NC7SZ00 TinyLogic UHS Two-Input NAND Gate Description The NC7SZ00 is a single two-input NAND gate from ON Semiconductor's Ultra-High Speed (UHS) series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC operating range. The inputs and output are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V, independent of VCC operating voltage. www.onsemi.com MARKING DIAGRAMS Features * * * * * * * * * * Pin 1 Ultra-High Speed: tPD 2.4 ns (Typical) into 50 pF at 5 V VCC High Output Drive: 24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Matches Performance of LCX Operated at 3.3 V VCC Power Down High-Impedance Inputs / Outputs Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Ultra-Small MicroPakTM Packages Space-Saving SC-74A and SC-88A Packages These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant & YYKK XYZ UDFN6 CASE 517DP Pin 1 SC-74A CASE 318BQ 7Z00MG G SC-88A CASE 419AC-01 IEEE / IEC A B YYKK XYZ SIP6 CASE 127EB Z00T Y Figure 1. Logic Symbol YY, 7Z00, Z00 KK XY Z M G T = Specific Device Code = 2-Digit Lot Run Traceability Code = 2-Digit Date Code Format = Assembly Plant Code = Data Code = Pb-Free Package = Die Run Code = Year Coding Scheme = Plant Code Identifier = Eight-Week Datacoding Scheme (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. (c) Semiconductor Components Industries, LLC, 1996 March, 2020 - Rev. 5 1 Publication Order Number: NC7SZ00/D NC7SZ00 Pin Configurations A 1 5 VCC B 2 GND 3 4 Y A 1 6 VCC B 2 5 NC GND 3 Figure 2. SC-88A and SC-74A (Top View) 4 Y Figure 3. MicroPak (Top Through View) PIN DEFINITIONS FUNCTION TABLE Pin # SC-88A / SC74A Pin # MicroPak Name Inputs 1 1 A Input 2 2 B Input 3 3 GND Ground 4 4 Y Output 5 6 VCC Supply Voltage 5 NC No Connect Description B Y L L H L H H H L H H H L H = HIGH Logic Level L = LOW Logic Level www.onsemi.com 2 Output A NC7SZ00 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage -0.5 6.0 V VIN DC Input Voltage -0.5 6.0 V DC Output Voltage -0.5 6.0 V VIN < -0.5 V - -50 mA VIN > 6.0 V - +20 VOUT < -0.5 V - -50 VOUT > 6 V, VCC = GND - +20 DC Output Current - 50 mA DC VCC or Ground Current - 50 mA -65 +150 C - +150 C VOUT IIK IOK IOUT ICC or IGND TSTG Parameter DC Input Diode Current DC Output Diode Current Storage Temperature Range mA TJ Junction Temperature Under Bias TL Junction Lead Temperature (Soldering, 10 Seconds) - +260 C PD Power Dissipation in Still Air SC-74A - 225 mW SC-88A-5 - 190 MicroPak-6 - 327 MicroPak2TM-6 - 327 Human Body Model, JEDEC: JESD22-A114 - 4000 Charge Device Model, JEDEC: JESD22-C101 - 2000 ESD V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT Parameter Min Max Unit Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.5 5.5 Input Voltage 0 5.5 V Output Voltage 0 VCC V -40 +85 C VCC = 1.8 V, 2.5 V 0.2 V 0 20 ns/V VCC = 3.3 V 0.3 V 0 10 VCC = 5.0 V 0.5 V 0 5 SC-74A - 555 SC-88A-5 - 659 MicroPak-6 - 382 MicroPak2-6 - 382 TA Operating Temperature tr, tf Input Rise and Fall Times qJA Thermal Resistance Conditions C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7SZ00 DC ELECTICAL CHARACTERISTICS