DRV DRV101 101 DRV 10 1 SBVS008B - JANUARY 1998 - REVISED MAY 2009 www.ti.com PWM SOLENOID/VALVE DRIVER FEATURES DESCRIPTION HIGH OUTPUT DRIVE: 2.3A WIDE SUPPLY RANGE: +9V to +60V COMPLETE FUNCTION PWM Output Internal 24kHz Oscillator Digital Control Input Adjustable Delay and Duty Cycle Over/Under Current Indicator FULLY PROTECTED Thermal Shutdown with Indicator Internal Current Limit PACKAGES: 7-Lead TO-220 and 7-Lead Surface-Mount DDPAK The DRV101 is a low-side power switch employing a pulse-width modulated (PWM) output. Its rugged design is optimized for driving electromechanical devices such as valves, solenoids, relays, actuators, and positioners. The DRV101 is also ideal for driving thermal devices such as heaters and lamps. PWM operation conserves power and reduces heat rise, resulting in higher reliability. In addition, adjustable PWM allows fine control of the power delivered to the load. Time from dc output to PWM output is externally adjustable. The DRV101 can be set to provide a strong initial closure, automatically switching to a soft hold mode for power savings. Duty cycle can be controlled by a resistor, analog voltage, or digital-to-analog converter for versatility. A flag output indicates thermal shutdown and over/under current limit. A wide supply range allows use with a variety of actuators. The DRV101 is available in a 7-lead staggered TO-220 package and a 7-lead surface-mount DDPAK plastic power package. It is specified over the extended industrial temperature range of -40C to +85C. APPLICATIONS ELECTROMECHANICAL DRIVERS: Solenoids Positioners Actuators High Power Relays/Contactors Valves Clutch/Brake FLUID AND GAS FLOW SYSTEMS INDUSTRIAL CONTROL FACTORY AUTOMATION PART HANDLERS PHOTOGRAPHIC PROCESSING ELECTRICAL HEATERS MOTOR SPEED CONTROL SOLENOID/COIL PROTECTORS MEDICAL ANALYZERS Input On 7 5 Load Thermal Shutdown Over/Under Current 24kHz Oscillator 1 6 Out PWM (TTL-Compatible) Off VS (+9V to +60V) Flag Gnd Delay 4 2 Delay Adjust (electrically connected to tab) 3 Duty Cycle Adjust Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright (c) 1998-2009, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com SPECIFICATIONS At TC = +25C, VS = +24V, Load = 100 || 1000pF, and 4.99k Flag pullup to +5V, unless otherwise noted. DRV101T, F PARAMETER OUTPUT Output Saturation Voltage, Sink Current Limit Under-Scale Current(1) Leakage Current DIGITAL CONTROL INPUT(2) VCTR Low (output disabled) VCTR High (output enabled) ICTR Low (output disabled) ICTR High (output enabled) Propagation Delay DELAY TO PWM(3) Delay Equation(4) Delay Time Minimum Delay Time(5) DUTY CYCLE ADJUST Duty Cycle Range Duty Cycle Accuracy vs Supply Voltage Nonlinearity(6) DYNAMIC RESPONSE Output Voltage Rise Time Output Voltage Fall Time Oscillator Frequency FLAG Normal Operation Fault(7) Sink Current Under-Current Flag: Set Reset Over-Current Flag: Set Reset COMMENTS MIN TYP MAX UNITS 1.9 +0.8 +0.2 2.3 23 0.01 +1 +0.3 3 V V A mA mA IO = 1A IO = 0.1A Output Transistor Off, VS = VO = +60V 0 +2.2 VCTR = 0V VCTR = +5V On-to-Off and Off-to-On TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance, JC 7-Lead DDPAK, 7-Lead TO-220 Thermal Resistance, JA 7-Lead DDPAK, 7-Lead TO-220 +1.2 +5.5 -80 20 2 V V A A s dc to PWM Mode CD = 0.1F CD = 0 Delay to PWM CD * 106 (CD in F) 80 95 110 15 50% Duty Cycle, RPWM = 28.7k 50% Duty Cycle, VS = VO = +9V to +60V 10% to 80% Duty Cycle VO = 10% to 90% of VS VO = 90% to 10% of VS 19 20k Pull-Up to +5V, IO < 1.5A Sinking 1mA VFLAG = 0.4V +4 THERMAL SHUTDOWN Junction Temperature Shutdown Reset from Shutdown POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current 1 10 to 90 2 1 2 5 5 % % % % FSR 1 0.1 24 2.5 2.5 29 s s kHz +4.9 +0.2 2 4 2 2 2 +0.8 +24 +9 3.5 -40 -55 -65 No Heat Sink V V mA s s s s C C +165 +150 IO = 0 s ms s +60 5 V V mA +85 +125 +150 C C C 3 C/W 65 C/W NOTES:(1) Under-scale current for TC < 100C--see Under-Scale Current vs Temperature typical performance curve. (2) Logic High enables output (normal operation). (3) Constant dc output to PWM (pulse-width modulated) time. (4) Maximum delay is determined by an external capacitor. Pulling the Delay Adjust Pin low corresponds to an infinite (continuous) delay. (5) Connecting the Delay Adjust pin to +5V reduces delay time to 3s. (6) VIN at pin 3 to percent of duty cycle at pin 6. (7) A fault results from over-temperature, over-current, or under-current conditions. 