General Description
The MAX3355E integrates a charge pump and com-
parators to enable a system with an integrated USB on-
the-go (OTG) dual-role transceiver to function as a USB
OTG dual-role device. USB OTG facilitates the direct
connection of peripherals and mobile devices such as
PDAs, cellular phones, MP3 players, and digital cam-
eras to one another without a host PC.
The MAX3355E’s internal charge pump supplies VBUS
power and signaling that is required by the transceiver as
defined in On-the-Go Supplement to the USB 2.0
Specification, Revision 1.0. The MAX3355E features ID
detection and internal comparators for monitoring
VBUS. The VBUS status outputs are used during negoti-
ation for the USB according to the session request pro-
tocol (SRP) and host negotiation protocol (HNP).
The MAX3355E operates with logic supply voltages
(VL) as low as 1.65V, ensuring compatibility with low-
voltage ASICs. The device also features a logic-selec-
table 1µA shutdown mode.
The MAX3355E has built-in ±15kV ESD-protection cir-
cuitry to protect the VBUS and ID_IN pins. The device is
available in a miniature 4 x 3 chip-scale package
(UCSP), as well as a 14-pin TSSOP package, and is
specified for operation over the -40°C to +85°C extended
temperature range.
Applications
Cell Phones MP3 Players
PDAs Digital Cameras
Features
♦Guaranteed 8mA (min) VBUS Charge-Pump Output
♦±15kV ESD Protection on VBUS and ID_IN
♦Up to +6.0V Backdrive Capability for VBUS
♦+2.6V to +5.5V Operating Voltage Range
♦VLOperates Down to +1.65V
♦Guaranteed VBUS Input Impedance When Not
Driven
♦Automatic CLOAD Detection
♦Comparators for Host Negotiation Protocol
♦ID_IN Detection
♦Available in 4 x 3 UCSP or 14-Pin TSSOP Package
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
________________________________________________________________ Maxim Integrated Products 1
PART TEMP RANGE PIN-
PACKAGE
TOP
MARK
MAX3355EEBC-T -40°C to +85°C 4 x 3 UCSP ABE
MAX3355EEUD -40°C to +85°C 14 TSSOP —
Ordering Information
CHARGE
PUMP
5V AT 8mA 40kΩ TO
100kΩ
STATUS2
STATUS1
ON/OFF
MAX3355E
VBUS
COMPARATORS
CURRENT
SOURCE
VBUS
VBUS
GND
USB CONNECTOR
ID_IN
GND
ID
D+
D-
VCC
VL
C+
VCC C-
ESD
LEVEL
SHIFTER
OFFVBUS
SHDN
STATUS1
STATUS2
ID_OUT
DUAL-ROLE
ASIC
LOGIC SUPPLY
+1.65V TO VCC
USB
XCVR
ESD
Functional Diagram
19-2844; Rev 1; 8/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configurations appear at end of data sheet.
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCC decoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, CLOAD = 1µF (min), ESRLOAD = 1Ω(max), TA= TMIN to TMAX. Typical values are at VCC = +3.0V, VL= 1.8V, TA=
+25°C, unless otherwise noted.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND)
VCC, VL, VBUS, ID_IN.............................................-0.3V to +6.0V
C+..................................................................(VCC - 0.3V) to +6V
C-................................................................-0.3V to (VCC + 0.3V)
OFFVBUS, SHDN, STATUS1,
STATUS2, ID_OUT ....................................-0.3V to (VL+ 0.3V)
VBUS Short Circuit to GND .........................................Continuous
