Film Capacitors
Metallized Polypropylene Film Capacitors (MKP)
Series/Type: B32774 ... B32778
Date: December 2012
© EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Typical applications
For compact design of:
Frequency converters
Industrial and high-end power supplies
Solar inverters
Climatic
Max. operating temperature: 105 °C (case)
Climatic category (IEC 60068-1): 40/85/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Capacitance values up to 110 µF
High CV product, compact
Excellent self-healing properties
Overvoltage capability
Low losses with high current capability
High reliability
Long useful life
RoHS-compatible
Terminals
Parallel wire leads, lead-free tinned
2-pin and 4-pin versions
Standard lead lengths: 6 1 mm
Special lead lengths are available on
request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated DC voltage
Delivery mode
Bulk (untaped, lead length 6 1 mm)
Dimensional drawings
2-pin version
4-pin version
Dimensions in mm
Version Lead
spacing
±0.4
Lead
diameter
d1
Type
2-pin 27.5 0.8 B32774D
2-pin 37.5 1.0 B32776E/T
4-pin 37.5 1.2 B32776G
4-pin 52.5 1.2 B32778G
Metallized polypropylene film capacitors (MKP) B32774 ... B32778
MKP DC link high density series
Page 2 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Overview of available types
Lead spacing 27.5 mm 37.5 mm
Type B32774 B32776
Page 5 6
VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300
CR(µF)
1.5
2.0
2.7
3.0
3.5
3.9
5.0
6.8
7.0
7.5
8.0
8.5
10
12
14
15
16
20
22
25
30
35
40
45
50
55
60
B32774 ... B32778
MKP DC link high density series
Page 3 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Lead spacing 52.5 mm
Type B32778
Page 9
VR(V DC) 450 575 800 900 1100 1300
CR(µF)
20
25
27
30
35
40
45
50
55
60
75
80
100
110
B32774 ... B32778
MKP DC link high density series
Page 4 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units (lead spacing 27.5 mm)
CR
µF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC
5.0 11.0 ×21.0 ×31.5 B32774D4505+000 5.0 4.5 8.5 2352
10 15.0 ×24.5 ×31.5 B32774D4106+000 6.5 6.0 7.5 1680
22 22.0 ×36.5 ×31.5 B32774D4226+000 10.0 9.0 5.0 784
VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC
3.0 11.0 ×21.0 ×31.5 B32774D8305+000 5.0 4.5 9.0 2352
5.0 14.0 ×24.5 ×31.5 B32774D8505+000 5.0 4.5 7.0 1848
12 22.0 ×36.5 ×31.5 B32774D8126+000 6.0 5.5 6.5 784
VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC
2.0 12.5 ×21.5 ×31.5 B32774D0205+000 4.0 3.5 11.0 2100
5.0 19.0 ×30.0 ×31.5 B32774D0505+000 6.5 6.0 7.0 896
7.0 22.0 ×36.5 ×31.5 B32774D0705+000 7.5 7.0 5.5 784
VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC
1.5 12.5 ×21.5 ×31.5 B32774D1155+000 4.5 4.0 10.5 2100
3.0 18.0 ×27.5 ×31.5 B32774D1305+000 6.0 5.5 7.0 1428
5.0 22.0 ×36.5 ×31.5 B32774D1505+000 8.0 7.0 6.0 784
B32774