2 DRV101 www.ti.com SBVS008B ABSOLUTE MAXIMUM RATINGS(1) CONNECTION DIAGRAMS Top Front View TO-220, DDPAK 7-Lead Stagger-Formed TO-220 1 2 3 4 5 6 7 7-Lead DDPAK Surface-Mount PWM VS Delay Gnd PWM VS NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Vapor-phase or IR reflow techniques are recommended for soldering the DRV101F surface-mount package. Wave soldering is not recommended due to excessive thermal shock and "shadowing" of nearby devices. ELECTROSTATIC DISCHARGE SENSITIVITY 1 2 3 4 5 6 7 In In Supply Voltage, VS .............................................................................. 60V Input Voltage .......................................................................... -0.2V to VS PWM Adjust Input .................................................................. -0.2V to VS Delay Adjust Input ................................................ -0.2V to VS (24V max) Operating Temperature Range ...................................... -40C to +125C Storage Temperature Range ......................................... -65C to +150C Junction Temperature .................................................................... +150C Lead Temperature (soldering, 10s)(2) ........................................... +300C Flag Out Flag Delay Gnd Out NOTE: Tabs are electrically connected to ground (pin 4). This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Ordering Addendum at the end of this data sheet. DRV101 SBVS008B www.ti.com 3 PIN DESCRIPTIONS PIN # NAME DESCRIPTION Pin 1 Input The input is compatible with standard TTL levels. The device output becomes enabled when the input voltage is driven above the typical switching threshold, 1.7V. Below this level, the output is disabled. With no connection to the pin, the input level rises to 3.4V. Input current is 20A when driven high and 80A with the input low. The input may be momentarily driven to the power supply (VS) without damage. Pin 2 Delay Adjust This pin sets the duration of the initial 100% duty cycle before the output goes into PWM mode. Leaving this pin floating results in a delay of approximately 15s, which is internally limited by parasitic capacitance. Minimum delay may be reduced to less than 3s by tying the pin to 5V. This pin connects internally to a 3A current source from VS and to a 3V threshold comparator. When the pin voltage is below 3V, the output device is 100% on. The PWM oscillator is not synchronized to the Input (pin 1), so the first pulse may be extended by any portion of the programmed duty cycle. Pin 3 Duty Cycle Adjust (PWM) Internally, this pin connects to the input of a comparator and a 19k resistor to ground. It is driven by a 200A current source from VS. The voltage at this node linearly sets the duty cycle. Duty cycle can be programmed with a resistor, analog voltage, or output of a D/A converter. The active voltage range is from 0.75V to 3.7V to facilitate the use of single-supply control electronics. At 0.75V (or RPWM = 3.5k), duty cycle is near 90%. Swing to ground should be limited to no lower than 0.1V. PWM frequency is a constant 24kHz. Pin 4 Ground This pin is electrically connected to the package tab. It must be connected to system ground for the DRV101 to function. It carries the 3.5mA quiescent current plus the load current when the device is on. Pin 5 VS This is the power supply pin. Operating range is +9V to +60V. Pin 6 Out The output is the collector of a power npn with the emitter connected to ground. Low power dissipation in the DRV101 is attained by the low saturation voltage and the fast switching transitions. Fall time is less than 75ns, rise time depends on load impedance. Base drive to the power device is limited with light loads to control turn-off delay. The response of this circuit causes the brief dip in saturation voltage after turn on. A flyback diode is needed with inductive loads to conduct the load current during the off cycle. The external diode should be selected for low forward voltage. The internal clamp diode provides protection but shouuld not be used to conduct load currents greater than 0.5A. Pin 7 Flag Normally high (active low), the Flag signals either an over-temperature, over-current, or under-current fault. The over/undercurrent flags are true only when the output is on (constant dc output or the "on" portion of PWM mode). A thermal fault (thermal shutdown) occurs