BMC is configured
for a redundant power subsystem.
• One or more processors are disabled by Fault Reliant Booting (FRB) or BIOS.
• BIOS has disabled or mapped out some of the system memory.
7.1.3 Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the onboard hard disk
controllers. The server board SE7520JR2 also provides a header giving access to this LED for
add-in controllers.
7.1.4 System Identification LED
The blue system identification LED is used to help identify a system for servicing. This is
especially useful when the system is installed when in a high density rack or cabinet that is
populated with several similar systems. The system ID LED will blink when the System ID
button on the control panel is pressed or it can be illuminated remotely through server
management software.
7.2 Internal Control Panel Headers
The Control Panel interface board has four internal headers:
• A 50-pin header provides control and status information to/from the server board. Using
a 50-pin flat cable, the header can either be connected to a matching connector on a hot
swap backplane or, in cabled drive configurations, can be connected to a matching
connector on the baseboard.
Intel® Local Control Panel Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
66
• A 10-pin header is used to provide USB support to the control panel. The round 10-pin
cable is routed from the control panel assembly to a matching connector on the
baseboard.
• A 4-pin IPMI Header (Not used).
• A 4-pin NMI/Temp Sensor Header.
The following tables provide the pin-outs for each of the headers.
Table 65. 50-pin Control Panel Connector
Description Pin # Pin # Description
PWR_LCD_5VSB 2 1 PWR_LCD_5VSB
HDD_LED_ACT_R_L 4 3 Unused
RST_P6_PWRGOOD 6 5 FP_SYS_FLT_LED1_R_L
P5V_STBY 8 7 FP_SYS_FLT_LED2_R_L
FP_PWR_LED_R_L 10 9 P5V_STBY
IPMB_5VSB_SDA 12 11 P3V3
IPMB_5VSB_SCL 14 13 GND
FP_PWR_BTN_L 16 15 FP_ID_LED_R_L
HDD_FAULT_LED_R_L 18 17 NIC2_LINK_LED_R_L
FP_RST_BTN_L 20 19 NIC2_ACT_LED_L
GND 22 21 BP_I2C_5V_SDA
FP_ID_SW_L 24 23 BP_I2C_5V_SCL
NIC1_ACT_LED_L 26 25 FP_CHASSIS_L
FP_NMI_BTN_L 28 27 NIC1_LINK_LED_R_L
EMP_DSR2_L 30 29 GND
EMP_SIN2 32 31 EMP_INUSE_L
EMP_RTS2_L 34 33 EMP_SOUT2
EMP_DTR2_L 36 35 EMP_CTS2_L
VGA_INUSE_L 38 37 EMP_DCD2_L
VGA_VSYNC_FP_L 40 39 1_WIRE_BUS
VGA_HSYNC_FP_L 42 41 GND
VGA_BLUE_FP 44 43 GND
VGA_GREEN_FP 46 45 GND
VGA_RED_FP 48 47 GND
50 49 GND
Table 66. Internal USB Header
Pin # Description
1 PWR_FP_USB2
2 PWR_FP_USB3
3 USB_DP2_FP
4 USB_DN2_FP
5 USB_DP3_FP
6 USB_DN3_FP
7 GND
8 GND
9 TP_USB0_P9
10 TP_USB0_P10
Intel® Server Chassis SR2400 Intel® Local Control Panel
Revision 2.0
Intel order number C78845-001 67
Table 67. IPMI Header
Pin
# Description
1 IPMB_5VSB_SDA
2 GND
3 IPMB_5VSB_SCL
4 P5V_STBY
Table 68. Internal NMI/Temp Sensor Header
Pin # Description
1 TBD
2 TBD
3 TBD
4 TBD
PCI Riser Cards and Assembly Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
68
8. PCI Riser Cards and Assembly
The Server Chassis SR2400 supports different riser card options depending on the add-in card
configuration desired. The riser assembly for the Server Chassis SR2400 is tool-less. Stand-offs
on the bracket allow the riser cards to slide onto the assembly where a latching mechanism
than holds each riser in place. Holding down the latch releases the risers for easy removal.
When re-inserting the riser assembly into the chassis, tabs on the back of the assembly should
be aligned with slots on the back edge of the chassis. The tabs fit into the slots securing the
riser assembly to the chassis when the top cover is in place.
The riser assembly provides two extraction levers to assist with riser assembly removal from the
riser slots.