MKP DC link high density series
Page 5 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm)
CR
µF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC
12 24.0 ×15.0 ×41.5 B32776T4126K000 8.0 8.0 8.0 1040
16 24.0 ×19.0 ×41.5 B32776T4166K000 9.0 9.0 7.0 780
30 20.0 ×39.5 ×41.5 10.2 B32776G4306+000 12.5 11.5 8.0 640
30 20.0 ×39.5 ×41.5 B32776E4306+000 11.5 10.5 9.0 640
35 28.0 ×37.0 ×42.0 10.2 B32776G4356+000 13.5 12.5 8.0 440
35 28.0 ×37.0 ×42.0 B32776E4356+000 12.5 11.5 9.0 440
40 28.0 ×37.0 ×42.0 10.2 B32776G4406+000 14.5 13.5 5.0 440
40 28.0 ×37.0 ×42.0 B32776E4406+000 13.5 12.5 5.5 440
50 28.0 ×42.5 ×41.5 10.2 B32776G4506+000 16.0 15.0 4.0 440
50 28.0 ×42.5 ×41.5 B32776E4506+000 15.0 14.0 4.0 440
60 30.0 ×45.0 ×42.0 B32776E4606+000 16.5 15.0 3.0 400
VR,70 °C= 575 V DC, Vop,85 °C= 500 V DC
8.5 24.0 ×15.0 ×41.5 B32776T5855+000 8.5 8.5 7.0 1040
12 24.0 ×19.0 ×41.5 B32776T5126K000 9.0 9.0 7.0 780
25 20.0 ×39.5 ×41.5 10.2 B32776G5256K000 11.5 11.5 4.75 640
25 20.0 ×39.5 ×41.5 B32776E5256K000 11.0 11.0 5.0 640
30 28.0 ×37.0 ×42.0 10.2 B32776G5306+000 14.0 14.0 3.85 440
30 28.0 ×37.0 ×42.0 B32776E5306+000 13.5 13.5 4.0 440
35 28.0 ×42.5 ×41.5 10.2 B32776G5356+000 14.5 14.0 3.75 440
35 28.0 ×42.5 ×41.5 B32776E5356+000 14.0 13.5 4.0 440
45 30.0 ×45.0 ×42.0 20.3 B32776G5456K000 16.5 16.5 2.85 400
45 30.0 ×45.0 ×42.0 B32776E5456K000 15.5 15.0 3.4 400
55 33.0 ×48.0 ×42.0 20.3 B32776G5556K000 19.0 19.0 2.4 180
B32776
MKP DC link high density series
Page 6 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm)
CR
µF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC
6.8 24.0 ×15.0 ×41.5 B32776T8685+000 7.0 7.0 11.0 1040
8.5 24.0 ×19.0 ×41.5 B32776T8855+000 8.0 8.0 9.0 780
14 18.0 ×32.5 ×41.5 B32776E8146+000 10.0 9.0 7.5 720
15 20.0 ×39.5 ×41.5 10.2 B32776G8156+000 10.5 9.5 7.0 640
20 28.0 ×37.0 ×42.0 10.2 B32776G8206+000 12.0 11.0 5.5 440
20 28.0 ×37.0 ×42.0 B32776E8206+000 11.5 10.5 6.5 440
22 28.0 ×37.0 ×42.0 10.2 B32776G8226+000 13.0 12.0 5.0 440
25 28.0 ×42.5 ×41.5 B32776E8256+000 13.5 12.5 4.5 440
30 30.0 ×45.0 ×42.0 20.3 B32776G8306+000 15.0 14.0 3.5 400
30 30.0 ×45.0 ×42.0 B32776E8306+000 14.0 13.0 5.0 400
VR,70 °C= 900 V DC, Vop,85 °C= 800 V DC
5 24.0 ×15.0 ×41.5 B32776T9505+000 4.5 4.5 17.0 1040
7.5 24.0 ×19.0 ×41.5 B32776T9755K000 6.0 6.0 12.0 780
15 20.0 ×39.5 ×41.5 10.2 B32776G9156K000 10.5 10.5 6.15 640
15 20.0 ×39.5 ×41.5 B32776E9156K000 10.0 10.0 6.35 640
20 28.0 ×37.0 ×42.0 10.2 B32776G9206K000 12.5 12.5 4.7 440
20 28.0 ×37.0 ×42.0 B32776E9206K000 12.0 12.0 4.9 440
22 28.0 ×42.5 ×41.5 10.2 B32776G9226K000 13.0 13.0 4.3 440
22 28.0 ×42.5 ×41.5 B32776E9226K000 12.5 12.0 4.8 440
25 30.0 ×45.0 ×42.0 20.3 B32776G9256+000 15.0 14.5 3.8 400
25 30.0 ×45.0 ×42.0 B32776E9256+000 14.0 13.5 4.2 400
30 33.0 ×48.0 ×42.0 20.3 B32776G9306+000 17.0 16.5 2.85 180
