© 1999 Burr-Brown Corporation PDS-1501A Printed in U.S.A. June, 1999
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
®
DAC7612
Dual, 12-Bit Serial Input
DIGITAL-TO-ANALOG CONVERTER
DESCRIPTION
The DAC7612 is a dual, 12-bit digital-to-analog con-
verter (DAC) with guaranteed 12-bit monotonicity
performance over the industrial temperature range. It
requires a single +5V supply and contains an input
shift register, latch, 2.435V reference, a dual DAC, and
high speed rail-to-rail output amplifiers. For a full-
scale step, each output will settle to 1 LSB within 7µs
while only consuming 3.7mW.
The synchronous serial interface is compatible with a
wide variety of DSPs and microcontrollers. Clock
(CLK), Serial Data In (SDI), Chip Select (CS) and
Load DACs (LOADDACS) comprise the serial inter-
face.
The DAC7612 is available in an 8-lead SOIC package
and is fully specified over the industrial temperature
range of –40°C to +85°C.
FEATURES
LOW POWER: 3.7mW
FAST SETTLING: 7µs to 1 LSB
1mV LSB WITH 4.095V FULL-SCALE
RANGE
COMPLETE WITH REFERENCE
12-BIT LINEARITY AND MONOTONICITY
OVER INDUSTRIAL TEMP RANGE
3-WIRE INTERFACE: Up to 20MHz Clock
SMALL PACKAGE: 8-Lead SOIC
APPLICATIONS
PROCESS CONTROL
DATA ACQUISITION SYSTEMS
CLOSED-LOOP SERVO-CONTROL
PC PERIPHERALS
PORTABLE INSTRUMENTATION
DAC7612
12-Bit DAC A
DAC Register A
14-Bit Serial Shift Register
12
12
DAC Register B Ref
12
12
LOADDACS
CS
CLK
SDI
V
DD
GND
V
OUTA
DAC7612
12-Bit DAC B V
OUTB
SBAS106
2
®
DAC7612
SPECIFICATIONS
At TA = –40°C to +85°C, and VDD = +5V, unless otherwise noted.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
DAC7612U DAC7612UB
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
RESOLUTION 12 Bits
ACCURACY
Relative Accuracy(1) –2 ±1/2 +2 –1 ±1/4 +1 LSB
Differential Nonlinearity Guaranteed Monotonic –1 ±1/2 +1 –1 ±1/4 +1 LSB
Zero-Scale Error Code 000H–1 +1 +3 ✻✻✻ LSB
Zero Scale Match Code 000H1/2 1/2 2 LSB
Full-Scale Voltage Code FFFH4.079 4.095 4.111 4.087 4.095 4.103 V
Full-Scale Match Code FFFH1/2 1/2 2 LSB
ANALOG OUTPUT
Output Current Code 800H±5±7✻✻ mA
Load Regulation RLOAD 402, Code 800H13 ✻✻ LSB
Capacitive Load No Oscillation 500 pF
Short-Circuit Current ±15 mA
Short-Circuit Duration GND or VDD Indefinite
DIGITAL INPUT
Data Format Serial
Data Coding Straight Binary
Logic Family CMOS
Logic Levels
VIH 0.7 • VDD V
VIL 0.3 • VDD V
IIH ±10 µA
IIL ±10 µA
DYNAMIC PERFORMANCE
Settling Time(2) (tS) To ±1 LSB of Final Value 7 µs
DAC Glitch 2.5 nV-s
Digital Feedthrough 0.5 nV-s
POWER SUPPLY
VDD +4.75 +5.0 +5.25 ✻✻✻ V
IDD
V
IH
= 5V, V
IL
= 0V, No Load, at Code 000
H
0.75 1.5 ✻✻ mA
Power Dissipation VIH = 5V, VIL = 0V, No Load 3.5 7.5 ✻✻ mW
Power Supply Sensitivity VDD = ±5% 0.0025 0.002 ✻✻%/%
TEMPERATURE RANGE
Specified Performance –40 +85 ✻✻°C
Same specification as for DAC7612U.
