GL100MN0MP - SHARP - Datasheet.Directory

1Sheet No.: D1-A00601EN

Date: May 30, 2007

©SHARP Corporation

GL100MN0MPx

GL100MN0MPx Surface Mount Type, Infrared

Emitting Diode

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

■Features

1. Compact and thin SMD package

2. Top view and side view mountable

3. Plastic mold with resin lens

4. Peak emission wavelength: 940 nm TYP.

5. Narrow directivity angle (Δθ: ±10° TYP.)

6. Lead free and RoHS directive compliant

■Model Line-up

■Agency Approvals/Compliance

1. Compliant with RoHS directive (2002/95/EC)

2. Content information about the six substances

specified in “Management Methods for Control of

Pollution Caused by Electronic Information Prod-

ucts Regulation” (popular name: China RoHS)

(Chinese: );

refer to page 7.

■Applications

1. Office automation equipment

2. Audio visual equipment

3. Home appliances

4. Telecommunication equipment

5. Measuring equipment

6. Tooling machines

7. Computers

Model No. Packaging Mount Direction

GL100MN0MP 2000 pcs/reel Side view

GL100MN0MP1 1500 pcs/reel Top view

Sheet No.: D1-A00601EN

GL100MN0MPx

■External Dimensions

3.0

2.2

0.95

(0.4)

3.0 3.0

1.5 1.5

1.1

1.4

0.85

1.7

1.1 1.1

1.5

(0.2)

(0.35)

0.4

2.2

1.0

(0.65) 0.75

R0.8

(0.57)

(1.0) (1.0)

(0.57)

NOTES:

1. Unit: mm

2. Unspecified tolerance : ±0.2 mm

3. ( ) : Reference dimensions

4. Au-plated area

5. Do not allow circuit runs in area

(Lens center)

Viewed from PCB

(Side view Mounting)

Viewed from PCB

(Top view Mounting)

Anode

Cathode

No. Name

0.65

Pin Arrangement

Sheet No.: D1-A00601EN

GL100MN0MPx

■Absolute Maximum Ratings

*1 Pulse width: 100 µs, Duty ratio: 0.01

*2 Within 10 s (MAX.) see Fig. 10.

■Electro-optical Charactertistics

Parameter Symbol Rating Unit

Forward current IF50 mA

Peak pulsed forward current *1 IFM 0.5 A

Reverse voltage VR6V

Power dissipation P 75 mW

Operating temperature Topr -30 to +85°C

Storage temperature Tstg -40 to+ 95 °C

Soldering temperature *2 Tsol 240 °C

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Forward voltage VFIF = 20 mA – 1.2 1.4 V

Peak forward voltage VFM IFM = 0.5 A – 3.0 4.0 V

Reverse current IRVR = 3 V––10µA

Radiant intensity φeIF = 20 mA 1.0 – 3.0 mW

Peak emission wavelength λpI

F = 5 mA – 940 – nm

Half intensity wavelength Δλ IF = 5 mA – 45 – nm

Terminal capacitance CtVR = 0, f = 1 MHz – 50 – pF

Response frequency fC– – 300 – kHz

Half-intensity angle Δθ – – ±10 – degrees

Fig. 1 Forward Current vs.

Ambient Temperature

-50 -25 0 25 50 75 100

Ambient temperature Ta (°C)

Forward current I

(mA)

-30 85

Fig. 2 Peak Forward Current vs. Duty Ratio

100

1000

10000

Duty ratio

Peak forward current I

(mA)

10-4 10-3 10-2 10-1 100

Pulse width ≤ 100 µs

Ta = 25°C

(Ta = 25°C)

Sheet No.: D1-A00601EN

GL100MN0MPx

Fig. 3 Spectral Distribution

Fig. 4 Peak Emission Wavelength vs.

Ambient Temperature

Relative radiant intensity (%)

100

860 900 940 980 1020

880 920 960 1000 1040

Wavelength λ (nm)

IF = 5 mA

= 25°C

920

930

940

950

960

970

980

-50 -25-30 0 25 50 75 85 100

Peak emission wavelength λp (nm)

Ambient temperature Ta (°C)

IF = constant

Fig. 5 Forward Current vs. Forward Voltage

Fig. 6 Relative Radiant Flux vs.

Ambient Temperature

Forward current I

(mA)

0.1

100

1000

0 0.5 1 1.5 2 2.5 3

Forward voltage V

(V)

50°C 0°C

−30°C

25°C

Ta = 85°C

IF = constant

Relative radiant flux (%)

0.1

-50 -25-30 0 25 50 8575 100

Ambient temperature Ta (°C)

Sheet No.: D1-A00601EN

GL100MN0MPx

Fig. 7 Radiant Flux vs. Forward Current

Fig. 8 Relative Output vs.

Distance to Detector

0.01

100

0.1

1 10010 1000

Ta = 25°C

Radiant flux Φe (mW)

Forward current IF (mA)

Pulse

(Pulse width ≤100 ms)

Relative output (%)

0.01

0.1

100

0.1 1 10 100 1000

(Detector: PT100MF0MP)

Distance to detector (mm)

IF = constant

Ta = 25°C

Fig. 9 Radiation Diagram

Relative radiant intensity (%)

100

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20° -10° 0° +10° +20°

+30°

+40°

+50°

+60°

+70°

+80°

+90°

Angular displacement θ

Sheet No.: D1-A00601EN

GL100MN0MPx

■Design Considerations

Design Guidelines

1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% deg-

radation in output after 5 years of continuous use.