B32776
MKP DC link high density series
Page 7 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm)
CR
µF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC
3.9 24.0 ×15.0 ×41.5 B32776T0395+000 6.5 6.5 12.0 1040
5 24.0 ×19.0 ×41.5 B32776T0505+000 7.0 7.0 10.0 780
12 20.0 ×39.5 ×41.5 10.2 B32776G0126+000 11.0 10.0 6.5 640
12 20.0 ×39.5 ×41.5 B32776E0126+000 10.0 9.0 7.0 640
14 28.0 ×37.0 ×42.0 10.2 B32776G0146+000 13.0 12.0 5.5 440
14 28.0 ×37.0 ×42.0 B32776E0146+000 12.0 11.0 6.0 440
16 28.0 ×42.5 ×41.5 10.2 B32776G0166+000 13.0 12.0 5.0 440
16 28.0 ×42.5 ×41.5 B32776E0166+000 12.0 11.0 5.5 440
20 30.0 ×45.0 ×42.0 20.3 B32776G0206+000 15.0 13.0 3.0 400
20 30.0 ×45.0 ×42.0 B32776E0206+000 13.0 12.0 3.5 400
VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC
2.7 24.0 ×15.0 ×41.5 B32776T1275+000 6.0 6.0 16.0 1040
3.5 24.0 ×19.0 ×41.5 B32776T1355+000 6.5 6.5 13.0 780
8.0 20.0 ×39.5 ×41.5 10.2 B32776G1805+000 9.0 8.0 8.0 640
10 28.0 ×37.0 ×42.0 10.2 B32776G1106+000 12.0 11.0 6.5 440
10 28.0 ×37.0 ×42.0 B32776E1106+000 11.0 10.0 7.0 440
12 28.0 ×42.5 ×41.5 10.2 B32776G1126+000 13.0 12.0 5.5 440
14 30.0 ×45.0 ×42.0 B32776E1146+000 13.0 12.0 5.0 400
B32776
MKP DC link high density series
Page 8 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units (lead spacing 52.5 mm)
CR
µF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC
75 30.0 ×45.0 ×57.5 20.3 B32778G4756+000 16.0 15.5 5.5 280
80 30.0 ×45.0 ×57.5 20.3 B32778G4806+000 16.5 16.0 5.0 280
100 35.0 ×50.0 ×57.5 20.3 B32778G4107+000 18.0 18.0 4.0 108
110 35.0 ×50.0 ×57.5 20.3 B32778G4117+000 19.0 19.0 4.0 108
VR,70 °C= 575 V DC, Vop,85 °C= 500 V DC
60 30.0 ×45.0 ×57.5 20.3 B32778G5606+000 16.0 15.5 3.5 280
80 35.0 ×50.0 ×57.5 20.3 B32778G5806+000 19.0 18.5 3.0 108
VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC
45 30.0 ×45.0 ×57.5 20.3 B32778G8456+000 16.0 15.0 4.0 280
55 35.0 ×50.0 ×57.5 20.3 B32778G8556+000 17.0 16.0 3.5 108
60 35.0 ×50.0 ×57.5 20.3 B32778G8606+000 19.0 18.0 3.0 108
VR,70 °C= 900 V DC, Vop,85 °C= 800 V DC
35 30.0 ×45.0 ×57.5 20.3 B32778G9356+000 14.0 14.0 4.5 280
50 35.0 ×50.0 ×57.5 20.3 B32778G9506K000 18.0 18.0 3.5 108
VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC
30 30.0 ×45.0 ×57.5 20.3 B32778G0306+000 16.0 14.0 5.0 280
40 35.0 ×50.0 ×57.5 20.3 B32778G0406+000 20.0 20.0 3.5 108
VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC
20 30.0 ×45.0 ×57.5 20.3 B32778G1206+000 14.0 13.0 5.5 280
25 35.0 ×50.0 ×57.5 20.3 B32778G1256+000 17.0 16.0 4.5 108
27 35.0 ×50.0 ×57.5 20.3 B32778G1276+000 17.5 16.0 4.5 108
B32778
MKP DC link high density series
Page 9 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Technical data
Reference standard: IEC 61071. All data given at T = 20 °C, unless otherwise specified.