NOTES: (1) This term is sometimes referred to as Linearity Error or Integral Nonlinearity (INL). (2) Specification does not apply to negative-going transitions where
the final output voltage will be within 3 LSBs of ground. In this region, settling time may be double the value indicated.
3
®
DAC7612
PIN CONFIGURATION
Top View SO-8
VDD to GND .......................................................................... –0.3V to 6V
Digital Inputs to GND .............................................. –0.3V to VDD + 0.3V
VOUT to GND ...........................................................–0.3V to VDD + 0.3V
Power Dissipation ........................................................................ 325mW
Thermal Resistance,
θ
JA ........................................................... 150°C/W
Maximum Junction Temperature..................................................+150°C
Operating Temperature Range ...................................... –40°C to +85°C
Storage Temperature Range ....................................... –65°C to +150°C
Lead Temperature (soldering, 10s)..............................................+300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS(1)
PIN DESCRIPTIONS
PIN LABEL DESCRIPTION
1 SDI Serial Data Input. Data is clocked into the internal
serial register on the rising edge of CLK.
2 CLK Synchronous Clock for the Serial Data Input.
3 LOADDACS Loads the internal DAC registers. All DAC registers
are transparent latches and are transparent when
LOADDACS is LOW (regardless of the state of CS
or CLK).
4 CS Chip Select. Active LOW.
5V
OUTB DAC B Output Voltage
6 GND Ground
7V
DD Positive Power Supply
8V
OUTA DAC A Output Voltage
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE
ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT
PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER(1) NUMBER(2) MEDIA
DAC7612U ±2±1 –40°C to +85°C SO-8 182 DAC7612U Rails
"" " " ""DAC7612U/2K5 Tape and Reel
DAC7612UB ±1±1 –40°C to +85°C SO-8 182 DAC7612UB Rails
"" " " ""DAC7612UB/2K5 Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC7612U/2K5” will get a single
2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
1
2
3
4
8
7
6
5
SDI
CLK
LOADDACS
CS
V
OUTA
V
DD
GND
V
OUTB
DAC7612U
4
®
DAC7612
EQUIVALENT INPUT LOGIC
Serial Shift Register
DAC B Register
DAC A Register
DAC Switches
Data
DAC Switches
12
12
12
12
ESD protection
diodes to V
DD
and GND
LOADDACS
SDI
CS
CLK
5
®
DAC7612
TIMING DIAGRAMS
LOGIC TRUTH TABLE TIMING SPECIFICATIONS
TA = –40°C to +85°C and VDD = +5V.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
tCH Clock Width HIGH 30 ns
tCL Clock Width LOW 30 ns
tLDW Load Pulse Width 20 ns
tDS Data Setup 15 ns
tDH Data Hold 15 ns
tLD1 Load Setup 15 ns
tLD2 Load Hold 10 ns
tCSS Select 30 ns
tCSH Deselect 20 ns
NOTE: All input control signals are specified with tR = tF = 5ns (10% to 90%
of +5V) and timed from a voltage level of 2.5V. These parameters are
guaranteed by design and are not subject to production testing.
SDI
CLK
tCL tCH
tDH
tDS
SERIAL SHIFT DAC DAC
A1 A0
CLK
CS
LOADDACS
REGISTER REGISTER A REGISTER B
X X X H H No Change No Change No Change
XX
L H Shifts One Bit No Change No Change
LXXH
(1) L No Change Loads Serial Loads Serial
Data Word Data Word
H L X H L No Change Loads Serial No Change
Data Word
H H X H L No Change No Change Loads Serial
Data Word
Positive Logic Transition; X = Don’t Care.
NOTE: (1) A HIGH value is suggested in order to avoid to “false clock” from
advancing the shift register and changing the DAC voltage.
B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13
A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DATA INPUT TABLE
A1
(MSB) (LSB)
SDI
CLK
CS
LOADDACS
A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
t
CSS
t
LD1
t
LD2
t
CSH
LOADDACS
FS
ZS
V
OUT
t
LDW
t
S
±1 LSB
Error Band
6
®
DAC7612
TYPICAL PERFORMANCE CURVES
At TA = +25°, and VDD = 5V, unless otherwise specified.
