TLP182 TOSHIBA Photocoupler InGaAs Infrared LED & Photo-Transistor TLP182 Telephone Use Equipment Programmable Controllers AC / DC-Input Module Telecommunication Unit: mm TLP182 consist of photo transistor, optically coupled to two InGaAs infrared emitting diode connected inverse parallel, and can operate directly by low AC input current. TLP182 are guaranteed wide operating temperature (Ta = -55 to 125 C) and high isolation voltage (3750Vrms), it's suitable for switching power supplies and hybrid ICs. * Collector-emitter voltage : 80V (min) * Current transfer ratio * Isolation voltage : 3750 Vrms (min) * Operation Temperature :-55 to 125 C * UL recognized : UL1577, File No. E67349 * cUL approved : CSA Component Acceptance Service No.5A, Rank GB : 50% (min) : 100% (min) File No. E67349 * * Option (V4) VDE approved : DIN EN 60747-5-5, approved No. 40009347 (Note) When an EN 60747-5-5 approved type is needed, please designate the "Option(V4)" Construction mechanical rating Creepage distance Clearance Insulation thickness : 5.0 mm(min) : 5.0 mm(min) : 0.4 mm(min) JEDEC JEITA TOSHIBA 11-4M1S Weight: 0.08 g (typ.) Pin Configuration 1 6 3 4 1: Anode, Cathode 3: Cathode, Anode 4: Emitter 6: Collector 1 2013-9-13 TLP182 Current Transfer Ratio (Unless otherwise specified, Ta = 25C) Rank (Note 1) Blank Y Test condition IF =5 mA, VCE = 5 V IF =0.5 mA, VCE = 5 V IF =5 mA, VCE = 5 V Current Transfer Ratio IC / I F Min Max Marking of classification 50 600 Blank, YE, GR, GB, BL 50 150 YE 100 300 GR 100 600 GB 200 600 BL Unit IF =0.5 mA, VCE = 5 V GR IF =5 mA, VCE = 5 V IF =0.5 mA, VCE = 5 V GB IF =5 mA, VCE = 5 V % IF =0.5 mA, VCE = 5 V BL IF =5 mA, VCE = 5 V IF =0.5 mA, VCE = 5 V Note1: Specify both the part number and a rank in this format when ordering (e.g.) rank GB: TLP182 (GB,E For safety standard certification, however, specify the part number alone. (e.g.)TLP182 (GB,E: TLP182 2 2013-9-13 TLP182 Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25C) Characteristic Unit IF(RMS) 50 mA IF / Ta -1.5 mA / C 1 A Tj 125 C Collector-emitter voltage VCEO 80 V Emitter-collector voltage VECO 7 V IC 50 mA LED Input forward current derating (Ta90C) Input forward current (pulsed) Junction temperature Detector Note Rating R.M.S. forward current Collector current Collector power dissipation Symbol IFP (Note 2) PC 150 mW PC / Ta -1.5 mW / C Tj 125 C Operating temperature range Topr -55 to 125 C Storage temperature range Tstg -55 to 125 C Lead soldering temperature Tsol 260(10s) C Total package power dissipation PT 200 mW PT / Ta -2.0 mW / C 3750 Vrms Power dissipation derating (Ta 25C) Junction temperature Total package power dissipation derating (Ta 25C) Isolation voltage BVS (Note 3) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: Pulse width 100 s, frequency 100 Hz Note 3: AC, 1min., R.H. 60%, Device considered a two terminal device: LED side pins shorted together and detector side pins shorted together. 3 2013-9-13 TLP182 Electrical Characteristics (Unless otherwise specified, Ta = 25C) Detector LED Characteristic Symbol Test Condition Input forward voltage VF IF = 10 mA Input capacitance CT V = 0 V, f = 1 MHz Min Typ. Max Unit 1.1 1.25 1.4 V - 60 - pF - - V Collector-emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 Emitter-collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 - - V VCE = 48 V - 0.01 0.08 A VCE = 48 V, Ta = 85C - 2 50 A V = 0 V, f = 1 MHz - 10 - pF Unit Collector dark current IDARK Collector-emitter capacitance CCE Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25C) Characteristic Symbol Test Condition IF = 5 mA, VCE = 5 V Current transfer ratio IC / I F Rank GB IF = 0.5 mA, VCE = 5 V Rank GB Saturated CTR IC / IF (sat) IF = 1 mA, VCE = 0.4 V Rank GB IC = 2.4 mA, IF = 8 mA Collector-emitter saturation voltage VCE (sat) IC = 0.2 mA, IF = 1 mA Rank GB Off-state collector current IC(off) Collector current ratio IC (ratio) VF = 0.7 V, VCE = 48 V IC (IF = -5 mA) / IC (IF = 5 mA) (Fig 1) Min Typ. Max 50 - 600 100 - 600 50 - 