HSMS-2804-TR2 - Agilent / Hewlett-Packard

Surface Mount RF Schottky

Barrier Diodes

Technical Data

HSMS-280x Series

Features

• Surface Mount Packages

• High Breakdown Voltage

• Low FIT (Failure in Time)

Rate*

• Six-sigma Quality Level

• Single, Dual and Quad

Versions

• Tape and Reel Options

Available

• Lead-free Option Available

* For more information see the

Surface Mount Schottky Reliability

Data Sheet.

Description/Applications

These Schottky diodes are

specifically designed for both

analog and digital applications.

This series offers a wide range of

specifications and package

configurations to give the

designer wide flexibility. The

HSMS-280x series of diodes is

optimized for high voltage

applications.

Note that Agilent’s manufacturing

techniques assure that dice found

in pairs and quads are taken from

adjacent sites on the wafer,

assuring the highest degree of

match.

Package Lead Code Identification, SOT-23/SOT-143

(Top View)

COMMON

CATHODE

UNCONNECTED

PAIR

COMMON

ANODE

SERIES

SINGLE

RING

QUAD

BRIDGE

QUAD

Package Lead Code

Identification, SOT-323

(Top View)

Package Lead Code

Identification, SOT-363

(Top View)

COMMON

CATHODE

COMMON

ANODE

SERIES

SINGLE

COMMON

CATHODE QUAD

UNCONNECTED

TRIO

BRIDGE

QUAD

COMMON

ANODE QUAD

RING

QUAD

123

654

HIGH ISOLATION

UNCONNECTED PAIR

123

654

123

654

123

654

123

654

123

654

Electrical Specifications TA = 25°C, Single Diode[4]

Maximum Maximum

Minimum Maximum Forward Reverse Typical

Part Package Breakdown Forward Voltage Leakage Maximum Dynamic

Number Marking Lead Voltage Voltage VF (V) @ IR (nA) @ Capacitance Resistance

HSMS[5] Code Code Configuration VBR (V) VF (mV) IF (mA) VR (V) CT (pF) RD (ΩΩ

ΩΩ

Ω)[6]

2800 A0[3] 0 Single 70 410 1.0 15 200 50 2.0 35

2802 A2[3] 2 Series

2803 A3[3] 3 Common Anode

2804 A4[3] 4 Common Cathode

2805 A5[3] 5 Unconnected Pair

2807 A7[3] 7 Ring Quad[5]

2808 A8[3] 8 Bridge Quad[5]

280B A0[7] B Single

280C A2[7] C Series

280E A3[7] E Common Anode

280F A4[7] F Common Cathode

280K AK[7] K High Isolation

Unconnected Pair

280L AL[7] L Unconnected Trio

280M H[7] M Common Cathode Quad

280N N[7] N Common Anode Quad

280P AP[7] P Bridge Quad

280R O[7] R Ring Quad

Test Conditions IR = 10 µAI

F = 1 mA VF = 0 V IF = 5 mA

f = 1 MHz

Notes:

1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.

2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.

3. Package marking code is in white.

4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

5. See section titled “Quad Capacitance.”

6. RD = RS + 5.2 Ω at 25°C and If = 5 mA.

7. Package marking code is laser marked.

Absolute Maximum Ratings[1] TC = 25°C

Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363

IfForward Current (1 µs Pulse) Amp 1 1

PIV Peak Inverse Voltage V Same as VBR Same as VBR

TjJunction Temperature °C 150 150

Tstg Storage Temperature °C -65 to 150 -65 to 150

θjc Thermal Resistance[2] °C/W 500 150

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.

Notes:

1. Package marking provides

orientation and identification.

2. See “Electrical Specifications” for

appropriate package marking.

Pin Connections and Package Marking, SOT-363

GUx

ESD WARNING:

Handling Precautions Should Be Taken

To Avoid Static Discharge.

Quad Capacitance

Capacitance of Schottky diode

quads is measured using an

HP4271 LCR meter. This

instrument effectively isolates

individual diode branches from

the others, allowing accurate

capacitance measurement of each

branch or each diode. The

conditions are: 20 mV R.M.S.

voltage at 1 MHz. Agilent defines

this measurement as “CM”, and it

is equivalent to the capacitance of

the diode by itself. The equivalent

diagonal and adjacent

capacitances can then be

calculated by the formulas given

below.

