1
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections
FX11L Series
NEWNEW
2003.7
■Features
1. Low Profile Design
The board to board mating height of 2 mm suits smaller,thinner
case designs.
2. Improved Transmission Efficiency Between
Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
4. Reinforced Fittings for Added Solder Weld
Strength
Reinforced fittings provide greater adhesion to the
board,protecting against peeling.The unique connector
design provides a connection between the fitting and the
ground plate for a stronger ground.
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.
■Applications
Notebook computers, PDA, and other miniature electronic equipment.
●Cross-Section of Mating
Detailed Figure of Solder Gap
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
2
■Product Specifications
Note 1: Please contact us when connector application exceeds 0.3 A rated current.
Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.
■Materials
■Product Number Configuration
Please use this information to discern the product specifications from the product number codes.
To order, please select from the product number codes listed in tables on pages 3 to 6 of this catalog.
FX 11L ##-✽P - /✽- SV (✽ ✽)
1 2 75 4
3 6
FX 11L ##-✽P - SV (✽ ✽)
1 2 753 4 6
Type With Ground Plate
Type Without Ground Plate
Series name
:
FX
Series No.
:
11L
Form Symbol A
:
With guide post
B
:
Without guide post
Number of contacts
Signal/Ground:60/6, 80/8, 100/10, 120/12
Signal: 68, 92, 116, 140
Type without ground
Type with ground plate
Connector type
P
:
Header
S
:
Receptacle
Contact form
SV
:
Straight SMT
Blank:
Tray packaging (Without pick-and-place tape)
(21):
Embossed tape packaging (Without pick-and-place tape)
(22):
Embossed tape packaging (With pick-and-place tape)
1 5
6
7
2
3
4
Rating Rated current
Rated voltage 0.3 A (Note 1)
50 V AC Operating temperature range
Operating humidity range
-55 to 85ç
Relative humidity 95% or less
(No condensation)
Storage temperature range
Storage humidity range -10 to +60ç(Note 2)
-40 to -70% (Note 2)
Part
Insulator
Contacts
Ground plate
Reinforced fitting
Reinforced plate
Material
LCP resin
Copper alloy
Phosphor bronze
Phosphor bronze
Phosphor bronze
Process
Beige
Header
Engagement Area: Gold plating of 0.1µm
Termination Area
: Flash plating
Receptacle
Solder plating
Tin plating
UL Rating
UL94V-0
----------
----------
----------
----------
Measured at 100 V DC
150 V AC applied for one minute
Measured at 100 mA
Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions,
10 cycles each
Acceleration of 490 m/s
2
, 11ms duration, sine half-wave
waveform,for 3 cycles in the both directions of each of the 3 axes
Temperature of 40ç, humidity of 90 to 95%, duration 96 h
Temperature: -55
ç
→15 to 35
ç
→85
ç
→15 to 35
ç
Time: 30 min. →2 to 3 min. →30 min. →2 to 3 min. for 5 cycles
50 times
Reflow: At the recommended temperature profile
Soldering iron temperature: 300çfor 3 seconds
100 Møor greater
No flashover or breakdown
60 møor less
No electrical discontinuity for 1µs or greater
No damage, cracks, or parts looseness
No electrical discontinuity for 1µs or longer
No damage, cracks, or parts looseness
Contact resistance of 70 m
ø
or less, insulation resistance of
100 M
ø
or greater, no damage, cracks, or parts looseness
Contact resistance of 70 m
ø
or less, insulation resistance of
100 M
ø
or greater, no damage, cracks, or parts looseness
Contact resistance of 70 møor less
No damage, cracks, or parts looseness
No melting of resin portion which affects performance
1. Insulation resistance
2. Voltage proof
3. Contact resistance
Item Requirements Conditions
4. Vibration
5. Shock
6. Damp heat
(Steady state)
8. Insertion/
Withdrawal life
9. Resistance to
soldering heat
7. Rapid change
of temperature
Note : The black dots on the insulater will not affect performance.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
3
■Headers with Ground Plate
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
[Specifications number] – ✽ ✽, (✽ ✽)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
BRecommended Land Pattern Dimensions (Metal Mask Dimensions)
Note Cross-hatched portions, totaling n places, indicate the ground circuits.