Output Current (all other pins)..........................................±15mA
Continuous Power Dissipation (TA= +70°C)
4 x 3 UCSP (derate 6.5mW/°C above +70°C) .............520mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 2.6 5.5 V
Logic Supply Voltage VL1.65 VCC V
Logic Supply Current IL100 µA
No activity on VBUS; comparator and
reference active 200 µA
Operating Supply Current ICC Device A configured, OFFVBUS = VL,
ILOAD = 8mA, charge pump on 20 mA
Device B configured, SHDN = GND 1
Shutdown Supply Current ICCSHDN Device A configured, SHDN = GND 30 µA
Thermal-Shutdown Protection
Threshold
Device A configured, OFFVBUS = VL,
charge pump on +150 °C
Thermal-Shutdown Protection
Hysteresis
Device A configured, OFFVBUS = VL,
charge pump on +20 °C
LOGIC INPUTS AND OUTPUTS
VOH ISOURCE = +1mA 2/3 x VL
STATUS1, STATUS2, ID_OUT
Output Voltage VOL ISINK = -1mA 0.4 V
VIH 2/3 x VL
OFFVBUS, SHDN Input Voltage VIL 0.4 V
Input Leakage Current ILKG OFFVBUS, SHDN = GND or VL±1 µA
VBUS OUTPUT VOLTAGE: DEVICE A CONFIGURED
ILOAD = 0 to 8mA, CLOAD = 1µF,
OFFVBUS = VL, ID_IN = GND 4.63 5.25
VBUS Output Voltage
No load, CLOAD = 1µF, OFFVBUS = VL,
ID_IN = GND 4.8
V
VBUS Leakage Voltage OFFVBUS = GND 200 mV
VBUS Sink Current OFFVBUS = GND, VBUS = +6.0V 150 µA
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCC decoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, CLOAD = 1µF (min), ESRLOAD = 1Ω(max), TA= TMIN to TMAX. Typical values are at VCC = +3.0V, VL= 1.8V, TA=
+25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VBUS Source Current OFFVBUS = VL, ID_IN = GND 8 mA
VBUS Short-Circuit Current Limit VBUS shorted to GND 200 mA
VBUS Output Ripple ILOAD = 8mA, CLOAD = 1µF,
OFFVBUS = VL, ID_IN = GND (Note 3) 100 mV
Charge-Pump Switching
Frequency 500 kHz
VBUS Input Impedance RINVBUS OFFVBUS = GND or SHDN = GND 40 100 kΩ
LOAD DETECTION VBUS OUTPUT VOLTAGE
CLOAD = 20µF, OFFVBUS = VL, ID_IN =
VCC, IBUS source on-time = tVBUSCHRG 2.1
VBUS Output Voltage
CLOAD = 95µF, OFFVBUS = VL, ID_IN =
VCC, IBUS source on-time = tVBUSCHRG 1.9
V
VBUS Source Current OFFVBUS = VL, ID_IN = VCC (Note 4) 450 600 850 µA
VBUS Current Gate Time tVBUSCHRG OFFVBUS = VL, ID_IN = VCC, Device B
(Note 4)
155
(max) 105 56
(min) ms
VBUS COMPARATOR
VBUS Valid Comparator Threshold VTHVBUSVLD VBUS rising 4.4 4.55 4.63 V
VBUS Valid Comparator Hysteresis 20 mV
Session Valid Comparator
Threshold VTHSESVLD 1.12 1.4 1.68 V
Session Valid Comparator
Hysteresis 15 mV
B-Session End Comparator
Threshold VTHSESEND 0.4 0.5 0.6 V
B-Session End Comparator
Hysteresis 30 mV
Shutdown Comparator VTH,SHDN 0.8 2.4 V
ID_IN
ID_IN Voltage Input for Device B 2/3 x Vcc V
ID_IN Voltage Input for Device A 0.4 V
ID_IN Input Impedance 150 200 250 kΩ
ESD PROTECTION (ID_IN, VBUS)
Human Body Model ±15 kV
IFC 1000-4-2 Air-Gap Discharge ±15 kV
IFC 1000-4-2 Contact Discharge ±8 kV
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC, VL= +3.3V, C1 = 0.1µF, VCC decoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF capacitor to GND, CLOAD = 1µF
min, ESRLOAD = 1Ωmax, TA= +25°C, unless otherwise noted.)