5.0
4.8
4.6
4.4
4.2
4.0
MINIMUM SUPPLY VOLTAGE vs LOAD
V
DD
Minimum (V)
Output Load Current (mA)
0.01 0.1 1 10
5
4
3
2
1
0
OUTPUT SWING vs LOAD
Output Voltage (V)
Load Resistance ()
10 100 1k 10k 100k
R
L
tied to V
DD
Data = 000
H
R
L
tied to GND
Data = FFF
H
70
60
50
40
30
20
10
0
POWER SUPPLY REJECTION vs FREQUENCY
PSR (dB)
Frequency (Hz)
10 100 1k 10k 100k 1M
Data = FFFH
VDD = 5V
±200mV AC
Time (2ms/div)
Code = FFFH, BW = 1MHz
BROADBAND NOISE
Noise Voltage (500µV/div)
1k
100
10
1
0.1
0.01
PULL-DOWN VOLTAGE vs OUTPUT SINK CURRENT
Delta VOUT (mV)
Current (mA)
0.001 0.01 0.1 1 10 100
+85°C
Data = 000H
–40°C
+25°C
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE
Supply Current (mA)
Logic Voltage (V)
012345
7
®
DAC7612
RISE TIME DETAIL
V
OUT
(1mV/div)
Time (10µs/div)
LOADDACS
C
L
= 100pF
R
L
= No Load
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
20
15
10
5
0
–5
–10
–15
–20
SHORT-CIRCUIT CURRENT vs OUTPUT VOLTAGE
Output Current (mA)
Output Voltage (V)
01 423 56
Positive
Current
Limit Data = 800
H
Output tied to I
SOURCE
Negative
Current
Limit
MIDSCALE GLITCH PERFORMANCE
V
OUT
(5mV/div)
Time (500ns/div)
7FF
H
to 800
H
LOADDACS
MIDSCALE GLITCH PERFORMANCE
V
OUT
(5mV/div)
Time (500ns/div)
800
H
to 7FF
H
LOADDACS
LARGE-SIGNAL SETTLING TIME
V
OUT
(1V/div)
Time (20µs/div)
C
L
= 100pF
R
L
= No Load
LOADDACS
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
SUPPLY CURRENT vs TEMPERATURE
Supply Current (mA)
Temperature (°C)
–50 –30 –10 10 30 50 70 90 110 130
V
LOGIC
= 3.5V
Data = FFF
H
No Load
V
DD
= 4.75V
At worst-case digital inputs.
V
DD
= 5.25V V
DD
= 5.0V
8
®
DAC7612
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
10.000
1.000
0.100
0.010
OUTPUT VOLTAGE NOISE vs FREQUENCY
Noise (µV/Hz)
Frequency (Hz)
10 100 1k 10k 100k
Data = FFF
H
5
4
3
2
1
0
–1
–2
–3
–4
–5
LONG-TERM DRIFT ACCELERATED BY BURN-IN
Output Voltage Change at FS (mV)
Hours of Operation at +150°C
0 168 336 504 672 840 1008
Max
Avg
Min
4.111
4.103
4.095
4.087
4.079
FULL-SCALE VOLTAGE vs TEMPERATURE
Full-Scale Output (V)
Temperature (°C)
–40 –15 10 35 60 85
Avg + 3σ
Avg – 3σ
Avg
35
30
25
20
15
10
5
0
–12 –10 –8 –6 –4 –2 0 2 84 6 10 12
T.U.E = Σ (INL + Z
SE
+ FSE)
Sample Size = 200 Units
T
A
= +25°C
Number of Units
TOTAL UNADJUSTED ERROR HISTOGRAM
FALL TIME DETAIL
V
OUT
(1mV/div)
Time (10µs/div)
C
L
= 100pF
R
L
= No Load
LOADDACS
3
2
1
0
–1
ZERO-SCALE VOLTAGE vs TEMPERATURE
Zero-Scale Output (mV)
Temperature (°C)
–40 –15 10 35 60 85
Avg – 3σ
Avg
Avg + 3σ
9
®
DAC7612
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at +85°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at +85°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at +25°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at +25°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at –40°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at –40°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
10
®
DAC7612
next 12 bits are the code (MSB-first) sent to the DAC. The
data format is Straight Binary and is loaded MSB-first into
the shift registers after loading the address bits. Table I shows
the relationship between input code and output voltage.