The cross-hatched area inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
Not required in products without guideposts.
1
2
3
Recommended metal mask thickness: 0.15 mm
HRS No.
CL573-0002-7-✽ ✽
CL573-0003-0-✽ ✽
CL573-0004-2-✽ ✽
CL573-0005-5-✽ ✽
CL573-0012-0-✽ ✽
CL573-0013-3-✽ ✽
CL573-0014-6-✽ ✽
CL573-0015-9-✽ ✽
Product No.
FX11LA-060P/06-SV (✽ ✽)
FX11LA-080P/08-SV (✽ ✽)
FX11LA-100P/10-SV (✽ ✽)
FX11LA-120P/12-SV (✽ ✽)
FX11LB-060P/06-SV (✽ ✽)
FX11LB-080P/08-SV (✽ ✽)
FX11LB-100P/10-SV (✽ ✽)
FX11LB-120P/12-SV (✽ ✽)
Number of Contacts
Signal Ground
060
080
100
120
060
080
100
120
06
08
10
12
06
08
10
12
A
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
12
18
24
30
12
18
24
30
22.6
28.6
34.6
40.6
22.6
28.6
34.6
40.6
18
24
30
36
----------
----------
----------
-----------
19.4
25.4
31.4
37.4
19.4
25.4
31.4
37.4
B C D E Notes
With guideposts
Without guideposts
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
4
■Receptacles with Ground Plate
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
BRecommended Land Pattern Dimensions (Metal Mask Dimensions)
0.25
Recommended metal mask thickness: 0.15 mm
Number of Contacts
Signal Ground
060
080
100
120
060
080
100
120
06
08
10
12
06
08
10
12
A B C D E F
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
12
18
24
30
12
18
24
30
25
31
37
43
25
31
37
43
20.8
26.8
32.8
38.8
----------
----------
----------
----------
25.4
31.4
37.4
43.4
25.4
31.4
37.4
43.4
22.2
28.2
34.2
40.2
22.2
28.2
34.2
40.2
Notes
With guideposts
Without guideposts
HRS No.
CL573-0102-1-✽ ✽
CL573-0103-4-✽ ✽
CL573-0104-7-✽ ✽
CL573-0105-7-✽ ✽
CL573-0112-5-✽ ✽
CL573-0113-8-✽ ✽
CL573-0114-0-✽ ✽
CL573-0105-3-✽ ✽
Product No.
FX11LA-060S/06-SV (✽ ✽)
FX11LA-080S/08-SV (✽ ✽)
FX11LA-100S/10-SV (✽ ✽)
FX11LA-120S/12-SV (✽ ✽)
FX11LB-060S/06-SV (✽ ✽)
FX11LB-080S/08-SV (✽ ✽)
FX11LB-100S/10-SV (✽ ✽)
FX11LB-120S/12-SV (✽ ✽)s
[Specifications number] - ✽ ✽, (✽ ✽)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note Cross-hatched portions, totaling n places, indicate the ground circuits.
Cross-hatched portions, totaling 2 places, indicate the reinforced fittings.
The cross-hatched area inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
Not required in products without guideposts.
1
2
3
4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
5
■Headers without Ground Plate
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Number of
Contacts
Signal
068
092
116
140
068
092
116
140
A
16.5
22.5
28.5
34.5
16.5
22.5
28.5
34.5
22.6
28.6
34.6
40.6
22.6
28.6
34.6
40.6
18
24
30
36
----------
----------
----------
----------
19.4
25.4
31.4
37.4
19.4
25.4
31.4
37.4
B C D Notes
With guideposts
Without guideposts
HRS No.
CL573-0042-1-✽ ✽
CL573-0043-4-✽ ✽
CL573-0044-7-✽ ✽
CL573-0045-0-✽ ✽
CL573-0052-5-✽ ✽
CL573-0053-8-✽ ✽
CL573-0054-0-✽ ✽
CL573-0055-3-✽ ✽
Product No.
