Product Specification
MAIN FEATURES
§ 8-bit resolution.
§ ADC gain adjust.
§ 2 GHz full power input bandwidth.
§ 1 Gsps (min) sampling rate.
§ SINAD = 45 dB (7.4 Effective Bits) SFDR = 58 dBc
@ FS = 1 Gsps, FIN = 20 MHz :
§ SINAD = 44 dB (7.2 Effective Bits) SFDR = 56 dBc
@ FS = 1 Gsps, FIN = 500 MHz :
§ SINAD = 42 dB (7.0 Effective Bits) SFDR = 52 dBc
@ FS = 1 Gsps, FIN = 1000 MHz (-3 dB FS)
§ 2-tone IMD : -52dBc (489 MHz, 490 MHz) @ 1GSPS.
§ DNL = 0.4 LSB INL = 0.7 LSB.
§ Low Bit Error Rate (10-13 ) @ 1 Gsps
§ Very low input capacitance : 0.4 pF
§ 500 mVpp differential or single-ended analog inputs.
§ Differential or single-ended 50Ω ECL compatible clock inputs.
§ ECL or LVDS/HSTL output compatibility.
§ Data ready output with asynchronous reset.
§ Gray or Binary selectable output data ; NRZ output mode.
§ Power consumption : 3.6 W @ Tj = 70°C
3.8 W @ Tj =125°C
§ Dual power supply : ± 5 V
§ Radiation tolerance oriented design (150 Krad (Si) measured).
APPLICATIONS
§ Digital Sampling Oscilloscopes.
§ Satellite receiver.
§ Electronic countermeasures / Electronic warfare.
§ Direct RF down – conversion.
SCREENING
§ Atmel-Grenoble standard die flow.
§ Mil-PRF-38535, QML level Q for package version.
§ Space screening according to ESA/SCC 9000.
§ Temperature range : -55°C < Tc ; Tj < +125°C
DESCRIPTION
The JTS8388B is a monolithic 8–bit analog–to–digital converter, designed for
digitizing wide bandwidth analog signals at very high sampling rates of up to 1
Gsps.
The JTS8388B is using an innovative architecture, including an on chip Sample
and Hold (S/H), and is fabricated with an advanced high speed bipolar process
(B6HF from Siemens).
The on–chip S/H has a 2 GHz full power input bandwidth, providing excellent
dynamic performance in undersampling applications (High IF digitizing).
ADC 8-bit 1 Gsps
JTS8388B
1/ Delivered in die form
2/ Chip Evaluation Board : Available
TSEV8388B
3/ CQFP68 packaged device available :
refer to TS8388BF datasheet
4/ Other possible packaging : contact sales
office
Novembre 2000
2
JTS8388B
Product Specification
TABLE OF CONTENTS
1. SIMPLIFIED BLOCK DIAGRAM.................................................................................................................................... 3
2. FUNCTIONAL DESCRIPTION........................................................................................................................................ 3
3. SPECIFICATIONS............................................................................................................................................................. 4
3.1. ABSOLUTE MAXIMUM RATINGS (SEE NOTES BELOW)......................................................................................................................................4
3.2. RECOMMENDED CONDITIONS OF USE..........................................................................................................................................................4
3.3. ELECTRICAL OPERATING CHARACTERISTICS.............................................................................................................................................5
3.4. TIMING DIAGRAMS ..................................................................................................................................................................................................9
3.5. EXPLANATION OF TEST LEVELS...................................................................................................................................................................10
3.6. WAFER SCREENING ........................................................................................................................................................................................10
3.7. FUNCTIONS DESCRIPTION.............................................................................................................................................................................11
3.8. DIGITAL OUTPUT CODING..............................................................................................................................................................................11
4. PACKAGE DESCRIPTION............................................................................................................................................. 12
4.1. JTS8388B PIN DESCRIPTION..........................................................................................................................................................................12
4.2. JTS8388B CHIP PAD LIST, COORDINATES AND CORRESPONDING FUNCTIONS.................................................................................13
4.3. JTS8388B CHIP PADS DESIGNATION VH25B...............................................................................................................................................14
4.4. DIE MECHANICAL INFORMATIONS................................................................................................................................................................15
5. TYPICAL CHARACTERIZATION RESULTS.............................................................................................................. 16
5.1. STATIC LINEARITY – FS = 50 MSPS / FIN = 10 MHZ.....................................................................................................................................16
5.2. EFFECTIVE NUMBER OF BITS VERSUS POWER SUPPLIES VARIATION ................................................................................................17
5.3. TYPICAL FFT RESULTS...................................................................................................................................................................................18
5.4. SPURIOUS FREE DYNAMIC RANGE VERSUS INPUT AMPLITUDE............................................................................................................19
5.5. DYNAMIC PERFORMANCE VERSUS ANALOG INPUT FREQUENCY.........................................................................................................20
5.6. EFFECTIVE NUMBER OF BITS (ENOB) VERSUS SAMPLING FREQUENCY.............................................................................................21
5.7. SFDR VERSUS SAMPLING FREQUENCY......................................................................................................................................................21
5.8. JTS8388B ADC PERFORMANCES VERSUS JUNCTION TEMPERATURE .................................................................................................22
5.9. TYPICAL FULL POWER INPUT BANDWIDTH ................................................................................................................................................23
5.10. ADC STEP RESPONSE................................................................................................................................................................................24
6. DEFINITION OF TERMS............................................................................................................................................... 25
7. APPLYING THE JTS8388B ............................................................................................................................................ 27
7.1. TIMING INFORMATIONS ..................................................................................................................................................................................27
7.2. PRINCIPLE OF DATA READY SIGNAL CONTROL BY DRRB INPUT COMMAND ......................................................................................28
7.3. ANALOG INPUTS (VIN) (VINB).........................................................................................................................................................................28
7.4. CLOCK INPUTS (CLK) (CLKB)..........................................................................................................................................................................29
7.5. CLOCK SIGNAL DUTY CYCLE ADJUST .........................................................................................................................................................31
7.6. NOISE IMMUNITY INFORMATIONS ................................................................................................................................................................31
7.7. DIGITAL OUTPUTS............................................................................................................................................................................................32
7.8. OUT OF RANGE BIT..........................................................................................................................................................................................35
7.9. GRAY OR BINARY OUTPUT DATA FORMAT SELECT..................................................................................................................................35
7.10. TS8388 B THERMAL REQUIREMENTS......................................................................................................................................................35
7.11. DIODE PAD 32...............................................................................................................................................................................................36
7.12. ADC GAIN CONTROL PAD 38 .....................................................................................................................................................................36
8. EQUIVALENT INPUT / OUTPUT SCHEMATICS ....................................................................................................... 37
8.1. EQUIVALENT ANALOG INPUT CIRCUIT AND ESD PROTECTIONS...........................................................................................................37
8.2. EQUIVALENT ANALOG CLOCK INPUT CIRCUIT AND ESD PROTECTIONS..............................................................................................37
8.3. EQUIVALENT DATA OUTPUT BUFFER CIRCUIT AND ESD PROTECTIONS.............................................................................................38
8.4. ADC GAIN ADJUST EQUIVALENT INPUT CIRCUITS AND ESD PROTECTIONS.......................................................................................38
8.5. GORB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS.........................................................................................................39
8.6. DRRB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS .........................................................................................................40
9. TSEV8388B : DEVICE EVALUATION BOARD............................................................................................................ 41
10. ORDERING INFORMATION..................................................................................................................................... 42
3
Product Specification
JTS8388B
1. SIMPLIFIED BLOCK DIAGRAM
G=2 T/H G=1 T/H G=1
CLOCK
BUFFER
RESISTO
R CHAIN ANALOG
ENCODING
BLOCK
INTERPOLATION
STAGES
REGENERATION
LATCHES
ERROR CORRECTION &
DECODE LOGIC
OUTPUT LATCHES &
BUFFERS
4
4 5
4 5
8
8
VIN,VINB
CLK,
CLKB
GAIN
DRRB DR,DRB GORB DATA,DATAB OR,ORB
MASTER/SLAVE TRACK & HOLD
AMPLIFIER
2. FUNCTIONAL DESCRIPTION
The JTS8388B is an 8 bit 1Gsps ADC based on an advanced high speed bipolar technology (B6HF from SIEMENS) featuring a cutoff frequency of
25 GHz.
The JTS8388B includes a front-end master/slave Track and Hold stage (S/H), followed by an analog encoding stage and interpolation circuitry.
Successive banks of latches are regenerating the analog residues into logical data before entering an error correction circuitry and a
resynchronization stage followed by 75 Ω differential output buffers.
The JTS8388B works in fully differential mode from analog inputs up to digital outputs.
The JTS8388B features a full power input bandwidth of 2 GHz.
Control pin GORB is provided to select either Gray or Binary data output format.
Gain control pin is provided in order to adjust the ADC gain.
The JTS8388B uses only vertical isolated NPN transistors together with oxide isolated polysilicon resistors, providing enhanced radiation tolerance
(no performance drift measured at 150kRad total dose).
4
JTS8388B
Product Specification
3. SPECIFICATIONS
3.1. ABSOLUTE MAXIMUM RATINGS (SEE NOTES BELOW)
Parameter Symbol Comments Value Unit
Positive supply voltage VCC GND to 6 V
Digital negative supply
voltage DVEE GND to -5.7 V
Digital positive supply
voltage VPLUSD GND-0.3 to 2.8 V
Negative supply voltage VEE GND to -6 V
Maximum difference
between negative supply
voltages
DVEE to VEE 0.3 V
Analog input voltages VIN or VINB -1 to +1 V
Maximum difference
between VIN and VINB
VIN - VINB-2 to +2 V
Digital input voltage VDGORB -0.3 to VCC +0.3 V
Digital input voltage VDDRRB VEE -0.3 to +0.9 V
Digital output voltage Vo VPLUSD-3 to VPLUSD -0.5 V
Clock input voltage VCLK or VCLKB -3 to +1.5 V
Maximum difference
between VCLK and VCLKB
VCLK - VCLKB -2 to +2 V
Maximum junction
temperature Tj+135 oC
Storage temperature Tstg -65 to +150 oC
Lead temperature
(soldering 10s) Tleads +300 oC
Notes : Absolute maximum ratings are limiting values (referenced to GND=0V), to be applied individually, while other parameters are within
specified operating conditions. Long exposure to maximum rating may affect device reliability.
