SP3239E Intelligent +3.0V to +5.5V RS-232 Transceiver FEATURES Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply Interoperable with EIA/TIA-232 and adheres to EIA/TIA-562 down to a +2.7V power source Minimum 250Kbps data rate under load Regulated Charge Pump Yields Stable RS-232 Outputs Regardless of VCC Variations Enhanced ESD Specifications: +15kV Human Body Model +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact Discharge C2+ 1 28 C1+ GND 2 27 V+ C2- 3 26 VCC V- 4 25 T1OUT 5 T2OUT 6 T3 OUT 7 SP3239E C1- 24 T1 IN 23 T2 IN 22 T3 IN R1IN 8 21 R1OUT R 2IN 9 20 R2OUT T4OUT 10 19 T4IN R3 IN 11 T5 OUT 12 18 17 R3 OUT T5 IN NC 13 16 R1OUT 15 NC SHUTDOWN 14 Now Available in Lead Free Packaging DESCRIPTION The SP3239E device is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook and palmtop computers. The SP3239E uses an internal high-efficiency, charge-pump power supply that requires only 0.1F capacitors in 3.3V operation. This charge pump and Exar's driver architecture allow the SP3239E device to deliver compliant RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3239E is a 5-driver / 3-receiver device that is ideal for laptop / notebook computer and PDA applications. The SP3239E includes one complementary receiver that remains alert to monitor an external device's Ring Indicate signal while the device is shutdown. Device Power Supplies RS-232 Drivers RS-232 Receivers External Components Auto On-Line Circuitry SELECTION TABLE TTL 3-State # of Pins SP3223E +3.0V to +5.5V 2 2 4 Capacitors YES YES 20 SP3243E +3.0V to +5.5V 3 5 4 Capacitors YES YES 28 SP3238E +3.0V to +5.5V 5 3 4 Capacitors YES YES 28 SP3239E +3.0V to +5.5V 5 3 4 Capacitors NO YES 28 SP3249E +3.0V to +5.5V 5 3 4 Capacitors NO NO 24 Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 ABSOLUTE MAXIMUM RATINGS Power Dissipation per package These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. 28-pin SSOP (derate 11.2mW/oC above +70oC)..........900mW VCC.......................................................-0.3V to +6.0V V+ (NOTE 1).......................................-0.3V to +7.0V V- (NOTE 1)........................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...........................................+13V ICC (DC VCC or GND current).........................+100mA Input Voltages TxIN, SHUTDOWN, ..................-0.3V to Vcc + 0.3V RxIN...................................................................+25V Output Voltages TxOUT.............................................................+13.2V RxOUT........................................-0.3V to (VCC +0.3V) Short-Circuit Duration TxOUT....................................................Continuous Storage Temperature......................-65C to +150C NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ELECTRICAL CHARACTERISTICS VCC = +3.0V to +5.5V, C1 - C4 = 0.1F (tested at 3.3V +/-5%), C1 - C4 = 0.22F (tested at 3.3V +/-10%), C1 = 0.047F and C2 - C4 = 0.33F (tested at 5.0V +/-10%), TAMB = TMIN to TMAX, unless otherwise noted. Typical values are at TA = 25C PARAMETER MIN. TYP. MAX. UNITS CONDITIONS Supply Current, Shutdown 1.0 10 A SHUTDOWN = GND, TxIN = GND or VCC Supply Current 0.3 1.0 mA SHUTDOWN = VCC, no load 0.8 V V DC CHARACTERISTICS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW HIGH 2.4 VCC = +3.3V or +5.0V, TxIN, SHUTDOWN Input Leakage Current +0.01 +1.0 A TxIN, SHUTDOWN TAMB = +25C Output Leakage Current +0.05 +10 A Receivers disabled 0.4 Output Voltage LOW Output Voltage HIGH V IOUT = 1.6mA VCC -0.6 VCC -0.1 V IOUT = -1.0mA +5.0 +5.4 V All driver outputs loaded with 3K to GND DRIVER OUTPUTS Output Voltage Swing Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 ELECTRICAL CHARACTERISTICS VCC = +3.0V to +5.5V, C1 - C4 = 0.1F (tested at 3.3V +/-5%), C1 - C4 = 0.22F (tested at 3.3V +/-10%), C1 = 0.047F and C2 - C4 = 0.33F (tested at 5.0V +/-10%), TAMB = TMIN to TMAX, unless otherwise noted. Typical values are at TA = 25C PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DRIVER OUTPUTS (continued) Output Resistance 300 Output Short-Circuit Current +35 +60 mA 25 V VCC = V+ = V- = 0V, VOUT=+2V VOUT = GND