There are 4 different riser card options offered:
o Low profile PCI-X – This riser card is capable of supporting up to three low profile 66/100
MHz PCI-X cards
o Full height PCI-X – This riser card is capable of supporting up to three full height/full length
66/100 MHz PCI-X cards
o Full height PCI-X (active) – This riser card is capable of supporting two 133 MHz PCI-X
cards and one 66/100 MHz PCI-X card.
o Full height PCI-Express – This riser card is capable of supporting two X4 PCI-Express cards
and one 66/100 PCI-X card.
Intel® Server Chassis SR2400 PCI Riser Cards and Assembly
Revision 2.0
Intel order number C78845-001 69
8.1 PCI Riser Card Mechanical Drawings
Figure 36. Full Height PCI-Express Riser Card
Figure 37. Full Height Passive PCI-X Riser Card
PCI Riser Cards and Assembly Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
70
Figure 38. Full Height Active PCI-X Riser Card
Figure 39. Low Profile Passive PCI-X Riser Card
Intel® Server Chassis SR2400 Supported Intel® Server Boards
Revision 2.0
Intel order number C78845-001 71
9. Supported Intel® Server Boards
The Server Chassis SR2400 is mechanically and functionally designed to support the Intel®
Server Board SE7520JR2.and Intel Server Board SE7320VP2. The following sections provide
an overview of the baseboard feature sets. The Technical Product Specification for each server
board should be referenced for more detailed information. The documents can be downloaded
from the following web sites:
http://support.intel.com/support/motherboards/server/se7520jr2
http://support.intel.com/support/motherboards/server/se7320vp2
9.1 Intel Server Board SE7520JR2
9.1.1 Server Board SE7520JR2 SKU Availability
The name SE7520JR2 is used to describe the family of boards made available under a common
product name. The core features for each board will be common; however each board will have
the following distinctions:
Product Code Feature Distinctions
SE7520JR2SCSID2 Onboard SCSI + Onboard SATA (RAID) + DDR2–400 MHz
SE7520JR2SCSID1 Onboard SCSI + Onboard SATA (RAID) + DDR–266/333 MHz
SE7520JR2ATAD2 Onboard SATA (RAID) + DDR2–400 MHz
SE7520JR2ATAD1 Onboard SATA (RAID) + DDR–266/333 MHz
9.1.2 Server Board SE7520JR2 Feature Set
• Dual processor slots supporting 800MHz Front Side Bus (FSB) Intel® Xeon™ processors
• Intel E7520 Chipset (MCH, PXH, ICH-5R)
• Two PCI riser slots
o Riser Slot 1: Supports low profile PCI-X 66/100MHz PCI-X cards
o Riser Slot 2: Using Intel® adaptive slot technology and different riser cards, this
slot is capable of supporting full height PCI-X 66/100/133 or PCI-Express cards.
• Six DIMM slots supporting DDR2– 400MHz memory or DDR–266/333 MHz1
• Dual channel LSI* 53C1030 Ultra320 SCSI Controller with integrated RAID 0/1 support
• Dual Intel® 82546GB 10/100/1000 Network Interface Controllers (NICs)
• On board ATI* Rage XL video controller with 8MB SDRAM
• On-board platform instrumentation using a National* PC87431M mini-BMC
• External IO connectors
• Stacked PS2 ports for keyboard and mouse
1 The use of DDR2 - 400 MHz or DDR - 266/333 MHz DIMMs is dependant on which board SKU is used. DDR-2
DIMMs cannot be used on a board designed to support DDR. DDR DIMMs cannot be used on boards designed to
support DDR-2.
Supported Intel® Server Boards Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
72
• RJ45 Serial B Port
o Two RJ45 NIC connectors
o 15-pin video connector
o Two USB 2.0 ports
o U320 High density SCSI connector (Channel B)
• Internal IO Connectors / Headers
o Two onboard USB port headers. Each header is capable of supporting two USB
2.0 ports.
o One 10-pin DH10 Serial A Header
o One Ultra320 68-pin SCSI Connector (Channel A)
o Two SATA connectors with integrated chipset RAID 0/1 support
o One ATA100 connector
o One floppy connector
o SSI-compliant and custom control panel headers
o SSI-compliant 24-pin main power connector. This supports ATX-12V standard in
the first 20 pins
o Intel® Management Module (IMM) connector
• Intel® Light-Guided Diagnostics on all FRU devices (processors, memory, power)
• Port-80 Diagnostic LEDs displaying POST codes
The following image shows the board layout of the Server Board SE7520JR2. Each connector
and major component is identified by number and is identified in Table 69.
