HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specically designed for both
analog and digital applications. This series oers a wide
range of specications and package congurations to
give the designer wide exibility. The HSMS‑280x series
of diodes is optimized for high voltage applications.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.
Package Lead Code Identication, SOT-23/SOT-143
(Top View)
Package Lead Code Identication, SOT-323
(Top View)
Package Lead Code Identication, SOT-363
(Top View)
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
0.026
0.079
0.018
0.039
Dimensions in inches
Features
• Surface Mount Packages
• High Breakdown Voltage
• Low FIT (Failure in Time) Rate*
• Six‑sigma Quality Level
• Single, Dual and Quad Versions
• Tape and Reel Options Available
• Lead‑free
* For more information see the Surface Mount Schottky Reliability
Data Sheet.
COMMON
CATHODE
#4
UNCONNECTED
PAIR
#5
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
1 2
3
1 2
3 4
BRIDGE
QUAD
#8
1 2
3 4
1 2
3
1 2
3
1 2
3
2
Absolute Maximum Ratings[1] TC = 25°C
Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363
IfForward Current (1 µs Pulse) Amp 1 1
PIV Peak Inverse Voltage V Same as VBR Same as VBR
TjJunction Temperature °C 150 150
Tstg Storage Temperature °C -65 to 150 -65 to 150
θjc Thermal Resistance[2] °C/W 500 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is dened to be the temperature at the package pins where contact is made to the circuit board.
Notes:
1. Package marking provides orientation and identication.
2. See “Electrical Specications” for appropriate package marking.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
Pin Connections and Package Marking, SOT-363
GUx
1
2
3
6
5
4
Electrical Specications TA = 25°C, Single Diode [3]
Part
Number
HSMS[4]
Package
Marking
Code
Lead
Code Conguration
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Forward
Voltage
VF (mV)
Maximum
Forward
Voltage
VF (V) @ IF (mA)
Maximum
Reverse
Leakage
IR (nA) @ VR (V)
Maximum
Capacitance
CT (pF)
Typical
Dynamic
Resistance
RD (Ω)[5]
2800 A0 0 Single
70 410 1.0 @ 15 200 @ 50 2.0 35
2802 A2 2 Series
2803 A3 3 Common Anode
2804 A4 4 Common Cathode
2805 A5 5 Unconnected Pair
2808 A8 8 Bridge Quad[4]
280B A0 B Single
280C A2 C Series
280E A3 E Common Anode
280F A4 F Common Cathode
280K AK K High Isolation
Unconnected Pair
280L AL L Unconnected Trio
280M H M Common Cathode Quad
280N N N Common Anode Quad
280P AP P Bridge Quad
280R O R Ring Quad
Test Conditions IR = 10 mA IF = 1 mA VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. DCTO for diodes in pairs and quads is 0.2 pF maximum.
3. Eective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. RD = RS + 5.2 Ω at 25°C and If = 5 mA.
3
Quad Capacitance
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument eectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago denes this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.
In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the gure below.
The diagonal capacitance is calculated using the follow‑
ing formula
C1 x C2 C3 x C4
CDIAGONAL = _______ + _______
C1 + C2 C3 + C4
C1
C2C4
C3
A
B
C
The equivalent adjacent capacitance is the capacitance
between points A and C in the gure below. This capaci‑
tance is calculated using the following formula
1
CADJACENT = C1 + ____________
1 1 1
–– + –– + ––
C2 C3 C4
This information does not apply to cross‑over quad
diodes.
SPICE Parameters
Parameter Units HSMS-280x
BVV 75
CJ0 pF 1.6
EGeV 0.69
IBV A E‑5
ISA 3.00E‑08
N 1.08
RSΩ 30
PBV 0.65
PT2
M 0.5
Cj
Rj
RS
Rj = 8.33 X 10-5 nT
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
RS = series resistance (see Table of SPICE parameters)
Cj = junction capacitance (see Table of SPICE parameters)
Linear Equivalent Circuit, Diode Chip
4
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
0 0.1 0.30.2 0.5 0.60.4 0.80.7 0.9
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs.
