A AP PP PLLIIC CA ATTIIO ON N HFI chip inductors can be used in a variety of electronics including: z Cellular Phones z WLAN z High-Speed Communication Devices FFE EA ATTU UR RE ES S HFI chip inductors are Mag Layers line of high frequency ceramic chip inductors. We have developed highly reliable and versatile chip inductors that will meet your high frequency design requirements. z High Frequency Range HFI chip inductors have a ceramic material construction that extends the effective frequency range to 10 GHz. z Multiple Size Availability HFI chip inductors are available in three compact sizes: 100505, 160808 and 201209. z High Q characteristics H-series HFI chip inductors exhibit higher Q at high frequency. P PR RO OD DU UC CTT IID DE EN NTTIIFFIIC CA ATTIIO ON N H F I - 2 0 1 2 0 9 - 1 0 N J c d e f g d Dimension Code c Product Code e Inductance f Tolerance Code: S=0.3nH, J=5%, K=10% g Code for Special Specification P PR RO OD DU UC CTT D DIIM ME EN NS SIIO ON N C D A B NOTEDimensions in mm PRODUCT NO. A B C D HFI-201209 (0805) 2.00.20 (0.0790.008) 1.20.20 (0.0470.008) 0.90.20 (0.0350.008) 0.50.30 (0.0200.012) MAG.LAYERS HFI-201209 Series E ELLE EC CTTR RIIC CA ALL R RE EQ QU UIIR RE EM ME EN NTTS S Inductance Q Min. S.R.F. (nH) Q Typical PART NO. at 100 MHz (MHz) at 100 MHz 800 MHz * at 50 MHz Min. * at 50 MHz HFI-201209-1N5 1.5 61 RDC() IDC(mA) Tolerance Max. Max. HFI-201209-1N8 1.8 HFI-201209-2N2 2.2 53 HFI-201209-2N7 2.7 56 HFI-201209-3N3 3.3 47 0.13 HFI-201209-3N9 3.9 54 0.15 HFI-201209-4N7 4.7 55 3500 0.20 HFI-201209-5N6 5.6 60 3200 0.23 HFI-201209-6N8 6.8 63 2800 0.25 HFI-201209-8N2 8.2 62 2400 0.28 HFI-201209-10N 10 2100 0.30 HFI-201209-12N 12 1900 0.35 HFI-201209-15N 15 1600 0.40 HFI-201209-18N 18 1500 0.45 HFI-201209-22N 22 1400 0.50 HFI-201209-27N 27 58 1300 0.55 HFI-201209-33N 33 55 1200 0.60 HFI-201209-39N 39 47 1000 0.65 HFI-201209-47N 47 43 900 0.70 HFI-201209-56N 56 39 800 0.75 HFI-201209-68N 68 30 700 0.80 HFI-201209-82N 82 HFI-201209-R10 100 600 0.90 HFI-201209-R12 *120 HFI-201209-R15 *150 HFI-201209-R18 *180 HFI-201209-R22 *220 HFI-201209-R27 *270 HFI-201209-R33 *330 HFI-201209-R39 *390 HFI-201209-R47 470 10 12 15 55 60 63 60 18 4000 500 * 13 * 12 0.10 * 10 J;K 1.00 1.10 350 1.20 300 1.30 200 300 0.95 400 250 S 1.40 1.30 1.50 z Temperature rise should be less than 25 and inductance change should be less than 5% when rated current is applied. MAG.LAYERS HFI-201209 Series TTY CS S((TT==2255 YP PIIC CA ALL E )) ELLE EC CTTR RIIC CA ALL C CH HA AR RA AC CTTE ER RIIS STTIIC HFI-201209-1N5 5 70 60 Inductance(nH) 4 50 3 Q 40 30 2 20 1 10 0 0 1 10 100 1000 1 Frequency(MHz) 10 100 Frequency(MHz) 1000 HFI-201209-1N8 4 .0 70 3 .5 60 50 2 .5 40 2 .0 Q Inductance(nH) 3 .0 1 .5 0 .5 0 .0 30 20 1 .0 10 1 10 100 F re q u e n c y(M H z ) 0 1000 1 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-2N2 70 5 60 50 40 3 Q Inductance(nH) 4 2 20 1 0 30 10 0 1 10 100 F re q u e n c y(M H z ) 1000 1 10 100 F re q u e n c y(M H z ) 1 10 100 Frequency(MHz) 1000 HFI-201209-2N7 60 4 40 Q Inductance(nH) 50 3 2 30 20 1 10 0 0 1 10 100 Frequency(MHz) 1000 1000 HFI-201209-3N3 70 5 60 50 40 3 Q Inductance(nH) 4 2 20 10 1 0 30 0 1 10 100 F re q u e n c y (M H z ) 1000 1 10 100 F re q u e n c y(M H z ) 1000 MAG.LAYERS HFI-201209 Series HFI-201209-3N9 70 60 4 50 3 Q Inductance(nH) 5 40 30 2 20 1 10 0 0 