NC7SZ00M5X - APTINA IMAGING - Datasheet.Directory

 Semiconductor Components Industries, LLC, 1996

March, 2020 − Rev. 5

1Publication Order Number:

NC7SZ00/D

NC7SZ00

TinyLogic UHS Two-Input

NAND Gate

Description

The NC7SZ00 is a single two−input NAND gate from

ON Semiconductor’s Ultra−High Speed (UHS) series of TinyLogic.

The device is fabricated with advanced CMOS technology to achieve

ultra−high speed with high output drive while maintaining low static

power dissipation over a broad VCC operating range. The device is

specified to operate over the 1.65 V to 5.5 V VCC operating range. The

inputs and output are high impedance when VCC is 0 V. Inputs tolerate

voltages up to 5.5 V, independent of VCC operating voltage.

Features

•Ultra−High Speed: tPD 2.4 ns (Typical) into 50 pF at 5 V VCC

•High Output Drive: ±24 mA at 3 V VCC

•Broad VCC Operating Range: 1.65 V to 5.5 V

•Matches Performance of LCX Operated at 3.3 V VCC

•Power Down High−Impedance Inputs / Outputs

•Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation

•Proprietary Noise / EMI Reduction Circuitry

•Ultra−Small MicroPak Packages

•Space−Saving SC−74A and SC−88A Packages

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Figure 1. Logic Symbol

IEEE / IEC

YY, 7Z00, Z00 = Specific Device Code

KK = 2−Digit Lot Run Traceability Code

XY = 2−Digit Date Code Format

Z = Assembly Plant Code

M = Data Code

G= Pb−Free Package

T = Die Run Code

= Year Coding Scheme

= Plant Code Identifier

= Eight−Week Datacoding Scheme

See detailed ordering, marking and shipping information in the

package dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

www.onsemi.com

SC−88A

CASE 419AC−01

SIP6

CASE 127EB

UDFN6

CASE 517DP

YYKK

XYZ

YYKK

XYZ

Z00T

Pin 1

SC−74A

CASE 318BQ

7Z00MG

(Note: Microdot may be in either location)

NC7SZ00

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Pin Configurations

VCC

GND Y

Figure 2. SC−88A and SC−74A (Top View)

A 1 6 VCC

B 2 5 NC

GND 3 4 Y

Figure 3. MicroPak (Top Through View)

PIN DEFINITIONS

Pin # SC−88A /

SC74A Pin # MicroPak Name Description

1 1 A Input

2 2 B Input

3 3 GND Ground

4 4 Y Output

5 6 VCC Supply Voltage

5 NC No Connect

FUNCTION TABLE

Inputs Output

A B Y

L L H

L H H

H L H

H H L

H = HIGH Logic Level

L = LOW Logic Level

NC7SZ00

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ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Max Unit

VCC Supply Voltage −0.5 6.0 V

VIN DC Input Voltage −0.5 6.0 V

VOUT DC Output Voltage −0.5 6.0 V

IIK DC Input Diode Current VIN < −0.5 V − −50 mA

VIN > 6.0 V −+20

IOK DC Output Diode Current VOUT < −0.5 V − −50 mA

VOUT > 6 V, VCC = GND −+20

IOUT DC Output Current −±50 mA

ICC or IGND DC VCC or Ground Current −±50 mA

TSTG Storage Temperature Range −65 +150 °C

TJJunction Temperature Under Bias −+150 °C

TLJunction Lead Temperature (Soldering, 10 Seconds) −+260 °C

PDPower Dissipation in Still Air SC−74A −225 mW

SC−88A−5−190

MicroPak−6−327

MicroPak2−6−327

ESD Human Body Model, JEDEC: JESD22−A114 −4000 V

Charge Device Model, JEDEC: JESD22−C101 −2000

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Conditions Min Max Unit

VCC Supply Voltage Operating 1.65 5.50 V

Supply Voltage Data Retention 1.5 5.5

VIN Input Voltage 0 5.5 V

VOUT Output Voltage 0 VCC V

TAOperating Temperature −40 +85 °C

tr, tfInput Rise and Fall Times VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V

VCC = 3.3 V ±0.3 V 0 10

VCC = 5.0 V ±0.5 V 0 5

qJA Thermal Resistance SC−74A −555 °C/W

SC−88A−5−659

MicroPak−6−382

MicroPak2−6−382

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

1. Unused inputs must be held HIGH or LOW. They may not float.

NC7SZ00

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DC ELECTICAL CHARACTERISTICS