The use of a thermal heat sink is mandatory (see Thermal characteristics page 19).
3.2. RECOMMENDED CONDITIONS OF USE
Parameter Symbol Comments Min. Typ. Max. Unit
Positive supply voltage VCC 4.75 +5 5.25 V
Positive digital supply voltage VPLUSD ECL output compatibility GND V
VPLUSD LVDS output compatibility +1.4 +2.4 +2.6 V
Negative supply voltages VEE, DVEE -5.25 -5.0 -4.75 V
Differential analog input voltage
(Full Scale) VIN, VINB
VIN -VINB
50 Ω differential or single-ended ±113
450
±125
500
±137
550
mV
mVpp
Clock input power level PCLK PCLKB 50 Ω single–ended clock input 3 4 10 dBm
Operating temperature range TJCivil : “C” grade
Industrial : “V” grade
Military : “M” grade
0 < Tc < 70
-40 < Tc < 85
-55 < Tc ; Tj < +125
oC
5
Product Specification
JTS8388B
3.3. ELECTRICAL OPERATING CHARACTERISTICS
VEE = DVEE = -5 V ; VCC = +5 V ; VIN -VINB = 500 mVpp Full Scale differential input ;
Digital outputs 75 or 50 Ω differentially terminated ;
Tj (typical) = 70°C. Full temperature range : up to -55°C < Tc ; Tj < +125°C
Parameter Symb Temp Test
level Min Typ Max Unit
POWER REQUIREMENTS
Positive supply voltage Analog
Digital (ECL)
Digital (LVDS)
VCC
VPLUSD
VPLUSD
II,IV 4.75
1.4
5
0
2.4
5.25
2.6
V
V
V
Positive supply current Analog
Digital ICC
IPLUSD
II, IV 400
120 425
130 mA
mA
Negative supply voltage VEE Full IV -5.25 -5 -4.75 V
Negative supply current Analog
Digital AIEE
DIEE II,IV 170
140 185
160 mA
mA
Nominal power dissipation PD Full II
IV 3.6
3.8 3.7
3.9 W
W
Power supply rejection ratio (note 2) PSRR IV +/- 0.5 mV/V
RESOLUTION 8bits
ANALOG INPUTS
Full Scale Input Voltage range (differential mode)
( 0 Volt common mode voltage ) VIN
VINB
Full IV -125
-125 125
125 mV
mV
Full Scale Input Voltage range (single–ended input option )
(see Application
Notes)
VIN
VINB
Full IV -250 0250 mV
mV
Analog input capacitance CIN Full IV 0.4 pF
Input bias current IIN Full IV 10 µA
Input Resistance RIN Full IV 1MΩ
Full Power input Bandwidth FPBW Full IV 1.8 GHz
Small Signal input Bandwidth (10 % full scale) SSBW Full IV 1.9 GHz
CLOCK INPUTS
Logic compatibility for clock inputs (note 10 )
(see Application Notes) ECL or specified clock input
power level in dBm
ECL Clock inputs voltages (VCLK or VCLKB) : Full IV
• Logic “0” voltage VIL -1.5 V
• Logic “1” voltage VIH -1.1 V
• Logic “0” current IIL 5µA
• Logic “1” current IIH 5µA
Clock input power level into 50 Ω termination DBm into 50 Ω
Clock input power level Full IV -2 4 10 dBm
Clock input capacitance CCLK Full IV 0.4 3.5 pF
6
JTS8388B
Product Specification
Parameter Symb Temp Test
level Min Typ Max Unit
DIGITAL OUTPUTS (notes 1,6)
Single ended or differential input mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format,
Tj (typical) = 70°C. Full temperature range : up to -55°C < Tc ; Tj < +125°C.
Logic compatibility for digital outputs
( Depending on the value of VPLUSD )
(see Application Notes)
ECL or LVDS
Differential output voltage swings ( assuming VPLUSD = 0V) :
75 Ω open transmission lines ( ECL levels )
75 Ω differentially terminated
50 Ω differentially terminated
Full IV 1.50
0.70
0.54
1.620
0.825
0.660
V
V
V
Output levels ( assuming VPLUSD = 0V)
75 Ω open transmission lines (note 6) 25°CIV
• Logic “0” voltage VOL -1.62 -1.54 V
• Logic “1” voltage VOH -0.88 -0.8 V
Output levels ( assuming VPLUSD = 0V)
75 Ω differentially terminated (note 6) 25°CIV
• Logic “0” voltage VOL -1.41 -1.34 V
• Logic “1” voltage VOH -1.07 -1 V
Output levels ( assuming VPLUSD = 0V)
50 Ω differentially terminated (note 6) 25°CII
• Logic “0” voltage VOL -1.35 -1.28 V
• Logic “1” voltage VOH -1.09 -1.02 V
Differential Output Swing DOS Full VI 250 290 mV
Output level drift with temperature Full IV 1.6 mV/°C
DC ACCURACY
Single ended or differential input mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format,
Tj (typical) = 70°C. Full temperature range :-55°C < Tc ; Tj < +125°C.
Differential non linearity (notes 2,3) DNL Full I
VI 0.4
0.5 0.5
0.6 LSB
LSB
Integral non linearity (notes 2,3) INL Full I
VI 0.7
0.9 1
1.2 LSB
LSB
No missing codes (note 3) Full Guaranteed over specified temperature range
Gain error Full I
VI -10
-11 -2
-2 6
7% FS
% FS
Input offset voltage Full I
VI -26
-30 -5
-5 14
17 mV
mV
Gain error drift
Offset error drift Full
Full IV
IV 100
40
125
50
150
60
ppm/°C
ppm/°C
7
Product Specification
JTS8388B
Parameter Symb Temp Test
level Min Typ Max Unit
TRANSIENT PERFORMANCE
Bit Error Rate (notes 2, 4)
FS = 1 Gsps Fin = 62.5 MHz BER Full IV 1E-12 Error/
sample
ADC settling time (note 2)
VIn -VinB = 400 mVpp TS IV 0.5 ns
Overvoltage recovery time (note 2) ORT IV 0.5 ns
AC PERFORMANCE
Single ended or differential input and clock mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format,
Tj. = 70°C, unless otherwise specified.
Signal to Noise and Distortion ratio (note 2) SINAD Full IV
FS = 1 Gsps Fin = 20 MHz 43 45 dB
FS = 1 Gsps Fin = 500 MHz 42 44 dB
FS = 1 Gsps Fin = 1000 MHz (-1dB Fs) 40 42 dB
Effective Number Of bits ENOB Full IV
FS = 1 Gsps Fin = 20 MHz 7.0 7.2 Bits
FS = 1 Gsps Fin = 500 MHz 6.6 6.8 Bits
FS = 1 Gsps Fin = 1000 MHz (-1dBFs) 6.2 6.4 Bits
Signal to Noise Ratio (note 2) SNR Full IV
FS = 1 Gsps Fin = 20 MHz 42 45 dB
FS = 1 Gsps Fin = 500 MHz 41 44 dB
FS = 1 Gsps Fin = 1000 MHz (-1dBFs) 41 44 dB
Total Harmonic Distortion (note 2) THD Full IV
FS = 1 Gsps Fin = 20 MHz 50 54 dB
FS = 1 Gsps Fin = 500 MHz 46 50 dB
FS = 1 Gsps Fin = 1000 MHz (-1dBFs)42 46 dB
Spurious Free Dynamic Range (note 2) SFDR Full IV
FS = 1 Gsps Fin = 20 MHz - 52 - 57 dBc
FS = 1 Gsps Fin = 500 MHz - 47 - 52 dBc
FS = 1 Gsps Fin = 1000 MHz (-1dBFs) - 42 - 47 dBc
FS = 1 Gsps Fin = 1000 MHz (-3dBFs) - 45 - 50 dBc
Two-tone inter-modulation distortion (note 2) IMD Full IV
FIN1 = 489 MHz @ FS = 1 Gsps - 47 - 52 dBc
FIN2 = 490 MHz @ FS = 1 Gsps
8
JTS8388B
Product Specification
Parameter Symb Temp Test
level Min Typ Max Unit
SWITCHING PERFORMANCE AND CHARACTERISTICS – See Timing Diagrams Figure 1, Figure 2
Maximum clock frequency FSFull 11.4 GSPS
Minimum clock frequency FSFull IV 10 MSPS
Minimum Clock pulse width (high) TC1 Full IV 0.280 0.500 50 ns
Minimum Clock pulse width (low) TC2 Full IV 0.350 0.500 50 ns
Aperture delay (Note 2) TA Full IV 100 +250 400 ps
Aperture uncertainty (Notes 2, 5) Jitter 25oCIV 0.4 0.6 ps (rms)
Data output delay (Notes 2, 10, 11, 12) TOD Full IV 1150 1360 1660 ps
Output rise/fall time for DATA (20 % – 80 %)
(note 11)TR/TF Full IV 250 350 550 ps
Output rise/fall time for DATA READY
(20 % – 80 % ) (note 11)
TR/TF Full IV 250 350 550 ps
Data ready output delay (Notes 2,10, 11, 12) TDR Full IV 1110 1320 1620 ps
Data ready reset delay TRDR Full IV 720 1000 ps
TOD-TODR
(notes 9, 13)
TOD-
TDR Full IV 40 40 40 ps
TC1+TDR-TOD
See Timing Diagram (Note 2) @ 1Gsps
TD1 Full IV 460 460 460 ps
Data pipeline delay TPD Full IV 4clock
cycles
Note 1 : Differential output buffers are internally loaded by 75 Ω resistors. Buffer bias current = 11 mA.
Note 2 : See definition of terms
Note 3 : Histogram testing based on sampling of a 10 MHz sinewave at 50 MSPS.
