This is information on a product in full production.
June 2012 Doc ID 10890 Rev 7 1/44
1
VN820-E
High-side driver
Datasheet production data
Features
ECOPACK®: lead free and RoHS compliant
Automotive Grade: compliance with AEC
guidelines
Very low stadby current
CMOS compatible input
On-state open-load detection
Off-state open-load detection
Thermal shutdown protection and diagnosis
Undervoltage shutdown
Overvoltage clamp
Output stuck to VCC detection
Load current limitation
Reverse battery protection
Electrostatic discarge protection
Description
The VN820-E is a monolithic device designed in
STMicroelectronic's VIPower® M0-3 technology.
The VN820-E is intended for driving any type of
load with one side connected to ground. The
active VCC pin voltage clamp protects the device
against low energy spikes.
Active current limitation combined with thermal
shutdown and automatic restart protect the device
against overload. The device detects the open-
load condition in both on- and off-state mode. In
the off-state the device detects if the output is
shorted to VCC. The device automatically turns off
where the ground pin becomes disconnected.
Type RDS(on) IOUT VCC
VN820-E
VN820SP-E
VN820B5-E
VN820PT-E
VN820-12-E
VN820-11-E
40 mΩ9A 36V
PENTAWATT
P2PAK
1
10
PowerSO-10
PPAK
Table 1. Device summary
Package Order codes
Tube Tape and reel
PENTAWATT
VN820-E
VN820-12-E
VN820-11-E
-
PowerSO-10 VN820SP-E VN820SPTR-E
P2PAK VN820B5-E VN820B5TR-E
PPAK VN820PT-E VN820PTTR-E
www.st.com
Contents VN820-E
2/44 Doc ID 10890 Rev 7
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 18
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 19
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.5 PowerSO-10, P2PAK, PPAK, PENTAWATT maximum demagnetization
energy (VCC = 13.5V) 21
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1 P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2 PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.3 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.2 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.3 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.6 PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.7 P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.8 PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
VN820-E Contents
Doc ID 10890 Rev 7 3/44
5.9 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
List of tables VN820-E
4/44 Doc ID 10890 Rev 7
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 14. P2PAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 15. PPAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 16. PowerSO-10 thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 17. PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 18. P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 19. PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 20. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 21. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
VN820-E List of figures
Doc ID 10890 Rev 7 5/44
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 23. Ilim vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 26. PowerSO-10, P2PAK, PPAK, PENTAWATT maximum turn-off current versus inductance
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 27. P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 28. P2PAK Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . . . . . 22
Figure 29. P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 30. Thermal fitting model of a single channel HSD in P2PAK. . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 32. PPAK Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . . . . . . 25
Figure 33. PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 34. Thermal fitting model of a single channel HSD in PPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 35. PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 36. PowerSO-10 Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . 28
Figure 37. PowerSO-10 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . 29
Figure 38. Thermal fitting model of a single channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . 29
Figure 39. PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 40. P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 41. PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 42. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 43. PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 44. P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 45. P2PAK tape and reel (suffix “TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 46. PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 47. PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
List of figures VN820-E
6/44 Doc ID 10890 Rev 7
Figure 48. PPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 49. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 50. PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 51. PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
VN820-E Block diagram and pin description
Doc ID 10890 Rev 7 7/44
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
Table 2. Suggested connections for unused and not connected pins
Connection / pin Status N.C. Output Input
Floating X X X X
To ground X Through 10 KΩ resistor
5.$%26/,4!'%
/6%24%-0%2!452%
6
'.$
).054
/5405
4
/6%26/,4!'%
#522%.4
,)-)4%2
,/')#
$2)6%2
0OWER #,!-0
34!453
6##
#,!-0
/. 34!4% /0%.,/!$
/&& 34!4% /0%.,/!$
!.$ /54054 3(/24%$ 4/ 6##
$%4%#4)/.
$%4%#4)/.
$%4%#4)/.
$%4%#4)/.
$%4%#4)/.
'!0'-3
##


287387
287387
287387
287387
*5281'
,1387
67$78 6
1&
1&
9
&&
287387
0OWER3/
'!0'2)
287387
67$78 6
9
&&
,1387
*1'
00!+00!+0%.4!7!44
'!0'2)
Electrical specifications VN820-E
8/44 Doc ID 10890 Rev 7
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
Stressing the device above the rating listed in theTa bl e 3 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to Absolute maximum rating conditions for extended periods may affect device
reliability.