Symbol Parameter VCC (V) Conditions

TA = +25°C TA = −40 to +85°C

Unit

Min Typ Max Min Max

VIH HIGH Level Input Voltage 1.65 to 1.95 0.65 VCC − − 0.65 VCC −V

2.30 to 5.50 0.70 VCC − − 0.70 VCC −

VIL LOW Level Input Voltage 1.65 to 1.95 − − 0.35 VCC −0.35 VCC V

2.30 to 5.50 − − 0.30 VCC −0.30 VCC

VOH HIGH Level Output Voltage 1.65 VIN = VIL,

IOH = −100 mA

1.55 1.65 −1.55 −V

1.80 1.70 1.80 −1.70 −

2.30 2.20 2.30 −2.20 −

3.00 2.90 3.00 −2.90 −

4.50 4.40 4.50 −4.40 −

1.65 IOH = −4 mA 1.29 1.52 −1.29 −

2.30 IOH = −8 mA 1.90 2.15 −1.90 −

3.00 IOH = −16 mA 2.40 2.80 −2.40 −

3.00 IOH = −24 mA 2.30 2.68 −2.30 −

4.50 IOH = −32 mA 3.80 4.20 −3.80 −

VOL LOW Level Output Voltage 1.65 VIN = VIH,

IOL = 100 mA

−0.00 0.10 −0.08 V

2.30 −0.00 0.10 −0.10

3.00 −0.00 0.10 −0.10

4.50 −0.00 0.10 −0.10

1.65 IOL = 4 mA −0.80 0.24 −0.24

2.30 IOL = 8 mA −0.10 0.30 −0.30

3.00 IOL = 16 mA −0.15 0.40 −0.40

3.00 IOL = 24 mA −0.22 0.55 −0.55

4.50 IOL = 32 mA −0.22 0.55 −0.55

IIN Input Leakage Current 1.65 to 5.5 VIN = 5.5 V, GND − − ±1−±10 mA

IOFF Power Off 0 VIN or VOUT = 5.5 V − − 1−10 mA

ICC Quiescent Supply Current 1.65 to 5.50 VIN = 5.5 V, GND − − 2−20 mA

NC7SZ00

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AC ELECTRICAL CHARACTERISTICS

Symbol Parameter VCC (V) Conditions

TA = +25°C TA = −40 to +85°C

Unit

Min Typ Max Min Max

tPHL, tPLH Propagation Delay

(Figure 4, 5)

1.65 CL = 15 pF,

RL = 1 MW

−5.4 11.4 −12.0 ns

1.80 −4.5 9.5 −10.0

2.50 ±0.20 −3.0 6.5 −7.0

3.30 ±0.30 −2.4 4.5 −4.7

5.00 ±0.50 −2.0 3.9 −4.1

3.30 ±0.30 CL = 50 pF,

RL = 500 W

−2.9 5.0 −5.2

5.00 ±0.50 −2.4 4.3 −4.5

CIN Input Capacitance 0.00 −4− − − pF

CPD Power Dissipation Capacitance

(Note 2) (Figure 6)

3.30 −24 − − − pF

5.00 −30 − − −

2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at

no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:

ICCD = (CPD) (VCC) (fIN) + (ICCstatic).

Figure 4. AC Test Circuit Figure 5. AC Waveforms

VCC

Figure 6. ICCD Test Circuit

VCC

CLRL

INPUT OUTPUT

INPUT

NOTE:

3. Input = AC Waveform; tr = tf = 1.8 ns;

PRR = 10 MHz; Duty Cycle = 50%.

tr = 3 ns

50%

90%

10%

90%

10%

INPUT

OUTPUT

tf = 3 ns

VCC

GND

VOH

VOL

50%

tPHL tPLH

NC7SZ00

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ORDERING INFORMATION

Part Number Top Mark Package Shipping

†

NC7SZ00M5X 7Z00 SC−74A 3000 / Tape & Reel

NC7SZ00P5X Z00 SC−88A 3000 / Tape & Reel

NC7SZ00L6X YY MicroPak 5000 / Tape & Reel

NC7SZ00FHX YY MicroPak2 5000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other

countries.

SIP6 1.45X1.0

CASE 127EB

ISSUE O

DATE 31 AUG 2016

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON13590G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SIP6 1.45X1.0

SC−74A

CASE 318BQ

ISSUE B

DATE 18 JAN 2018

SCALE 2:1

GENERIC

MARKING DIAGRAM*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present. Some products

may not follow the Generic Marking.

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE.

DIM MIN MAX

MILLIMETERS

A0.90 1.10

b0.25 0.50

e0.95 BSC

A1 0.01 0.10

c0.10 0.26

L0.20 0.60

M0 10

E2.50 3.00

123

0.20

CAB

CSEATING

PLANE

DETAIL A

TOP VIEW

SIDE VIEW

END VIEW

1.35 1.65

2.85 3.15

2.40

0.70

DIMENSIONS: MILLIMETERS

RECOMMENDED

0.95

PITCH

1.00

0.05

DETAIL A

XXX MG

XXX = Specific Device Code

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON66279G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SC−74A

UDFN6 1.0X1.0, 0.35P

CASE 517DP

ISSUE O

DATE 31 AUG 2016

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON13593G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

UDFN6 1.0X1.0, 0.35P

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

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claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

LITERATURE FULFILLMENT:

Email Requests to: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

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