Note 4 : Output error amplitude < ± 4 LSB around worst code.
Note 5 : Maximum jitter value obtained for single–ended clock input on the JTS8388B die (chip on board) : 200 fs.
(500 fs expected on JTS8388B)
Note 6 : Digital output back termination options depicted in Application Notes figures 3,4,5 .
Note 7 : With a typical value of TD = 465 ps, at 1 Gsps, the timing safety margin for the data storing using the ECLinPS 10E452 output registers
from Motorola is of ± 315 ps, equally shared before and after the rising edge of the Data Ready signals (DR, DRB).
Note 8 : The clock inputs may be indifferently entered in differential or single–ended, using ECL levels or 4 dBm typical power level into the
50 Ω termination resistor of the inphase clock input.
(4 dBm into 50 Ω clock input correspond to 10 dBm power level for the clock generator.)
Note 9 : At 1GSPS, 50/50 clock duty cycle, TC2 = 500 ps (TC1). TDR - TOD = -100 ps (typ) does not depend on the sampling rate.
Note 10 : Specified loading conditions for digital outputs :
- 50 Ω or 75 Ω controlled impedance traces properly 50 / 75 Ω terminated, or unterminated 75 Ω controlled impedance traces.
- Controlled impedance traces far end loaded by 1 standard ECLinPS register from Motorola.( e.g. : 10E452 ) ( Typical input parasitic
capacitance of 1.5 pF including package and ESD protections. )
Note 11 : Termination load parasitic capacitance derating values :
- 50 Ω or 75 Ω controlled impedance traces properly 50 / 75 Ω terminated : 60 ps / pF or 75 ps per additionnal ECLinPS load.
- Unterminated ( source terminated ) 75 Ω controlled impedance lines : 100 ps / pF or 150 ps per additionnal ECLinPS termination load.
Note 12 : apply proper 50 / 75 impedance traces propagation time derating values : 6 ps / mm (155 ps/inch) for TSEV8388B Evaluation Board.
Note 13 : Values for TOD and TDR track each other over temperature, ( 1 % variation for TOD - TDR per 100 oC. temperature variation ). Therefore
TOD - TDR variation over temperature is negligible. Moreover, the internal ( onchip ) and package skews between each Data TODs and
TDR effect can be considered as negligible.Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same
is true for the TOD and TDR maximum values (see Advanced Application Notes about TOD - TDR variation over temperature in section 7).
9
Product Specification
JTS8388B
3.4. TIMING DIAGRAMS
TC1 TC2
TA= 250 ps
TBC
XX
N+1
XN+2
X
N+3
N
Figure 1 JTS8388B TIMING DIAGRAM ( 1 GSPS CLOCK )
Data Ready Reset , Clock held at LOW
DIGITAL
OUTPUTS
(V
IN, VINB)
Data Ready
(DR, DRB)
(CLK, CLKB)
X
N+5
TD1=TC1+TDR-TOD
= TC1-40 ps =
460 ps
ps
DATA
N-4 DATA
N-3 DATA N
DATA
N-1
DATA
N-2
TC=1000 ps
XX
N+4
TOD = 1360 ps
1360 ps
DRR
1ns (min)
TDR = 1320 ps
TPD: 4.0 Clock
periods
1000
ps
TRDR = 920
ps
N-1
TD2 = TC2+TOD-
TDR
= TC2+40ps = 540
ps
TDR = 1320 ps
DATA
N-5 DATA
N+1
TC1 TC2
TA= 250ps
XX
N+1
XN+2
XN+3
N
Figure 2 JTS8388B TIMING DIAGRAM ( 1 GSPS CLOCK )
Data Ready Reset , Clock held at HIGH
DIGITAL
OUTPUTS
(VIN, VINB )
Data Ready
(DR, DRB)
(CLK, CLKB)
XN+5
TD1=TC1+TDR-TOD
= TC1-40 ps = 460
DATA
N-4 DATA
N-3 DATA N
DATA
N-1
DATA
N-2
TC = 1000 ps
X
X
N+4
TOD = 1360
1360
DRRB 1ns
TDR = 1320
TPD: 4.0 Clock
1000
TRDR = 920ps
N-1
TD2 = TC2+TOD-TDR
= TC2+40ps = 540 ps
TDR = 1120
DATA
N-5 DATA
N+1
10
JTS8388B
Product Specification
3.5. EXPLANATION OF TEST LEVELS
D100 % wafer tested at +25°C (1)
I100% production tested at +25°C (1) (for packaged device).
II 100 % production tested at +25°C (1), and sample tested at specified temperatures
III Sample tested only at specified temperatures
IV Parameter is guaranteed by design and characterization testing (thermal steady-state conditions at
specified temperature).
VParameter is a typical value only
VI 100 % production tested over specified temperature range.
Only MIN and MAX values are guaranteed (typical values are issuing from characterization results).
(1) Unless otherwise specified, all tests are pulsed tests : therefore Tj = Tc = Ta,
3.6. WAFER SCREENING
Parameter Temperature JTS8388B chip Unit
Min Max
DC Accuracy @ 50 MSPS / 10 MHz
DNL LSB
INL 25°C (2) LSB
No missing codes Guaranteed
AC Performance
TBD
SNR 45 dB
ENOB
25°C (2)
7.1 bit
(2) Unless otherwise specified, all tests are pulsed tests : therefore Tj = Tc = Ta,
11
Product Specification
JTS8388B
3.7. FUNCTIONS DESCRIPTION
Name Function
VCC Positive power supply
VEE Analog negative power supply
VPLUSD Digital positive power supply
GND Ground
VIN, VINB Differential analog inputs
CLK, CLKB Differential clock inputs
<D0:D7>
<D0B:D7B> Differential output data port
DR ; DRB Differential data ready outputs
OR ; ORB Out of range outputs
GAIN ADC gain adjust
GORB Gray or Binary digital output select
DIOD/DRRB Die junction temp. measurement/
asynchronous data ready reset
VPLUSD = +0 V (ECL)
VPLUSD=+2.4V (LVDS)
VIN
VINB
CLK
CLKB
D0 → → D7
D0B →→ D7B
DR
16
VEE=-5V
VCC = +5 V
JTS8388B
ORB
GND
GORB
GAIN
OR
DVEE=-5V
DIOD/
DRRB
DRB
3.8. DIGITAL OUTPUT CODING
NRZ (Non Return to Zero) mode, ideal coding : does not include gain, offset, and linearity voltage errors.
Differential
analog input Voltage level Digital output Out of
Range
Binary
GORB = VCC or floating Gray
GORB = GND
> +251 mV > Positive full scale + 1/2 LSB 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1
+251 mV
+249 mV Positive full scale + 1/2 LSB
Positive full scale – 1/2 LSB 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 0 1 0 0 0 0 0 0 0
1 0 0 0 0 0 0 1 0
0
+126 mV
+124 mV Positive 1/2 scale + 1/2 LSB
Positive1/2 scale – 1/2 LSB 1 1 0 0 0 0 0 0
1 0 1 1 1 1 1 1 1 0 1 0 0 0 0 0
1 1 1 0 0 0 0 0 0
0
+1 mV
-1 mV Bipolar zero + 1/2 LSB
Bipolar zero - 1/2 LSB 1 0 0 0 0 0 0 0
0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0
0 1 0 0 0 0 0 0 0
0
-124 mV
-126 mV Negative 1/2 scale + 1/2 LSB
Negative 1/2 scale - 1/2 LSB 0 1 0 0 0 0 0 0
0 0 1 1 1 1 1 1 0 1 1 0 0 0 0 0
0 0 1 0 0 0 0 0 0
0
-249 mV
-251 mV Negative full scale + 1/2 LSB
Negative full scale - 1/2 LSB 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0
0
< -251 mV < Negative full scale - 1/2 LSB 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
12
JTS8388B
Product Specification
4. PACKAGE DESCRIPTION.
4.1. JTS8388B PIN DESCRIPTION
Symbol Pin number Function
GND 20, 24, 26, 28, 33, 35, 37 Analog ground.
Pads n°20, 24,26,28,37 are double.
Pads n°26,33,35 are single.
14 bonding wires are available for analog ground access.
VPLUSD 1, 11 Digital positive supply. (0V for ECL compatibility, +2.4V for LVDS
compatibility).
2 double pads (note 3)
VCC 19, 21, 23, 30, 39, 40 +5 V positive supply.
VEE 22, 29, 31 -5 V analog supply.
DVEE 6-5 V digital supply.
VIN 34 In phase (+) analog input signal of the Sample and Hold
differential preamplifier.
VINB 36 Inverted phase (-) of analog input signal.
CLK 25 In phase (+) ECL clock input.
CLKB 27 Inverted phase (-) of ECL clock input.
D0, D1, D2, D3, D4, D5, D6,
D7 16, 14, 12, 9, 4, 2, 45, 43 In phase (+) digital outputs.
D0 is the LSB. D7 is the MSB.
D0B, D1B, D2B, D3B, D4B,
D5B, D6B, D7B 17, 15, 13, 10, 5, 3, 46, 44 Inverted phase (-) Digital outputs.
B0B is the inverted LSB. D7B is the inverted MSB.
OR 41 In phase (+) Out of Range Output.
Out of Range goes high on the leading edge of code 0 and code
256.
ORB 42 Inverted phase (+) of Out of Range Bit (OR).
DR 7In phase (+) output of Data Ready Signal.
DRB 8Inverted phase (-) output of Data Ready Signal.
GORB 18 Gray or Binary select output format control pad.
– Binary output format if GORB is floating or VCC.
– Gray output format if GORB is connected at ground (0 V).
GAIN 38 ADC gain adjust pin.
DIOD/DRRB 32 DIOD : die junction temperature measurement pad.
Can be left floating or grounded if not used.