Operating temperature range (case) Max. operating temperature, Top,max
Upper category temperature Tmax
Lower category temperature Tmin
+105 °C
+85 °C
–40 °C
ESR (at 10 kHz) LS 27.5
LS 37.5
LS 52.5
< 3.0 ESRtyp
< 2.5 ESRtyp
< 2.0 ESRtyp
Insulation Resistance Rins
given as time constant
τ= CRRins, rel. humidity ≤65%
(minimum as-delivered values)
30 000 s
DC test voltage between terminals (10 s) 1.5 VR
DC test voltage terminal to case (10 s) 2110 V AC, 50 Hz
Maximum peak current (A)
Damp heat test
Limit values after damp heat test
56 days/40 °C/93% relative humidity
Capacitance change | ∆C/C | ≤5%
Dissipation factor change ∆tan δ ≤ 1.5 · 10-3 (at 1 kHz)
Insulation resistance Rins ≥50% of minimum
as-delivered values
Reliability: Failure rate λ50 fit (≤110-9/h) at 0.5 VR,40°C
Service life tSL 100 000 h at VRand 70 °C
For conversion to other operating conditions, refer to
chapter "Quality, 2 Reliability".
VR(V DC) 450 575 800 900 1100 1300
450 575 800 900 1100 1300
450 500 700 800 920 1100
Continuous operation voltage
Vop (V DC) at 70 °C
Continuous operation voltage
Vop (V DC) at 85 °C
For temperatures between
70 °C and 85 °C
1%/°C of derating respect Vop at 70 °C
(no derating at 450 V DC series)
B32774 ... B32778
MKP DC link high density series
Page 10 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
Note:
The values of dV/dt provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt values
Lead spacing 27.5 mm 37.5 mm
Type B32774 B32776
VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300
dV/dt in V/µs 30 40 75 100 21 22 22 32 54 73
Lead spacing 52.5 mm
Type B32778
VR(V DC) 450 575 800 900 1100 1300
dV/dt in V/µs 14 15 15 25 35 50
B32774 ... B32778
MKP DC link high density series
Page 11 of 21Please read Cautions and warnings and
Important notes at the end of this document.
ESL values
ESL
2-pin B32774D 25 nH
B32776E 10 nH
4-pin B32776G 15 nH
B32778G 15 nH
Typical waveforms
Restrictions:
VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which
the capacitor has been designed for continuous operation.
AC ≤0.2 VR
VP,max: Maximum permissible recurrent voltage that may appear for 2% of the period.
B32774 ... B32778
MKP DC link high density series
Page 12 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing > 10 mm)
260 ±5°C 10 ±1 s
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1 s
MKP
MKT
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤10 mm) and
insulated (B32559)
B32774 ... B32778
MKP DC link high density series
Page 13 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
∆C/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
B32774 ... B32778
MKP DC link high density series
Page 14 of 21Please read Cautions and warnings and
Important notes at the end of this document.
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 °C
MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
B32774 ... B32778
MKP DC link high density series
Page 15 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage conditions Make sure that capacitors are stored within the
specified range of time, temperature and humidity
conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity
(passive flammability), avoid overload of the
capacitors (active flammability) and consider the
flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand
vibration. The capacitors are tested to
IEC 60068-2-6.
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
5.2
"Resistance to vibration"
B32774 ... B32778
MKP DC link high density series
Page 16 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature
limits during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
finished assemblies
When embedding finished circuit assemblies in
plastic resins, chemical and thermal influences
must be taken into account.
Caution: Consult us first, if you also wish to
embed other uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
B32774 ... B32778
MKP DC link high density series
Page 17 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A Capacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
C Capacitance Kapazität
CRRated capacitance Nennkapazität
∆C Absolute capacitance change Absolute Kapazitätsänderung
∆C/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
∆C/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
∆t Time interval Zeitintervall
∆T Absolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
∆tan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
∆V Absolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
∆V/∆t Voltage change per time interval Spannungsänderung pro Zeitintervall
E Activation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
f Frequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
i Current (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32774 ... B32778
MKP DC link high density series
Page 18 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
Q Heat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
R Universal molar constant for gases Allg. Molarkonstante für Gas
R Ohmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
S severity (humidity test) Schärfegrad (Feuchtetest)
t Time Zeit
T Temperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature Beriebstemperatur
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
VAC AC voltage Wechselspannung
B32774 ... B32778
MKP DC link high density series
Page 19 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
Z Impedance Scheinwiderstand
Lead spacing Rastermaß
B32774 ... B32778
MKP DC link high density series
Page 20 of 21Please read Cautions and warnings and
Important notes at the end of this document.
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS,
DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Important notes
Page 21 of 21