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-4N7 70 8 60 50 40 4 Q Inductance(nH) 6 30 20 2 10 0 1 10 100 F re q u e n c y(M H z ) 0 1000 1 HFI-201209-5N6 70 60 8 50 6 40 Q Inductance(nH) 10 30 4 20 2 10 0 0 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 HFI-201209-6N8 12 60 40 Q Inductance(nH) 50 9 6 30 20 3 10 0 0 1 10 100 Frequency(MHz) 1000 HFI-201209-8N2 80 70 12 60 50 8 Q Inductance(nH) 10 6 40 30 20 4 2 10 0 0 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 MAG.LAYERS HFI-201209 Series HFI-201209-10N 60 20 50 Inductance(nH) 15 Q 40 10 30 20 5 10 0 0 1 10 100 Frequency(MHz) 1 1000 10 100 Frequency(MHz) 1000 HFI-201209-12N 15 12 Q Inductance(nH) 18 9 6 3 0 1 10 100 Frequency(MHz) 80 70 60 50 40 30 20 10 0 1000 1 10 100 Frequency(MHz) 1 10 100 F re q u e n c y(M H z ) 1 10 100 Frequency(MHz) 1000 30 70 25 60 50 20 40 15 Q Inductance(nH) HFI-201209-15N 10 20 5 0 30 10 1 10 100 F re q u e n c y(M H z ) 0 1000 1000 30 60 25 50 20 40 Q Inductance(nH) HFI-201209-18N 15 30 10 20 5 10 0 0 1 10 100 Frequency(MHz) 1000 1000 HFI-201209-22N 40 70 60 50 40 20 Q Inductance(nH) 30 30 20 10 10 0 1 10 100 F re q u e n c y(M H z ) 1000 0 1 10 100 F re q u e n c y(M H z ) 1000 MAG.LAYERS HFI-201209 Series HFI-201209-27N 50 70 60 50 30 40 Q Inductance(nH) 40 20 30 20 10 10 0 1 10 100 F re q u e n c y(M H z ) 0 1000 1 10 100 F re q u e n c y(M H z ) 1000 60 50 50 40 40 30 30 Q Inductance(nH) HFI-201209-33N 20 20 10 10 0 0 1 10 100 F re q u e n c y(M H z ) 1 1000 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-39N 50 80 40 60 30 Q Inductance(nH) 100 40 20 20 10 0 1 10 100 F re q u e n c y(M H z ) 0 1000 1 10 100 F re q u e n c y(M H z ) 1000 1 10 100 Frequency(MHz) 1000 1 10 100 Frequency(MHz) 1000 HFI-201209-47N 50 40 150 30 Q Inductance(nH) 200 100 20 50 10 0 0 1 10 100 Frequency(MHz) 1000 HFI-201209-56N 200 40 30 25 Q Inductance(nH) 35 150 100 50 20 15 10 5 0 0 1 10 100 Frequency(MHz) 1000 MAG.LAYERS HFI-201209 Series 400 50 300 40 30 Q Inductance(nH) HFI-201209-68N 200 20 100 10 0 0 1 10 100 Frequency(MHz) 1 1000 10 100 Frequency(MHz) 1000 HFI-201209-82N 400 300 Q Inductance(nH) 500 200 100 0 1 10 100 Frequency(MHz) 40 35 30 25 20 15 10 5 0 1000 1 10 100 Frequency(MHz) 1000 HFI-201209-R10 40 35 400 30 25 300 Q Inductance(nH) 500 200 20 15 10 100 5 0 0 1 10 100 Frequency(MHz) 1 1000 10 100 Frequency(MHz) 1000 HFI-201209-R12 1400 30 1200 25 20 800 Q Inductance(nH) 1000 15 600 10 400 5 200 0 0 1 10 100 1 1000 10 100 1000 100 1000 Frequency( MHz) Frequency( MHz) HFI-201209-R15 30 1500 25 1200 20 900 15 Q Impedancn(nH) 1800 600 10 300 5 0 0 1 10 100 Frequency(MHz) 1000 1 10 Frequency(MHz) MAG.LAYERS HFI-201209 Series 500 30 400 25 20 300 Q Impedancn(nH) HFI-201209-R18 15 200 10 100 5 0 1 10 100 1000 0 1 10 Frequency (M Hz) 100 1000 Frequency (M Hz) HFI-201209-R22 35 1200 30 25 20 600 Q Inductance(nH) 900 15 10 300 5 0 0 1 10 100 F re q u e n c y(M H z ) 1000 1 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-R27 900 30 600 20 Q 40 Inductance(nH) 1200 10 300 0 1 10 100 F re q u e n c y(M H z ) 0 1000 1 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-R33 1200 35 30 25 20 600 Q Inductance(nH) 900 15 10 300 5 0 1 10 100 F re q u e n c y(M H z ) 0 1000 1 10 100 F re q u e n c y(M H z ) 1 10 100 F re q u e n c y(M H z ) 1000 HFI-201209-R39 1000 25 800 20 600 15 Q 30 Inductance(nH) 1200 400 10 200 5 0 1 10 