when the die surface reaches approximately 165C and latches until the die cools to 150C. Its output requires a pull-up resistor. It can typically sink two milliamps, sufficient to drive a low-current LED. LOGIC BLOCK DIAGRAM VS (+9V to +60V) Flag 7 5 Load Over/Under Current 6 Out Thermal Shutdown Input 1 PWM On Off 4 Gnd Delay 2 CD 4 Schottky Power Rectifier 3 RPWM DRV101 www.ti.com SBVS008B TYPICAL PERFORMANCE CURVES At TC = +25C and VS = +24V, unless otherwise noted. DUTY CYCLE and DUTY CYCLE ERROR vs VOLTAGE 90 DUTY CYCLE vs TEMPERATURE 8 100 Load = 1A RPWM = 6.04k 6 Duty Cycle (%) 70 4 60 2 Error 50 0 40 -2 30 -4 20 -6 10 -8 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 80 Duty Cycle (%) Duty Cycle Duty Cycle Error (%) 80 60 RPWM = 30.1k RPWM = 100k 40 RPWM = 301k 20 RPWM = 750k 0 4.0 -75 -50 -25 VPWM (V) 25 50 75 100 125 100 125 CURRENT LIMIT vs TEMPERATURE OUTPUT SATURATION VOLTAGE vs TEMPERATURE 2.6 2.5 VS = +9V to +60V 2.0 2.4 IO = 2A Effect of Current-Limit Current Limit (mA) Saturation Voltage (V) 0 Temperature (C) 1.5 IO = 1.5A 1.0 IO = 1A 0.5 IO = 0.5A 2.2 2.0 1.8 IO = 0.1A 1.6 0 -75 -50 -25 0 25 50 75 100 -75 125 -50 -25 QUIESCENT CURRENT vs TEMPERATURE 25 50 75 UNDER-SCALE CURRENT vs TEMPERATURE 3.9 30 VS = +9V 3.7 Under-Scale Current (mA) VS = +60V Quiescent Current (mA) 0 Temperature (C) Temperature (C) VS = +24V 3.5 VS = +9V 3.3 3.1 25 VS = +24V 20 15 Lines represent maximum current before under-current Flag occurs. Under-current Flag may not occur for case temperature above 100C. 10 5 VS = +60V 0 -75 -50 -25 0 25 50 75 100 125 -75 Temperature (C) -25 0 25 50 75 100 125 Temperature (C) DRV101 SBVS008B -50 www.ti.com 5 TYPICAL PERFORMANCE CURVES (CONT) At TC = +25C and VS = +24V, unless otherwise noted. FLAG OPERATION OVER-CURRENT LIMIT (VS = +60V, CD = 110pF, RPWM = 750k) FLAG OPERATION UNDER-CURRENT (VS = +24V, CD = 110pF, RPWM = 6.04k) 4V Onset of current limit 40V VIN VOUT 60V 20V No Load 2V 0 Flag only on during constant output or "ON" portion of PWM mode 0 Flag only set during constant output mode or "ON" portion of PWM mode 2V 4V VFLAG VFLAG 4V 2V 0 0 Constant Output PWM Mode 25s/div 50s/div DC TO PWM MODE DRIVING INDUCTIVE LOAD (VS = +60V, CD = 110pF, RPWM = 301k) DUTY CYCLE UNDERSHOOT Load = 1A 30V VOUT VOUT 60V 40V Non-optimized Layout 30V See Duty Cycle Undershoot curve for detail 1A VOUT 0V IGND 10V 0 20V 2A 20V 0 20V 10V Clean Layout 0 Inductive load ramp current 1s/div 50s/div TYPICAL SOLENOID CURRENT WAVEFORM (VS = +24V) OSCILLATOR FREQUENCY vs TEMPERATURE 1A Solenoid Motion Period { 0.5A PWM Mode 0 Oscillator Frequency (kHz) 24.2 24.0 VS = +9V 23.8 23.6 VS = +60V Solenoid Closure 23.4 -75 -55 -35 25ms/div -15 5 25 45 65 85 105 125 Temperature (C) 6 DRV101 www.ti.com SBVS008B TYPICAL PERFORMANCE CURVES (CONT) At TC = +25C and VS = +24V, unless otherwise noted. MINIMUM DELAY TO PWM vs TEMPERATURE NOMINAL DELAY TIME TO PWM vs TEMPERATURE 22 104 20 102 VS = +9V V VSS == +24V +24V 100 19 98 Delay (ms) Delay (s) CD = 0.1F No connection to Delay Adjust pin (CD = 0) 21 18 17 16 VS = +60V VS = +24V VS = +60V 96 94 92 15 VS = +9V 90 14 88 -75 -50 -25 0 25 50 75 100 125 -75 Temperature (C) -25 0 25 50 75 100 125 Temperature (C) DRV101 SBVS008B -50 www.ti.com 7 BASIC OPERATION by a resistor, analog voltage, or D/A converter. Figure 1b provides an example timing diagram with the Delay Adjust pin connected to 0.1F and duty cycle set for 25%. See the "Delay Adjust" and "Duty Cycle Adjust" text for equations and further explanation. The DRV101 is a low-side, bipolar power switch employing a pulse-width modulated (PWM) output for driving electromechanical and thermal devices. Its design is optimized for two types of applications; a two-state driver (open/close) for loads such as solenoids and actuators, and a linear driver for valves, positioners, heaters, and lamps. Its wide supply range, adjustable delay to PWM mode, and adjustable duty cycle make it suitable for a wide range of applications. Figure 1 shows the basic circuit connections to operate the DRV101. A 0.1F bypass capacitor is shown connected to the power supply pin. Ground (pin 4) is electrically connected to the package tab. This pin must be connected to system ground for the DRV101 to function. This serves as the load current path to ground, as well as the DRV101 reference ground. The load (solenoid, valve, etc.) is connected