,1387
,6
,,1
9,1
9&&
67$786
,67$7
967$7
*1'
9&&
,287
9287
,*1'
287387
9
)
'!0'2)
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
PowerSO-10 PENTAWATT P2PAK PPAK
VCC DC supply voltage 41 V
-VCC Reverse DC supply voltage - 0.3 V
-Ignd DC reverse ground pin current - 200 mA
IOUT DC output current Internally limited A
-IOUT Reverse DC output current - 9 A
IIN DC input current +/- 10 mA
ISTAT DC Status current +/- 10 mA
VESD
Electrostatic discharge
(human body model:
R = 1.5 KΩ; C = 100 pF)
INPUT
–STATUS
–OUTPUT
–V
CC
4000
4000
5000
5000
V
V
V
V
VN820-E Electrical specifications
Doc ID 10890 Rev 7 9/44
2.2 Thermal data
EMAX
Maximum switching energy
(L = 1.4 mH; RL= 0 Ω;
Vbat = 13.5 V; Tjstart = 150 ºC;
IL = 13 A)
156 mJ
Ptot Power dissipation TC = 25 °C 65.8 W
TjJunction operating temperature Internally limited °C
TcCase operating temperature - 40 to 150 °C
Tstg Storage temperature - 55 to 150 °C
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
PowerSO-10 PENTAWATT P2PAK PPAK
Table 4. Thermal data
Symbol Parameter Max. value Unit
PowerSO-10 PENTAWATT P2PAK PPAK
Rthj-case
Thermalresistance
junction-case 1.9 1.9 1.9 1.9 °C/W
Rthj-lead
Thermalresistance
junction-lead ----°C/W
Rthj-amb
Thermalresistance
junction-ambient
51.9(1)
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick).
61.9(2) 51.9(2) 76.9(2) °C/W
37(2)
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick).
-37
(4) 45(4) °C/W
Electrical specifications VN820-E
10/44 Doc ID 10890 Rev 7
2.3 Electrical characteristics
Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless
otherwise stated.
Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC Operating supply voltage 5.5 13 36 V
VUSD Undervoltage shutdown 3 4 5.5 V
VUSDhyst
Undervoltage shutdown
hysteresis 0.5 V
VOV Overvoltage shutdown 36 V
RON On-state resistance IOUT = 3 A; Tj = 25 °C; VCC > 8 V
IOUT = 3 A; VCC > 8 V
40
80
mΩ
mΩ
ISSupply current
Off-state; VCC = 13 V;
VIN = VOUT = 0 V
Off-state; VCC = 13 V;
VIN = VOUT = 0 V; Tj = 25 °C
On-state; VCC = 13 V; VIN = 5 V;
IOUT = 0 A
10
10
2
25
20
3.5
µA
µA
mA
IL(off1) Off-state output current VIN = VOUT = 0 V 0 50 µA
IL(off2) Off-state output current VIN = 0 V; VOUT = 3.5 V -75 0 µA
IL(off3) Off-state output current VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125°C A
IL(off4) Off-state output current VIN = VOUT = 0 V; VCC = 13 V;
Tj = 25 °C A
Table 6. Switching (VCC =13V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time RL = 4.3 Ω from VIN rising edge to
VOUT = 1.3 V 30 µs
td(off) Turn-off delay time RL = 4.3 Ω from VIN falling edge to
VOUT = 11.7 V 30 µs
dVOUT/dt(on) Turn-on voltage slope RL = 4.3 Ω from VOUT = 1.3 V to
VOUT=10.4 V See Figure 21 V/µs
dVOUT/dt(off) Turn-off voltage slope RL = 4.3 Ω from VOUT = 11.7 V to
VOUT = 1.3 V See Figure 22 V/µs
VN820-E Electrical specifications
Doc ID 10890 Rev 7 11/44
Table 7. Input pin
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIL Input low-level 1.25 V
IIL Low-level input current VIN = 1.25 V 1 µA
VIH Input high-level 3.25 V
IIH High-level input current VIN = 3.25 V 10 µA
Vhyst Input hysteresis voltage 0.5 V
VICL Input clamp voltage IIN = 1m A
IIN = -1m A
66.8
- 0.7
8V
V
Table 8. VCC output diode
Symbol Param eter Test conditions Min. Typ. Max. Unit
VFForward on voltage - IOUT = 2 A; Tj = 150 °C - - 0.6 V
Table 9. Status pin
Symbol Parameter Test conditions Min. Typ. Max. Unit
VSTAT Status low output voltage ISTAT = 1.6 mA 0.5 V
ILSTAT Status leakage current Normal operation; VSTAT = 5 V 10 µA
CSTAT Status pin input capacitance Normal operation; VSTAT = 5 V 100 pF
VSCL Status clamp voltage ISTAT = 1m A
ISTAT = - 1m A
66.8
- 0.7
8V
V
Table 10. Protections(1)
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device operates under
abnormal conditions this software must limit the duration and number of activation cycles.