The digital data into the DAC7612 is double-buffered. This
means that new data can be entered into the chosen DAC
without disturbing the old data and the analog output of the
converter. At some point after the data has been entered into
the serial shift register, this data can be transferred into the
DAC registers. This transfer is accomplished with a HIGH
to LOW transition of the LOADDACS pin. The LOADDACS
pin makes the DAC registers transparent. If new data is
shifted into the shift register while LOADDACS is LOW,
the DAC output voltages will change as each new bit is
entered. To prevent this, LOADDACS must be returned
HIGH prior to shifting in new serial data.
DIGITAL-TO-ANALOG CONVERTER
The internal DAC section is a 12-bit voltage output
device that swings between ground and the internal ref-
erence voltage. The DAC is realized by a laser-trimmed
R-2R ladder network which is switched by N-channel
MOSFETs. Each DAC output is internally connected to a
rail-to-rail output operational amplifier.
OUTPUT AMPLIFIER
A precision, low-power amplifier buffers the output of each
DAC section and provides additional gain to achieve a 0V to
4.095V range. Each amplifier has low offset voltage, low
OPERATION
The DAC7612 is a dual, 12-bit digital-to-analog converter
(DAC) complete with a serial-to-parallel shift register, DAC
registers, laser-trimmed 12-bit DACs, on-board reference,
and rail-to-rail output amplifiers. Figure 1 shows the basic
operation of the DAC7612.
INTERFACE
Figure 1 shows the basic connection between a
microcontroller and the DAC7612. The interface consists of
a Serial Clock (CLK), Serial Data (SDI), and a Load DAC
signal (LOADDACS). In addition, a chip select (CS) input is
available to enable serial communication when there are
multiple serial devices. Loading either DAC A or DAC B is
done by shifting 14 serial bits in via the SDI input. The first
2 bits represent the address of the DAC to be updated and the
DAC7612 Full-Scale Range = 4.095V
Least Significant Bit = 1mV
DIGITAL INPUT CODE ANALOG OUTPUT
STRAIGHT OFFSETBINARY (V) DESCRIPTION
FFFH+4.095 Full Scale
801H+2.049 Midscale + 1 LSB
800H+2.048 Midscale
7FFH+2.047 Midscale – 1 LSB
000H0 Zero Scale
TABLE I. Digital Input Code and Corresponding Ideal
Analog Output.
FIGURE 1. Basic Operation of the DAC7612.
1
2
3
4
8
7
6
5
SDI
CLK
LOADDACS
CS
VOUTA
VDD
GND
VOUTB
DAC7612U
Serial Data
Serial Clock
Load DACs
Chip Select
0.1µF
0V to +4.095V
0V to +4.095V
10µF
+
11
®
DAC7612
noise, and a set gain of 1.682V/V (4.095/2.435). See Figure
2 for an equivalent circuit schematic of the analog portion of
the DAC7612.
The output amplifier has a 7µs typical settling time to ±1
LSB of the final value. Note that there are differences in the
settling time for negative-going signals versus positive-
going signals.
The rail-to-rail output stage of the amplifier provides the full-
scale range of 0V to 4.095V while operating on a supply voltage
as low as 4.75V. In addition to its ability to drive resistive loads,
the amplifier will remain stable while driving capacitive loads
of up to 500pF. See Figure 3 for an equivalent circuit schematic
of the amplifier’s output driver and the Typical Performance
Curves section for more information regarding settling time,
load driving capability, and output noise.
POWER SUPPLY
A BiCMOS process and careful design of the bipolar and
CMOS sections of the DAC7612 result in a very low power
device. Bipolar transistors are used where tight matching
and low noise are needed to achieve analog accuracy, and
CMOS transistors are used for logic, switching functions
and for other low power stages.
