DS3658 www.ti.com SNLS365B - MARCH 1995 - REVISED APRIL 2013 DS3658 Quad High Current Peripheral Driver Check for Samples: DS3658 FEATURES DESCRIPTION * * * * The DS3658 quad peripheral driver is designed for those applications where low operating power, high breakdown voltage, high output current and low output ON voltage are required. A unique input circuit combines TTL compatibility with high impedance. In fact, its extreme low input current allows it to be driven directly by a CMOS device. 1 2 * * * * * * * * * * * * * Single Saturated Transistor Outputs Low Standby Power, 10 mW Typical High Impedance TTL Compatible Inputs Outputs May Be Tied Together for Increased Current Capacity High Output Current - 600 mA Per Output - 2.4A Per Package No Output Latch-up at 35V Low Output ON Voltage (350 mV typ @ 600 mA) High Breakdown Voltage (70V) Open Collector Outputs Output Clamp Diodes for Inductive Fly Back Protection NPN Inputs for Minimal Input Currents (1 A Typical) Low Operating Power Standard 5V Power Supply Power Up/Down Protection Fail Safe Operation 2W Power Package Pin-for-Pin Compatible with SN75437 The outputs are capable of sinking 600 mA each and offer a 70V breakdown. However, for inductive loads the output should be clamped to 35V or less to avoid latch-up during turn off (inductive fly back protection--refer to AN-213 'SNOA610'). An on-chip clamp diode capable of handling 800 mA is provided at each output for this purpose. In addition, the DS3658 incorporates circuitry that specifies glitchfree power up or down operation and a fail-safe feature which puts the output in a high impedance state when the input is open. The PDIP package is specifically constructed to allow increased power dissipation over conventional packages. The four ground pins are directly connected to the device chip with a special cooper lead frame. When the quad driver is soldered into a PC board, the power rating of the device improves significantly. APPLICATIONS * * * * * * * * * * Relay Drivers Lamp Drivers Solenoid Drivers Hammer Drivers Stepping Motor Drivers Triac Drivers LED Drivers High Current, High Voltage Drivers Level Translators Fiber Optic LED Drivers 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2013, Texas Instruments Incorporated DS3658 SNLS365B - MARCH 1995 - REVISED APRIL 2013 www.ti.com Connection Diagram Figure 1. PDIP- Top View See Package Number NFG0016E These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 7V Input Voltage 15V Output Voltage 70V Output Current Continuous Power Dissipation @ 25C Free-Air 1.5A (3) 2075 mW -65C to +150C Storage Temperature Range Lead Temperature (Soldering, 4 sec.) (1) (2) (3) 260C "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be specified. They are not meant to imply that the device should be operated at these limits. Electrical Characteristics provides conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. For operation over 25 free-air temperature, derate linearly to 1328 mW @ 70C @ the rate of 16.6 mW/C. Operating Conditions Supply Voltage Ambient Temperature 2 Min Max 4.75 5.25 V 0 70 C Submit Documentation Feedback Units Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: DS3658 DS3658 www.ti.com SNLS365B - MARCH 1995 - REVISED APRIL 2013 Electrical Characteristics (1) (2) Symbol Parameter Conditions VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 5.25V, VCC = 5.25V IIL Input Low Current VIN = 0.4V VIK Input Clamp Voltage VOL Output Low Voltage Min Typ Max Units 2.0 V 0.8 V 1.0 1.0 A 10 A II = -12 mA -0.8 -1.5 V IL = 300 mA 0.2 0.4 V IL = 600 mA (3) 0.35 0.7 V 100 A 1.6 V ICEX Output Leakage Current VCE = 70V, VIN = 0.8V VF Diode Forward Voltage IF = 800 mA IR Diode Leakage Current VR = 70V 100 A ICC Supply Current All Inputs High 60 85 mA All Inputs Low 2 4 mA (1) 1.0 Unless otherwise specified, min/max limits apply across the 0C to +70C temperature range and the 4.75V to 5.25V power supply range. All typical values are for TA = 25C and VCC = 5.0V. All currents into device pins are shown as positive, all currents out of device pins are shown as negative, all voltages are referenced to ground, unless otherwise specified. All values shown as max or min are so classified on absolute value basis. All sections of this quad circuit may conduct rated current simultaneously, however, power dissipation averaged over a short interval of time must fall within specified continuous dissipation ratings. (2) (3) Switching Characteristics (1) Typ Max Units tPHL Symbol Turn On Delay RL = 60, VL = 30V 226 500 ns tPLH Turn Off Delay RL = 60, VL = 30V 2430 8000 ns (1) Parameter Conditions Min Unless otherwise specified, min/max limits apply across the 0C to +70C temperature range and the 4.75V to 5.25V power supply range. All typical values are for TA = 25C and VCC = 5.0V. Truth Table (1) (1) IN EN OUT H H L L H Z H L Z L L Z H = High state L = Low state Z = High impedance state Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: DS3658 3 DS3658 SNLS365B - MARCH 1995 - REVISED APRIL 2013 www.ti.com AC Test Circuit Figure 2. Switching Waveforms Figure 3. Typical Applications Figure 4. Stepping Motor Driver 4 Submit Documentation Feedback Figure 5. Lamp Driver Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: DS3658 DS3658 www.ti.com SNLS365B - MARCH 1995 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision A (April 2013) to Revision B * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 4 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: DS3658 5 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) DS3658N NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS3658N DS3658N/NOPB ACTIVE PDIP NFG 16 25 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM 0 to 70 DS3658N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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