0
40
20
80
60
100
120
050
VCC INPUT CURRENT
vs. VBUS OUTPUT CURRENT
MAX3355E toc01
VBUS OUTPUT CURRENT (mA)
VCC INPUT CURRENT (mA)
2010 30 40
VCC = 2.6V
VCC = 4.0V
VCC = 5.5V
4.00
4.50
4.25
4.75
5.00
5.25
050
VBUS OUTPUT VOLTAGE
vs. VBUS OUTPUT CURRENT
MAX3355E toc02
VBUS OUTPUT CURRENT (mA)
VBUS OUTPUT VOLTAGE (V)
2010 30 40
VCC = 4.0V
VCC = 5.5V
VCC = 2.6V
0
75
25
50
100
125
150
2.5 5.5
VBUS OUTPUT RIPPLE VOLTAGE
vs. VCC INPUT VOLTAGE
MAX3355E toc03
VCC INPUT VOLTAGE (V)
VBUS OUTPUT RIPPLE VOLTAGE (mV)
3.53.0 4.0 5.04.5
IVBUS = 8mA
TIMING CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCC decoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, CLOAD = 1µF (min), ESRLOAD = 1Ω(max), TA= TMIN to TMAX. Typical values are at VCC = +3.0V, VL= 1.8V, TA=
+25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VBUS Rise Time 0 to 4.4V, CLOAD = 1µF, ILOAD = 8mA 100 ms
OFFVBUS Propagation Delay 6µs
Comparator Propagation Delay 3µs
Time to Exit Shutdown 50 µs
Time to Shutdown 1µs
ID_OUT Rise Time CID_OUT = 50pF 10 ns
ID_OUT Fall Time CID_OUT = 50pF 10 ns
Note 1: Limits are 100% production tested at +25°C. Limits over temperature are guaranteed by design.
Note 2: All currents out of the device are positive; all currents into the device are negative. All voltages are referenced to device
ground unless otherwise specified.
Note 3: The ripple voltage is strongly correlated to the bus capacitance and its ESR.
Note 4: The VBUS current source and current gate time vary together with process and temperature such that the resulting VBUS
pulse is guaranteed to drive a <13µF load to a voltage >2.0V, and to drive a >96µF load to a voltage <2.2V.
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(VCC, VL= +3.3V, C1 = 0.1µF, VCC decoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF capacitor to GND, CLOAD = 1µF
min, ESRLOAD = 1Ωmax, TA= +25°C, unless otherwise noted.)
4.0
4.8
4.2
4.4
4.6
5.0
5.2
5.4
2.5 5.5
VBUS OUTPUT VOLTAGE
vs. VCC INPUT VOLTAGE
MAX3355E toc04
VCC INPUT VOLTAGE (V)
VBUS OUTPUT VOLTAGE (V)
3.53.0 4.0 5.04.5
IVBUS = 0mA
IVBUS = 8mA
65
67
66
68
69
70
-40 85
VBUS INPUT IMPEDANCE
vs. TEMPERATURE
MAX3355E toc05
TEMPERATURE (°C)
VBUS INPUT IMPEDANCE (kΩ)
10-15 35 60
16
17
18
19
20
-40 85
SUPPLY CURRENT
vs. TEMPERATURE
MAX3355E toc06
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
10-15 35 60
IVBUS = 8mA
VCC = 4.0V
VCC = 2.6V
VCC = 5.5V
VBUS vs. CAPACITANCE LOAD
DURING LOAD DETECTION
MAX3355E toc07
CVBUS = 10µF
1V/div
CVBUS = 96µF
1V/div
40ms/div
0
0
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
6 _______________________________________________________________________________________
Typical Application Circuit
µP
OFFVBUS
VL
VCC
VCC
VL
ID_OUT
STATUS1
STATUS2
SHDN GND
OTG SIE
ID_IN
C-
VBUS
C+
D-
D+
C1
0.1µF
CLOAD
1µF
1µF
0.1µF
USB OTG
CONNECTOR
MAX3355E
Pin Description
PIN
UCSP TSSOP NAME FUNCTION
A1 2 VCC Power Supply. +2.6V to +5.5V input supply. Bypass VCC to GND with a 1µF capacitor.
A2 3 ID_OUT Device ID Output. Output of ID_IN level translated to VL.
A3 5 STATUS1 Status Output 1. Provides output voltage detection for use during HNP handshaking (Tables 1
and 2).
A4 6 STATUS2 Status Output 2. Provides output voltage detection for use during HNP handshaking (Tables 1
and 2).
B1 1 VBUS
U S B S up p l y. V
B U S
p r ovi d es a nom i nal + 5.0V outp ut w hen ID _IN i s l ow and O FFVBUS i s hi g h.
