TLP182
2013-9-13
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TOSHIBA Photocoupler InGaAs Infrared LED & Photo−Transistor
TLP182
Telephone Use Equipment
Programmable Controllers
AC / DC−Input Module
Telecommunication
TLP182 consist of photo transistor, optically coupled to two InGaAs infrared
emitting diode connected inverse parallel, and can operate directly by low AC
input current.
TLP182 are guaranteed wide operating temperature (Ta = -55 to 125 ˚C) and
high isolation voltage (3750Vrms), it’s suitable for switching power supplies and
hybrid ICs.
• Collector-emitter voltage : 80V (min)
• Current transfer ratio : 50% (min)
Rank GB : 100% (min)
• Isolation voltage : 3750 Vrms (min)
• Operation Temperature :-55 to 125 ˚C
• UL recognized : UL1577, File No. E67349
• cUL approved : CSA Component Acceptance Service No.5A,
File No. E67349
• Option (V4)
VDE approved : DIN EN 60747-5-5, approved No. 40009347
(Note) When an EN 60747-5-5 approved type is needed,
please designate the “Option(V4)”
• Construction mechanical rating
Creepage distance : 5.0 mm(min)
Clearance : 5.0 mm(min)
Insulation thickness : 0.4 mm(min)
JEDEC
-
JEITA
-
TOSHIBA
11-4M1S
Weight: 0.08 g (typ.)
Pin Configuration
6
1: Anode, Cathode
3: Cathode, Anode
4: Emitter
6: Collector
4
1
3
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Current Transfer Ratio (Unless otherwise specified, Ta = 25°C)
Note1: Specify both the part number and a rank in this format when ordering
(e.g.) rank GB: TLP182 (GB,E
For safety standard certification, however, specify the part number alone.
(e.g.)TLP182 (GB,E: TLP182
Rank
(Note 1) Test condition
Current Transfer Ratio
Marking of classification Unit
IC / IF
Min
Max
Blank
IF =±5 mA, VCE = 5 V
50 600 Blank, YE, GR, GB, BL
%
IF =±0.5 mA, VCE = 5 V
Y IF =±5 mA, VCE = 5 V 50 150 YE
IF =±0.5 mA, VCE = 5 V
GR IF =±5 mA, VCE = 5 V 100 300 GR
IF =±0.5 mA, VCE = 5 V
GB IF =±5 mA, VCE = 5 V 100 600 GB
IF =±0.5 mA, VCE = 5 V
BL IF =±5 mA, VCE = 5 V 200 600 BL
IF =±0.5 mA, VCE = 5 V
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Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)
Characteristic Symbol Note Rating Unit
LED
R.M.S. forward current IF(RMS) ±50 mA
Input forward current derating (Ta≥90°C) ΔIF / ΔTa -1.5 mA / °C
Input forward current (pulsed) IFP (Note 2) ±1 A
Junction temperature Tj 125 °C
Detector
Collector−emitter voltage VCEO 80 V
Emitter−collector voltage VECO 7 V
Collector current IC 50 mA
Collector power dissipation PC 150 mW
Power dissipation derating (Ta ≥ 25°C) ΔPC / ΔTa -1.5 mW / °C
Junction temperature Tj 125 °C
Operating temperature range Topr −55 to 125 °C
Storage temperature range Tstg −55 to 125 °C
Lead soldering temperature Tsol 260(10s) °C
Total package power dissipation PT 200 mW
Total package power dissipation derating (Ta ≥ 25°C) ΔPT / ΔTa -2.0 mW / °C
Isolation voltage BVS (Note 3) 3750 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: Pulse width ≤ 100 μs, frequency 100 Hz
Note 3: AC, 1min., R.H.≤ 60%, Device considered a two terminal device: LED side pins shorted together and detector
side pins shorted together.
