MPXAZ4100A6U - Freescale Semiconductor / Motorola

MPXAZ4100A

Rev 1, 05/2005

Freescale Semiconductor

Technical Data

Integrated Silicon Pressure Sensor

for Manifold Absolute Pressure

Applications On-Chip Signal

Conditioned, Temperature

Compensated and Calibrated

The Freescale MPXAZ4100A series Manifold Absolute Pressure (MAP)

sensor for engine control is designed to sense absolute air pressure within the

intake manifold. This measurement can be used to compute the amount of fuel

required for each cylinder. The small form factor and high reliability of on-chip

integration makes the Freescale MAP sensor a logical and economical choice for

automotive system designers.

The MPXAZ4100A series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output signal

that is proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a

pressure sensor chip.

Features

• Resistant to high humidity and common automotive media

• 1.8% Maximum Error Over 0° to 85°C

• Specifically Designed for Intake Manifold Absolute

Pressure Sensing in Engine Control Systems

• Ideally Suited for Microprocessor or Microcontroller Based Systems

• Temperature Compensated Over –40°C to +125°C

• Durable Thermoplastic (PPS) Surface Mount Package

Typical Applications

• Manifold Sensing for Automotive Systems

• Also Ideal for Non-Automotive Applications

ORDERING INFORMATION

Device

Type Options Case

No.

MPX Series

Order No.

Packing

Options

Device

Marking

SMALL OUTLINE PACKAGE (MPXAZ4100A SERIES)

Basic

Elements

Absolute,

Element Only

482 MPXAZ4100A6U Rails MPXAZ4100A

Absolute,

Element Only

482 MPXAZ4100A6T1 Tape & Reel MPXAZ4100A

Ported

Elements

Absolute, Axial

Port

482A MPXAZ4100AC6U Rails MPXAZ4100A

Absolute, Axial

Port

482A MPXAZ4100AC6T1 Tape & Reel MPXAZ4100A

MPXAZ4100A

SERIES

INTEGRATED

PRESSURE SENSOR

20 TO 105 kPA (2.9 TO 15.2 psi)

0.3 TO 4.9 V OUTPUT

MPXA4100A6U/6T1

CASE 482-01

MPXA4100AC6U/AC6T1

CASE 482A-01

PIN NUMBER(1)

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch in the lead.

1 N/C 5 N/C

2 VS6N/C

3GND 7N/C

4 VOUT 8N/C

SMALL OUTLINE PACKAGES

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MPXAZ4100A

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating Symbol Value Unit

Maximum Pressure (P1 > P2) PMAX 400 kPa

Storage Temperature TSTG –40 to +125 °C

Operating Temperature TA–40 to +125 °C

Vout

GND

Sensing

Element

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

for small outline package devices.

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitry

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MPXAZ4100A

Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

Figure 3 required to meet electrical specifications.)

Characteristic Symbol Min Typ Max Unit

Pressure Range(1)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

POP 20 — 105 kPa

Supply Voltage(2)

2. Device is ratiometric within this specified excitation range.

VS4.85 5.1 5.35 Vdc

Supply Current Io— 7.0 10 mAdc

Minimum Pressure Offset (0 to 85°C)

@ VS = 5.1 Volts(3)

3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

Voff 0.225 0.306 0.388 Vdc

Full Scale Output (0 to 85°C)

@ VS = 5.1 Volts(4)

4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

VFSO 4.870 4.951 5.032 Vdc

Full Scale Span (0 to 85°C)

@ VS = 5.1 Volts(5)

5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFSS —4.59—Vdc

Accuracy(6) (0 to 85°C)

6. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

minimum or maximum rated pressure, at 25°C.

• TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C.

• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.

• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

———±1.8 %VFSS

Sensitivity V/P — 54 — mV/kPa

Response Time(7)

7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

tR—1.0—ms

Output Source Current at Full Scale Output Io+ —0.1—mAdc

Warm-Up Time(8)

8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

——20—ms

Offset Stability(9)

9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

——±0.5 — %VFSS

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Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 482).

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

A gel die coat isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be

transmitted to the sensor diaphragm. The gel die coat and

durable polymer package provide a media resistant barrier

that allows the sensor to operate reliably in high humidity

conditions as well as environments containing common

automotive media. Contact the factory for more information

regarding media compatibility in your specific application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646.)

Figure 4. Output versus Absolute Pressure

Fluoro Silicone

Gel Die Coat

Wire Bond

Lead Frame

Sealed Vacuum Reference

Absolute Element Die Bond

Stainless Steel Cap

Thermoplastic Case

Die

+5 V

1.0 µF0.01 µF470 pFGND

Vout

IPS

Output

Output (Volts)

100

105

110

MAX

TYP

MIN

5.0

4.5

3.5

4.0

3.0

2.5

2.0

1.5

1.0

0.5

Pressure (ref: to sealed vacuum) in kPa

Transfer Function:

Vout = Vs* (.01059*P-.152) ± Error

VS = 5.1 Vdc

Temperature = 0 to 85°C

20 kPa TO 105 kPa

MPXAZ4100A

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MPXAZ4100A

Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518)

± (Pressure Error x Temp. Factor x 0.01059 x VS)

VS = 5.1 V ± 0.25 Vdc

Transfer Function (MPXAZ4100A)

MPXAZ4100A Series

Temp Multiplier

-40 3

0 to 85 1

+125 3

Temperature in °C

4.0

3.0

2.0

0.0

1.0

-40 -20 0 20 40 60 14012010080

Temperature

Error

Factor

NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.

Temperature Error Band

Error Limits for Pressure

3.0

2.0

1.0

-1.0

-2.0

-3.0

0.0

20 40 60 80 100 120

Pressure (in kPa)

Pressure Error (kPa)

Pressure Error (Max)

Pressure Error Band

20 to 105 (kPa) ±1.5 (kPa)

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MPXAZ4100A

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm SCALE 2:1

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MPXAZ4100A

PACKAGE DIMENSIONS

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

D8 PL

0.25 (0.010) A S

-A-

-B-

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C5.380.2300.212 5.84

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.405 0.415 10.29 10.54

S0.709 0.725 18.01 18.41

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C12.700.5200.500 13.21

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.444 0.448 11.28 11.38

S0.709 0.725 18.01 18.41

V0.245 0.255 6.22 6.48

W0.115 0.125 2.92 3.17

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

D8 PL

0.25 (0.010) AT

-A-

-B-

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

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MPXAZ4100A

Rev. 1

05/2005

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