V
B U S
i s l ow er than + 2.1V w hen ID _IN i s op en or a l oad g r eater than 96.5µF i s sensed . V
B U S
can
b e b ackd r i ven to + 6.0V w i thout any conseq uence. Byp ass V
B U S
to G N D w i th a 1µF cap aci tor .
B2 4 OFFVBUS VBUS Off. Turns the internal charge pump providing VBUS on and off.
B3 11 SHDN Shutdown. Connect SHDN to GND to enter shutdown and reduce supply current to less than
1µA. Connect SHDN to VL for normal operation.
B4 9 VLLogic Supply. VL sets the logic output high voltage and logic input high threshold. VL must be
between +1.65V and VCC.
C1 14 C+ Charge-Pump Positive Connection
C2 13 C- Charge-Pump Negative Connection
C3 12 GND Ground
C4 10 ID_IN Device ID. ID_IN is internally pulled up to VCC. Leave ID_IN open for device B and connect
ID_IN to GND for device A.
—7, 8 N.C. No Connection
Detailed Description
USB OTG is an emerging USB standard that enables
devices to talk in a peer-to-peer manner on a USB bus.
OTG allows peripherals and mobile devices such as
PDAs, cellular phones, and digital cameras to be
attached directly to one another without requiring a
PC host.
The MAX3355E integrates a charge pump and compara-
tors to enable a system with an integrated USB OTG
dual-role transceiver to function as a USB OTG dual-role
device. The MAX3355E’s internal charge pump supplies
VBUS power and signaling as defined in On-the-Go
Supplement: USB 2.0, Revision 1.0. The MAX3355E’s
internal level-detection comparators monitor important
VBUS voltages needed to support SRP and HNP.
Charge Pump
The MAX3355E provides power for the VBUS line using
an internal charge pump. The charge pump provides
an OTG-compliant output on VBUS while sourcing 8mA
load current. The charge pump can be powered from
voltages between +2.6V and +5.5V. A 0.1µF flying
capacitor, connected between C+ and C-, and a 1µF
(min) decoupling reservoir capacitor on VBUS are
required for proper operation.
The charge pump is active if OFFVBUS is connected to
VLand the MAX3355E is configured as device A (ID_IN
connected to GND). To minimize VBUS ripple, select a
reservoir capacitor value between 1µF and 6.8µF. The
charge-pump output is protected from short-circuit con-
ditions on VBUS by an internal current clamp that limits
the VBUS current to 200mA.
Current Generator
An internal current generator injects up to 600µA of cur-
rent onto the VBUS line. The current generator is stable
over the supply voltage variation. The current generator
is connected to VBUS when OFFVBUS and SHDN are 1
and ID_IN is open. It remains connected for tVBUSCHRG
or until the VBUS line voltage exceeds the lower of VCC
and 4.82V.
Comparators
The MAX3355E contains internal comparators for moni-
toring the VBUS voltage. The status of VBUS is summa-
rized in two status outputs: STATUS1 and STATUS2.
The status outputs can be used to negotiate for the
USB OTG bus. The VBUS status is conveyed according
to Table 1. While in shutdown mode, the STATUS2 out-
put can be used to indicate VBUS voltage (Table 2).
Device ID
Configure the MAX3355E as device A by connecting
ID_IN to GND and as device B by leaving ID_IN open
(Table 3). ID_IN is level translated to VLand provided
as an output at ID_OUT. VL sets the logic output high
level. ID_IN is internally pulled up to VCC.
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
_______________________________________________________________________________________ 7
STATUS1 STATUS2 SIGNIFICANCE
00 V
BUS < VTHSESEND
10V
THSESEND < VBUS < VTHSESVLD
01V
THSESVLD < VBUS < VTHVBUSVLD
11 V
BUS > VTHVBUSVLD
Table 1. Status Bit Significance
STATUS1 STATUS2 SIGNIFICANCE
01 V
BUS < VTH,SHDN
00 V
BUS > VTH,SHDN
Table 2. Status Bit Shutdown
Functionality (SHDN = GND)
ID_IN ID_OUT CONFIGURATION
0 0 Device A
Open VLDevice B
Table 3. Device ID
SHDN OFFVBUS ID_IN VBUS CHARGE PUMP COMPARATORS
0XXR
INVBUS Inactive Inactive
10XR
INVBUS Inactive Active
1 1 0 5V Active Active
111R
INVBUS (Note 5) Inactive Active
Table 4. Function Select
Note: The 600µA current source is supplied for tVBUSCHRG (see the Current Generator section).
