MAG.LAYERS
HFI-201209 Series
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HFI chip inductors can be used in a variety of electronics including:
z Cellular Phones
z WLAN
z High-Speed Communication Devices
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HFI chip inductors are Mag Layers line of high frequency ceramic chip inductors. We
have developed highly reliable and versatile chip inductors that will meet your high
frequency design requirements.
z High Frequency Range
HFI chip inductors have a ceramic material construction that extends the effective
frequency range to 10 GHz.
z Multiple Size Availability
HFI chip inductors are available in three compact sizes: 100505, 160808 and
201209.
z High Q characteristics
H-series HFI chip inductors exhibit higher Q at high frequency.
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HFI - 201209 - 10N J □
c d e f g
c Product Code d Dimension Code
e Inductance f Tolerance Code: S=±0.3nH, J=±5%, K=±10%
g Code for Special Specification
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NOTE：Dimensions in mm
PRODUCT NO. A B C D
HFI-201209
(0805)
2.0±0.20
(0.079±0.008)
1.2±0.20
(0.047±0.008)
0.9±0.20
(0.035±0.008)
0.5±0.30
(0.020±0.012)
MAG.LAYERS
HFI-201209 Series
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PART NO.
Inductance
(nH)
at 100 MHz
* at 50 MHz
Q Min.
at 100 MHz
* at 50 MHz
Q Typical
800 MHz
S.R.F.
(MHz)
Min.
RDC(Ω)
Max.
IDC(mA)
Max. Tolerance
HFI-201209-1N5□ 1.5 61
HFI-201209-1N8□ 1.8 55
HFI-201209-2N2□ 2.2
10
53
HFI-201209-2N7□ 2.7 56
0.10
HFI-201209-3N3□ 3.3 47 0.13
HFI-201209-3N9□ 3.9 54
4000
0.15
HFI-201209-4N7□ 4.7
12
55 3500 0.20
HFI-201209-5N6□ 5.6 60 3200 0.23
S
HFI-201209-6N8□ 6.8 63 2800 0.25
HFI-201209-8N2□ 8.2 62 2400 0.28
HFI-201209-10N□ 10 2100 0.30
HFI-201209-12N□ 12 60 1900 0.35
HFI-201209-15N□ 15 63 1600 0.40
HFI-201209-18N□ 18
15
1500 0.45
HFI-201209-22N□ 22 60 1400 0.50
HFI-201209-27N□ 27 58 1300 0.55
HFI-201209-33N□ 33 55 1200 0.60
HFI-201209-39N□ 39 47 1000 0.65
HFI-201209-47N□ 47 43 900 0.70
HFI-201209-56N□ 56 39 800 0.75
HFI-201209-68N□ 68 30 700 0.80
HFI-201209-82N□ 82
HFI-201209-R10□ 100
18
600 0.90
HFI-201209-R12□ *120 0.95
HFI-201209-R15□ *150 500 1.00
HFI-201209-R18□ *180
* 13
400 1.10
HFI-201209-R22□ *220 350 1.20
HFI-201209-R27□ *270 300 1.30
HFI-201209-R33□ *330
* 12
1.40
HFI-201209-R39□ *390 250 1.30
HFI-201209-R47□ 470 * 10
-
200 1.50
300
J;K
z Temperature rise should be less than 25℃ and inductance change should be less
than ±5% when rated current is applied.
MAG.LAYERS
HFI-201209 Series
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CS
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S(
(
(T
T
T=
=
=2
2
25
5
5℃
℃
℃)
)
)
HFI-201209-1N5
0
1
2
3
4
5
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
70
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-1N8
1 10 100 1000
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M Hz)
HFI-201209-2N2
1 10 100 1000
0
1
2
3
4
5
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M H z)
HFI-201209-2N7
0
1
2
3
4
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-3N3
1 10 100 1000
0
1
2
3
4
5
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M H z)
MAG.LAYERS
HFI-201209 Series
HFI-201209-3N9
0
1
2
3
4
5
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
70
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-4N7
1 10 100 1000
0
2
4
6
8
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M Hz)
HFI-201209-5N6
0
2
4
6
8
10
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
70
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-6N8
0
3
6
9
12
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
1 10 100 1000
Frequency(MHz)
HFI-201209-8N2
0
2
4
6
8
10
12
1 10 100 1000
Frequency(MHz)
Inductance(n
0
10
20
30
40
50
60
70
80
1 10 100 1000
Frequency(MHz)
Q
MAG.LAYERS
HFI-201209 Series
HFI-201209-10N
0
5
10
15
20
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-12N
0
3
6
9
12
15
18
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
70
80
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-15N
1 10 100 1000
0
5
10
15
20
25
30
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M Hz)
HFI-201209-18N
0
5
10
15
20
25
30
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
60
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-22N
1 10 100 1000
0
10
20
30
40
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M Hz)
MAG.LAYERS
HFI-201209 Series
HFI-201209-27N
1101001000
0
10
20
30
40
50
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
60
70
Q
Frequency(M H z)
HFI-201209-33N
1 10 100 1000
0
10
20
30
40
50
60
Inductance(nH)
Frequency(MHz)
1 10 100 1000
0
10
20
30
40
50
Q
Frequency(MHz)
HFI-201209-39N
1 10 100 1000
0
20
40
60
80
100
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
10
20
30
40
50
Q
Frequency(MHz)
HFI-201209-47N
0
50
100
150
200
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
10
20
30
40
50
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-56N
