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Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
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Renesas Electronics document. We appreciate your understanding.
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
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Notice
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DATA SHEET
1997
The mark <R> shows major revised points.
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC358
Document No. G11765EJ6V0DS00 (6th edition)
Date Published December 2007 N
Printed in Japan
LOW POWER DUAL OPERATIONAL AMPLIFIERS
DESCRIPTION
The
µ
PC358 is a dual operational amplifier which is
designed to operate from a single power supply over a
wide range of voltages. Operation from split power
supplies is also possible and the power supply current
drain is very low. Further advantage, the input common-
mode voltage range includes ground in the linear mode.
FEATURES
•Internally frequency compensation
•Wide output voltage swing V– to V+ –1.5 V
•Common mode input voltage range includes V–
•Wide supply voltage range
3 V to 30 V (Single)
±1.5 V to ±15 V (Split)
•Output short circuit protection
EQUIVALENT CIRCUIT (1/2 Circuit)
V+
V–
OUT
Q6
Q5
Q7
Q13
Q12
Q11
Q10
Q9Q8
Q4
Q3Q2
Q1
CC
II
IN
RSC
6 A
µ
6 A
µ
100 A
µ
50 A
µ
PIN CONFIGURATION (Marking Side)
OUT1
II1
IN1
V–
V+
OUT2
II2
IN2
1
2
3
4
8
7
6
5
+–1
–+ 2
PC358C, 358G2
µ
ORDERING INFORMATION
Part Number Package
µ
PC358C 8-pin plastic DIP (7.62 mm (300))
µ
PC358G2 8-pin plastic SOP (5.72 mm (225))
µ
PC358G2(5) 8-pin plastic SOP (5.72 mm (225))
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
<R>
<R>
µ
PC358
2Data Sheet G11765EJ6V0DS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter Symbol Ratings Unit
Voltage between V+ and V–Note 1 V+ – V––0.3 to +32 V
Differential Input Voltage VID ±32 V
Input Voltage Note 2 VIV––0.3 to V–+32 V
Output Voltage Note 3 VOV––0.3 to V++0.3 V
Power Dissipation C Package Note 4 PT350 mW
G2 Package Note 5 440 mW
Output Short Circuit Duration Note 6 Indefinite s
Operating Ambient Temperature TA–20 to +80 °C
Storage Temperature Tstg –55 to +125 °C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction independent of the magnitude
of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation
will establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage which should be allowed to supply to the output terminal from external
without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.
4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C.
5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and
Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage (Split) V±±1.5 ±15 V
Supply Voltage (V– = GND) V++3 +30 V
µ
PC358C,
µ
PC358G2
ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Offset Voltage VIO RS = 0 Ω±2±7mV
Input Offset Current IIO ±5±50 nA
Input Bias Current Note 7 IB45 250 nA
Large Signal Voltage Gain AVRL ≥ 2 kΩ25 100 V/mA
Supply Current Note 8 ICC RL = ∞, IO = 0 A 0.7 1.2 mA
Common Mode Rejection Ratio CMR 65 70 dB
Supply Voltage Rejection Ratio SVR 65 100 dB
Output Voltage Swing VORL = 2 kΩ (Connect to GND) 0 V+ –1.5 V
Common Mode Input Voltage Range VICM 0V
+ –1.5 V
Output Current (SOURCE) IO SOURCE VIN+ = +1 V, VIN– = 0 V 20 40 mA
Output Current (SINK) IO SINK VIN– = +1 V, VIN+ = 0 V 10 20 mA
VIN– = +1 V, VIN+ = 0 V, 12 50
µ
A
VO = 200 mV
Channel Separation f = 1 kHz to 20 kHz 120 dB
Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input
stage.