600 100 - 600 - 60 - 50 - - - - 0.3 - 0.2 - - - 0.3 - 1 10 A 0.33 - 3 -- % % V Fig. 1: Collector current ratio test circuit I (I = I , V = 5V) IC(ratio)= C2 F F2 CE IC1(IF = IF1, VCE = 5V) IC1 IF1 VCE IC2 IF2 4 2013-9-13 TLP182 Isolation Characteristics ( Unless otherwise specified, Ta = 25C) Characteristic Symbol Total capacitance (input to output) CS Isolation resistance RS Test Condition BVS Typ. Max Unit - 0.8 - pF - VS = 0 V, f = 1 MHz VS = 500 V, R.H. 60% 1x10 AC, 1 minute Isolation voltage Min 10 10 14 3750 - - AC, 1 second, in oil - 10000 - DC, 1 minute, in oil - 10000 - Vdc Min Typ. Max Unit 2 3 3 3 0.4 20 35 4 7 30 Vrms Switching Characteristics ( Unless otherwise specified, Ta = 25C) Characteristic Symbol Rise time tr Fall time tf Turn-on time ton Turn-off time toff Turn-on time ton Storage time ts Turn-off time toff Turn-on time ton Storage time ts Turn-off time toff Test Condition VCC = 10 V, IC = 2 mA RL = 100 RL = 1.9 k VCC = 5 V, IF = 16 mA (Fig.2) RL = 4.7 k VCC = 5 V, IF = 1.6 mA (Fig.2) s s Fig. 2: Switching time test circuit IF RL IF VCC ts VCC 4.5V VCE VCE 0.5V ton 5 toff 2013-9-13 TLP182 Characteristics Curves (Note) P C - Ta PC Collector power dissipation Input forward current I F (mA) (mW) I F - Ta This curve shows the maximum limit to the input forward current. Ambient temperature Ta This curve shows the maximum limit to the collector power dissipation. Ambient temperature (C) IFP-DR Ta (C) IF-VF Pules width 100s (mA) IF Input forward current Input forward current (pulsed) IFP (mA) Ta=25C This curve shows the maximum limit to the input forward current (pulsed). 0.001 0.01 0.1 Duty cycle ratio 125C 110C 85C 50C 25C 0C -25C -55C 1 DR Input forward voltage (V) IFP - VFP Input forward current (pulsed) IFP (mA) Input forward current temperature coefficient VF /Ta (mV/C) V F / Ta - I F VF Input forward current IF (mA) Pulse width 10s Repeatitive frequency=100Hz Ta=25C Input forward voltage (pulsed) VFP (V) Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 6 2013-9-13 TLP182 IC-VCE IC-VCE PC(max) (mA) (mA) Ta=25C Ta=25C 50 mA 30 mA IC 15 mA 10 mA 5mA IF = 2mA Collector-emitter voltage 30 mA VCE 20 mA 15 mA Collector current Collector current IC 20 mA 50 mA 10 mA 5 mA IF = 2 mA Collector-emitter voltage (V) VCE IC / IF -IF IC-IF Ta=25C Current transfer ratio Collector current IC (mA) IC / IF (%) Ta=25C VCE=10V VCE=5V VCE=10V VCE=5V VCE=0.4V Input forward voltage IF VCE=0.4V (mA) Input forward current IF (mA) V C E ( s a t ) - Ta (V) Collector-emitter saturation voltage I D A R K - Ta VCE(sat) VCE=48V Dark current IDARK (A) (V) IF=8mA, IC=2.4mA Ambient temperature Ta (C) Ambient temperature Ta (C) Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 7 2013-9-13 TLP182 Collector current IC (mA) I C - Ta 5 mA IF=0.5mA VCE=5V Ambient temperature Ta (C) Switching time - RL S w i t c h i n g t i m e - Ta Ta=25C IF=16mA IF=16mA VCC=5V RL=1.9k VCC=5V toff (s) ts Switching time Switching time (s) toff ts ton ton Load resistance Ambient temperature RL (k) Ta (C) Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 8 2013-9-13 TLP182 Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow Temperature profile example of lead (Pb) solder (C) This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 240 210 160 140 less than 30s 60 to 120s Time (s) Temperature profile example of using lead (Pb)-free solder (C) This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 260 230 190 180 60 to 120s 30 to 50s Time (s) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150C between 60 and 120 seconds. Complete soldering within 10 seconds below 260C. Flow soldering must be performed once. 3) Using a soldering iron Complete soldering within 10 seconds below 260C, or within 3 seconds at 350C. Each pin may be heated at most once. 9 2013-9-13 TLP182 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5C to 35C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 10 2013-9-13 TLP182 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 11 2013-9-13