RECEIVER INPUTS Input Voltage Range -25 Input Threshold LOW 0.6 1.2 V Vcc = 3.3V Input Threshold LOW 0.8 1.5 V Vcc = 5.0V Input Threshold HIGH 1.5 2.4 V Vcc = 3.3V Input Threshold HIGH 1.8 2.4 V Vcc = 5.0V 7 k Input Hysteresis 0.5 Input Resistance 3 5 V TIMING CHARACTERISTICS Maximum Data Rate 250 kbps RL = 3K, CL = 1000pF, one driver switching Receiver Propagation Delay tPHL tPLH 0.15 0.15 s Receiver input to Receiver output, CL = 150pF Receiver Output Enable Time 200 ns Normal operation Receiver Output Disable Time 200 ns Normal operation Driver Skew 100 ns | tPHL - tPLH |, TAMB = 25C Receiver Skew 50 Transition-Region Slew Rate ns 30 V/s | tPHL - tPLH | Vcc = 3.3V, RL = 3k, TAMB = 25C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rate, all drivers loaded with 3k, 0.1F charge pump capacitors, and TAMB = +25C. 25 20 V /u S 6 V o lt 4 2 15 POS. SR NE G S R 10 VOH 0 -2 0 1000 2000 3000 4000 5 VOL 5000 0 -4 0 -6 1000 2000 3000 4000 5000 pF pF Figure 2. Slew Rate VS. Load Capacitance Figure 1. Transmitter Output Voltage VS. Load Capacitance 60 50 mA 40 250K bps 30 120K bps 20K bps 20 10 0 0 1000 2000 3000 4000 5000 pF Figure 3. Supply Current VS. Load Capacitance when Transmitting Data Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 NAME FUNCTION PIN NUMBER C2+ Positive terminal of the symmetrical charge-pump capacitor C2. 1 GND Ground. 2 Negative terminal of the symmetrical charge-pump capacitor C2. 3 C2- Regulated -5.5V output generated by the charge pump. 4 T1OUT V- RS-232 Driver Output. 5 T2OUT RS-232 Driver Output. 6 T3OUT RS-232 Driver Output. 7 R1IN RS-232 receiver input. 8 R2IN RS-232 receiver input. 9 T4OUT RS-232 Driver Output. 10 R3IN RS-232 receiver input. 11 T5OUT RS-232 Driver Output. 12 No connect. 13 Apply logic LOW to shut down drivers and charge pump. 14 No Connect or tie HIGH for normal operation. 15 Non-Inverting receiver - 1 output, active in shutdown. 16 TTL/CMOS driver input. 17 TTL/CMOS receiver output. 18 NC SHUTDOWN NC R1OUT T5IN R3OUT TTL/CMOS driver input. 19 R2OUT T4IN TTL/CMOS receiver output. 20 R1OUT TTL/CMOS receiver output. 21 T3IN TTL/CMOS driver input. 22 T2IN TTL/CMOS driver input. 23 T1IN TTL/CMOS driver input. 24 C1- Negative terminal of the symmetrical charge-pump capacitor C1. 25 Vcc +3.0V to +5.5V supply voltage. 26 V+ Regulated +5.5V output generated by the charge pump. 27 Positive terminal of the symmetrical charge-pump capacitor C1. 28 C1+ Table 1. Device Pin Description Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 28 C1+ C2+ 1 GND 2 27 V+ C2- 3 26 VCC 25 C1- V- 4 T1OUT 5 SP3239E 24 T1 IN 23 T2 IN T2OUT 6 T3 OUT 7 22 T3 IN R1IN 8 21 R1OUT R 2IN 9 20 R2OUT T4OUT 10 19 T4IN R3 IN 11 T5 OUT 12 17 R3 OUT T5 IN NC 13 16 R1OUT 18 15 NC SHUTDOWN 14 Figure 4. SP3239E Pinout Configuration C5 C1 C2 + + + 28 C1+ 0.1F V+ 27 C3 25 C11 C2+ 0.1F TTL/CMOS INPUTS VCC 26 VCC 0.1F SP3239E V- + 0.1F 4 C4 3 C224 T1IN T1OUT 5 23 T2IN T2OUT 6 22 T3IN T3OUT 7 19 T4IN T4OUT 10 17 T5IN T5OUT 12 R1IN 8 R2IN 9 R3IN 11 + 0.1F RS-232 OUTPUTS 16 R1OUT 21 R1OUT TTL/CMOS OUTPUTS 5k 20 R2OUT 5k 18 R3OUT VCC 14 RS-232 INPUTS 5k SHUTDOWN GND 2 Figure 5. SP3239E Typical Operating Circuit Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 DESCRIPTION THEORY OF OPERATION The SP3239E device meets the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3239E devices feature Exar's proprietary and patented (U.S. 5,306,954) on-board charge pump circuitry that generates 5.5V RS-232 voltage levels from a single +3.0V to +5.5V power supply. The SP3239E devices can guarantee a data rate of 250kbps fully loaded. The SP3239E device is made up of three basic circuit blocks: 1. Drivers 2. Receivers 3. The Exar proprietary charge pump Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to 5.0V EIA/ TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. These drivers comply with the EIA-TIA-232-F and all previous RS-232 versions. The SP3239E is a 5-driver/3-receiver device, ideal for portable or hand-held applications. The SP3239E includes one complementary always-active receiver that can monitor an external device (such as a modem) in shutdown. This aids in protecting