8. This current flows irrespective of the existence of use.
<R>
µ
PC358
3
Data Sheet G11765EJ6V0DS
µ
PC358G2(5)
ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Offset Voltage VIO RS = 0 Ω±2±3mV
Input Offset Current IIO ±5±50 nA
Input Bias Current Note 7 IB45 60 nA
Large Signal Voltage Gain AVRL ≥ 2 kΩ50 100 V/mA
Supply Current Note 8 ICC RL = ∞, IO = 0 A 0.7 0.9 mA
Common Mode Rejection Ratio CMR 65 70 dB
Supply Voltage Rejection Ratio SVR 65 100 dB
Output Voltage Swing VORL = 2 kΩ (Connect to GND) 0 V+ –1.5 V
Common Mode Input Voltage Range VICM 0V
+ –1.4 V
Output Current (SOURCE) IO SOURCE VIN+ = +1 V, VIN– = 0 V 30 40 mA
Output Current (SINK) IO SINK VIN– = +1 V, VIN+ = 0 V 15 20 mA
VIN– = +1 V, VIN+ = 0 V, 30 50
µ
A
VO = 200 mV
Channel Separation f = 1 kHz to 20 kHz 120 dB
Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input
stage.
8. This current flows irrespective of the existence of use.
µ
PC358
4Data Sheet G11765EJ6V0DS
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.)
POWER DISSIPATION
PT - Total Power Dissipation - mW
TA - Operating Ambient Temperature - °C
SUPPLY CURRENT
ICC - Supply Current - mA
4
3
2
1
V+ - Supply Voltage - V (V– = GND)
INPUT OFFSET VOLTAGE
VIO - Input Offset Voltage - mV
0
3
2
1
0
V+ - Supply Voltage - V (V– = GND)
INPUT OFFSET VOLTAGE
VIO - Input Offset Voltage - mV
–50
5
4
3
2
1
0
–1
–2
–3
–4
TA - Operating Ambient Temperature - ˚C
INPUT BIAS CURRENT
IB - Input Bias Current - nA
V+ - Supply Voltage - V (V– = GND)
INPUT BIAS CURRENT
IB - Input Bias Current - nA
TA - Operating Ambient Temperature - ˚C
010203040
ICC
V+
+
–
TA = 0 to 70 °C
TA = –20 °C
A
TA = 25 ˚C
10 20 30 40 050100
V+ = 5 V
600
0
500
400
300
200
100
20 40 60 80 100
PC358G2
PC358C
µ
µ
100
040
75
50
25
302010
TA= 25 °C
100
–50 100
80
40
20
500
60
0
V+ = +15 V
V– = GND
each 5 samples data
<R>
µ
PC358
5
Data Sheet G11765EJ6V0DS
OUTPUT SHORT CIRCUIT CURRENT
IO SHORT - Output Short Circuit Current - mA
–20
70
60
50
40
30
TA - Ambient Temperature - ˚C
OPEN LOOP FREQUENCY RESPONSE
Aυ - Open Loop Voltage Gain - dB
1
140
120
100
80
60
40
20
0
f - Frequency - Hz
OPEN LOOP VOLTAGE GAIN
AV - Open Loop Voltage Gain - dB
0
160
120
80
40
V+ - Supply Voltage - V (V– = GND)
LARGE SIGNAL
FREQUENCY RESPONSE
VO - Output Voltage Swing -Vp-p
f - Frequency - Hz
020608010100 k 10 M
10 20 30 40
IO SHORT
+
–
V
+
= 30 V
10 MΩ
VIN
V+/2
V+
VO
–
+
0.1 F
µ
V
+
= 10 to 15 V
RL = 20 kΩ
RL = 2 kΩ
40 10 k100 1 k 1 M
20
1 k
–
+
+15 V
VO
VIN
100 kΩ
15
10
5
03510 k
30 50 100 k 300 500
1 M
1 kΩ
+7 V
2 k
Ω
VOLTAGE FOLLOWER
PULSE RESPONSE
Input Voltage - V Output Voltage - V
VIN -VO -
4
3
2
1
0
3
2
1
020406080
COMMON MODE REJECTION RATIO
CMR - Common Mode Rejection Ratio - dB
100
120
100
80
60
40
20
0
f - Frequency - Hz
1 k 10 k 100 k 1 M