between the supply (pin 5) and output (pin 6). For an inductive load, an external diode across the output is required as shown in Figure 1a. The diode serves to maintain the hold force during PWM operation. For remotely located loads, the external diode should be placed close to the DRV101 (Figure 1a). The internal clamp diode between the output and ground should not be used to carry load current. The Input (pin 1) is compatible with standard TTL levels. Input voltages between +2.2V and +5.5V turn the device output on, while pulling the pin low (0V to +1.2V), shuts the DRV101 output off. Input current is typically 80A. Delay Adjust (pin 2) and Duty Cycle Adjust (pin 3) allow external adjustment of the PWM output signal. The Delay Adjust pin can be left floating for minimum delay to PWM mode (typically 15s) or a capacitor can be used to set the delay time. Duty cycle of the PWM output can be controlled The Flag (pin 7) provides fault status for under-current, over-current, and thermal shutdown conditions. This pin is active low with pin voltage typically +0.3V during a fault condition. A small value capacitor may be needed between Flag and ground for noisy applications. Basic Circuit Connections VS 0.1F Flag 7 5 (1) Load Thermal Shutdown Over/Under Current 6 24kHz Oscillator (a) Input 1 Out PWM (TTL-Compatible) Gnd Delay On 4 Off 2 CD (electrically connected to tab) 3 Delay Adjust RPWM Duty Cycle Adjust NOTE: (1) External flyback diode required for inductive loads to conduct load current during the off cycle. For remotely located loads, diode should be placed close to the DRV101. Motorola MSRS1100T3 (1A, 100V), MBRS360T3 (3A, 60V) Simplified Timing Diagram CD = 0.1F (95ms constant dc output before PWM) RPWM = 130k *** +2.2V to +5.5V INPUT 0V to +1.2V (b) VS OUTPUT *** CD = 0.1F 95ms 0 tON tON 10.4s tP 41.6s (1/24kHz) t Duty Cycle = ON = 25% tP tP Initial dc Output (set by value of CD) RPWM = 130k PWM Mode (resistor or voltage controlled) FIGURE 1. Basic Circuit Connections and Timing Diagram. 8 DRV101 www.ti.com SBVS008B APPLICATIONS INFORMATION POWER SUPPLY The DRV101 operates from a single +9V to +60V supply with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the Typical Performance Curves. ADJUSTABLE DUTY CYCLE The DRV101's externally adjustable duty cycle provides an accurate means of controlling power delivered to the load. Duty cycle can be set from 10% to 100% with an external resistor, analog voltage, or the output of a D/A converter. Reduced duty cycle results in reduced power dissipation. This keeps the DRV101 and load cooler, resulting in increased reliability for both devices. PWM frequency is a constant 24kHz. ADJUSTABLE INITIAL 100% DUTY CYCLE Resistor Controlled Duty Cycle A unique feature of the DRV101 is its ability to provide an initial constant dc output (100% duty cycle) and then switch to PWM mode to save power. This function is particularly useful when driving solenoids which have a much higher pull-in current requirement than hold requirement. Duty cycle is easily programmed with a resistor (RPWM) connected between the Duty Cycle Adjust pin and ground. Increased resistor values correspond to decreased duty cycles. Table II provides resistor values for typical duty cycles. Resistor values for additional duty cycles can be obtained from Figure 3. For reference purposes, the equation for calculating RPWM is included in Figure 3. The duration of this constant dc output (before PWM output begins) can be externally controlled with a capacitor connected from Delay Adjust (pin 2) to ground according to the following equation: DUTY CYCLE RESISTOR(1) RPWM (k) VOLTAGE(2) VPWM (V) 10 20 30 40 50 60 70 80 90 976 205 84.5 46.4 28.7 18.2 11.8 7.50 4.87 3.7 3.4 3.0 2.6 2.2 1.75 1.35 1.00 0.75 Delay Time CD * 106 (time in seconds, CD in Farads) Leaving the Delay Adjust pin open results in a constant output time of approximately 15s. The duration of this initial output can be reduced to less than 3s by connecting the pin to 5V. Table I provides examples of desired "delay" times (constant output before PWM mode) and the appropriate capacitor values or pin connection. CONSTANT OUTPUT DURATION CD 3s 15s 100s 1ms 100ms Pin connected to 5V Pin open 100pF 1nF 0.1F NOTES: (1) Resistor values listed are nearest 1% standard values. (2) Do not drive pin below 0.1V. For additional values, see "Duty Cycle vs Voltage" typical