Symbol Parameter Test conditions Min. Typ. Max. Unit
TTSD Shutdown temperature 150 175 200 °C
TRReset temperature 135 °C
Thyst Thermal hysteresis 7 15 °C
tSDL
Status delay in overload
condition Tj > Tjsh 20 ms
Ilim Current limitation 9V < V
CC < 36 V
5.5 V < VCC < 36 V
91320
20
A
A
Vdemag
Turn-off output clamp
voltage
IOUT = 3 A;
VIN = 0V;
L = 6 mH
VCC - 41 VCC - 48 VCC - 55 V
Electrical specifications VN820-E
12/44 Doc ID 10890 Rev 7
Figure 4. Status timings
Figure 5. Switching time waveforms
Table 11. Open-load detection
Symbol Parameter Test conditions Min. Typ. Max. Unit
IOL
Open-load on-state
detection threshold VIN = 5 V 70 150 300 mA
tDOL(on)
Open-load on-state
detection delay IOUT = 0 A 200 µs
VOL
Open-load off-state
voltage detection
threshold
VIN = 0 V 1.5 2.5 3.5 V
tDOL(off)
Open-load detection
delay at turn-off 1000 µs
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VN820-E Electrical specifications
Doc ID 10890 Rev 7 13/44
Table 12. Truth t able
Conditions Input Output Status
Normal operation L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Overtemperature L
H
L
L
H
L
Undervoltage L
H
L
L
X
X
Overvoltage L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Table 13. Electrical transient requirements
ISO T/R
7637/1
Test pulse
Test level
I II III IV Delays and impedance
1 - 25V(1)
1. All functions of the device are performed as designed after exposure to disturbance.
- 50V(1) - 75V(1) - 100V(1) 2ms, 10Ω
2+ 25V
(1) + 50V(1) + 75V(1) + 100V(1) 0.2ms, 10Ω
3a - 25V(1) - 50V(1) - 100V(1) - 150V(1) 0.1µs, 50Ω
3b + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.1µs, 50Ω
4- 4V
(1) - 5V(1) - 6V(1) - 7V(1) 100ms, 0.01Ω
5 + 26.5V(1) + 46.5V(2)
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
+ 66.5V(2) + 86.5V(2) 400ms, 2Ω
Electrical specifications VN820-E
14/44 Doc ID 10890 Rev 7
Figure 6. Waveforms
OPEN-LOAD without external pull-up
STATUS
INPUT
NORMAL OPERATION
UNDERVOLTAGE
V
CC
V
USD
V
USDhyst
INPUT
OVERVOLTAGE
V
CC
V
CC
> V
OV
STATUS
INPUT
STATUS
STATUS
INPUT
STATUS
INPUT
OPEN-LOAD with external pull-up
undefined
LOAD VOLTAGE
V
CC
<V
OV
LOAD VOLTAGE
LOAD VOLTAGE
LOAD VOLTAGE
LOAD VOLTAGE
OVERTEMPERATURE
INPUT
STATUS
T
TSD
T
R
T
j
LOAD CURRENT
V
OUT
> V
OL
V
OL
VN820-E Electrical specifications
Doc ID 10890 Rev 7 15/44
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High-level input current
Figure 9. Input clamp voltage Figure 10. Status leakage current
Figure 11. Status low output voltage Figure 12. Status clamp voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
IL(off1) (µA)
Off state
Vcc=36V
Vin=Vout=0V
-50 -25 0 25 50 75 100 125 150 175
Tc
(
°C
)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Iih (uA)
Vin=3.25V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vicl (V)
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.01
0.02
0.03
0.04
0.05
Ilstat (uA)
Vstat=5V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Vstat (V)
Istat=1.6mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vscl (V)
Istat=1mA
Electrical specifications VN820-E
16/44 Doc ID 10890 Rev 7
Figure 13. On-state resistance vs Tcase Figure 14. On-state resistance vs VCC
Figure 15. Open-load on-state detection
threshold Figure 16. Input high-level
Figure 17. Input low-level Figure 18. Input hysteresi s voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
10
20
30
40
50
60
70
80
90
100
Ron (mOhm)
Iout=3A
Vcc=8V; 13V; 36V
5 10152025303540
Vcc (V)
0
10
20
30
40
50
60
70
80
90
100
Ron (mOhm)
Tc= - 40ºC
Tc= 25ºC
Tc= 150ºC
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
50
60
70
80
90
100
110
120
130
140
150
Iol (mA)
Vcc=13V
Vin=5V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Vih (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Vil (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Vhyst (V)
VN820-E Electrical specifications
Doc ID 10890 Rev 7 17/44
Figure 19. Overvoltage shutdown Figure 20. Open-load off -state voltage
detection threshold
Figure 21. Turn-on voltage slope Figure 22. Turn-off voltage slope
