BAS85,115 - NXP Semiconductors - Datasheet.Directory

1. Product profile

1.1 General description

Planar Schottky barrier diode with an integrated guard ring for stress protection,

encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted

Device SMD package with tin-plated metal discs at each end. It is suitable for

“automatic placement” and as such it can withstand immersion soldering.

1.2 Features and benefits

Low forward voltage

High breakdo wn vo ltage

Guard-ring protected

Hermetically sealed glass SMD package

1.3 Applications

Ultra high-speed switching

Voltage clamping

Protection circuits

Blocking diodes

1.4 Quick reference data

BAS85

Schottky barrier diode

Rev. 6 — 10 September 2010 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current - - 200 mA

VRreverse voltage - - 30 V

VFforward voltage IF= 100 mA - - 800 mV

Product data sheet Rev. 6 — 10 September 2010 2 of 10

NXP Semiconductors BAS85

Schottky barrier diode

2. Pinning information

[1] The marking band indicates the cathode.

3. Ordering information

4. Marking

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode ka

sym00

Tabl e 3. Ordering information

Type number Package

Name Description Version

BAS85 - hermetically sealed glass surface-mounted package;

2 connectors SOD80C

Table 4. Marking codes

Type number Marking code

BAS85 marking band

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 30 V

IFforward current - 200 mA

IF(AV) average forward current [1] -200mA

IFRM repetitive peak forward

current tp≤1s; δ≤0.5 - 300 mA

IFSM non-repetitive peak

forward current tp=10ms - 5 A

Tjjunction temperature - 125 °C

Tamb ambient temperature −65 +125 °C

Tstg storage temperature −65 +150 °C

Product data sheet Rev. 6 — 10 September 2010 3 of 10

NXP Semiconductors BAS85

Schottky barrier diode

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 320 K/W

Table 7. Characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 0.1 mA - - 240 mV

IF= 1 mA - - 320 mV

IF= 10 mA - - 400 mV

IF= 30 mA - - 500 mV

IF= 100 mA - - 800 mV

IRreverse current VR=25V [1] --2.3μA

Cddiode capacitance VR=1V; f=1MHz --10pF

Product data sheet Rev. 6 — 10 September 2010 4 of 10

NXP Semiconductors BAS85

Schottky barrier diode

FR4 PCB, standard footprint (1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

Fig 1. Average forward current as a function of

ambient temperature ; derating curve Fig 2. Forward current as a function of forward

voltage; typical values

(1) Tamb =85°C

(2) Tamb =25°C

(3) Tamb =−40 °C

f=1MHz; T

amb =25°C

Fig 3. Revers e current as a function of reverse

voltage; typical values Fig 4. Diode ca pacitance as a function of reverse

voltage; typical values

100

150

200

250

0 50 100 150

IF(AV)

(mA)

Tamb (°C)

mra540

1.20.80.40 VF (V)

(mA)

103

102

10−1

mld358

(1) (2) (3)

mgc682

105

(nA)

104

103

102

10−1

3020 VR (V)

100

(1)

(2)

(3)

01020

VR (V) 30

(pF)

mgc681

Product data sheet Rev. 6 — 10 September 2010 5 of 10

NXP Semiconductors BAS85

Schottky barrier diode

8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

Fig 5. Package outline SOD80C

06-03-16Dimensions in mm

1.60

1.45

0.3

3.7

3.3

0.3

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quan tity

2500 10000

BAS85 SOD80C 4 mm pitch, 8 mm tape and reel -115 -135

Product data sheet Rev. 6 — 10 September 2010 6 of 10

NXP Semiconductors BAS85

Schottky barrier diode

10. Soldering

Fig 6. Reflow soldering footprint SOD80C

Fig 7. Wave soldering footprint SOD80C

sod080c

2.30

4.30

4.55

1.601.702.25

0.90

(2x)

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sod080c

2.70

4.90

6.30

1.702.90

1.90

solder lands

tracks

solder resist

occupied area

Dimensions in mm

Product data sheet Rev. 6 — 10 September 2010 7 of 10

NXP Semiconductors BAS85

Schottky barrier diode

11. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS85_6 20100910 Product data sheet - BAS85_5

Modifications: •Section 4 “Marking”: updated

•Section 12 “Legal information”: updated

BAS85_5 20090325 Product data sheet - BAS85_4

BAS85_4 20000525 Product specification - BAS85_3

BAS85_3 19961001 Product specification - BAS85_2

BAS85_2 19960320 Product specification - -

Product data sheet Rev. 6 — 10 September 2010 8 of 10

NXP Semiconductors BAS85

Schottky barrier diode

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe propert y or environment al

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 10 September 2010 9 of 10

NXP Semiconductors BAS85

Schottky barrier diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAS85

Schottky barrier diode

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 September 2010

Document identifier: BAS85

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Packing information . . . . . . . . . . . . . . . . . . . . . 5

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10