performance curve. TABLE II. Duty Cycle Adjust. TA= +25C, VS = +24V. 1000 TABLE I. Delay Adjust Pin Connections. The internal Delay Adjust circuitry is composed of a 3A current source and a 3V comparator as shown in Figure 2. Thus, when the pin voltage is less than 3V, the output device is 100% on (dc output mode). RPWM (k) 100 10 1 10 20 DRV101 VS 40 60 80 100 Duty Cycle (%) 3V Reference RPWM = [ a + b (DC) + c (DC)2 + d (DC)3 + e (DC)4]-1 where: a = 2.4711 x 10-6 b = -5.2095 x 10-7 c = 4.4576 x 10-8 Comparator 3A d = -7.6427 x 10-10 e = 6.8039 x 10-12 DC = duty cycle in % For 50% duty cycle: RPWM = [2.4711 x 10-6 + (-5.2095 x 10-7) (50) + (4.4576 x 10-8) (50)2 + (-7.6427 x 10-10) (50)3 + (6.8039 x 10-12) (50)4]-1 2 Delay Adjust CD = 28.7k FIGURE 2. Simplified Circuit Model of the Delay Adjust Pin. FIGURE 3. RPWM vs Duty Cycle. DRV101 SBVS008B www.ti.com 9 Voltage Controlled Duty Cycle STATUS FLAG Duty cycle can also be programmed with an analog voltage, VPWM. With VPWM 0.75V, duty cycle is near 90%. Increasing this voltage results in decreased duty cycles. Table II provides VPWM values for typical duty cycles. See the "Duty Cycle vs Voltage" Typical Performance Curve for additional duty cycles. Flag (pin 7) provides fault indication for under-current, over-current, and thermal shutdown conditions. During a fault condition, Flag output is driven low (pin voltage typically drops to 0.3V). A pull-up resistor, as shown in Figure 6, is required to interface with standard logic. A small value capacitor may be needed between Flag and ground in noisy applications. The Duty Cycle Adjust pin should not be driven below 0.1V. If the voltage source used can go between 0.1V and ground, a series resistor between the voltage source and the Duty Cycle Adjust pin (Figure 4) is required to limit swing. If the pin is driven below 0.1V, the output will be unpredictable. VS Figure 6 gives an example of a non-latching fault monitoring circuit, while Figure 7 provides a latching version. The Flag pin can sink several milliamps, sufficent to drive external logic circuitry or an LED (Figure 8) to indicate when a fault has occurred. In addition, the Flag pin can be used to turn off other DRV101's in a system for chain fault protection. 5 DRV101 6 +5V Out 5k Pull-Up PWM TTL or HCT 4 VPWM 3 Flag D/A Converter (or analog voltage) 1k(1) 7 Thermal Shutdown Over/Under Current 6 Out NOTE: (1) Required if voltage source can go below 0.1V. FIGURE 4. Using a Voltage to Program Duty Cycle. 4 DRV101 The DRV101's internal 24kHz oscillator sets the PWM period. This frequency is not externally adjustable. Duty Cycle Adjust (pin 3) is internally driven by a 200A current source and connects to the input of a comparator and a 19k resistor as shown in Figure 5. The DRV101's PWM control design is inherently monotonic. That is, a decreased voltage (or resistor value) always produces an increased duty cycle. FIGURE 6. Non-Latching Fault Monitoring Circuit. +5V 74XX76A VS 3.8V f = 24kHz Flag Q Flag Q Flag Reset 20k J CLR CLK (1) 0.7V GND K VS Comparator 200A Flag 7 Thermal Shutdown Over/Under Current 19k 6 Out DRV101 3 Duty Cycle Adjust DRV101 Resistor or Voltage Source(1) 4 NOTE: (1) Small capacitor (10pF) may be required in noisy environments. NOTE: (1) Do not drive pin below 0.1V. FIGURE 5. Simplified Circuit Model of the Duty Cycle Adjust Pin. 10 FIGURE 7. Latching Fault Monitoring Circuit. DRV101 www.ti.com SBVS008B An under-current fault occurs when the output current is below the under-scale current threshold (typically 23mA). For example, this function indicates when the load is disconnected. Again, the flag output is not latched, so an undercurrent condition during PWM mode will produce a flag output that is modulated by the PWM waveform. An initial, brief under-current flag normally appears driving inductive loads and may be avoided by adding a parallel resistor sufficient to move the initial current above the under-current threshold. An under-current flag may not appear for case temperatures above 100C. Avoid adding capacitance to pin 6 (Out) as it may cause momentary current limiting. +5V 5k (LED) HLMP-Q156 Flag 7 Thermal Shutdown Over/Under Current 6 Out Over-Temperature Fault 4 DRV101 A thermal fault occurs when the die reaches approximately 165C, producing a similar effect as pulling the input low. Internal shutdown circuitry disables the output and