Figure 23. Ilim vs Tcase
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
30
32
34
36
38
40
42
44
46
48
50
Vov (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vol (V)
Vin=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
100
200
300
400
500
600
700
800
900
1000
dVout/dt/(on) (V/ms)
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
100
200
300
400
500
600
700
800
900
1000
dVout/dt(off) (V/ms)
Vcc=13V
Rl=4.3Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
2
4
6
8
10
12
14
16
18
20
Ilim (A)
Vcc=13V
Application information VN820-E
18/44 Doc ID 10890 Rev 7
3 Application information
Figure 24. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to set a dimension the RGND resistor.
1. RGND 600 mV / (IS(on)max).
2. RGND ≥ (- VCC) / (- IGND)
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (- VCC)2/ RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift does not vary depending on how many devices are ON in case of several
high-side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
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VN820-E Application information
Doc ID 10890 Rev 7 19/44
3.1.2 Solution 2: diode (DGND) in the ground line
A resistor (RGND = 1kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift not varies if more than one HSD shares the same diode/resistor network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
The safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/Os pins from latching-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
μC I/Os.
-VCCpeak/Ilatchup Rprot (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100 V and Ilatchup 20 mA; VOHµC 4.5 V
5kΩ Rprot 65 kΩ.
Recommended values: Rprot =10 kΩ .
3.4 Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1. no false open-load indication when load is connected: in this case we have to avoid
VOUT to be higher than VOlmin; this results in the following condition
VOUT = (VPU / (RL+RPU)) RL < VOlmin.
2. no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU – VOLmax) / IL(off2).
Application information VN820-E
20/44 Doc ID 10890 Rev 7
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pull-
up resistor RPU should be connected to a supply that is switched off when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics
section.
Figure 25. Open-load detection in off-state
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VN820-E Application information
Doc ID 10890 Rev 7 21/44
3.5 PowerSO-10, P2PAK, PPAK, PENTAWATT maximum
demagnetiza tion energy (VCC = 13.5V)
Figure 26. PowerSO-10,
P
2
PAK, PPAK, PENTAWATT
maximum turn-off current
versus inductance
Note: Values are generated with RL = 0 Ω. In case of repetitive pulses, Tjstart (at beginning of each
demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
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Package and PCB thermal data VN820-E
22/44 Doc ID 10890 Rev 7
4 Package and PCB thermal data
4.1 P2PAK thermal data
Figure 27. P2PAK PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness = 35 μm , Copper areas: 0.97 cm2, 8 cm2).
Figure 28. P2PAK Rthj-amb vs PCB copper area in open box free air conditions
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VN820-E Package and PCB thermal data
Doc ID 10890 Rev 7 23/44
Figure 29. P2PAK thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
where δ = tP/T
Figure 30. Thermal fitting model of a single channel HSD in P2PAK
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Package and PCB thermal data VN820-E
24/44 Doc ID 10890 Rev 7
Table 14. P2PAK thermal parameters
Area/island (cm2)0.976
R1 (°C/W) 0.04
R2 (°C/W) 0.25
R3 (°C/W) 0.3
R4 (°C/W) 4
R5 (°C/W) 9
R6 (°C/W) 37 22
C1 (W·s/°C) 0.0008
C2 (W·s/°C) 0.007
C3 (W·s/°C) 0.015
C4 (W·s/°C) 0.4
C5 (W·s/°C) 2
C6 (W·s/°C) 3 5
VN820-E Package and PCB thermal data
Doc ID 10890 Rev 7 25/44
4.2 PPAK thermal data
Figure 31. PPAK PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 μm , Copper areas: 0.44 cm2, 8 cm2).