Forward Voltage at Temperatures.
0.01
10
1
0.1
100
TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.
0 10 20 30 5040
I
R
– REVERSE CURRENT (nA)
V
R
– REVERSE VOLTAGE (V)
1
1000
100
10
100,000
10,000
TA = +125°C
TA = +75°C
TA = +25°C
Figure 3. Dynamic Resistance vs.
Forward Current.
0.1 1 100
R
D
– DYNAMIC RESISTANCE (Ω)
I
F
– FORWARD CURRENT (mA)
10
1
10
1000
100
Figure 4. Total Capacitance vs.
Reverse Voltage.
0 10 20 30 5040
C
T
– CAPACITANCE (pF)
V
R
– REVERSE VOLTAGE (V)
0
1.5
1
0.5
2
V
F
- FORWARD VOLTAGE (V)
Figure 5. Typical V
f
Match, Pairs and
Quads.
30
10
1
0.3
30
10
1
0.3
I
F
- FORWARD CURRENT (mA)
∆V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
0.2 0.4 0.6 0.8 1.0 1.2 1.4
I
F
(Left Scale)
∆V
F
(Right Scale)
5
Table 1. Typical SPICE Parameters
Parameter Units HSMS-280x HSMS-281x HSMS-282x
BVV 75 25 15
CJ0 pF 1.6 1.1 0.7
EGeV 0.69 0.69 0.69
IBV A 1 E‑5 1 E‑5 1 E‑4
ISA 3 E‑8 4.8 E‑9 2.2 E‑8
N 1.08 1.08 1.08
RSΩ 30 10 6
PB (VJ) V 0.65 0.65 0.65
PT (XTI) 2 2 2
M 0.5 0.5 0.5
Applications Information Introduction —
Product Selection
Avago’s family of Schottky products provides unique
solutions to many design problems.
The rst step in choosing the right product is to select the
diode type. All of the products in the HSMS‑280x family
use the same diode chip, and the same is true of the
HSMS‑281x and HSMS‑282x families. Each family has a dif‑
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will oer higher current
carrying capacity and better performance. The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), oering
lower 1/f or icker noise than the HSMS‑282x family.
In general, the HSMS‑282x family should be the designer’s
rst choice, with the ‑280x family reserved for high voltage
applications and the HSMS‑281x family for low icker
noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
323 (SC‑70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor‑
mance.
0.026
0.039
0.079
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
363 (SC‑70, 6 lead) package is shown in Figure 7 (dimen‑
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip‑
ment without adding parasitics that could impair the
performance.
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
6
Figure 8. Surface Mount Assembly Prole.
25
Time
Temperature
Tp
T
L
tp
t
L
t 25°C to Peak
Ramp-up
ts
Ts
min
Ramp-down
Preheat
Critical Zone
T
L
to Tp
Ts
max
Lead-Free Reow Prole Recommendation (IPC/JEDEC J-STD-020C)
Reow Parameter Lead-Free Assembly
Average ramp‑up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max
Preheat Temperature Min (TS(min)) 150°C
Temperature Max (TS(max)) 200°C
Time (min to max) (tS) 60‑180 seconds
Ts(max) to TL Ramp‑up Rate 3°C/second max
Time maintained above: Temperature (TL) 217°C
Time (tL) 60‑150 seconds
Peak Temperature (TP) 260 +0/‑5°C
Time within 5 °C of actual Peak temperature (tP) 20‑40 seconds
Ramp‑down Rate 6°C/second max
Time 25 °C to Peak Temperature 8 minutes max
Note 1: All temperatures refer to topside of the package, measured on the package body surface
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualied to the time‑
temperature prole shown in Figure 8. This prole is
representative of an IR reow type of surface mount as‑
sembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reow zone briey elevates the temperature suciently
to produce a reow of the solder.
The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reow of solder.