In a quad, the diagonal capaci-

tance is the capacitance between

points A and B as shown in the

figure below. The diagonal

capacitance is calculated using

the following formula

C1 x C2 C3 x C4

CDIAGONAL = _______ + _______

C1 + C2 C3 + C4

The equivalent adjacent

capacitance is the capacitance

between points A and C in the

figure below. This capacitance is

calculated using the following

formula

CADJACENT = C1 + ____________

1 1 1

–– + –– + ––

C2 C3C4

This information does not apply

to cross-over quad diodes.

SPICE Parameters

Parameter Units HSMS-280x

BVV75

CJ0 pF 1.6

EGeV 0.69

IBV AE-5

ISA3E-8

N 1.08

RSΩ30

PBV 0.65

PT2

M 0.5

Rj = 8.33 X 10-5 nT

Ib + Is

where

Ib = externally applied bias current in amps

Is = saturation current (see table of SPICE parameters)

T = temperature, °K

n = ideality factor (see table of SPICE parameters)

Note:

To effectively model the packaged HSMS-280x product,

please refer to Application Note AN1124.

RS = series resistance (see Table of SPICE parameters)

Cj = junction capacitance (see Table of SPICE parameters)

Linear Equivalent Circuit, Diode Chip

Typical Performance, T

C = 25°C (unless otherwise noted), Single Diode

0 0.1 0.30.2 0.5 0.60.4 0.80.7 0.9

IF – FORWARD CURRENT (mA)

VF – FORWARD VOLTAGE (V)

Figure 1. Forward Current vs.

Forward Voltage at Temperatures.

0.01

0.1

100

= +125°C

= +75°C

= +25°C

= –25°C

Figure 2. Reverse Current vs.

Reverse Voltage at Temperatures.

0102030 5040

IR – REVERSE CURRENT (nA)

VR – REVERSE VOLTAGE (V)

1000

100

100,000

10,000

= +125°C

= +75°C

= +25°C

Figure 3. Dynamic Resistance vs.

Forward Current.

0.1 1 100

RD – DYNAMIC RESISTANCE (Ω)

IF – FORWARD CURRENT (mA)

1000

100

Figure 4. Total Capacitance vs.

Reverse Voltage.

0102030 5040

CT – CAPACITANCE (pF)

VR – REVERSE VOLTAGE (V)

1.5

0.5

VF - FORWARD VOLTAGE (V)

Figure 5. Typical V

Match, Pairs and

Quads.

0.3

IF - FORWARD CURRENT (mA)

∆V

- FORWARD VOLTAGE DIFFERENCE (mV)

0.2 0.4 0.6 0.8 1.0 1.2 1.4

IF (Left Scale)

∆VF (Right Scale)

Table 1. Typical SPICE Parameters.

Parameter Units HSMS-280x HSMS-281x HSMS-282x

BVV75 25 15

CJ0 pF 1.6 1.1 0.7

EGeV 0.69 0.69 0.69

IBV A 1 E-5 1 E-5 1 E-4

ISA 3 E-8 4.8 E-9 2.2 E-8

N 1.08 1.08 1.08

RSΩ30 10 6.0

PB (VJ) V 0.65 0.65 0.65

PT (XTI) 2 2 2

M 0.5 0.5 0.5

Applications Information

Introduction —

Product Selection

Agilent’s family of Schottky

products provides unique solu-

tions to many design problems.

The first step in choosing the right

product is to select the diode type.

All of the products in the

HSMS-280x family use the same

diode chip, and the same is true of

the HSMS-281x and HSMS-282x

families. Each family has a

different set of characteristics

which can be compared most

easily by consulting the SPICE

parameters in Table 1.

A review of these data shows that

the HSMS-280x family has the

highest breakdown voltage, but at

the expense of a high value of

series resistance (Rs). In applica-

tions which do not require high

voltage the HSMS-282x family,

with a lower value of series

resistance, will offer higher

current carrying capacity and

better performance. The HSMS-

281x family is a hybrid Schottky

(as is the HSMS-280x), offering

lower 1/f or flicker noise than the

HSMS-282x family.

In general, the HSMS-282x family

should be the designer’s first

choice, with the -280x family

reserved for high voltage applica-

tions and the HSMS-281x family

for low flicker noise applications.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-323 (SC-70)

package is shown in Figure 6

(dimensions are in inches). This

layout provides ample allowance

for package placement by auto-

mated assembly equipment

without adding parasitics that

could impair the performance.