Intel® Server Chassis SR2400 Supported Intel® Server Boards
Revision 2.0
Intel order number C78845-001 73
Figure 40. Intel® Server Board SE7520JR2 Board Layout
3
18
17
14
13
11
15
10
9 8 7
6
5
4
19
25
26 27
12
16
32 33
29 28
21
24
20
39
37
34
31
35
22
36 40
38
23
1 2
30
Supported Intel® Server Boards Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
74
Table 69. Baseboard Layout Reference
Ref # Description Ref # Description
1
(J1A1) 2-Pin Chassis Intrusion Header
(J1A2) 2-Pin Hard Drive Act LED Header
(J1A4) Rolling BIOS Jumper
22 CPU #2 Fan Header
2 10-Pin DH10 Serial A Header 23 CPU #1 Fan Header
3 Ext SCSI Channel B Connector 24 5-pin Power Sense Header
4 USB Port 2 25 PXH – Chipset Component
5 USB Port 1 26 CPU #2 Socket
6 Video Connector 27 CPU #1 Socket
7 NIC #2 28 ICH5-R – Chipset Component
8 NIC #1 29 SATA Ports
9 RJ-45 Serial B Port 30
(J1H2) Recovery Boot Jumper
(J1H3) Password Clear Jumper
(J1H4) CMOS Clear Jumper
10 Stacked PS/2 Keyboard and Mouse Ports 31 Legacy ATA-100 connector
11 Intel Management Module Connector 32 50-pin Control Panel Header
12 CMOS Battery 33 100-pin Control Panel, Floppy, IDE Connector
13 Full Height Riser Card Slot 34 Legacy Floppy Connector
14 Low Profile Riser Card Slot 35 SSI 34-pin Control Panel Header
15 DIMM Slots 36 8-Pin AUX Power Connector
16 68-pin SCSI Channel A Connector 37 24-Pin Main Power Connector
17 LSI 53C1030 SCSI Controller 38 SSI System Fan Header
18 MCH – Chipset Component 39 SR1400/SR2400 System Fan Header
19 1x10 USB Header 40 Processor Voltage Regulator Circuitry
20 2x5 USB Header
21 ATI RageXL Video Controller
Intel® Server Chassis SR2400 Supported Intel® Server Boards
Revision 2.0
Intel order number C78845-001 75
9.2 Intel Server Board SE7320VP2
9.2.1 Intel Server Board SE7320VP2 SKU Availability
The SE7320VP2 product will be offered in one board SKU with Onboard SATA (RAID) and
support for DDR266/333 MHz memory.
9.2.2 Intel Server Board SE7320VP2 Feature Set
• Dual processor slots supporting 800MHz Front Side Bus (FSB) Intel® Xeon™ processors
• Intel E7320 Chipset (MCH, 6300ESB ICH)
• Two PCI riser slots
Full Height Riser Slot: “Intel® Adaptive Slot Technology”. Depending on the riser
used, is capable of supporting full height PCI-X 66MHz cards (with Passive
Riser), or one x4 PCI-Express card (with PCI-Express Riser).
Low Profile Riser Slot: Capable of supporting one low profile PCI-X 66MHz card.
• Six DIMM slots supporting DDR 266/333 MHz
• Dual 10/100/1000 Network Interface Controllers (NICs) (Intel® 82541PI Network interface
Controller & Marvell* 88E8050 Network Interface Controller)
• On board ATI* Rage XL video controller with 8MB SDRAM
• Mini-BMC providing “Essentials” server management option
• External IO connectors
Stacked PS2 ports for keyboard and mouse
RJ45 Serial B Port
Two RJ45 NIC connectors
15-pin video connector
Two USB 2.0 ports
• Internal IO Connectors / Headers
One onboard USB header capable of supporting two USB ports
One DH10 Serial A Header
Two SATA-100 connectors with integrated chipset RAID 0/1 support
Two ATA100 connections (one 40-pin Legacy connector & one through the 100-
pin high
density Front Panel connector)
One floppy connector
SSI-compliant and custom front panel headers
SSI-compliant 24-pin main power connector. This supports ATX-12V standard in
the first 20 pins
• Port-80 diagnostic LEDs displaying POST codes
The following figure shows the board layout of the Server Board SE7320VP2.