resets the Delay Adjust pin. The Flag is latched in the low state (fault condition) until the die has cooled to approximately 150C. A thermal fault can occur in any mode of operation. Recovery from thermal fault will start in delay mode (constant dc output). FIGURE 8. LED to Indicate Fault Condition. Over/Under Current Fault An over-current fault occurs when the output current is greater than approximately 2.3A. The status flag is not latched. Since current during PWM mode is switched on and off, the flag output will be modulated with PWM timing (see flag waveforms in the Typical Performance Curves). PACKAGE MOUNTING Figure 9 provides recommended PCB layouts for both the TO-220 and DDPAK power packages. The tab of both packages is electrically connected to ground (pin 4). It may be desirable to isolate the tab of TO-220 package from its mounting surface with a mica (or other film) insulator (see 7-Lead DDPAK(1) KTW Package(2) 7-Lead TO-220 KVT Package(2) 0.45 0.04 0.2 0.05 0.085 0.15 0.335 0.51 0.05 0.035 0.105 Mean dimensions in inches. Refer to end of data sheet for tolerances and detailed package drawings. NOTES: (1) For improved thermal performance increase footprint area. See Figure 11, Thermal Resistance vs Circuit Board Copper Area. (2) Refer to the mechanical drawings at the end of this document. FIGURE 9. TO-220 and DDPAK Solder Footprints. DRV101 SBVS008B www.ti.com 11 THERMAL RESISTANCE vs ALUMINUM PLATE AREA Aluminum Plate Area Thermal Resistance JA (C/W) 18 Vertically Mounted in Free Air Flat, Rectangular Aluminum Plate 16 14 0.030in Al 12 0.050in Al 10 Aluminum Plate Thickness 0.062in Al 8 0 1 2 3 4 5 6 7 Optional mica or film insulator for electrical isolation. Adds DRV101 approximately 1C/W. TO-220 Package 8 Aluminum Plate Area (inches2) FIGURE 10. TO-220 Thermal Resistance vs Aluminum Plate Area. THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA Thermal Resistance, JA (C/W) 50 DRV101 DDPAK Surface-Mount Package 1oz. copper 40 Circuit Board Copper Area 30 20 10 0 0 1 2 3 4 DRV101 DDPAK Surface-Mount Package 5 Copper Area (inches2) FIGURE 11. DDPAK Thermal Resistance vs Circuit Board Copper Area. Figure 10). For lowest overall thermal resistance, it is best to isolate the entire heat sink/DRV101 structure from the mounting surface rather than to use an insulator between the semiconductor and heat sink. For best thermal performance, the tab of the DDPAK surface-mount version should be soldered directly to a circuit board copper area. Increasing the copper area improves heat dissipation. Figure 11 shows typical thermal resistance from junction-to-ambient as a function of the copper area. POWER DISSIPATION Power dissipation depends on power supply, signal, and load conditions. Power dissipation is equal to the product of output current times the voltage across the conducting output transistor times the duty cycle. Power dissipation can be minimized by using the lowest possible duty cycle necessary to assure the required hold force. Application Bulletin AB-039 explains how to calculate or measure power dissipation with unusual signals and loads. THERMAL PROTECTION Power dissipated in the DRV101 will cause the junction temperature to rise. The DRV101 has thermal shutdown circuitry that protects the device from damage. The thermal 12 protection circuitry disables the output when the junction temperature reaches approximately +165C, allowing the device to cool. When the junction temperature cools to approximately +150C, the output circuitry is again enabled. Depending on load and signal conditions, the thermal protection circuit may cycle on and off. This limits the dissipation of the amplifier but may have an undesirable effect on the load. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to +125C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered. Use worst-case load and signal conditions. For good reliability, thermal protection should trigger more than 40C above the maximum expected ambient condition of your application. This produces a junction temperature of 125C at the maximum expected ambient condition. The internal protection circuitry of the DRV101 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the DRV101 into thermal shutdown will degrade reliability. DRV101 www.ti.com SBVS008B HEAT SINKING Heat Sink Selection Example Most applications will not require a heat sink to assure that the