0.026

0.035

0.07

0.016

Figure 6. PCB Pad Layout

(dimensions in inches).

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-363 (SC-70,

6 lead) package is shown in

Figure 7 (dimensions are in

inches). This layout provides

ample allowance for package

placement by automated assembly

equipment without adding

parasitics that could impair the

performance.

0.026

0.075

0.016

0.035

Figure 7. PCB Pad Layout

(dimensions in inches).

TIME (seconds)

MAX

TEMPERATURE (°C)

100

150

200

250

Preheat

Zone Cool Down

Zone

Reflow

Zone

120 180 240 300

Figure 8. Surface Mount Assembly Profile.

SMT Assembly

Reliable assembly of surface

mount components is a complex

process that involves many

material, process, and equipment

factors, including: method of

heating (e.g., IR or vapor phase

reflow, wave soldering, etc.)

circuit board material, conductor

thickness and pattern, type of

solder alloy, and the thermal

conductivity and thermal mass of

components. Components with a

low mass, such as the SOT

package, will reach solder reflow

temperatures faster than those

with a greater mass.

Agilent’s SOT diodes have been

qualified to the time-temperature

profile shown in Figure 8. This

profile is representative of an IR

reflow type of surface mount

assembly process.

These parameters are typical for a

surface mount assembly process

for Agilent diodes. As a general

guideline, the circuit board and

components should be exposed

only to the minimum tempera-

tures and times necessary to

achieve a uniform reflow of

solder.

After ramping up from room

temperature, the circuit board

with components attached to it

(held in place with solder paste)

passes through one or more

preheat zones. The preheat zones

increase the temperature of the

board and components to prevent

thermal shock and begin evaporat-

ing solvents from the solder paste.

The reflow zone briefly elevates

the temperature sufficiently to

produce a reflow of the solder.

The rates of change of tempera-

ture for the ramp-up and cool-

down zones are chosen to be low

enough to not cause deformation

of the board or damage to compo-

nents due to thermal shock. The

maximum temperature in the

reflow zone (TMAX) should not

exceed 235°C.

Package Dimensions

Outline 23 (SOT-23)

Outline 143 (SOT-143)

SIDE VIEW

TOP VIEW

END VIEW

DIMENSIONS ARE IN MILLIMETERS

(

INCHES

)

1.02 (0.040)

0.89 (0.035)

0.60 (0.024)

0.45 (0.018)

1.40 (0.055)

1.20 (0.047)

2.65 (0.104)

2.10 (0.083)

3.06 (0.120)

2.80 (0.110)

2.04 (0.080)

1.78 (0.070)

1.02 (0.041)

0.85 (0.033)

0.152 (0.006)

0.066 (0.003)

0.10 (0.004)

0.013 (0.0005)

0.69 (0.027)

0.45 (0.018)

0.54 (0.021)

0.37 (0.015)

X X X

PACKAGE

MARKING

CODE (XX)

DATE CODE (X)

0.69 (0.027)

0.45 (0.018)

1.40 (0.055)

1.20 (0.047)

2.65 (0.104)

2.10 (0.083)

0.60 (0.024)

0.45 (0.018) 0.54 (0.021)

0.37 (0.015)

0.10 (0.004)

0.013 (0.0005)

1.04 (0.041)

0.85 (0.033)

0.92 (0.036)

0.78 (0.031)

2.04 (0.080)

1.78 (0.070)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

0.15 (0.006)

0.09 (0.003)

3.06 (0.120)

2.80 (0.110)

PACKAGE

MARKING

CODE (XX)

X X X

DATE CODE (X)

Part Number Ordering Information

No. of

Part Number Devices Container

HSMS-280x-TR2* 10000 13" Reel

HSMS-280x-TR1* 3000 7" Reel

HSMS-280x-BLK * 100 antistatic bag

x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L, M, N, P, R

For lead-free option, the part number will have the

character "G" at the end, eg. HSMS-280x-TR2G for a

10,000 lead-free reel.

Outline SOT-363 (SC-70 6 Lead)

Outline SOT-323 (SC-70 3 Lead)

2.20 (0.087)

2.00 (0.079)

1.35 (0.053)

1.15 (0.045)

1.30 (0.051)

REF.

0.650 BSC (0.025)

2.20 (0.087)

1.80 (0.071)

0.10 (0.004)

0.00 (0.00)

0.25 (0.010)

0.15 (0.006)

1.00 (0.039)

0.80 (0.031) 0.20 (0.008)

0.10 (0.004)

0.30 (0.012)

0.10 (0.004)

0.30 REF.

10°

0.425 (0.017)

TYP.