2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.

■Manufacturing Guidelines

Soldering Instructions

1. Sharp recommends soldering no more than once when using solder reflow methods.

2. When using solder reflow methods, follow the Reflow Soldering Temperature Profile shown in Fig. 10. Sharp

recommends checking the process to make sure these parameters are not exceeded; exceeding these param-

eters can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires,

or other similar failure modes.

3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the

part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.

4. If hand soldering, use temperatures ≤260° for ≤3 seconds. Do not dip-solder or VPS-solder this part.

5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Cleaning Instructions

1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

Fig. 10 Reflow Soldering Temperature Profile

200°C

25°C

240°C MAX.

120 s MAX. 90 s MAX.

60 s MAX.

10 s MAX.

165°C MAX.

1 ~ 4°C/s

Sheet No.: D1-A00601EN

GL100MN0MPx

Storage and Handling

1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%.

2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than

60%, and mount the parts within two days. If unable to do so, bake before mounting.

3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry

box or by resealing the parts in a moisture-proof bag with a desiccant. If unable to do so, bake before mounting.

4. When baking the parts before mounting, Sharp recommends baking the parts only once and only if in a metal

tray or mounted on a PCB. Recommended conditions are for 16 to 24 hours, at a temperature of 125°C.

■Presence of ODCs (RoHS Compliance)

This product shall not contain the following materials, and they are not used in the production process for this

product:

• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific

brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

• Content information about the six substances specified in “Management Methods for Control of Pollution

Caused by Electronic Information Products Regulation” (Chinese: )

NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement

as described in SJ/T 11363-2006 standard.

■Taping Specifications

1. Tape structure and dimensions conforms to those shown in Fig. 11 to Fig. 16.

2. Product insertion will have the cathode to the hole side of the tape.

3. Cover tape peel-separation force: F = 0.2 to 1.0 N (where θ 160° to 180°)

4. Quantity per reel = 2000 pcs. (GL100MN0MP) or 1500 pcs. (GL100MN0MP1)

5. Product mass: 0.01 g (approx.)

6. Packaging:

a. Reels are sealed inside an aluminum bag, along with a humidity indicator card.

b. Bags are labeled and securely packed.

Category

Toxic and Hazdardous Substances

Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent

chromiun (Cr6+)

Polybrominated

biphenyls (PBB)

Polybrominated

diphenyl ethers

(PBDE)

Infrared Emitting Diode ✓✓✓✓✓✓

Sheet No.: D1-A00601EN

GL100MN0MPx

■Packing Specifications

●GL100MN0MP (Side view mount, 2000 pcs/reel)

Fig. 11 Tape Shape and Dimension

Fig. 12 Reel Shape and Dimension

4.0 ±0.1

2.0 ±0.05

4.0 ±0.1

1.6 ±0.1

2.5 ±0.1

1.75 ±0.1

0.3 ±0.05

5.5 ±0.1

5°

3.5 ±0.05

8.0 ±0.3

1.75 ±0.1

φ1.5 +0.1

-0

3.3 ±0.1

1.7 ±0.1

180.0

NOTE: Unit: mm

11.4 ±1

2.0 ±0.5

φ13.0 ±0.2

9.0

+0.3

-0

60.0

-0

Sheet No.: D1-A00601EN

GL100MN0MPx

●GL100MN0MP1 (Top view mount, 1500 pcs/reel)

Fig. 13 Product Insertion Direction

Fig. 14 Tape Shape and Dimension

Pull-out direction

4.0 ±0.1

2.0 ±0.05

4.0 ±0.1

1.8 ±0.1

2.45 ±0.1

0.3 ±0.05

5.5 ±0.1

5°

3.5 ±0.05

8.0 ±0.3

1.75 ±0.1

3.3 ±0.1

φ1.5 +0.1

-0

Sheet No.: D1-A00601EN

GL100MN0MPx

Fig. 15 Reel Shape and Dimension

Fig. 16 Product Insertion Direction

180.0

NOTE: Unit: mm

11.4 ±1

2.0 ±0.5

φ13.0 ±0.2

9.0 +0.3

-0

60.0 +1

-0

Pull-out direction

■Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems

related to any intellectual property right of a third party

resulting from the use of SHARP’s devices.

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

specifications, characteristics, data materials, struc-

ture, and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment (terminal)

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliabilty such as:

--- Transportation control and safety equipment

(i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-

tion with equipment that requires an extremely high

level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment (trunk lines)

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.

scuba)

· If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

· This publication is the proprietary product of SHARP

duced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or

in part, without the express written permission of

SHARP. Express written permission is also required

before any use of this publication may be made by a

third party.

· Contact and consult with a SHARP representative if

there are any questions about the contents of this pub-

lication.

Sheet No.: D1-A00601EN

GL100MN0MPx