0
50
100
150
200
1 10 100 1000
Frequency(MHz)
Inductance(n
H)
0
5
10
15
20
25
30
35
40
1 10 100 1000
Frequency(MHz)
Q
MAG.LAYERS
HFI-201209 Series
HFI-201209-68N
0
100
200
300
400
1 10 100 1000
Frequency(MHz)
Inductance(nH
)
0
10
20
30
40
50
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-82N
0
100
200
300
400
500
1 10 100 1000
Frequency(MHz)
Inductance(nH
)
0
5
10
15
20
25
30
35
40
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-R10
0
100
200
300
400
500
1 10 100 1000
Frequency(MHz)
Inductance(nH
)
0
5
10
15
20
25
30
35
40
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-R12
0
200
400
600
800
1000
1200
1400
1 10 100 1000
Frequency( MHz)
Inductance(nH)
0
5
10
15
20
25
30
1 10 100 1000
Frequen cy ( M Hz)
Q
HFI-201209-R15
0
300
600
900
1200
1500
1800
1 10 100 1000
Frequency(MHz)
Impedancn(nH)
0
5
10
15
20
25
30
1 10 100 1000
Frequency(MHz)
Q
MAG.LAYERS
HFI-201209 Series
HFI-201209-R18
0
100
200
300
400
500
1 10 100 1000
Frequency(MHz)
Impedancn(nH)
0
5
10
15
20
25
30
1 10 100 1000
Frequency(MHz)
Q
HFI-201209-R22
1 10 100 1000
0
300
600
900
1200
Inductance(nH)
Frequency(M Hz)
1 10 100 1000
0
5
10
15
20
25
30
35
Q
Frequency(MHz)
HFI-201209-R27
1 10 100 1000
0
300
600
900
1200
Inductance(nH)
Frequency(MHz)
1101001000
0
10
20
30
40
Q
Frequency(M Hz)
HFI-201209-R33
1 10 100 1000
0
300
600
900
1200
Inductance(nH)
Frequency(MHz)
1 10 100 1000
0
5
10
15
20
25
30
35
Q
Frequency(MHz)
HFI-201209-R39
1 10 100 1000
0
200
400
600
800
1000
1200
Inductance(nH)
Frequency(MHz)
1 10 100 1000
0
5
10
15
20
25
30
Q
Frequency(MHz)
MAG.LAYERS
HFI-201209 Series
HFI-201209-R47
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z Test Instrument:
L, Q: Agilent 4291B Impedance Analyzer
Agilent 16192 (For 2012/1608)
Agilent 16196B (For 1005)
Osc. Level: 500mV
SRF: Agilent N5230A Network Analyzer
RDC: Agilent 34401A
z Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
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P
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PC
C
CB
B
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L
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LA
A
AY
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YO
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T
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Unit: mm
Type 2012
L 2.0
Size W1.2
A 0.8~1.2
B 0.8~1.2
C 0.9~1.6
MAG.LAYERS
HFI-201209 Series
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z
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Peel-off Force
165° TO 180°
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
z Dimension (Unit: mm)
C
D
A
E
B
F
TYPE SIZE A B W P T CHIPS/REEL
HFI 201209 1.5 2.3 8 4 1.3 4000
TYPE A
B
C D E
F
8 mm 178±1
60 +0.5
-0 - 13 ±0.2 9 ±0.5 12 ±0.5
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1 -
MAG.LAYERS
HFI-201209 Series
z Taping Quantity
SERIES 2012
PCS/Reel 4000
z Tape Packing Case
`
W
L
H
Unit: cm
No. of Reels W L H
2 18±0.5 18±0.5 2.4±0.2
3 18±0.5 18±0.5 3.6±0.2
4 18±0.5 18±0.5 4.8±0.2
5 18±0.5 18±0.5 6.0±0.2
MAG.LAYERS
HFI-201209 Series
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•MECHANICAL PERFORMANCE TEST
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode
shall be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode
shall be covered with solder.
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) Time (Sec)
Terminal Strength
The terminal electrode shall not be broken
off nor the chip damage.
W
HFI-201209 0.6 30±5
TYPE A(MM) P(KGF)
Bending Strength
The body shall not be damaged by force.
A
Chip
P
1.0
R0.5
HFI-201209 1.4 1.0
• CLIMATIC TEST
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -40℃~85℃ for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 40℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
Low Temperature
Resistance
No mechanical damage.
Inductance shall be within ± 5% of the
initial value, and Q shall be within ± 30%
of the initial value.
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -40 ℃ TO +85℃
2. Storage Condition: The temperature should be within -40℃~85℃and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.
MAG.LAYERS
HFI-201209 Series
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OF
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Ts
min
Ts
max
tL
tP
tS
Preheat
TP
TL
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t=25
℃
to Peak Time
Temperature
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Tsmin 100℃ 150℃
Preheat
Tsmax 150℃ 200℃
Average ramp-up rate (Tsmax to TP) 3℃/second max. 3℃/second max.
Temperature (TL)183℃ 217℃
Time main above Time (tL) 60~150 seconds 60~150 seconds
Peak temperature (TP) 230℃ 250~260℃
Time within 5 ℃ of actual peak
temperature (tP) 10 seconds 10 seconds
Ramp-down rate 6℃/sec max. 6℃/sec max.
Time 25℃ to peak temperature 6 minutes max. 8 minutes max.
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The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.