FX11LA-068P-SV (✽ ✽)
FX11LA-092P-SV (✽ ✽)
FX11LA-116P-SV (✽ ✽)
FX11LA-140P-SV (✽ ✽)
FX11LB-068P-SV (✽ ✽)
FX11LB-092P-SV (✽ ✽)
FX11LB-116P-SV (✽ ✽)
FX11LB-140P-SV (✽ ✽)
[Specifications number] - ✽ ✽, (✽ ✽)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note The cross-hatched area inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
Not required in products without guideposts.
1
2
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
6
■Receptacles without Ground Plate
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Number of
Contacts
Signal
068
092
116
140
068
092
116
140
A
18
24
30
36
18
24
30
36
16.5
22.5
28.5
34.5
16.5
22.5
28.5
34.5
25
31
37
43
25
31
37
43
20.8
26.8
32.8
38.8
----------
----------
----------
----------
B C D Notes
With guideposts
Without guideposts
HRS No.
CL573-0142-6-✽ ✽
CL573-0143-9-✽ ✽
CL573-0144-1-✽ ✽
CL573-0145-4-✽ ✽
CL573-0152-0-✽ ✽
CL573-0153-2-✽ ✽
CL573-0154-5-✽ ✽
CL573-0155-8-✽ ✽
Product No.
FX11LA-068S-SV (✽ ✽)
FX11LA-092S-SV (✽ ✽)
FX11LA-116S-SV (✽ ✽)
FX11LA-140S-SV (✽ ✽)
FX11LB-068S-SV (✽ ✽)
FX11LB-092S-SV (✽ ✽)
FX11LB-116S-SV (✽ ✽)
FX11LB-140S-SV (✽ ✽)
[Specifications number] - ✽ ✽, (✽ ✽)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note The cross-hatched area inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
Not required in products without guideposts.
1
2
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
7
20.2
26.2
20.2
26.2
A B C D E
40.4
52.4
40.4
52.4
44
56
44
56
45.5
59
45.5
59
50.6
64
50.5
64
Insertion Connector
FX11L#-060P/06-SV
FX11L#-080P/08-SV
FX11L#-100P/10-SV
FX11L#-120P/12-SV
FX11L#-068P/12-SV
FX11L#-092P/12-SV
FX11L#-116P/12-SV
FX11L#-140P/12-SV
20.2
26.2
20.2
26.2
A B C D E
40.4
52.4
40.4
52.4
44
56
44
56
45.5
59
45.5
59
50.6
64
50.5
64
Insertion Connector
FX11L#-060S/06-SV
FX11L#-080S/08-SV
FX11L#-100S/10-SV
FX11L#-120S/12-SV
FX11L#-068S/12-SV
FX11L#-092S/12-SV
FX11L#-116S/12-SV
FX11L#-140S/12-SV
BEmbossed Carrier Tape Dimensions
Note 1: There is no polarity in terms of embossed tape
packaging for this product.
Note 2: Left figure is representative of products with
ground plates.
Note 1: There is no polarity in terms of embossed tape
packaging for this product.
Note 2: Left figure is representative of products with
ground plates.
●Headers
●Receptacles
●Reel Packaging Dimensions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
8
BRecommended Temperature Profile
BWashing Conditions
BConnector Handling Precautions
1. Allowable Creepage Dimensions at Time of Mating
The effective coupling length of this product is 0.55 mm for the signal portion and the ground portion. The creepage of the
header and receptacle at the time of mating should be within 0.18 mm of the completely coupled condition.
2. Retension of Boards
Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors.
3. Solder Repair
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
4. Miscellaneous
·
Note that excessive twisting while inserting or withdrawing connectors will cause damage.
·
The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Organic Solvent Washing
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
Solvent
Room temperature washing
Heated washing
IPA
(Isopropyl alcohol)
HCFC
(Hydrochlorofluorocarbon)
Yes
Yes
Yes
Yes
Applicable Conditions
Reflow method : IR reflow
Solder : Cream type 63Sn/37Pb
(Flux component of 9wt%)
Test substrate : Glass epoxy 85 x 110 x 1.6mm
Metal mask thickness
: 0.15mm
This temperature profile is a recommendation.
Conditions may change somewhat depending on the type
of cream solder and the amount.
This temperature profile is a reference for the setting conditions described below. It will differ depending on conditions and so
mounting should follow verification.
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933
®
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