maximum operating junction temperature (125C) is not exceeded. However, junction temperature should be kept as low as possible for increased reliability. Junction temperature can be determined according to the equation: A TO-220 package is dissipating 5 Watts. The maximum expected ambient temperature is 35C. Find the proper heat sink to keep the junction temperature below 125C. TJ = TA = PD = JC = CH = HA = JA = TJ = TA + PDJA (1) where, JA = JC + CH + HA (2) Junction Temperature (C) Ambient Temperature (C) Power Dissipated (W) Junction-to-Case Thermal Resistance (C/W) Case-to-Heat Sink Thermal Resistance (C/W) Heat Sink-to-Ambient Thermal Resistance (C/W) Junction-to-Air Thermal Resistance (C/W) Figure 12 shows maximum power dissipation versus ambient temperature with and without the use of a heat sink. Using a heat sink significantly increases the maximum power dissipation at a given ambient temperature as shown. Power Dissipation (Watts) TO-220 with Thermalloy 6030B Heat Sink JA = 16.7C/W 8 PD = (TJ (max) - TA) / JA TJ (max) = 125C With infinite heat sink ( JA = 3C/W), max PD = 33W at TA = 25C 6 DDPAK JA = 26C/W (3 in2 one oz copper mounting pad) 4 DDPAK or TO-220 JA = 65C/W (no heat sink) 0 25 50 75 100 (3) HA = TJ - TA - ( JC + CH ) PD HA = 125 C - 35 C - (3 C/ W + 1 C/ W ) = 14 C/ W 5W (4) Another variable to consider is natural convection versus forced convection air flow. Forced-air cooling by a small fan can lower CA (CH + HA) dramatically. Heat sink manufacturers provide thermal data for both of these cases. For additional information on determining heat sink requirements, consult Application Bulletin AB-038. 2 0 TJ = TA + PD(JC + CH + HA) TJ, TA, and PD are given. JC is provided in the specification table, 3C/W. CH can be obtained from the heat sink manufacturer. Its value depends on heat sink size, area, and material used. Semiconductor package type, mounting screw torque, insulating material used (if any), and thermal joint compound used (if any) also affect CH. A typical CH for a TO-220 mounted package is 1C/W. Now we can solve for HA: To maintain junction temperature below 125C, the heat sink selected must have a HA less than 14C/W. In other words, the heat sink temperature rise above ambient must be less than 70C (14C/W x 5W). For example, at 5 Watts Thermalloy model number 6030B has a heat sink temperature rise of 66C above ambient (HA = 66C/5W = 13.2C/W), which is below the 70C required in this example. Figure 12 shows power dissipation versus ambient temperature for a TO-220 package with a 6030B heat sink. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE 10 Combining Equations 1 and 2 gives: 125 As mentioned earlier, once a heat sink has been selected, the complete design should be tested under worst-case load and signal conditions to ensure proper thermal protection. Ambient Temperature (C) FIGURE 12. Maximum Power Dissipation vs Ambient Temperature. The difficulty in selecting the heat sink required lies in determining the power dissipated by the DRV101. For dc output into a purely resistive load, power dissipation is simply the load current times the voltage developed across the conducting output transistor times the duty cycle. Other loads are not as simple. Consult Application Bulletin AB-039 for further insight on calculating power dissipation. Once power dissipation for an application is known, the proper heat sink can be selected. DRV101 SBVS008B www.ti.com 13 APPLICATION CIRCUITS Pinch Valve +5V Flexible Tube 5k Flag VS (+9V to +60V) Plunger 7 5 Thermal Shutdown Over/Under Current Out 24kHz Oscillator Microprocessor TTL Control Input 1 Solenoid Coil 6 Can drive most types of solenoid-actuated valves and actuators PWM Gnd On Delay 4 DRV101 Off 2 Delay Adjust 3 CD RPWM Duty Cycle Adjust(1) (10% to 100%) NOTE: (1) Duty cycle can be programmed by a resistor, analog voltage, or D/A converter. Do not drive below 0.1V. FIGURE 13. Fluid Flow Control System. VS VS Brighter light results in increased duty cycle 5 (1) Coil DRV101 5 Lamp DRV101 6 6 Input (On/Off) 1 On/Off 4 4 3 100 Aimed at ambient light Cadmium Sulfide Optical Detector (Clairex CL70SHL or CLSP5M) Duty Cycle Adjust 4-20mA 187 10k NOTE: (1) Rectifier diode required for inductive loads to conduct load current during the off cycle. FIGURE 14. Instrument Light Dimmer Circuit. 14 FIGURE 15. 