Figure 32. PPAK Rthj-amb vs PCB copper area in open box free air conditions
GAPGRI00172
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Package and PCB thermal data VN820-E
26/44 Doc ID 10890 Rev 7
Figure 33. PPAK thermal impedance junction ambient single pulse
Equation 2: pulse calculation formula
where δ = tP/T
Figure 34. Thermal fitting model of a single channel HSD in PPAK
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VN820-E Package and PCB thermal data
Doc ID 10890 Rev 7 27/44
Table 15. PPAK thermal parameters
Area/island (cm2)0.446
R1 (°C/W) 0.04
R2 (°C/W) 0.25
R3 (°C/W) 0.3
R4 (°C/W) 2
R5 (°C/W) 15
R6 (°C/W) 61 24
C1 (W·s/°C) 0.0008
C2 (W·s/°C) 0.007
C3 (W·s/°C) 0.02
C4 (W·s/°C) 0.3
C5 (W·s/°C) 0.45
C6 (W·s/°C) 0.8 5
Package and PCB thermal data VN820-E
28/44 Doc ID 10890 Rev 7
4.3 PowerSO-10 thermal data
Figure 35. PowerSO-10 PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
8cm
2).
Figure 36. PowerSO-10 Rthj-amb vs PCB copper area in open box free air conditions
GAPGRI00280
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VN820-E Package and PCB thermal data
Doc ID 10890 Rev 7 29/44
Figure 37. PowerSO-10 thermal impedance junction ambient single pulse
Equation 3: pulse calculation formula
Figure 38. Thermal fitting model of a single channel HSD in PowerSO-10
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Package and PCB thermal data VN820-E
30/44 Doc ID 10890 Rev 7
Tab le 16. PowerSO- 10 ther mal parameters
Area / island (cm2)Footprint6
R1 (°C/W) 0.04
R2 (°C/W) 0.25
R3 (°C/W) 0.25
R4 (°C/W) 0.8
R5 (°C/W) 12
R6 (°C/W) 37 22
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 7E-03
C3 (W.s/°C) 0.015
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
VN820-E Package and packing information
Doc ID 10890 Rev 7 31/44
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2 PENTAWATT mechanical data
Figure 39. PENTAWATT package dimensions
GAPGRI00283
Package and packing information VN820-E
32/44 Doc ID 10890 Rev 7
Table 17. PENTAWATT mechanical data
Dim. mm
Min. Typ. Max.
A4.8
C1.37
D2.4 2.8
D1 1.2 1.35
E0.35 0.55
F 0.8 1.05
F1 1 1.4
G 3.2 3.4 3.6
G1 6.6 6.8 7
H2 10.4
H3 10.05 10.4
L 17.85
L1 15.75
L2 21.4
L3 22.5
L5 2.6 3
L6 15.1 15.8
L7 6 6.6
M4.5
M1 4
Diam. 3.65 3.85
VN820-E Package and packing information
Doc ID 10890 Rev 7 33/44
5.3 P2PAK mechanical data
Figure 40. P2PAK package dimensions
("1($'5
Package and packing information VN820-E
34/44 Doc ID 10890 Rev 7
Table 18. P2PAK mechanical data
Dim. mm
Min. Typ. Max.
A4.30 4.80
A1 2.40 2.80
A2 0.03 0.23
b0.80 1.05
c0.45 0.60
c2 1.17 1.37
D8.95 9.35
D2 8.00
E 10.00 10.40
E1 8.50
e3.20 3.60
e1 6.60 7.00
L 13.70 14.50
L2 1.25 1.40
L3 0.90 1.70
L5 1.55 2.40
R0.40
V2
Package weight 1.40 Gr (typ)
VN820-E Package and packing information
Doc ID 10890 Rev 7 35/44
5.4 PPAK mechanical data
Figure 41. PPAK package dimensions
'!0'2)
Package and packing information VN820-E
36/44 Doc ID 10890 Rev 7
Table 19. PPAK mecha nical data
Dim. mm
Min. Typ. Max.
A2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B0.40 0.60
B2 5.20 5.40
C0.45 0.60
C2 0.48 0.60
D1 5.1
D6.00 6.20
E6.40 6.60
E1 4.7
e1.27
G4.90 5.25
G1 2.38 2.70
H9.35 10.10
L2 0.8 1.00
L4 0.60 1.00
L5 1
L6 2.80
R0.2
V2
Package weight Gr. 0.3
VN820-E Package and packing information
Doc ID 10890 Rev 7 37/44
5.5 PowerSO-10 mechanical data
Figure 42. PowerSO-10 package dimensions
'(7$,/$
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6($7,1 *
D
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$
K
$
'
'
(
 $
(
&
$
%
%
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6($7,1 *
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Package and packing information VN820-E
38/44 Doc ID 10890 Rev 7
Table 20. PowerSO-10 mechanical data
Dim. mm
Min. Typ. Max.