MAX3355E
OFFVBUS
Connect OFFVBUS to GND to disable VBUS and the
charge pump (Table 4). For normal VBUS operation,
connect OFFVBUS to VL. When OFFVBUS = GND, VBUS
impedance is between 40kΩto 100kΩas defined in On-
the-Go Supplement: USB 2.0, Revision 1.0.
SHDN
The MAX3355E shutdown mode reduces supply current
to less than 1µA. To enter shutdown mode, connect
SHDN to GND. Shutdown mode disables the charge
pump and comparators (Table 4). While in shutdown
mode, the STATUS1 output defaults to logic 0 and STA-
TUS2 indicates VBUS. During shutdown, if VBUS is exter-
nally driven above VTH,SHDN (defined in the Comparators
section), the MAX3355E sinks current from VCC.
Applications Information
±15kV ESD Protection
To protect the MAX3355E against ESD, ID_IN and VBUS
have extra protection against static electricity to protect
the device up to ±15kV. For ±15kV protection on VBUS,
a 1µF capacitor must be connected from VBUS to GND
as close to the device as possible. The ESD structures
withstand high ESD in all states—normal operation,
shutdown, and powered down. ESD protection can be
tested in various ways. The ID_IN input and VBUS are
characterized for protection to the following limits:
1) ±15kV using the Human Body Model
2) ±8kV using the IEC 1000-4-2 Contact Discharge
method
3) ±15kV using the IEC 1000-4-2 Air-Gap Discharge
method
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 1 shows the Human Body Model and Figure 2
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩresistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment. It does not specifi-
cally refer to integrated circuits. The MAX3355E helps
the user design equipment that meets Level 4 of IEC
1000-4-2, without the need for additional ESD-protec-
tion components. The major difference between tests
done using the Human Body Model and IEC 1000-4-2
is a higher peak current in IEC 1000-4-2. This occurs
because series resistance is lower in the IEC 1000-4-2
model. Hence, the ESD withstand voltage measured to
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
8 _______________________________________________________________________________________
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1MΩ
RD
1.5kΩ
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
IP 100%
90%
36.8%
tRL TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
0
AMPERES
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50Ω to 100Ω
RD
330Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 1. Human Body ESD Test Model
Figure 2. Human Body Current Waveform
Figure 3. IEC 1000-4-2 ESD Test Model
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
_______________________________________________________________________________________ 9
Pin Configurations
TOP VIEW
MAX3355E
TOP VIEW
ID_OUT STATUS1 STATUS2
VCC
OFFVBUS SHDN VL
VBUS
A
32 4
1
B
C
C+ C- GND ID_IN
14
13
12
11
10
9
8
1
2
3
4
5
6
7
C+
C-
GND
SHDNOFFVBUS
ID_OUT
VCC
VBUS
MAX3355E
ID_IN
VL
N.C.N.C.
STATUS2
STATUS1
TSSOP UCSP
Chip Information
TRANSISTOR COUNT: 1601
PROCESS: BiCMOS
IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 3 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
contact-discharge method connects the probe to the
device before the probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. After PC board assembly, the Machine
Model is less relevant to I/O ports.
Layout Considerations
The MAX3355E charge-pump switching frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
capacitors and the MAX3355E.
UCSP Applications Information
For the latest application details on UCSP construc-
tion, dimensions, tape-carrier information, printed cir-
cuit board techniques, bump-pad layout, and
recommended reflow temperature profile, as well as
the latest information on reliability testing results, refer
to Maxim Application Note: UCSP–A Wafer-Level
Chip-Scale Package available on Maxim’s web site at
www.maxim-ic.com/ucsp.
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
10 ______________________________________________________________________________________
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
12L, UCSP 4x3.EPS
F
1
1
21-0104
PACKAGE OUTLINE, 4x3 UCSP
MAX3355E Package Code: B12-1
MAX3355E
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11
© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
TSSOP4.40mm.EPS