100 F re q u e n c y(M H z) 1000 0 1000 MAG.LAYERS HFI-201209 Series HFI-201209-R47 M ME EA AS SU UR RIIN NG GM ME ETTH HO OD D // C CO ON ND DIITTIIO ON N zTest Instrument: L, Q: Agilent 4291B Impedance Analyzer Agilent 16192 (For 2012/1608) Agilent 16196B (For 1005) Osc. Level: 500mV SRF: Agilent N5230A Network Analyzer RDC: Agilent 34401A zTest Condition: < Unless otherwise specified > Temperature: 15C to 35C Humidity: 25% to 85% RH < In case of doubt > Temperature: 25C 2C Humidity: 60% to 70% RH R RE EC CO OM MM ME EN ND DE ED DP PC CB B LLA AY YO OU UTT Unit: mm Type Size 2012 L 2.0 W 1.2 A 0.8~1.2 B 0.8~1.2 C 0.9~1.6 MAG.LAYERS HFI-201209 Series P PA AC CK KA AG GIIN NG G z z Peel-off Force 165 TO 180 TOP COVER TAPE BASE TAPE The force for peeling off cover tape is 10 grams in the arrow direction. z Dimension (Unit: mm) F A B C TYPE A B C D E F 8 mm 1781 60 +0.5 -0 - 13 0.2 9 0.5 12 0.5 12 mm 1780.3 60 0.2 19.3 0.1 13.5 0.1 13.6 0.1 - D E TYPE SIZE A B W P T CHIPS/REEL HFI 201209 1.5 2.3 8 4 1.3 4000 MAG.LAYERS HFI-201209 Series z Taping Quantity SERIES 2012 PCS/Reel 4000 z Tape Packing Case W L H No. of Reels W L H 2 180.5 180.5 2.40.2 3 180.5 180.5 3.60.2 4 180.5 180.5 4.80.2 5 180.5 180.5 6.00.2 Unit: cm MAG.LAYERS HFI-201209 Series R RE ELLIIA AB BIILLTTY Y TTE ES STT *MECHANICAL PERFORMANCE TEST ITEM Solderability SPECIFICATION TEST CONDITION More than 90% of the terminal electrode Solder: shall be covered with fresh solder. Sn-3.0Ag-0.5Cu Solder Temperature: 245 5 Flux: Rosin Dip Time: 3 1 Seconds Solder temperature : 260 5 The chip shall not crack. More than 75% of the terminal electrode Flux: Rosin Soldering Heat Resistance shall be covered with solder. Dip time: 10 1 seconds The terminal electrode shall not be broken TYPE W(KGF) Time (Sec) off nor the chip damage. Terminal Strength W The body shall not be damaged by force. R0.5 Bending Strength 1.0 Chip P HFI-201209 0.6 305 TYPE A(MM) P(KGF) HFI-201209 1.4 1.0 A * CLIMATIC TEST ITEM Thermal Shock (Temperature Cycle) SPECIFICATION No mechanical damage. Inductance shall be within 5% of the initial value, and Q shall be within 30% of the initial value. TEST CONDITION Temperature: -40~85 for 30 minutes each, 100 cycles. Humidity Resistance Temperature : 40 Humidity: 95% RH Time: 1000 12 Hours High Temperature Resistance Temperature : 852 Time: 1000 12 Hours Low Temperature Resistance Temperature : -402 Time: 1000 12 Hours 1. Operating Temperature Range: -40 TO +85 2. Storage Condition: The temperature should be within -40~85 and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery. MAG.LAYERS HFI-201209 Series R RE EC E CO OM MM ME EN ND DE ED DR RE EFFLLO OW WS SO OLLD DE ER RIIN NG GP PR RO OFFIILLE tP Temperature TP Critical Zone TL to TP Ramp-up T L tL T smax T smin Ramp-down t S Preheat t=25 to Peak Time Profile Feature Sn-Pb Pb-Free 60~120 seconds 60~180 seconds Tsmin 100 150 Tsmax 150 200 3/second max. 3/second max. 183 217 60~150 seconds 60~150 seconds 230 250~260 10 seconds 10 seconds 6/sec max. 6/sec max. 6 minutes max. 8 minutes max. ts Preheat Average ramp-up rate (Tsmax to TP) Time main above Temperature (TL) Time (tL) Peak temperature (TP) Time within 5 of actual peak temperature (tP) Ramp-down rate Time 25 to peak temperature N NO OTTE ES S The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. MAG.LAYERS HFI-201209 Series