DIMENSIONS ARE IN MILLIMETERS

(

INCHES

)

PACKAGE

MARKING

CODE (XX)

X X X

DATE CODE (X)

2.20 (0.087)

2.00 (0.079)

1.35 (0.053)

1.15 (0.045)

1.30 (0.051)

REF.

0.650 BSC (0.025)

2.20 (0.087)

1.80 (0.071)

0.10 (0.004)

0.00 (0.00)

0.25 (0.010)

0.15 (0.006)

1.00 (0.039)

0.80 (0.031)

0.20 (0.008)

0.10 (0.004)

0.30 (0.012)

0.10 (0.004)

0.30 REF.

10°

0.425 (0.017)

TYP.

DIMENSIONS ARE IN MILLIMETERS

(

INCHES

)

PACKAGE

MARKING

CODE (XX)

X X X

DATE CODE (X)

Device Orientation

USER

FEED

DIRECTION

COVER TAPE

CARRIER

TAPE

REEL

For Outline SOT-143

Note: "AB" represents package marking code.

"C" re

resents date code.

END VIE

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

For Outlines SOT-23, -323

Note: "AB" represents package marking code.

"C" represents date code.

END VIE

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

END VIE

8 mm

4 mm

TOP VIEW

Note: "AB" represents package marking code.

"C" represents date code.

ABC ABC ABC ABC

For Outline SOT-363

Tape Dimensions and Product Orientation

For Outline SOT-23

9° MAX

Ko 8° MAX

13.5° MAX

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

3.15 ± 0.10

2.77 ± 0.10

1.22 ± 0.10

4.00 ± 0.10

1.00 + 0.05

0.124 ± 0.004

0.109 ± 0.004

0.048 ± 0.004

0.157 ± 0.004

0.039 ± 0.002

CAVITY

DIAMETER

PITCH

POSITION

1.50 + 0.10

4.00 ± 0.10

1.75 ± 0.10

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH

THICKNESS

8.00 + 0.30 – 0.10

0.229 ± 0.013

0.315 + 0.012 – 0.004

0.009 ± 0.0005

CARRIER TAPE

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

BETWEEN

CENTERLINE

For Outline SOT-143

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

3.19 ± 0.10

2.80 ± 0.10

1.31 ± 0.10

4.00 ± 0.10

1.00 + 0.25

0.126 ± 0.004

0.110 ± 0.004

0.052 ± 0.004

0.157 ± 0.004

0.039 + 0.010

CAVITY

DIAMETER

PITCH

POSITION

1.50 + 0.10

4.00 ± 0.10

1.75 ± 0.10

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH

THICKNESS

8.00 + 0.30 – 0.10

0.254 ± 0.013

0.315+ 0.012 – 0.004

0.0100 ± 0.0005

CARRIER TAPE

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

9° MAX 9° MAX

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (65) 6756 2394

India, Australia, New Zealand: (65) 6755 1939

Japan: (+81 3) 3335-8152(Domestic/International), or

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Korea: (65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand, Philippines,

Indonesia: (65) 6755 2044

Taiwan: (65) 6755 1843

Data subject to change.

Obsoletes 5968-7960E

March 24, 2004

5989-0474EN

Tape Dimensions and Product Orientation

For Outlines SOT-323, -363

(CARRIER TAPE THICKNESS) T

(COVER TAPE THICKNESS)

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

2.40 ± 0.10

1.20 ± 0.10

4.00 ± 0.10

1.00 + 0.25

0.094 ± 0.004

0.047 ± 0.004

0.157 ± 0.004

0.039 + 0.010

CAVITY

DIAMETER

PITCH

POSITION

1.55 ± 0.05

4.00 ± 0.10

1.75 ± 0.10

0.061 ± 0.002

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH

THICKNESS

8.00 ± 0.30

0.254 ± 0.02

0.315 ± 0.012

0.0100 ± 0.0008

CARRIER TAPE

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

FOR SOT-323 (SC70-3 LEAD) An 8°C MAX

FOR SOT-363 (SC70-6 LEAD) 10°C MAX

ANGLE

WIDTH

TAPE THICKNESS

5.4 ± 0.10

0.062 ± 0.001

0.205 ± 0.004

0.0025 ± 0.00004

COVER TAPE