the UART or serial controller IC by preventing forward biasing of the protection diodes where VCC may be disconnected. The drivers can guarantee a data rate of 250kbps fully loaded with 3k in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. All unused drivers inputs should be connected to GND or VCC. The slew rate of the driver output is internally limited to a maximum of 30V/s in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. VCC C5 C1 C2 + + + 28 C1+ 0.1F 0.1F V+ 27 C3 25 C11 C2+ RxD UART or Serial C 26 VCC 0.1F SP3239E + Figure 7 shows a loopback test circuit used to test the RS-232 drivers. Figure 8 shows the test results of the loopback circuit with all five drivers active at 120kbps with typical RS-232 loads in parallel with 1000pF capacitors. Figure 9 shows the test results where one driver was active at 250kbps and all five drivers loaded with an RS-232 receiver in parallel with a 1000pF capacitor. A solid RS-232 data transmission rate of 120kbps provides compatibility with many designs in personal computer peripherals and LAN applications. 0.1F V- 4 C4 3 C224 T1IN T1OUT 5 T2OUT 6 CTS 23 T2IN DSR 22 T3IN T3OUT 7 DCD 19 T4IN T4OUT 10 RI 17 T5IN T5OUT 12 + 0.1F RS-232 OUTPUTS 16 R1OUT TxD 21 R1OUT RTS 20 R2OUT DTR 18 R3OUT VCC 14 R1IN 8 5k 5k R2IN 9 RS-232 INPUTS R3IN 11 5k SHUTDOWN GND Receivers 2 RESET P Supervisor IC The receivers convert +5.0V EIA/TIA-232 levels to TTL or CMOS logic output levels. The truth table logic of the SP3239E driver and receiver outputs can be found in Table 2. VIN Figure 6. Interface Circuitry Controlled by Microprocessor Supervisory Circuit Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 Device: SP3239E VCC C5 C1 C2 + + + 0.1F C1+ 0.1F V+ C1C2+ 0.1F VCC SP3239E C4 0.1F + TxOUT RxOUT R1OUT 0 High-Z High-Z Active 1 Active Active Active Table 2. SHUTDOWN Logic 0.1F TxOUT RxOUT LOGIC OUTPUTS + V- C2TxIN LOGIC INPUTS C3 SHUTDOWN RxIN 1000pF The SP3239E includes an additional non-inverting receiver with an output R1OUT. R1OUT is an extra output that remains active and monitors activity while the other receiver outputs are forced into high impedance. This allows a Ring Indicator (RI) signal from a peripheral to be monitored without forward biasing the TTL/CMOS inputs of the other devices connected to the receiver outputs. 5k VCC SHUTDOWN GND Figure 7. Loopback Test Circuit for RS-232 Driver Data Transmission Rates Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, an internal 5k pulldown resistor to ground will commit the output of the receiver to a HIGH state. Charge Pump The charge pump is an Exar-patented design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. This is important to maintain compliant RS-232 levels regardless of power supply fluctuations. Figure 8. Loopback Test results at 120kbps (All Drivers Fully Loaded) The charge pump operates in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pump is enabled. If the output voltages exceed a magnitude of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. Figure 9. Loopback Test results at 250Kbps (All Drivers Fully Loaded) Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 Phase 1 -- VSS charge storage -- During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1- is transferred to C2-. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Phase 2 -- VSS transfer -- Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. Phase 3 -- VDD charge storage -- The third phase of the clock is identical to the first phase -- the charge transferred in C1 produces -VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. Since both V+ and V- are separately generated from VCC, in a no-load condition V+ and V- will be symmetrical. Older charge pump approaches that generate V- from V+ will show a decrease in the magnitude of V- compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 500kHz. The external capacitors can be as low as 0.1F with a 16V breakdown voltage rating. Phase 4 -- VDD transfer -- The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the Figure 10. Charge Pump Waveform Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com SP3239E_100_020111 VCC = +5V C4 +5V C1 + + C2 - -5V - + - VDD Storage Capacitor - + VSS Storage Capacitor C3 -5V Figure 11. Charge Pump -- Phase 1 VCC = +5V C4 + C1 C2 - + - + - - + VDD Storage Capacitor VSS Storage Capacitor C3 -5.5V Figure 12. Charge Pump -- Phase 2 VCC = +5V C4 +5V C1 + - C2 -5V + - + - VDD Storage Capacitor - + VSS Storage Capacitor C3 -5V Figure 13. Charge Pump -- Phase 3 VCC = +5V +5.5V C1 + - C2 C4 + - + - - + VDD Storage Capacitor VSS Storage Capacitor C3 Figure 14. Charge Pump -- Phase 4 Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 10 SP3239E_100_020111 VCC C5 C1 + + 28 0.1F C2 0.1F C1+ 25 C11 + 26 VCC 0.1F 3 C2+ SP3239E V+ 27 C3 V- C2- C4 R1IN 8 R2IN 9 R3IN 11 24 T1IN T1OUT 5 23 T2IN T2OUT 6 22 T3IN T3OUT 7 19 T4IN T4OUT 10 17 T5IN T5OUT 12 5k 20 R2OUT 5k 18 R3OUT 0.1F 4 16 R1OUT 21 R1OUT + + 0.1F 5k VCC 14 DB-9 Connector SHUTDOWN 6 7 8 9 GND 2 DB-9 Connector Pins: 1. Received Line Signal Detector 2. Received Data 3. Transmitted Data 4. Data Terminal Ready 5. Signal Ground (Common) 6. 7. 8. 9. 1 2 3 4 5 DCE Ready Request to Send Clear to Send Ring Indicator Figure 15. Circuit for the connectivity of the SP3239E with a DB-9 connector Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 11 SP3239E_100_020111 ESD Tolerance most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC61000-4-2 is shown on Figure 17. There are two methods within IEC61000-4-2, the Air Discharge method and the Contact Discharge method. The SP3239E device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC61000-4-2 Air-Discharge c) IEC61000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semi-conductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body's potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 16. This method will test the IC's capability to withstand an ESD transient during normal handling such as in manufacturing areas where the IC's tend to be handled frequently. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The IEC-61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC61000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives RS RC SW1 DC Power Source SW2 CS Device Under Test Figure 16. ESD Test Circuit for Human Body Model Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 12 SP3239E_100_020111 Contact-Discharge Model RS RC RV SW1 SW2 Device Under Test CS DC Power Source R S and RV add up to 330 for IEC61000-4-2. Figure 17. ESD Test Circuit for IEC61000-4-2 I The circuit models in Figures 16 and 17 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. 30A 15A 0A For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5k an 100pF, respectively. For IEC-61000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330 an 150pF, respectively. t = 0ns t t = 30ns Figure 18. ESD Test Waveform for IEC61000-4-2 The higher CS value and lower RS value in the IEC61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. Device PIN TESTED Driver Outputs Receiver Inputs Human Body MODEL Air Discharge +15kV +15kV +15kV +15kV IEC61000-4-2 Direct Contact Level +8kV +8kV 4 4 Table 3. Transceiver ESD Tolerance Levels Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 13 SP3239E_100_020111 PACKAGE: 28 PIN SSOP e Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 14 SP3239E_100_020111 ORDERING INFORMATION Part Number Temp. Range Package SP3239ECA-L 0C to +70C 28 Pin SSOP SP3239ECA-L/TR 0C to +70C 28 Pin SSOP SP3239EEA-L -40C to +85C 28 Pin SSOP SP3239EEA-L/TR -40C to +85C 28 Pin SSOP For Tape and Reel option add "/TR", Example: SP3239ECA-L/TR. Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 15 SP3239E_100_020111 REVISION HISTORY DATE REVISION DESCRIPTION 02/28/05 -- 02/01/11 1.0.0 Legacy Sipex Datasheet Convert to Exar Format, Update ordering information and change ESD specification to IEC61000-4-2 Notice EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2011 EXAR Corporation Datasheet February 2011 For technical support please email Exar's Serial Technical Support group at : serialtechsupport@exar.com Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. Exar Corporation 48720 Kato Road, Fremont CA, 94538 * 510-668-7017 * www.exar.com 16 SP3239E_100_020111