Supported Intel® Server Boards Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
76
Figure 41. Intel® Server Board SE7320VP2 Board Layout
Intel® Server Chassis SR2400 Regulatory, Environmentals, and Specifications
Revision 2.0
Intel order number C78845-001 77
10. Regulatory, Environmentals, and Specifications
10.1 Product Regulatory Compliance
10.1.1 Product Safety Compliance
The SR2400 complies with the following safety requirements:
• UL60950 – CSA 60950(USA / Canada)
• EN60950 (Europe)
• IEC60950 (International)
• CB Certificate & Report, IEC60950 (report to include all country national deviations)
• GS License (Germany)
• GOST R 50377-92 - License (Russia)
• Belarus License (Belarus)
• Ukraine License (Ukraine)
• CE - Low Voltage Directive 73/23/EEE (Europe)
• IRAM Certification (Argentina)
• GB4943- CNCA Certification (China)
10.1.2 Product EMC Compliance
The SR2400 has been tested and verified to comply with the following electromagnetic
compatibility (EMC) regulations when installed a compatible Intel host system. For information
on compatible host system(s) refer to Intel’s Server Builder website or contact your local Intel
representative.
• FCC (Class A Verification) – Radiated & Conducted Emissions (USA)
• CISPR 22 – Emissions (International)
• EN55022 - Emissions (Europe)
• EN55024 - Immunity (Europe)
• EN61000-3-2 - Harmonics (Europe)
• EN61000-3-3 - Voltage Flicker (Europe)
• CE – EMC Directive 89/336/EEC (Europe)
• VCCI Emissions (Japan)
• AS/NZS 3548 Emissions (Australia / New Zealand)
• BSMI CNS13438 Emissions (Taiwan)
• GOST R 29216-91 Emissions (Russia)
• GOST R 50628-95 Immunity (Russia)
• Belarus License (Belarus)
• Ukraine License (Ukraine)
• RRL MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea)
• GB 9254 - CNCA Certification (China)
• GB 17625 - (Harmonics) CNCA Certification (China)
Regulatory, Environmentals, and Specifications Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
78
10.1.3 Product Regulatory Compliance Markings
This product is provided with the following Product Certification Markings.
Regulatory Compliance Country Marking
cULus Listing Marks USA/Canada
GS Mark Germany
CE Mark Europe
FCC Marking (Class A) USA
EMC Marking (Class A) Canada
VCCI Marking (Class A) Japan
BSMI Certification
Number & Class A
Warning
Taiwan
GOST R Marking Russia
RRL MIC Mark Korea
China Compulsory
Certification Mark China
10.2 Electromagnetic Compatibility Notices
10.2.1 USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel® Server Chassis SR2400 Regulatory, Environmentals, and Specifications
Revision 2.0
Intel order number C78845-001 79
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals, that are not shielded and grounded may result in interference
to radio and TV reception.
10.2.2 FCC Verification Statement
Product Type: SR2400; SE7520JR2
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
10.2.3 ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux
appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur:
“Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
(English translation of the notice above) This digital apparatus does not exceed the Class A
limits for radio noise emissions from digital apparatus set out in the interference-causing
equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of
Communications.
10.2.4 Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
Regulatory, Environmentals, and Specifications Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
80
10.2.5 Japan EMC Compatibility
Electromagnetic Compatibility Notices (International)
English translation of the notice above:
This is a Class A product based on the standard of the Voluntary Control Council For
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.
10.2.6 BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety label
which is located on the bottom side (pedestal orientation) or side (rack mount configuration).
10.2.7 Korean RRL Compliance
English translation of the notice above:
1. Type of Equipment (Model Name): On License and Product
2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative
3. Name of Certification Recipient: Intel Corporation
4. Date of Manufacturer: Refer to date code on product
5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
10.3 Replacing the Back up Battery
The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in
the absence of power. When the battery starts to weaken, it loses voltage, and the server
settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong.
Contact your customer service representative or dealer for a list of approved devices.
WARNING
Danger of explosion if battery is incorrectly replaced. Replace only with
the same or equivalent type recommended by the equipment
manufacturer. Discard used batteries according to manufacturer’s
instructions.
Intel® Server Chassis SR2400 Regulatory, Environmentals, and Specifications
Revision 2.0
Intel order number C78845-001 81
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning
må kun ske med batteri af samme fabrikat og type. Levér det brugte
batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri
som anbefalt av apparatfabrikanten. Brukt batteri returneres
apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller
en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera
använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo
ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty
paristo valmistajan ohjeiden mukaisesti.