7
Package Dimensions
Outline 23 (SOT-23)
e
B
e2
e1
E1
C
E
XXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
Outline SOT-323 (SC-70 3 Lead)
e
B
e1
E1
C
E
XXX
L
D
A
A1
Notes:
XXX-package marking
Drawin
g
s are not to scale
DIMENSIONS (mm)
MIN.
0.80
0.00
0.15
0.10
1.80
1.10
1.80
MAX.
1.00
0.10
0.40
0.20
2.25
1.40
2.40
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
1.30 typical
0.65 typical
0.425 typical
Part Number Ordering Information
Part Number
No. of
Devices Container
HSMS‑280x‑TR2G 10000 13” Reel
HSMS‑280x‑TR1G 3000 7” Reel
HSMS‑280x‑BLKG 100 antistatic bag
x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R
8
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
Note: "AB" represents package marking code.
"C" represents date code.
END VIEW
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
Note: "AB" represents package marking code.
"C" represents date code.
END VIEW
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
END VIEW
8 mm
4 mm
TOP VIEW
Note: "AB" represents package marking code.
"C" represents date code.
ABC ABC ABC ABC
Device Orientation
For Outline SOT-143
For Outlines SOT-23, -323
For Outline SOT-363
Outline 143 (SOT-143)
eB
e2
B1
e1
E1
C
E
XXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
Outline SOT-363 (SC-70 6 Lead)
E
HE
D
e
A1
b
A
A2
Q1
L
c
DIMENSIONS (mm)
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
0.10
0.15
0.10
0.10
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
0.30
0.20
0.30
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
0.650 BCS
Package Dimensions (Continued)
9
Tape Dimensions and Product Orientation
For Outline SOT-23
For Outline SOT-143
9
°
MAX
A
0
P
P
0
D
P
2
E
F
W
D
1
Ko 8
°
MAX
B
0
13.5
°
MAX
t1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 - 0.10
0.229
±
0.013
0.315 + 0.012 - 0.004
0.009
±
0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50
±
0.05
2.00
±
0.05
0.138
±
0.002
0.079
±
0.002
DISTANCE
BETWEEN
CENTERLINE
W
F
E
P
2
P
0
D
P
D
1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
3.19
±
0.10
2.80
±
0.10
1.31
±
0.10
4.00
±
0.10
1.00 + 0.25
0.126
±
0.004
0.110
±
0.004
0.052
±
0.004
0.157
±
0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 - 0.10
0.254
±
0.013
0.315+ 0.012 - 0.004
0.0100
±
0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50
±
0.05
2.00
±
0.05
0.138
±
0.002
0.079
±
0.002
DISTANCE
A
0
9
°
MAX 9
°
MAX
t
1
B0
K0
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4020EN
AV02-0533EN - October 6
, 2008
P
P
0
P
2
F
W
C
D
1
D
E
A
0
An
t
1
(CARRIER TAPE THICKNESS) T
t
(COVER TAPE THICKNESS)
An
B
0
K
0
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
2.40
±
0.10
2.40
±
0.10
1.20
±
0.10
4.00
±
0.10
1.00 + 0.25
0.094
±
0.004
0.094
±
0.004
0.047
±
0.004
0.157
±
0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.55
±
0.05
4.00
±
0.10
1.75
±
0.10
0.061
±
0.002
0.157
±
0.004
0.069
±
0.004
PERFORATION
WIDTH
THICKNESS
W
t
1
8.00
±
0.30
0.254
±
0.02
0.315
±
0.012
0.0100
±
0.0008
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50
±
0.05
2.00
±
0.05
0.138
±
0.002
0.079
±
0.002
DISTANCE
FOR SOT-323 (SC70-3 LEAD) An 8
°
C MAX
FOR SOT-363 (SC70-6 LEAD) 10
°
C MAX
ANGLE
WIDTH
TAPE THICKNESS
C
T
t
5.4
±
0.10
0.062
±
0.001
0.205
±
0.004
0.0025
±
0.00004
COVER TAPE