If power consumption is critical, it is important to keep the
logic levels on the digital inputs (SDI, CLK, CS,
LOADDACS) as close as possible to either VDD or ground.
This will keep the CMOS inputs (see “Supply Current vs
Logic Input Voltages” in the Typical Performance Curves)
from shunting current between VDD and ground.
The DAC7612 power supply should be bypassed as shown
in Figure 1. The bypass capacitors should be placed as close
to the device as possible, with the 0.1µF capacitor taking
priority in this regard. The “Power Supply Rejection vs
Frequency” graph in the Typical Performance Curves sec-
tion shows the PSRR performance of the DAC7612. This
should be taken into account when using switching power
supplies or DC/DC converters.
In addition to offering guaranteed performance with VDD in
the 4.75V to 5.25V range, the DAC7612 will operate with
reduced performance down to 4.5V. Operation between
4.5V and 4.75V will result in longer settling time, reduced
performance, and current sourcing capability. Consult the
“VDD vs Load Current” graph in the Typical Performance
Curves section for more information.
FIGURE 2. Simplified Schematic of Analog Portion.
FIGURE 3. Simplified Driver Section of Output Amplifier.
N-Channel
P-Channel
V
DD
V
OUT
GND
2R
2R
2R
R
2R
2R
RR1
R
R2
Output Amplifier
R-2R DAC
Bandgap
Reference 2.435V
Typical of DAC A or DAC B
Buffer
12
®
DAC7612
FIGURE 4. Suggested Power and Ground Connections for a DAC7612 Sharing a +5V Supply with a Digital System.
APPLICATIONS
POWER AND GROUNDING
The DAC7612 can be used in a wide variety of situations—
from low power, battery operated systems to large-scale
industrial process control systems. In addition, some appli-
cations require better performance than others, or are par-
ticularly sensitive to one or two specific parameters. This
diversity makes it difficult to define definite rules to follow
concerning the power supply, bypassing, and grounding.
The following discussion must be considered in relation to
the desired performance and needs of the particular system.
A precision analog component requires careful layout, ad-
equate bypassing, and a clean, well-regulated power supply.
As the DAC7612 is a single-supply, +5V component, it will
often be used in conjunction with digital logic,
microcontrollers, microprocessors, and digital signal proces-
sors. The more digital logic present in the design and the
higher the switching speed, the more difficult it will be to
achieve good performance.
Because the DAC7612 has a single ground pin, all return
currents, including digital and analog return currents, must
flow through this pin. The GND pin is also the ground
reference point for the internal bandgap reference. Ideally,
GND would be connected directly to an analog ground
plane. This plane would be separate from the ground con-
nection for the digital components until they are connected
at the power entry point of the system (see Figure 4).
The power applied to VDD should be well regulated and low-
noise. Switching power supplies and DC/DC converters will
often have high-frequency glitches or spikes riding on the
output voltage. In addition, digital components can create
similar high frequency spikes as their internal logic switches
states. This noise can easily couple into the DAC output
voltage through various paths between VDD and VOUT.
As with the GND connection, VDD should be connected to
a +5V power supply plane or trace that is separate from the
connection for digital logic until they are connected at the
power entry point. In addition, the 10µF and 0.1µF capaci-
tors shown in Figure 4 are strongly recommended and
should be installed as close to VDD and ground as possible.
In some situations, additional bypassing may be required
such as a 100µF electrolytic capacitor or even a “Pi” filter
made up of inductors and capacitors—all designed to essen-
tially lowpass filter the +5V supply, removing the high
frequency noise (see Figure 4).
+
+5V
GND
100µF
Digital Circuits
+5V
GND
+5V
Power
Supply
Other
Analog
Components
V
DD
GND
DAC7612
+10µF0.1µF
Optional
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
DAC7612U ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612UB ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612UB/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612UB/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612UBG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC7612UG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Feb-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
DAC7612U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
DAC7612UB/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DAC7612U/2K5 SOIC D 8 2500 346.0 346.0 29.0
DAC7612UB/2K5 SOIC D 8 2500 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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