10.4 System Level Environmental Limits
The table below defines the system level operating and non-operating environmental limits
Table 70. System Environmental Limits Summary
Parameter Limits
Operating Temperature +10°C to +35°C with the maximum rate of change not to exceed 10°C per hour
Non-Operating Temperature -40°C to +70°C
Non-Operating Humidity 90%, non-condensing @ 35°C
Acoustic noise Sound Pressure: 55 dBA (Rackmount) in an idle state at typical office ambient
temperature. (23 +/- degrees C) Sound Power: 7.0 BA in an idle state at typical office
ambient temperature. (23 +/- 2 degrees C)
Shock, operating Half sine, 2 g peak, 11 mSec
Shock, unpackaged Trapezoidal, 25 g, velocity change 136 inches/sec (≧40 lbs to > 80 lbs)
Shock, packaged Non-palletized free fall in height 24 inches (≧40 lbs to > 80 lbs)
Vibration, unpackaged 5 Hz to 500 Hz, 2.20 g RMS random
Shock, operating Half sine, 2 g peak, 11 mSec
ESD +/-15kV except I/O port +/-8KV per Intel Environmental test specification
System Cooling
Requirement in BTU/Hr 1826 BTU/hour
10.5 Serviceability and Availability
The system is designed to be serviced by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of
the system problem. To meet this goal, the system enclosure and hardware have been
designed to minimize the MTTR.
Regulatory, Environmentals, and Specifications Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
82
Following are the maximum times that a trained field service technician should take to perform
the listed system maintenance procedures, after diagnosis of the system and having identified
the failed component.
Activity Time
Estimate
Remove cover 10 Seconds
Remove and replace hard disk drive 2 Minutes 2
Remove and replace power supply module 30 Seconds
Remove and replace system fan 30 Seconds
Remove and replace backplane board 5 Minutes
Remove and replace control panel module 5 Minutes
Remove and replace baseboard 10 Minutes
10.6 Regulated Specified Components
To maintain the UL listing and compliance to other regulatory certifications and/or declarations,
the following regulated components must be used and conditions adhered to. Interchanging or
use of other component will void the UL listing and other product certifications and approvals.
Updated product information for configurations can be found on the Intel Server Builder Web
site at the following URL:
http://channel.intel.com/go/serverbuilder
If you do not have access to Intel’s Web address, please contact your local Intel representative.
Server Chassis (base chassis is provided with power supply and fans)⎯UL listed.
Server board⎯you must use an Intel server board—UL recognized.
Add-in boards⎯must have a printed wiring board flammability rating of minimum UL94V-1.
Add-in boards containing external power connectors and/or lithium batteries must be UL
recognized or UL listed. Any add-in board containing modem telecommunication circuitry
must be UL listed. In addition, the modem must have the appropriate telecommunications,
safety, and EMC approvals for the region in which it is sold.
Peripheral Storage Devices⎯must be UL recognized or UL listed accessory and TUV or VDE
licensed. Maximum power rating of any one device is 19 watts. Total server configuration is not
to exceed the maximum loading conditions of the power supply
2 Includes drive removal from and replacement into a drive tray
Intel® Server Chassis SR2400 Regulatory, Environmentals, and Specifications
Revision 2.0
Intel order number C78845-001 83
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Appendix A: SR2400 Integration and Usage Tips Intel® Server Chassis SR2400
Revision 2.0
Intel order number C78845-001
84
Appendix A: SR2400 Integration and Usage Tips
This appendix provides a list of useful information that is unique to the SR2400 server chassis
and should be kept in mind while integrating and configuring your system.
• To prevent a hot swap backplane from flexing when installing or removing hard drives,
the system top cover must be in place. Having the top cover installed will ensure the
drives attach securely to the drive connectors on the backplane.
• You must run the FRUSDR utility to load the proper Sensor Data Records for this
chassis on to the server board. Failure to do so may result in possible false errors being
reported to the System Event Log. It is best to download the latest FRUSDR Utility for
your particular server board from the following web site:
http://support.intel.com/support/motherboards/server
• To ensure proper cooling of your server, all air baffles and air ducts must be in place. In
addition, all drive bays must be populated with either a drive or a drive blank.
• Processor fans are not supported and are not needed in the server chassis SR2400.
• When installing the high density 100-pin flex cable, verify that both cable connectors are
seated securely and lay flat to the connectors located on the baseboard and backplane.
• System fans are not hot swappable
• The Intel Local Control Panel is only supported when an Intel Management Module is
used in the server.