DRRB : asynchronous data ready reset function
13
Product Specification
JTS8388B
4.2. JTS8388B CHIP PAD LIST, COORDINATES AND CORRESPONDING FUNCTIONS
Pad
number PosX PosY Chip pad
function
1880 1365 VPLUSD Positive digital supply (double pad) (note 3)
2670 1365 D5 In phase (+) digital output, bit 5 (D7 is the MSB ; Bit 7,
D0 is the LSB ; Bit 0)
3510 1365 D5B Inverted phase (-)digital output, bit 5
4350 1365 D4 In phase (+) digital output, bit 4
5190 1365 D4B Inverted phase (-) digital output, bit 4
6-20 1365 DVEE -5V digital supply (double pad)
7-230 1365 DR In phase (+) Data Ready
8-390 1365 DRB Inverted Phase (-) Data Ready
9-550 1365 D3 In phase (+) digital output, bit 3
10 -710 1365 D3B Inverted phase (-) digital output, bit 3
11 -920 1365 VPLUSD Positive digital supply (double pad) (note 3)
12 -1085 1115 D2 In phase (+) digital output, bit 2
13 -1085 955 D2B Inverted phase (-) digital output, bit 2
14 -1085 795 D1 In phase (+) digital output, bit 1
15 -1085 635 D1B Inverted phase (-) digital output, bit 1
16 -1085 475 D0 In phase (+) digital output, bit 0, Least Significant Bit
17 -1085 315 D0B Inverted phase (-) digital output, bit 0, Least Significant Bit
18 -1085 155 GORB Gray or Binary data output format select. (Note
2)
19 -1085 -55 VCC +5V supply (double pad)
20 -1085 -325 GND Analog Ground (double pad)
21 -1085 -595 VCC +5V supply (double pad)
22 -1085 -865 VEE -5V analog supply (double pad)
23 -1085 -1135 VCC +5V supply (double pad)
24 -905 -1365 GND Analog Ground (double pad)
25 -655 -1365 CLK In phase (+) clock input (double pad)
26 -455 -1365 GND Analog Ground
27 -255 -1365 CLKB Inverted phase (-) clock input (double pad)
28 -5 -1365 GND Analog Ground (double pad)
29 245 -1365 VEE -5V analog supply (double pad)
30 495 -1365 VCC +5V supply (double pad)
31 745 -1365 VEE -5V analog supply (double pad)
32 945 -1365 DIOD/DRRB Diode input for Tj monitoring / Input for asynchronous Data
Ready Reset
33 1085 -1195 GND Analog Ground
34 1085 -995 VIN In phase (+) analog input (double pad)
35 1085 -795 GND Analog Ground
36 1085 -595 VINBInverted phase (-) analog input (double pad)
37 1085 -345 GND Analog Ground (double pad)
38 1085 -145 GAIN ADC gain adjust input
39 1085 55 VCC +5V supply (double pad)
40 1085 265 VCC +5V supply
41 1085 425 OR In phase (+) Out of Range digital output
42 1085 585 ORB Inverted phase (-) Out of Range digital output
43 1085 745 D7 In phase (+) digital output, bit 7, Most Significant Bit
44 1085 905 D7B Inverted phase (-) digital output bit 7
45 1085 1065 D6 In phase (+) digital output, bit 6
46 1085 1225 D6B Inverted phase (-) digital output, bit 6
Note 1 : Coordinates are relative to pad centers. The coordinates origin (0,0) is at the center of the die.
All dimensions are given in microns. The pad 1 is the one pointed at by the arrow (see layout).
Distance between pad (glass window) and inner edge of seal-ring : 40µm.
Die size (inner edge of seal-ring : (-1175, -1175, 1455).
Die size (including scribe line) : (-1230, -1510) (1230, 1510) (2.46 x 3.02 mm²).
Actual die size (after separation) : (-1220, -1500) (1220, 1500) (2.44 mm x 3.00 mm).
Note 2 : GORB tied to Vcc or floating : Binary output data format. GORB tied to GND : Gray output data format
Note3 : The common mode level of the output buffers is 1.2V below the positive digital supply.
For ECL compatibility the positive digital supply must be set at 0V (ground).
For LVDS compatibility (output common mode at +1.2V) the positive digital supply must be set at 2.4V.
If the subsequent LVDS circuitry can withstand a lower level for input common mode, it is recommended to lower the positive digital supply
level in the name proportion in order to spare power dissipation.
14
JTS8388B
Product Specification
4.3. JTS8388B CHIP PADS DESIGNATION VH25B
Die Size : 2.44 x 3.00 mm (after separation) Die Area : 7.32 mm²
VPLUSDVPLUSD DVEE
OR
ORB
D7
D7B
D6
D6B
VCC
VCC
VCC
VCC
GND
GND
VEE
VEE
D5B D5D4D4BDRB DRD3D3B
D2
D2B
D1
D1B
D0
D0B
GORB
VCC
GND CLK CLKBGND VEEGND VCC
GND
GND
VINB
VIN
1234567891011
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
GAIN
DIOD/DRRB
15
Product Specification
JTS8388B
4.4. DIE MECHANICAL INFORMATIONS
Mask reference...........................................................VH25B
Die size between scribe line axis...................... 2.46 mm x 3.02 mm
after separation....................................2.44 mm x 3.00 mm
Prad size (single pad)..........................................100 µm x 100 µm
(double pad).........................................200 µm x 100 µm
Die thickness..............................................................300 µm ± 20 µm
Back side metallization...............................................none
Metallization Number of layers.................................3
Material................................................Ti/TiN Al-Si-Cu TiN (on top)
Diffusion barrier ................................... Ti/TiN
Thickness............................................. Metal 1 : 600 nm : Metal 2 & Metal 3 : 800 nm
Pad metallization (1) (2).................................................Ti/TiN Al-Si-Cu TiN (Metal 2)
Ti/TiN Al-Si-Cu TiN (Metal 3)
Passivation .............................................................Oxide/Nitride (SiO2/SiN2) : 300nm / 550 nm
Back side potential.....................................................-5V
Die transistor count ....................................................4450
Die attach....................................................................epoxy Ag filled high conductivity glue
Bond wire.................................................................... Al or Au 30 µm diameter
Qualification package.................................................CQFP68 (with restriction on electrical performance)
Note 1 : The top TiN layer is etched in one step together with the passivation layer.
Note 2 : The pad is a sandwich of Metal 2 and Metal 3 over field oxyde.
16
JTS8388B
Product Specification
5. TYPICAL CHARACTERIZATION RESULTS
5.1. STATIC LINEARITY – FS = 50 MSPS / FIN = 10 MHZ
5.1.1. INTEGRAL NON LINEARITY
LSB
INL = +/- 0.7 LSB
code
Signal Frequency = 10MHzClock Frequency = 50Msps
Positive peak : 0.78 LSB Negative peak : -0.73 LSB
5.1.2. DIFFERENTIAL NON LINEARITY
LSB
DNL = +/- 0.4 LSB
code
Signal Frequency = 10MHzClock Frequency = 50Msps
Positive peak : 0.3 LSB Negative peak : -0.39 LSB
17
Product Specification
JTS8388B
5.2. EFFECTIVE NUMBER OF BITS VERSUS POWER SUPPLIES VARIATION
0
1
2
3
4
5
6
7
8
-7 -6,5 -6 -5,5 -5 -4,5 -4
Effective number of bits = f (VEEA) ; Fs = 500 MSPS ; Fin = 100 MHz
VEEA (V)
ENOB (bits)
0
1
2
3
4
5
6
7
8
33,5 44,5 55,5 66,5 7
Effective number of bits = f (VCC) ; Fs = 500 MSPS ; Fin = 100 MHz
VCC (V)
ENOB (bits)
18
JTS8388B
Product Specification
5.3. TYPICAL FFT RESULTS
5.3.1. FS = 1 GSPS, FIN=20 MHZ
5.3.2. FS = 1 GSPS, FIN = 495 MHZ
5.3.3. FS = 1 GSPS, FIN = 995 MHZ ( -3DB FULL SCALE INPUT)
Single Ended or
differential
Fs =1 GSPS
Fin = 20 MHz
Eff. Bits =7.2
SINAD = 45 dB
SNR = 45 dB
THD = -54 dBc
SFDR = -57 dBc
H3H2
clock duty cycle = 50 %
Binary output coding
H11 H12
Single Ended or
differential
Fs =1 GSPS
Fin=495MHz
Eff. Bits =6.8
SINAD = 44 dB
SNR = 44 dB
THD = -50 dBc
SFDR= -52 dBc
clock duty cycle = 50 %
H3
H11
H14
H12
Binary output coding
H2
Single Ended or
differential
Fs =1 GSPS
Fin=995 MHz
Eff. Bits =6.4
SINAD =42 dB
SNR = 44 dB
THD = -46 dBc
SFDR= -50 dBc
clock duty cycle = 50 %
H2
H3
Binary output coding
H10
19
Product Specification
JTS8388B
5.4. SPURIOUS FREE DYNAMIC RANGE VERSUS INPUT AMPLITUDE
5.4.1. SAMPLING FREQUENCY FS=1 GSPS ; INPUT FREQUENCY FIN=995 MHZ ; GRAY OR BINARY OUTPUT CODING
Fs = 1 GSPS Fin = 995 MHz Full Scale
ENOB = 6.4 SINAD = 42 dB SNR = 44 dB THD = 46 dBc SFDR = -47 dBc
Full Scale
magnitude (code)
SFDR = -47 dBc
H2
H3
-3dB Full Scale
Fs = 1 GSPS Fin = 995 MHz (-3 dB Full Scale)
ENOB = 6.6 SINAD = 43 dB SNR = 44 dB SFDR = -50 dBc
magnitude (code)
THD = -48 dBc
SFDR = -50 dBc
H2
H3
20
JTS8388B
Product Specification
5.5. DYNAMIC PERFORMANCE VERSUS ANALOG INPUT FREQUENCY
Fs=1 Gsps, Fin = 0 up to 1600 MHz, Full Scale input (FS), FS -3 dB
Clock duty cycle 50 / 50, Binary/Gray output coding, fully differential or single-ended analog and clock inputs
3
4
5
6
7
8
0200 400 600 800 1000 1200 1400 1600 1800
Input frequency (MHz)
ENOB (dB)
-3 dB FS
FS
-10 dB
FS
30
32
34
36
38
40
42
44
46
48
50
0200 400 600 800 1000 1200 1400 1600 1800
Input frequency (MHz)
SNR (dB)
FS
-3 dB FS
-10 dB FS
-60
-55
-50
-45
-40
-35
-30
-25
-20
0200 400 600 800 1000 1200 1400 1600 1800 2000
Input frequency (MHz)
SFDR (dBc)
-3 dB FS
FS
-10 dB FS
21
Product Specification
JTS8388B
5.6. EFFECTIVE NUMBER OF BITS (ENOB) VERSUS SAMPLING FREQUENCY
Analog Input Frequency : Fin = 495 MHz and Nyquist conditions ( Fin = Fs / 2 )
Clock duty cycle 50 / 50 , Binary output coding
2
3
4
5
6
7
8
0 200 400 600 800 1000 1200 1400 1600