TA = +25C Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage Typ Max Min Max Unit 1.65 to 1.95 0.65 VCC - - 0.65 VCC - V 2.30 to 5.50 0.70 VCC - - 0.70 VCC - 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC 2.30 to 5.50 - - 0.30 VCC - 0.30 VCC 1.55 1.65 - 1.55 - 1.70 1.80 - 1.70 - 2.30 2.20 2.30 - 2.20 - 3.00 2.90 3.00 - 2.90 - 4.50 4.40 4.50 - 4.40 - VCC (V) 1.65 1.80 VOL LOW Level Output Voltage Input Leakage Current IOFF Power Off ICC Quiescent Supply Current Conditions VIN = VIL, IOH = -100 mA 1.65 IOH = -4 mA 1.29 1.52 - 1.29 - 2.30 IOH = -8 mA 1.90 2.15 - 1.90 - 3.00 IOH = -16 mA 2.40 2.80 - 2.40 - 3.00 IOH = -24 mA 2.30 2.68 - 2.30 - 4.50 IOH = -32 mA 3.80 4.20 - 3.80 - 1.65 VIN = VIH, IOL = 100 mA - 0.00 0.10 - 0.08 - 0.00 0.10 - 0.10 3.00 - 0.00 0.10 - 0.10 3.00 - 0.00 0.10 - 0.10 4.50 - 0.00 0.10 - 0.10 2.30 IIN TA = -40 to +85C Min V V V 1.65 IOL = 4 mA - 0.80 0.24 - 0.24 2.30 IOL = 8 mA - 0.10 0.30 - 0.30 3.00 IOL = 16 mA - 0.15 0.40 - 0.40 3.00 IOL = 24 mA - 0.22 0.55 - 0.55 4.50 IOL = 32 mA - 0.22 0.55 - 0.55 VIN = 5.5 V, GND - - 1 - 10 mA VIN or VOUT = 5.5 V - - 1 - 10 mA VIN = 5.5 V, GND - - 2 - 20 mA 1.65 to 5.5 0 1.65 to 5.50 www.onsemi.com 4 NC7SZ00 AC ELECTRICAL CHARACTERISTICS TA = +25C Symbol tPHL, tPLH Parameter Propagation Delay (Figure 4, 5) TA = -40 to +85C Min Typ Max Min Max Unit - 5.4 11.4 - 12.0 ns - 4.5 9.5 - 10.0 2.50 0.20 - 3.0 6.5 - 7.0 3.30 0.30 - 2.4 4.5 - 4.7 5.00 0.50 - 2.0 3.9 - 4.1 - 2.9 5.0 - 5.2 - 2.4 4.3 - 4.5 VCC (V) Conditions CL = 15 pF, RL = 1 MW 1.65 1.80 3.30 0.30 5.00 0.50 CL = 50 pF, RL = 500 W CIN Input Capacitance 0.00 - 4 - - - pF CPD Power Dissipation Capacitance (Note 2) (Figure 6) 3.30 - 24 - - - pF 5.00 - 30 - - - 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). tf = 3 ns tr = 3 ns 90% 50% INPUT VCC 10% CL RL OUTPUT VCC 50% 10% tW tPHL OUTPUT INPUT 90% tPLH 50% GND VOH 50% VOL Figure 4. AC Test Circuit Figure 5. AC Waveforms VCC A INPUT NOTE: 3. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 6. ICCD Test Circuit www.onsemi.com 5 NC7SZ00 ORDERING INFORMATION Top Mark Package Shipping NC7SZ00M5X 7Z00 SC-74A 3000 / Tape & Reel NC7SZ00P5X Z00 SC-88A 3000 / Tape & Reel NC7SZ00L6X YY MicroPak 5000 / Tape & Reel NC7SZ00FHX YY MicroPak2 5000 / Tape & Reel Part Number For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5 1 SCALE 2:1 5X DATE 18 JAN 2018 b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ GENERIC MARKING DIAGRAM* 0.95 PITCH XXX MG G XXX M G 2.40 = Specific Device Code = Date Code = Pb-Free Package (Note: Microdot may be in either location) 5X 1.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot " G", may or may not be present. Some products may not follow the Generic Marking. 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON66279G SC-74A Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 1.0X1.0, 0.35P CASE 517DP ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13593G UDFN6 1.0X1.0, 0.35P DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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