4-20mA Input to PWM Output. DRV101 www.ti.com SBVS008B Higher temperature results in lower duty cycle (a) VS Heating Element Thermistor 5 DRV101 6 1 R1 On/Off 4 R2 3 Duty Cycle Adjust 10F (b) VS REF200 0.1F 7, 8 Heating Element 5 DRV101 100A 100A 1 2 6 1 On/Off 4 2 3 2F Film NC 0.1F VS 7 1k Duty Cycle Adjust 6 2 OPA134 10M 3 4 10k 4.7V Temperature Control or Thermistor 5k at +25C IN4148(1) Integrator improves accuracy NOTE: (1) Or any common silicon diode suited to the mechanical mounting requirements. 20k FIGURE 16. Temperature Controller. DRV101 SBVS008B www.ti.com 15 +12V dc Tachometer Coupled to Motor 5 M DRV101 T 6 Input (On/Off) 1 4 3 Duty Cycle Speed Control(1) R1 R2 NOTE: (1) Select R1/R2 ratio based on tachometer output voltage. FIGURE 17. Constant Speed Motor Control. +40V 5 M DC Motor 6 Open circuit will provide 3.4V "on" signal DRV101 1 4 2 40k Speed Control Input 0V to +10V +15V 3 Duty Cycle Adjust Delay Adjust 0.5F 1k +15V 22k 470k 1nF 100k Frequency In 2N2222 T VOUT One-Shot 47k 10k AC Tachometer VFC32 Coupled to Motor -15V 5nF NP0 FIGURE 18. DC Motor Speed Control Using AC Tachometer. 16 DRV101 www.ti.com SBVS008B Only one DRV101 is turned on at sequence time Phase 2 Stepper Logic In DRV101 +VS M Phase 1 Stepper Logic In DRV101 Phase 3 Stepper Logic In DRV101 FIGURE 19. Three-Phase Stepper Motor Driver Provides High-Stepping Torque. VS 5 Lamp DRV101 VS = +9V to +60V 6 R1 1 R2 Select R1 and R2 to divide down VS to 5.5V max. For example: with VS = 60V R1 = 11k, R2 = 1k VIN = 1k * 60V = 5V 1k + 11k 4 3 R3 4.87k C1 20F Duty Cycle Adjust after soft start + 4.3V DIN5229 Sets start-up duty cycle R4 4.87k FIGURE 20. Soft-Start Circuit for Incandescent Lamps and Other Sensitive Loads. DRV101 SBVS008B www.ti.com 17 +12V 5 20 (10W) DRV101 P-Channel MOSFET IRF4905 6 12V 70A Load 4 FIGURE 21. High Power, High-Side Driver. +12V 1.4k 12 (20W) 5 1 Load DRV101 N-Channel MOSFET IRFZ48N 6 1k 12V 50A Out 4 2 3 CD(1) RPWM(2) NOTES: (1) CD controls "OFF" time (turn-on delay). (2) Duty cycle is inverted. FIGURE 22. High Power, Time Delay, Low-Side Driver. VS +12V Load 120 (2W) 750 5 2N3725A DRV101 6 2N3725A 480V 27A N-Channel IGBT IRGPC50F MPSA56 4 NOTE: Duty cycle is inverted. For example, to achieve 25% duty cycle, program 75%. FIGURE 23. Very High Power, Low-Side Driver. 18 DRV101 www.ti.com SBVS008B +170V 0.1F 2.7k 200 5 2N3725A DRV101 +5V 1 6 6 + DCP010512 12V - 2 5 MPSA56 1 P-Channel MOSFET IRF9640 0.1F Control In 4 2k 4N32 Optocoupler 2 CD Load 3 RPWM FIGURE 24. Isolated High-Side Driver. DRV101 SBVS008B www.ti.com 19 Revision History DATE REVISION 5/09 B PAGE SECTION 1 Front Page 11 Package Mounting DESCRIPTION Updated front page appearance. Changed Figure 9 to show TI package designator. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 20 DRV101 www.ti.com SBVS008B PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) DRV101F/500 LIFEBUY DDPAK/ TO-263 KTW 7 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 DRV101F DRV101FKTWT LIFEBUY DDPAK/ TO-263 KTW 7 250 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 85 DRV101F DRV101FKTWTG3 LIFEBUY DDPAK/ TO-263 KTW 7 250 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 85 DRV101F DRV101T LIFEBUY TO-220 KVT 7 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 DRV101T DRV101TG3 LIFEBUY TO-220 KVT 7 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 DRV101T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DRV101F/500 DDPAK/ TO-263 KTW 7 500 330.0 24.4 DRV101FKTWT DDPAK/ TO-263 KTW 7 250 330.0 24.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.95 16.5 5.15 16.0 24.0 Q2 10.6 15.6 4.9 16.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV101F/500 DDPAK/TO-263 KTW 7 500 346.0 346.0 41.0 DRV101FKTWT DDPAK/TO-263 KTW 7 250 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MPSF015 - AUGUST 2001 KTW (R-PSFM-G7) PLASTIC FLANGE-MOUNT 0.410 (10,41) 0.385 (9,78) 0.304 (7,72) -A- 0.006 -B- 0.303 (7,70) 0.297 (7,54) 0.0625 (1,587) H 0.055 (1,40) 0.0585 (1,485) 0.300 (7,62) 0.064 (1,63) 0.045 (1,14) 0.252 (6,40) 0.056 (1,42) 0.187 (4,75) 0.370 (9,40) 0.179 (4,55) 0.330 (8,38) H 0.296 (7,52) A 0.605 (15,37) 0.595 (15,11) 0.012 (0,305) C 0.000 (0,00) 0.019 (0,48) 0.104 (2,64) 0.096 (2,44) H 0.017 (0,43) 0.050 (1,27) C C F 0.034 (0,86) 0.022 (0,57) 0.010 (0,25) M B 0.026 (0,66) 0.014 (0,36) 0~3 AM C M 0.183 (4,65) 0.170 (4,32) 4201284/A 08/01 NOTES: A. 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