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Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
LED
Input forward voltage VF IF = ±10 mA 1.1 1.25 1.4 V
Input capacitance CT V = 0 V, f = 1 MHz - 60 - pF
Detector
Collector−emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 - - V
Emitter−collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 - - V
Collector dark current IDARK
VCE = 48 V - 0.01 0.08 μA
VCE = 48 V, Ta = 85°C - 2 50 μA
Collector-emitter capacitance CCE V = 0 V, f = 1 MHz - 10 - pF
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Current transfer ratio IC / IF
IF = ±5 mA, VCE = 5 V 50 - 600
%
Rank GB
100 - 600
IF = ±0.5 mA, VCE = 5 V 50
-
600
Rank GB
100
-
600
Saturated CTR IC / IF (sat)
IF = ±1 mA, VCE = 0.4 V - 60 -
%
Rank GB
50 - -
Collector−emitter saturation voltage VCE (sat)
IC = 2.4 mA, IF = ±8 mA - - 0.3
V
IC = 0.2 mA, IF = ±1 mA - 0.2 -
Rank GB
- - 0.3
Off−state collector current IC(off) VF = ± 0.7 V, VCE = 48 V - 1 10 μA
Collector current ratio IC (ratio) IC (IF = -5 mA) / IC (IF = 5 mA)
(Fig 1) 0.33 - 3 —
Fig. 1: Collector current ratio test circuit
IC(ratio)=
5V)
CE
V
,
F1
I
F
(I
C1
I
5V)
CE
V
,
F2
I
F
(I
C2
I
==
=
=
IC1
IC2
VCE
IF1
IF2
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Isolation Characteristics ( Unless otherwise specified, Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Total capacitance (input to output) CS VS = 0 V, f = 1 MHz - 0.8 - pF
Isolation resistance RS VS = 500 V, R.H. ≤ 60% 1×1010 1014 - Ω
Isolation voltage BVS
AC, 1 minute 3750 - -
Vrms
AC, 1 second, in oil - 10000 -
DC, 1 minute, in oil - 10000 - Vdc
Switching Characteristics ( Unless otherwise specified, Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Rise time tr
VCC = 10 V, IC = 2 mA
RL = 100 Ω
― 2 ―
μs
Fall time tf ― 3 ―
Turn−on time ton ― 3 ―
Turn−off time toff ― 3 ―
Turn−on time ton
RL = 1.9 kΩ (Fig.2)
VCC = 5 V, IF = ±16 mA
― 0.4 ―
Storage time ts ― 20 ―
Turn−off time toff ― 35 ―
Turn−on time ton
RL = 4.7 kΩ (Fig.2)
VCC = 5 V, IF = ±1.6 mA
― 4 ―
μs
Storage time ts ― 7 ―
Turn−off time toff ― 30 ―
Fig. 2: Switching time test circuit
toff
ton
VCE
IF
ts VCC
4.5V
0.5V
VCC
RL
IF
VCE
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Characteristics Curves (Note)
IF-Ta
PC-Ta
Input forward current I F (mA)
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
IFP- D R
IF- V F
Input forward current (pulsed)
IFP (mA)
Input forward current IF (mA)
Duty cycle ratio DR
Input forward voltage VF (V)
∆VF/∆Ta- I F
IF P – V F P
Input forward current temperature coefficient
ΔVF /ΔTa (mV/°C)
Input forward current (pulsed) IFP (mA)
Input forward current IF (mA)
Input forward voltage (pulsed) VFP (V)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
0.001 0.01 0.1 1
Pules width ≤100μs
Ta=25˚C
Pulse width ≤10μs
Repeatitive frequency=100Hz
Ta=25°C
This curve shows the
maximum limit to the input
forward current.
This curve shows the maximum
limit to the collector power
dissipation.
This curve shows the
maximum limit to the input
forward current (pulsed).
125˚C
110˚C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
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IC- V CE
IC- V CE
Collector current IC (mA)
Collector current IC (mA)
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
IC- I F
IC / IF - I F
Collector current IC (mA)
Current transfer ratio IC / IF (%)
Input forward voltage IF (mA)
Input forward current IF (mA)
I
DARK
-Ta
V
CE(sat)
- Ta
Dark current IDARK (μA)
Collector-emitter saturation voltage
VCE(sat) (V)
Ambient temperature Ta ( °C)
Ambient temperature Ta (°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
VCE=10V
VCE=5V
VCE=0.4V
VCE=10V
VCE=5V
VCE=0.4V
IF=8mA, IC=2.4mA
Ta=25˚C
Ta=25˚C
5mA
10 mA
15 mA
20 mA
30 mA
50 mA
P
C
(max)
5 mA
10 mA
15 mA
I
F
= 2 mA
20 mA
30 mA
50 mA
Ta=25˚C
V
CE=48V
I
F
= 2mA
Ta=25˚C
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IC - Ta
Collector current IC (mA)
Ambient temperature Ta (°C)
Switching time - RL
Switching time - Ta
Switching time (μs)
Switching time (μs)
Load resistance RL (kΩ)
Ambient temperature Ta ( °C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
t
off
Ta=25˚C
IF=16mA
VCC=5V
IF=16mA
VCC=5V
RL=1.9kΩ
ts
ton
t
off
ts
ton
VCE=5V
IF=0.5mA
5 mA
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Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solder
∙Temperature profile example of using lead (Pb)-free solder
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
･Please preheat it at 150°C between 60 and 120 seconds.
･Complete soldering within 10 seconds below 260°C.
･Flow soldering must be performed once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
Time
(s)
(°C)
240
210
160
60
to 120s
less than 30s
Package surface temperature
140
Time
(s)
(
°C
)
260
230
190
60
to
120s
30
to
50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
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2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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RESTRICTIONS ON PRODUCT USE
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in this document, and related hardware, software and systems (collectively "Product") without notice.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
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