Sampling frequency (Msps)
ENOB (dB)
Fin= FS/2
Fin=500 MHz
5.7. SFDR VERSUS SAMPLING FREQUENCY
Analog Input Frequency : Fin = 495 MHz and Nyquist conditions ( Fin = Fs / 2 )
Clock duty cycle 50 / 50 , Binary output coding
-60
-55
-50
-45
-40
-35
-30
-25
-20
0200 400 600 800 1000 1200 1400 1600
Sampling frequency (Msps)
SFDR (dBc)
Fin= FS/2
Fin=500 MHz
22
JTS8388B
Product Specification
5.8. JTS8388B ADC PERFORMANCES VERSUS JUNCTION TEMPERATURE
3
4
5
6
7
8
-40 -20 020 40 60 80 100 120 140 160
Effective number of bits versus junction temperature
Fs = 1 GSPS ; Fin = 500 MHz ; Duty cycle = 50%
Temperature ( oC)
ENOB (bits)
42
43
44
45
46
-40 -20 020 40 60 80 100 120 140
Signal to noise ratio versus junction temperature
Fs = 1 GSPS ; Fin = 507 MHz ; Differential clock, Single-ended analog input (Vin=-1dBFs)
Temperature ( oC)
SNR (dB)
43
45
47
49
51
53
-60 -40 -20 020 40 60 80 100 120 140
Total harmonic distorsion versus junction temperature
Fs = 1 GSPS ; Fin = 507 MHz ; Differential clock, Single-ended analog input (Vin=-1dBFs)
Temperature ( oC)
THD (dB)
23
Product Specification
JTS8388B
0
1
2
3
4
5
-40 -20 020 40 60 80 100 120 140 160
Power consumption versus junction temperature
Fs = 1 GSPS ; Fin = 500 MHz ; Duty cycle = 50%
Temperature ( oC)
Power consumption (W)
5.9. TYPICAL FULL POWER INPUT BANDWIDTH
1.5 GHz at -3 dB (-2dBm full power input)
-6
-5
-4
-3
-2
-1
0100 300 500 700 900 1100 1300 1500 1700
Frequency (MHz)
Magnitude (dB)
24
JTS8388B
Product Specification
5.10. ADC STEP RESPONSE
Test pulse input characteristics : 20% to 80% input full scale and rise time ~ 200ps.
5.10.1. TEST PULSE DIGITIZED WITH 20 GHZ DSO
50 mV/div
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.00time (ns)
Vpp ~ 260 mV
Tr ~ 240 ps
50 mV/div
500 ps/div
5.10.2. SAME TEST PULSE DIGITIZED WITH JTS8388B ADC
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.00
200
150
100
50
0
ADC code
time (ns)
Tr ~ 280 ps
50 codes/div (Vpp ~260 mV)
500 ps/div
ADC calculated rise time : between 150 and 200 ps.
N.B. : ripples are due to the test setup (they are present on both measurements)
25
Product Specification
JTS8388B
6. DEFINITION OF TERMS
(BER) Bit Error Rate Probability to exceed a specified error threshold for a sample. An error code is a code that differs
by more than +/- 4 LSB from the correct code.
(BW) Full power input
bandwidth Analog input frequency at which the fundamental component in the digitally reconstructed output
has fallen by 3 dB with respect to its low frequency value (determined by FFT analysis) for input
at Full Scale.
(SINAD) Signal to noise and
distortion ratio Ratio expressed in dB of the RMS signal amplitude, set to 1dB below Full Scale, to the RMS
sum of all other spectral components, including the harmonics except DC.
(SNR) Signal to noise ratio Ratio expressed in dB of the RMS signal amplitude, set to 1dB below Full Scale, to the RMS
sum of all other spectral components excluding the five first harmonics.
(THD) Total harmonic
distortion Ratio expressed in dBc of the RMS sum of the first five harmonic components, to the RMS value
of the measured fundamental spectral component.
(SFDR) Spurious free dynamic
range Ratio expressed in dB of the RMS signal amplitude, set at 1dB below Full Scale, to the RMS
value of the next highest spectral component (peak spurious spectral component). SFDR is the
key parameter for selecting a converter to be used in a frequency domain application ( Radar
systems, digital receiver, network analyzer ....). It may be reported in dBc (i.e., degrades as
signal levels is lowered), or in dBFS (i.e. always related back to converter full scale).
(ENOB) Effective Number Of Bits Where A is the actual input amplitude and V
is the full scale range of the ADC under test
(DNL) Differential non
linearity The Differential Non Linearity for an output code i is the difference between the measured step
size of code i and the ideal LSB step size. DNL (i) is expressed in LSBs. DNL is the maximum
value of all DNL (i). DNL error specification of less than 1 LSB guarantees that there are no
missing output codes and that the transfer function is monotonic.
(INL) Integral non linearity The Integral Non Linearity for an output code i is the difference between the measured input
voltage at which the transition occurs and the ideal value of this transition.
INL (i) is expressed in LSBs, and is the maximum value of all |INL (i)|.
(DG) Differential gain The peak gain variation (in percent) at five different DC levels for an AC signal of 20% Full
Scale peak to peak amplitude. FIN = 5 MHz. (TBC)
(DP) Differential phase Peak Phase variation (in degrees) at five different DC levels for an AC signal of 20% Full Scale
peak to peak amplitude. FIN = 5 MHz. (TBC)
(TA) Aperture delay Delay between the rising edge of the differential clock inputs (CLK,CLKB) (zero crossing point),
and the time at which (VIN,VINB) is sampled.
(JITTER) Aperture uncertainty Sample to sample variation in aperture delay. The voltage error due to jitter depends on the slew
rate of the signal at the sampling point.
(TS) Settling time Time delay to achieve 0.2 % accuracy at the converter output when a 80% Full Scale step
function is applied to the differential analog input.
(ORT) Overvoltage recovery
time Time to recover 0.2 % accuracy at the output, after a 150 % full scale step applied on the input is
reduced to midscale.
(TOD) Digital data
Output delay Delay from the falling edge of the differential clock inputs (CLK,CLKB) (zero crossing point) to
the next point of change in the differential output data (zero crossing) with specified load.
(TD1) Time delay from Data to
Data Ready Time delay from Data transition to Data ready.
(TD2) Time delay from Data
Ready to Data General expression is TD1 = TC1 + TDR - TOD with TC = TC1 + TC2 = 1 encoding clock period.
(TC) Encoding clock period TC1 = Minimum clock pulse width (high) TC = TC1 + TC2
TC2 = Minimum clock pulse width (low)
(TPD) Pipeline Delay Number of clock cycles between the sampling edge of an input data and the associated output
data being made available, (not taking in account the TOD). For the JTS8388B the TPD is 4
clock periods.
SINAD - 1.76 + 20 log (A/V/2)
ENOB =
6.02
26
JTS8388B
Product Specification
(TRDR) Data Ready reset delay Delay between the falling edge of the Data Ready output asynchronous Reset signal (DDRB)
and the reset to digital zero transition of the Data Ready output signal (DR).
(TR) Rise time Time delay for the output DATA signals to rize from 20% to 80% of delta between low level and
high level.
(TF) Fall time Time delay for the output DATA signals to fall from 80% to 20% of delta between low level and
high level.
(PSRR) Power supply
rejection ratio Ratio of input offset variation to a change in power supply voltage.
(NRZ) Non return to zero When the input signal is larger than the upper bound of the ADC input range, the output code is
identical to the maximum code and the Out of Range bit is set to logic one. When the input
signal is smaller than the lower bound of the ADC input range, the output code is identical to the
minimum code, and the Out of range bit is set to logic one. (It is assumed that the input signal
amplitude remains within the absolute maximum ratings).
(IMD) InterModulation Distortion The two tones intermodulation distortion ( IMD ) rejection is the ratio of either input tone to the
worst third order intermodulation products. The input tones levels are at - 7dB Full Scale.
(NPR) Noise Power Ratio The NPR is measured to characterize the ADC performance in response to broad bandwidth
signals. When using a notch-filtered broadband white-noise generator as the input to the ADC
under test, the Noise Power Ratio is defined as the ratio of the average out-of-notch to the
average in-notch power spectral density magnitudes for the FFT spectrum of the ADC output
sample test.
27
Product Specification
JTS8388B
7. APPLYING THE JTS8388B
7.1. TIMING INFORMATIONS
7.1.1. TIMING VALUE FOR JTS8388B
Timing values are given at chip inputs/outputs, taking into account pad and ESD protections capacitance, 2 mm (30 um diameter) bonding wire per
pad, and specified termination loads.
Propagation delays in 50/75 ohms impedance traces are NOT taken into account for TOD and TDR.
Apply proper derating values corresponding to termination topology.
The min/max timing values are valid over the full temperature range in the following conditions :
Note 1 : Specified Termination Load (Differential output Datas and Data Ready) :
50 ohms resistor in parallel with 1 standard ECLinPS register from Motorola, (e.g : 10E452)
(Typical ECLinPS inputs shows a typical input capacitance of 1.5 pF (including package and ESD protections)
If addressing an output Dmux, take care if some Digital outputs do not have the same termination load and apply corresponding derating value given
below.