RL ≥ 2 kΩ
V+ = 15 V
t - Time - s
µ
µ
PC358
6Data Sheet G11765EJ6V0DS
SLEW RATE
–50
0.3
0.2
0.1
0
TA - Operating Ambient Temperature - ˚C
050100
SR - Slew Rate - V/ s
µ
SR–
SR+
V± = ±15 V
VO = ±10 V
100
50
30
20
10
VO - Output Voltage - V
0.5
0.3
0.2
0.1
0.05
0.03
0.02
0.01
OUTPUT SINK CURRENT LIMIT
+
–
VO
IO SINK
V+
V+/2
0.01 0.03 0.05 0.1 0.3 0.5 1 2 5 10 1005030203
IO SINK - Output Sink Current - mA
5
3
2
1
V
+
= +15 V
∆VO - Output Voltage to V+ - V
5
3
1
0
2
V+/2
V+
∆VO
IO SOURCE
+
–
V+ = +15 V
OUTPUT SOURCE CURRENT LIMIT
0.01
4
IO SOURSE - Out
p
ut Source Current - mA
0.03 0.05 0.1 0.5 1 2 5 10 20 10050300.3 3
µ
PC358
7
Data Sheet G11765EJ6V0DS
PACKAGE DRAWINGS
14
85
ITEM MILLIMETERS
NOTES
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
P8C-100-300B,C-2
N0.25
P0.9 MIN.
R0∼15°
A10.16 MAX.
B1.27 MAX.
F1.4 MIN.
G3.2±0.3
J5.08 MAX.
K7.62 (T.P.)
C2.54 (T.P.)
D0.50±0.10
H0.51 MIN.
I4.31 MAX.
L6.4
M0.25+0.10
−0.05
2. ltem "K" to center of leads when formed parallel.
M
A
R
M
P
I
J
H
G
F
DN
C
B
8-PIN PLASTIC DIP (7.62mm(300))
L
K
<R>
µ
PC358
8Data Sheet G11765EJ6V0DS
ITEM
B
C
I
8-PIN PLASTIC SOP (5.72 mm (225))
D
E
F
G
H
J
P
MILLIMETERS
1.27 (T.P.)
0.78 MAX.
4.4±0.15
0.1±0.1
0.42
1.59±0.21
6.5±0.3
1.49
+0.08
−0.07
1.1±0.2
3°+7°
−3°
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
A5.2 +0.17
−0.20
K
L
M
N
0.6±0.2
0.17
0.12
0.10
+0.08
−0.07
S8GM-50-225B-6
85
14
S
M
C
detail of lead end
A
M
SN
F
G
B
E
D
P
H
IJ
K
L
µ
PC358
9
Data Sheet G11765EJ6V0DS
RECOMMENDED SOLDERING CONDITIONS
The
µ
PC358 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µ
PC358G2: 8-pin plastic SOP (5.72 mm (225))
Process Conditions Symbol
Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), IR35-00-3
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 3 time.
Vapor phase soldering Peak temperature: 215 °C or below (Package surface temperature), VP15-00-3
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 3 time.
Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Partial heating method Pin temperature: 350 °C or below, P350
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Types of Through-hole Device
µ
PC358C: 8-pin plastic DIP (7.62 mm (300))
Process Conditions
Wave soldering Solder temperature: 260 °C or below,
(only to leads) Flow time: 10 seconds or less.
Partial heating method Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
<R>
µ
PC358
10 Data Sheet G11765EJ6V0DS
REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E
SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html
NEC SEMICONDUCTOR DEVICE RELIABILITY/ IEI-1212
QUALITY CONTROL SYSTEM - STANDARD LINEAR IC
2
µ
PC358
The information in this document is current as of December, 2007. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