A3.35 3.65
A(1)
1. Muar only POA P013P.
3.4 3.6
A1 0 0.10
B0.40 0.60
B(1) 0.37 0.53
C0.35 0.55
C(1) 0.23 0.32
D9.40 9.60
D1 7.40 7.60
E9.30 9.50
E2 7.20 7.60
E2(1) 7.30 7.50
E4 5.90 6.10
E4(1) 5.90 6.30
e1.27
F1.25 1.35
F(1) 1.20 1.40
H 13.80 14.40
H(1) 13.85 14.35
h0.50
L1.20 1.80
L(1) 0.80 1.10
α
α(1)
VN820-E Package and packing information
Doc ID 10890 Rev 7 39/44
5.6 PENTAWATT packing information
Figure 43. PENTAWATT tube shipment (no suffix)
5.7 P2PAK packing informat io n
Figure 44. P2PAK tube shipment (no suffix)
#
"
!
("1($'5
All dimensions are in mm.
Base Q.ty 50
Bulk Q.ty 1000
Tube length (± 0.5 ) 532
A18
B33.1
C (± 0.1) 1
#
"
!
("1($'5
All dimensions are in mm.
Base Q.ty 50
Bulk Q.ty 1000
Tube length (± 0.5 ) 532
A18
B33.1
C (± 0.1) 1
Package and packing information VN820-E
40/44 Doc ID 10890 Rev 7
Figure 45. P2PAK tape and reel (suffix “TR”)
5.8 PPAK packing information
Figure 46. PPAK suggested pad layout
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compar tm en t Dep th K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
REEL DIMENSIONS
All dimensions are in mm
.
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
6.71.83
VN820-E Package and packing information
Doc ID 10890 Rev 7 41/44
Figure 47. PPAK tube shipment (no suffix)
Figure 48. PPAK tape and reel (suffix “TR”)
All dimensions are in mm.
Base Q.ty 75
Bulk Q. t y 3000
Tube length (± 0.5 ) 532
A6
B21.3
C (± 0.1) 0.6
A
C
B
All dimensions are in mm
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compar tm en t Dep th K (max) 2.75
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
REEL DIMENSIONS
Package and packing information VN820-E
42/44 Doc ID 10890 Rev 7
5.9 PowerSO-10 packing information
Figure 51. PowerSO-10 tape and reel shipment (suffix “TR”)
Figure 49. PowerSO-10 suggested
pad layout Figure 50. PowerSO-10 tube shipment (no
suffix)








("1($'5
B
A
C
All dimensions are in mm.
Base Q.ty Bulk Q.ty Tube len gth (± 0.5) A B C (± 0.1)
Casablanca 50 1000 532 10.4 16.4 0.8
Muar 50 1000 532 4.9 17.2 0.8
C
A
B
MUARCASABLANCA
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max ) 30.4
Tape dimensions
According to Electronic Industries Association (EIA)
Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diam et er D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartmen t Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Reel dim ensions
VN820-E Revision history
Doc ID 10890 Rev 7 43/44
6 Revision history
Table 21. Document revision history
Date Revision Changes
07-Dec-2004 1 Initial release.
09-Feb-2005 2 Text changed.
23-Mar-2005 3 Configuration diagram (PowerSO-10) modification.
03-May-2006 4 SO-16L mechanical and shipment data insertion.
17-Dec-2008 5
Document reformatted and restructured.
Added content, list of figures and tables.
Added ECOPACK® packages information.
Updated Figure 45: P2PAK tape and reel (suffix “TR”):
changed component spacing (P) in tape dimensions table from 16
mm to 12 mm.
29-Mar-2010 6
Updated features list.
Updated Table 1: Device summary.
Updated Table 3: Absolute maximum ratings.
Updated Section 3.5: PowerSO-10, P2PAK, PPAK, PENTAWATT
maximum demagnetization energy (VCC = 13.5V).
Removed SO-16L package into the document.
07-June-2012 7 Updated Section 5.8: PPAK packing information.
VN820-E
44/44 Doc ID 10890 Rev 7
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