Note 2 : Output Termination Load derating values for TOD and TDR :
~ 60 ps/pF or 75 ps per additional ECLinPS load.
Note 3 :Propagation time delay derating values have also to be applied for TOD and TDR :
~ 6 ps/mm (155 ps/inch) for TSEV8388B Evaluation Board.
Apply proper time delay derating value if a different dielectric layer is used.
7.1.2. PROPAGATION TIME CONSIDERATIONS
TOD and TDR Timing values are given from pin to pin and DO NOT include the additional propagation times between device pins and input/output
termination loads. For the TSEV8388B Evaluation Board, the propagation time delay is 6ps/mm (155ps/inch) corresponding to 3.4 (@10GHz)
dielectric constant of the RO4003 used for the Board.
If a different dielectric layer is used (for instance Teflon), please use appropriate propagation time values.
TD does NOT depend on propagation times because it is a differential data.
(TD is the time difference between Data Ready output delay and digital Data output delay)
TD is also the most straightforward data to measure, again because it is differential :
TD can be measured directly onto termination loads, with matched Oscilloscopes probes.
7.1.3. TOD - TDR VARIATION OVER TEMPERATURE
Values for TOD and TDR track each other over temperature (1 percent variation for TOD - TDR per 100 degrees Celsius temperature variation).
Therefore TOD - TDR variation over temperature is negligible. Moreover, the internal (onchip) and package skews between each Data TODs and
TDR effect can be considered as negligible.
Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same is true for the TOD and TDR maximum values.
In other terms :
If TOD is at 950 ps, TDR will not be at 1420 ps ( maximum time delay for TDR ).
If TOD is at 1460 ps, TDR will not be at 910 ps ( minimum time delay for TDR ) However, external TOD - TDR values may be dictated by total digital
datas skews between every TODs (each digital data) and TDR :
MCM Board , bonding wires and output lines lengths differences, and output termination impedance mismatches.
The external (on board) skew effect has NOT been taken into account for the specification of the minimum and maximum values for TOD-TDR.
7.1.4. PRINCIPLE OF OPERATION
The Analog input is sampled on the rising edge of external clock input (CLK,CLKB) after TA (aperture delay) of typically 250ps .
The digitized data is available after 4 clock periods latency (pipeline delay (TPD)), on clock rising edge, after 1160 ps typical propagation delay TOD.
The Data Ready differential output signal frequency (DR,DRB) is half the external clock frequency, that is it switches at the same rate as the digital
outputs.
The Data Ready output signal (DR,DRB) switches on external clock falling edge after a propagation delay TDR of typically 1120 ps.
A Master Asynchronous Reset input command DRRB ( ECL compatible single-ended input) is available for initializing the differential Data Ready
output signal ( DR,DRB ) .This feature is mandatory in certain applications using interleaved ADCs or using a single ADC with demultiplexed outputs.
Actually, without Data Ready signal initialization, it is impossible to store the output digital datas in a defined order.
28
JTS8388B
Product Specification
7.2. PRINCIPLE OF DATA READY SIGNAL CONTROL BY DRRB INPUT COMMAND
7.2.1. DATA READY OUTPUT SIGNAL RESET
The Data Ready signal is reset on falling edge of DRRB input command, on ECL logical low level (-1.8V). DRRB may also be tied to VEE = - 5V for
Data Ready output signal Master Reset. So long DRRB remains at logical low level, (or tied to VEE = - 5V), the Data Ready output remains at
logical zero and is independant of the external free running encoding clock.
The Data Ready output signal (DR,DRB) is reset to logical zero after TRDR= 720 ps typical.
TRDR is measured between the -1.3V point of the falling edge of DRRB input command and the zero crossing point of the differential Data Ready
output signal (DR,DRB).
The Data Ready Reset command may be a pulse of 1 ns minimum time width.
7.2.2. DATA READY OUTPUT SIGNAL RESTART
The Data Ready output signal restarts on DRRB command rising edge, ECL logical high levels (-0.8V).
DRRB may also be Grounded, or is allowed to float, for normal free running Data Ready output signal.
The Data Ready signal restart sequence depends on the logical level of the external encoding clock, at DRRB rising edge instant :
1) The DRRB rising edge occurs when external encoding clock input (CLK,CLKB) is LOW :
The Data Ready output first rising edge occurs after half a clock period on the clock falling edge, after a delay time TDR = 1320 ps already
defined hereabove.
2) The DRRB rising edge occurs when external encoding clock input (CLK,CLKB) is HIGH :
The Data Ready output first rising edge occurs after one clock period on the clock falling edge, and a delay TDR = 1320ps.
Consequently, as the analog input is sampled on clock rising edge, the first digitized data corresponding to the first acquisition ( N ) after Data Ready
signal restart ( rising edge ) is always strobed by the third rising edge of the data ready signal.
The time delay (TD1) is specified between the last point of a change in the differential output data (zero crossing point) to the rising or falling edge of
the differential Data Ready signal (DR,DRB) (zero crossing point).
Note 1 : For normal initialization of Data Ready output signal, the external encoding clock signal frequency and level must be controlled.
It is reminded that the minimum encoding clock sampling rate for the ADC is 10 MSPS and consequently the clock cannot be stopped.
Note 2 : One single pin is used for both DRRB input command and die junction temperature monitoring.
Pin denomination will be DRRB/DIOD.( On former version denomination was DIOD. )
Temperature monitoring and Data Ready control by DRRB is not possible simultaneously.
7.3. ANALOG INPUTS (VIN) (VINB)
The analog input Full Scale range is 0.5 Volts peak to peak (Vpp), or -2 dBm into the 50 ohms termination resistor.
In differential mode input configuration, that means 0.25 Volt on each input, or +/- 125 mV around zero volt. The input common mode is GROUND.
The typical input capacitance is 0.4 pF in die form (JTS8388B), not taking into account the bond wires capacitance.
The input capacitance is mainly due to the pad capacitance, as the ESD protections are not connected (but present) on the inputs.
Differential inputs voltage span
-125
125
[mV]
-250 mV250 mV
VIN
500mV
Full Scale
analog input
t
VINB
(VIN,VINB) = +/- 250 mV = 500 mV diff
0 Volt
Differential versus single ended analog input operation
The JTS8388B can operate at full speed in either differential or single ended configuration.
This is explained by the fact the ADC uses a high input impedance differential preamplifier stage, (preceeding the Sample and hold stage), which has
been designed in order to be entered either in differential mode or single–ended mode.
29
Product Specification
JTS8388B
This is true so long as the out of phase analog input pin VINB is 50 ohms terminated very closely to one of the neighboring shield ground pins (33?
35? 37) which constitute the local ground reference for the inphase analog input pin (VIN).
Thus the differential analog input preamplifier will fully reject the local ground noise ( and any capacitively and inductively coupled noise) as common
mode effects.
In typical single–ended configuration, enter on the (VIN) input pin, with the inverted phase input pin (VINB) grounded through the 50 ohms
termination resistor.
In single–ended input configuration, the in-phase input amplitude is 0.5 Volt peak to peak,centered on 0V. (or -2 dBm into 50 ohms.)
The inverted phase input is at ground potential through the 50 ohms termination resistor.
However, dynamic performances can be somewhat improved by entering either analog or clock inputs in differential mode.
Typical Single ended analog input configuration
VIN or VINB VIN or VINB double pad (pins 54, 55 or 56, 57)
50 Ω
(external)
50 Ω reverse termination
1MΩ3 pF
-250
250
[mV]
500 mV
500 mV
Full Scale
analog input
t
VINB
VIN
VINB = 0V
VIN = +/- 250 mV ⇔ 500 mV diff
7.4. CLOCK INPUTS (CLK) (CLKB)
The JTS8388B can be clocked at full speed without noticeable performance degradation in either differential or single ended configuration.
This is explained by the fact the ADC uses a differential preamplifier stage for the clock buffer, which has been designed in order to be entered either
in differential or single–ended mode.
7.4.1. SINGLE ENDED CLOCK INPUT (GROUND COMMON MODE)
Although the clock inputs were intended to be driven differentially with nominal -0.8V / -1.8V ECL levels, the JTS8388B clock buffer can manage a
single–ended sinewave clock signal centered around 0 Volt. This is the most convenient clock input configuration as it does not require the use of a
power splitter.
No performance degradation ( e.g. : due to timing jitter) is observed in this particular single–ended configuration up to 1.2GSPS Nyquist conditions (
Fin = 600 MHz ).
This is true so long as the inverted phase clock input pin is 50 ohms terminated very closely to one of the neighbouring shield ground pin, which
constitutes the local Ground reference for the inphase clock input.
Thus the JTS8388B differential clock input buffer will fully reject the local ground noise ( and any capacitively and inductively coupled noise) as
common mode effects.
Moreover, a very low phase noise sinewave generator must be used for enhanced jitter performance.
The typical inphase clock input amplitude is 1 Volt peak to peak, centered on 0 Volt (ground) common mode.
This corresponds to a typical clock input power level of 4 dBm into the 50 ohms termination resistor.
Do not exceed 10 dBm to avoid saturation of the preamplifier input transistors.
The inverted phase clock input is grounded through the 50 ohms termination resistor.
30
JTS8388B
Product Specification
Single ended Clock input (Ground common mode)
VCLK common mode = 0 Volt
VCLKB=0 Volt
4 dBm typical clock input power level
(into 50 ohms termination resistor)
[V]
t
VCLK
VCLKB = ( 0 V )
-0.5V
+0.5V CLK or CLKB
50 Ω
(external)
50 Ω reverse termination
1MΩ0.4 pF
CLK or CLKB double pad (pins 37, 38 or 39, 40)
Note 1 : Do not exceed 10 dBm into the 50 ohms termination resistor for single clock input power level.
7.4.2. DIFFERENTIAL ECL CLOCK INPUT
The clock inputs can be driven differentially with nominal -0.8V / -1.8V ECL levels.
In this mode, a low phase noise sinewave generator can be used to drive the clock inputs, followed by a power splitter (hybrid junction) in order to
obtain 180 degrees out of phase sinewave signals. Biasing tees can be used for offseting the common mode voltage to ECL levels.
Note : As the biasing tees propagation times are not matching, a tunable delay line is required in order to ensure the signals to be 180 degrees out
of phase especially at fast clock rates in the GSPS range.
Differential Clock inputs (ECL Levels)
-0.8V
[mV]
t
-1.8V
VCLKB
VCLK
Common mode = -1.3 V
CLK or CLKB
50 Ω reverse termination
1MΩ0.4 pF
-2V
50 Ω
(external)
CLK or CLKB double pad (pins 37, 38 or 39, 40)
7.4.3. SINGLE ENDED ECL CLOCK INPUT
In single–ended configuration enter on CLK ( resp. CLKB ) pin , with the inverted phase Clock input pin CLKB (respectively CLK) connected to -1.3V
through the 50 ohms termination resistor.
The inphase input amplitude is 1 Volt peak to peak, centered on -1.3 Volt common mode.
Single ended Clock input (ECL):
VCLK common mode = -1.3 Volt.
VCLKB = -1.3 Volt
-0.8V
[V]
t
-1.8V
VCLK
VCLKB = -1.3 V
31
Product Specification
JTS8388B
7.5. CLOCK SIGNAL DUTY CYCLE ADJUST
At fast sampling rates, ( 1 Gsps and above), the device performance ( especially the SNR ) may be improved by tuning the Clock duty cycle
(CLK,CLKB).
In single ended configuration, when using a sinewave clock generator, the clock signal duty cycle can be easily adjusted by simply offseting the
inphase clock signal using a biasing tee, (as the out of phase clock input is at ground level ).
Single ended Clock input (Inphase clock input common mode shifted)
VCLK common mode = -180mV
VCLKB = 0 Volt [V]
t
VCLK - 180 mV
VCLKB = ( 0 V )
-0.5V
40 % 60 %
+0.5V
Note 1 : Do not exceed 10 dBm into the 50 ohms termination resistor for single clock input power level.
Note 2 : For an input CLK signal of 4 dBm into 50 ohms, the typical offset value to achieve a 40 / 60 clock duty cycle is -180 mV on CLK.
7.6. NOISE IMMUNITY INFORMATIONS
Circuit noise immunity performance begins at design level.
Efforts have been made on the design in order to make the device as insensitive as possible to chip environment perturbations resulting from the
circuit itself or induced by external circuitry.
(Cascode stages isolation, internal damping resistors, clamps, internal (onchip) decoupling capacitors.)
Furthermore, the fully differential operation from analog input up to the digital outputs provides enhanced noise immunity by common mode noise
rejection.
Common mode noise voltage induced on the differential analog and clock inputs will be canceled out by these balanced differential amplifiers.
Moreover, proper active signals shielding has been provided on the chip to reduce the amount of coupled noise on the active inputs :
The analog inputs and clock inputs of the TS8388B device have been surrounded by ground pins, which must be directly connected to the external
ground plane.
32
JTS8388B
Product Specification
7.7. DIGITAL OUTPUTS
The JTS8388B differential output buffers are internally 75 ohms loaded. The 75 ohms resistors are connected to the digital ground pins through a -
0.8v level shift diode (see Figures 3,4,5 on next page).
The JTS8388B output buffers are designed for driving 75 ohms (default) or 50 ohms properly terminated impedance lines or coaxial cables.
An 11 mA bias current flowing alternately into one of the 75 ohms resistors when switching ensures a 0.825 V voltage drop across the resistor
(unterminated outputs).
The VPLUSD positive supply voltage allows the adjustment of the output common mode level from -1.2V (VPLUSD=0V for ECL output compatibility)
to +1.2V (VPLUSD=2.4V for LVDS output compatibility).
Therefore,the single ended output voltages vary approximately between -0.8V and -1.625V, ( outputs unterminated ), around
-1.2V common mode voltage.
Three possible line driving and back-termination scenarios are proposed (assuming VPLUSD=0V) :
1 ) 75 Ohms impedance transmission lines, 75 ohms differentialy terminated (Fig. 3) :
Each output voltage varies between -1V and -1.42V (respectively +1.4V and +1V), leading to +/- 0.41V =0.825 V in differential, around -1.21 V
(respectively +1.21V) common mode for VPLUSD=0V (respectively 2.4V).
2 ) 50 ohms impedance transmission lines, 50 ohms differentialy termination (Fig. 4) :
Each output voltage varies between -1.02V and -1.35V (respectively +1.38V and +1.05V), leading to +/- 0.33V=660 mV in differential, around -1.18V
(respectively +1.21V) common mode for VPLUSD=0V (respevtively 2.4V).
3 ) 75 ohms impedance open transmission lines (Fig. 5) :
Each output voltage varies between -1.6 V and -0.8 V (respectively +0.8V and +1.6V), which are true ECL levels, leading to +/- 0.8V=1.6V in
differential, around -1.2V (respectively +1.2V) common mode for VPLUSD=0V (respectively 2.4V).
Therefore, it is possible to drive directly high input impedance storing registers, without terminating the 75 ohms transmission lines.
In time domain, that means that the incident wave will reflect at the 75 ohms transmission line output and travel back to the generator ( i.e. the 75
ohms data output buffer ). As the buffer output impedance is 75 ohms, no back reflection will occur.
Note : This is no longer true if a 50 ohms transmission line is used, as the latter is not matching the buffer 75 ohms output impedance.
Each differential output termination length must be kept identical .
It is recommended to decouple the midpoint of the differential termination with a 10 nF capacitor to avoid common mode perturbation in case of slight
mismatch in the differential output line lengths.
Too large mismatches ( keep < a few mm ) in the differential line lengths will lead to switching currents flowing into the decoupling capacitor leading
to switching ground noise.
The differential output voltage levels ( 75 or 50 ohms termination ) are not ECL standard voltage levels, however it is possible to drive standard logic
ECL circuitry like the ECLinPS logic line from MOTOROLA.
At sampling rates exceeding 1GSPS, it may be difficult to trigger the HP16500 or any other Acquisition System with digital outputs.
It becomes necessary to regenerate digital data and Data Ready by means of external amplifiers, in order to be able to test the JTS8388B at its
optimum performance conditions.
33
Product Specification
JTS8388B
7.7.1. DIFFERENTIAL OUTPUT LOADING CONFIGURATIONS (LEVELS FOR ECL COMPATIBILITY)
-+
11 mA
DVEE
VPLUSD = 0V
75 Ω75 Ω
75
Ω
75
Ω
impedance 10 nF
75 Ω
75
Ω
Out -1V / -1.41V
OutB -1.41V / -1V
Differential output :
± 0.41V = 0.825V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 3 : DIFFERENTIAL OUTPUT : 75
Ω
TERMINATED
-0.8V
-+
11 mA
DVEE
VPLUSD = 0V
75 Ω75 Ω
50
Ω
50
Ω
impedance 10 nF
50 Ω
50
Ω
Out -1.02V / -1.35V
OutB -1.35V / -1.02V
Differential output :
± 0.33V = 0.660V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 4 : DIFFERENTIAL OUTPUT : 50
Ω
TERMINATED
-0.8V
-+
11 mA
DVEE
VPLUSD = 0V
75 Ω75 Ω
75
Ω
75
Ω
impedance
Out -0.8V / -1.6V
OutB -1.6V / -0.8V
Differential output :
± 0.8V = 1.6V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 5 : DIFFERENTIAL OUTPUT : OPEN LOADED
-0.8V
34
JTS8388B
Product Specification
7.7.2. DIFFERENTIAL OUTPUT LOADING CONFIGURATIONS (LEVELS FOR LVDS COMPATIBILITY)
-+
11 mA
DVEE
VPLUSD = 2.4V
75 Ω75 Ω
75
Ω
75
Ω
impedance 10 nF
75 Ω
75
Ω
Out 1.4V / 0.99V
OutB 0.99V / 1.4V
Differential output :
± 0.41V = 0.825V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 6 : DIFFERENTIAL OUTPUT : 75
Ω
TERMINATED
1.6V
-+
11 mA
DVEE
VPLUSD = 2.4V
75 Ω75 Ω
50
Ω
50
Ω
impedance 10 nF
50 Ω
50
Ω
Out 1.38V / 1.05V
OutB 1.05V / 1.38V
Differential output :
± 0.33V = 0.660V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 7 : DIFFERENTIAL OUTPUT : 50
Ω
TERMINATED
1.6V
-+
11 mA
DVEE
VPLUSD = 2.4V
75 Ω75 Ω
75
Ω
75
Ω
impedance
Out 1.6V / 0.8V
OutB 0.8V / 1.6V
Differential output :
± 0.8V = 1.6V
Common mode level : -1.2V
(-1.2V below VPLUSD level)
Figure 8 : DIFFERENTIAL OUTPUT : OPEN LOADED
1.6V
35
Product Specification
JTS8388B
7.8. OUT OF RANGE BIT
An Out of Range (OR,ORB) bit is provided that goes to logical high state when the input exceeds the positive full scale or falls below the negative full
scale.
When the analog input exceeds the positive full scale, the digital output datas remain at high logical state, with (OR,ORB) at logical one.
When the analog input falls below the negative full scale, the digital outputs remain at logical low state, with (OR,ORB) at logical one again.
7.9. GRAY OR BINARY OUTPUT DATA FORMAT SELECT
The JTS8388B internal regeneration latches indecision (for inputs very close to latches threshold) may produce errors in the logic encoding circuitry
and leading to large amplitude output errors.
This is due to the fact that the latches are regenerating the internal analog residues into logical states with a finite voltage gain value (Av) within a
given positive amount of time ∆(t) :
Av= exp(∆(t)/τ) , with τ the positive feedback regeneration time constant.
The JTS8388B has been designed for reducing the probability of occurence of such errors to approximately 10-13 (targetted for the JTS8388B at
1GSPS).
A standard technique for reducing the amplitude of such errors down to +/-1 LSB consists to output the digital datas in Gray code format.
Though the JTS8388B has been designed for featuring a Bit Error Rate of 10-13 with a binary output format, it is possible for the user to select
between the Binary or Gray output data format, in order to reduce the amplitude of such errors when occuring, by storing Gray output codes.
Digital Datas format selection :
BINARY output format if GORB is floating or VCC.
GRAY output format if GORB is connected to ground (0V).
7.10. TS8388 B THERMAL REQUIREMENTS
The JTS8388B is currently mounted on its dedicated Chip Evaluation Board (CEB), with fulfills the device thermal requirements in still air at room
temperature.
For operation in the military temperature range, forced convection is required to maintain the device junction temperature below the specified
maximum value.
The JTS8388B power dissipation is 3.6 Watt at 70°C junction temperature, and 3.8 Watt at 125°C junction temperature. The die dimensions are 2.44
mm x 3 mm = 7.32 mm².
The maximum junction temperature is 145°C.
To manage correctly the power dissipation of the JTS8388B device, the following thermal fixture profile is used, taking into account the die
dimensions and power dissipation :
7.5 C°/W typical value for die attach Ag filled Epoxy glue, but depending on gllue film thickness.
0.5 C°/W Copper block.
1 C°/W isolation foil.
6.5 C°/W heatsink (still air).
The heatsink used is the 3334B pin fin heatsink from Thermalloy, (also used cooling the 604 Power PC µP). Its dimensions are 50.70 mm x 50.39
mm = (1.996 inch x 1.984 inch x 0.650 inch).
The measured die junction to ambient thermal resistance (RTHJA) for the Chip Evaluation Board is approximately 15.5 C/W in still air.
At room temperature (25°C), this yields to a device junction temperature of approximately 80°C, in thermal steady state conditions.
36
JTS8388B
Product Specification
7.11. DIODE PAD 32
The DIODE pad 32 is provided for die junction temperature monitoring.
The operating die junction temperature must be kept below145°C, therefore an adequate cooling system has to be set up.
The diode mounted transistor measured Vbe value versus junction temperature is given below.
600
640
680
720
760
800
840
880
920
960
1000
-55 -35 -15 525 45 65 85 105 125
Junction temperature (deg.C)
VBE (mV)
7.12. ADC GAIN CONTROL PAD 38
The ADC gain is adjustable by the means of the PAD 38 (input impedance is 1MΩ in parallel with 2pF)
The gain adjust transfer function is given below :
0,80
0,85
0,90
0,95
1,00
1,05
1,10
1,15
1,20
-500 -400 -300 -200 -100 0100 200 300 400 500
Vgain (command voltage) (mV)
ADC Gain
37
Product Specification
JTS8388B
8. EQUIVALENT INPUT / OUTPUT SCHEMATICS
8.1. EQUIVALENT ANALOG INPUT CIRCUIT AND ESD PROTECTIONS
GND=0V
VCC=+5V
VCLAMP= +2.4V
+1.65V
-1.55V
VEE VEE
VCC
GND
VIN VINB
VEE=-5V
Pad
capacitance
340fF
Pad
capacitance
340fF
-0.8V
-5.8V
5.8V
0.8V
200
Ω
200
Ω
50
Ω
50
Ω
Note : the ESD protections are present but not connected for Vin and Vinb
E21VE21V
-0.8V
-5.8V
8.2. EQUIVALENT ANALOG CLOCK INPUT CIRCUIT AND ESD PROTECTIONS
VCC=+5V +0.8V
GND=0V
VEE
VEE=-5V
CLK
VCC
VEE
CLKB
Pad
capacitance
340fF
Pad
capacitance
340fF
-5.8V
-5.8V
-5.8V -5.8V
-5.8V
-5.8V
5.8V5.8V
0.8V 0.8V
150
Ω
150 Ω
380 µA380 µA
Note : the ESD protections are present but not connected for Clk and Clkb
38
JTS8388B
Product Specification
8.3. EQUIVALENT DATA OUTPUT BUFFER CIRCUIT AND ESD PROTECTIONS
VPLUSD=0V to 2.4V
DVEE=-5V VEE=-5VVEE=-5V
VEE VEE
OUT OUTB
-5.8V -5.8V
5.8V 5.8V
0.8V
0.8V 0.8V
0.8V
I=11mA
75
Ω
75
Ω
-3.7V
Pad
capacitance
180 fF
Pad
capacitance
180 fF
Note : the ESD protection equivalent capacitance is 150 fF.
8.4. ADC GAIN ADJUST EQUIVALENT INPUT CIRCUITS AND ESD PROTECTIONS
VEE
VEE VEE=-5V
VCC=+5V
+1.6V
Pad
capacitance
180 fF
-0.8 V
-5.8 V
-0.8 V
-5.8 V
0.8V
0.8V
5.8V
0.8V
0.8V
5.8V
1 kΩ1 k
Ω
2 pF 2 pF
GND GND
VEE
VEE
VCC
Pad
capacitance
180 fF
500 µA500
µ
A
GA GAB
NP1032C2 NP1032C2
Note : the ESD protection equivalent capacitance is 150 fF.
39
Product Specification
JTS8388B
8.5. GORB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS
GORB: gray or binary select input; floating or tied to VCC -> binary
VCC=+5V
VEE=-5V GND=0V
-0.8V
-0.8V
-5.8V
5.8V
5.8V
5.8V
5 k
Ω
1 k
Ω
1 kΩ
1 k
Ω
250 µA
250 µA
Pad
capacitance
180fF
GORB
VEE
Note : the ESD protection equivalent capacitance is 150 fF.
40
JTS8388B
Product Specification
8.6. DRRB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS
VEE=-5V
VEE
VCC=+5V
GND=0V
-1.3V
-2.6V
10 kΩ
200
Ω
DRRB
5.8 V
Pad
capacitance
180 fF
Actual protection range: 6.6V above VEE,
In fact stress above GND are clipped by
the CB diode used for Tj monitoring
0.8 V
NP1032C2
Note : the ESD protection equivalent capacitance is 150 fF.
41
Product Specification
JTS8388B
9. TSEV8388B : DEVICE EVALUATION BOARD
For complete specification, see separate TSEV8388B document.
GENERAL DESCRIPTION
The TSEV8388B Evaluation Board (CEB) is a prototype board which has been designed in order to facilitate the evaluation and the characterization
of the JTS8388B device up to its 2 GHz full power bandwidth at up to 1 Gsps in the military temperature range.
The high speed of the JTS8388B requires careful attention to circuit design and layout to achieve optimal performance.
This four metal layer board with internal ground plane has the adequate functions in order to allow a quick and simple evaluation of the JTS8388B
ADC performances over the temperature range.
The TSEV8388B Evaluation Board is very straightforward as it only implements the JTS8388B ADC, SMA connectors for input / output accesses
and a 2.54 mm pitch connector compatible with HP16500C high frequency probes.
The board also implements a de–embedding fixture in order to facilitate the evaluation of the high frequency insertion loss of the input microstrip
lines, and a die junction temperature measurement setting.
The board is constituted by a sandwich of two dielectric layers, featuring low insertion loss and enhanced thermal characteristics for operation in the
high frequency domain and extended temperature range.
The board dimensions are 130 mm x 130 mm.
The board set comes fully assembled and tested, with the JTS8388B die installed.
42
JTS8388B
Product Specification
10. ORDERING INFORMATION
Die form
J
TS
(X)
8388B - 1
V
B
Die prefix
Manufacturer prefix (1)
Prototype version
Device or family
Revision of the mask set
B : for VH25B
Screening levels
(2)
V : visual inspection
Back side metallization
1 : Naked Silicon
(1) ATMEL-GRENOBLE
(2) For availability of the different versions, contact your ATMEL-
Grenoble sales office
1
Prob test configuration
1 : ambiant temperature
2 : Tamb + high temp
Evaluation board
Evaluation board prefix
Device or family
TSEV 8388B
43
Product Specification
JTS8388B
APPENDIX
VALIDITY
Objective specification This datasheet contains target and goal specification for
discussion with customer and application validation. Before design phase.
Target specification This datasheet contains target and goal specification for product
development. Valid during the design
phase.
Preliminary specification
Alpha-site This datasheet contains preliminary data. Additional data may be
published later ; could include simulation results. Valid before the
characterization phase.
Preliminary specification
Beta-site This datasheet contains also characterization results. Valid before the
industrialization phase.
Product specification This datasheet contains final product specifiaction. Valid for production purpose.
Application information
Where application information is given, it is advisory and does not form part of the specification.
DATASHEET STATUS
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of
the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at
these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure
to limiting values for extended periods may affect device reliability.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be
expected to result in personal injury. ATMEL customers using or selling these products for use in such applications do so their own risk and agree to
fully indemnify ATMEL for any damages from improper use or sale.
44
JTS8388B
Product Specification
Atmel Grenoble, formerly Thomson-CSF Semiconducteurs Specifiques, an Atmel Group Company.
Information furnished is believed to be accurate and reliable. However Atmel-Grenoble assumes no responsability for the consequences of use of
such information nor for any infringement of pattents or other rights of third parties which may result from its use. No license is garanted by
implication or otherwise under any pattent or pattent rights of Atmel-Grenoble. Specifications mentioned in this publication are subject to change
without notice. This publication supersedes and replaces all information previously supplied. Atmel-Grenoble products are not authorized for use as
critical components in life support devices or systems without express written approval from Atmel Grenoble.
2000 Atmel Grenoble – Printed in France – all rights reserved.
This product is manufactured and commercialized by Atmel Grenoble – Avenue de Rocheplaine – BP 123 – 38521 Aint-Egreve Cedex – France.
For further information, please contact :
Atmel Grenoble – Route Departementale 128 – BP 46 – 91901 Orsay Cedex – France
Phone +33 (0) 1 69 33 03 24 – Fax +33 (0) 1 69 33 03 21
Email monique.lafrique@atmel-grenoble.com – Web site http://www.atmel-grenoble.com
