DATASHEET
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2 ICS9DB803D
IDT®
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2 1
ICS9DB803D REV N 071013
General Description
The ICS9DB803D is compatible with the Intel DB800v2
Differential Buffer Specification. This buffer provides 8
PCI-Express Gen2 clocks. The ICS9DB803D is driven by a
differential output pair from a CK410B+, CK505 or CK509B
main clock generator.
Recommended Application
DB800v2 compatible part with PCIe Gen1 and Gen2
Support
Output Features
8 - 0.7V current-mode differential output pairs
Supports zero delay buffer mode and fanout mode
Bandwidth programming available
50-100 MHz operation in PLL mode
50-400 MHz operation in Bypass mode
Features/Benefits
Spread spectrum modulation tolerant, 0 to -0.5% down
spread and +/- 0.25% center spread
Supports undriven differential outputs in PD# and
SRC_STOP# modes for power management
Key Specifications
Outputs cycle-cycle jitter < 50ps
Output to Output skew <50ps
Phase jitter: PCIe Gen1 < 86ps peak to peak
Phase jitter: PCIe Gen2 < 3.0/3.1ps rms
Functional Block Diagram
Note: Polarities shown are for OE_INV=0.
STOP
LOGIC
SRC_IN
SRC_IN#
DIF(7:0))
CONTROL
LOGIC
BYPASS#/PLL
SDATA
SCLK
PD#
SPREAD
COMPATIBLE
PLL
8
IREF
OE_(7:0)
8
LO C K
SRC_STOP#
HIGH_BW#
M
U
X
ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Pin Configuration
Power Groups
Polarity Inversion Pin List Table
SRC_DIV# 1 48 VDDA SRC_DIV# 1 48 VDDA
VDDR 2 47 GNDA VDDR 2 47 GNDA
GND 3 46 IREF GND 3 46 IREF
SRC_IN 4 45 LOCK SRC_IN 4 45 LOCK
SRC_IN# 5 44 OE_7 SRC_IN# 5 44 OE7#
OE_0 6 43 OE_4 OE0# 643
OE4#
OE_3 7 42 DIF_7 OE3# 742DIF_7
DIF_0 8 41 DIF_7# DIF_0 8 41 DIF_7#
DIF_0# 9 40 OE_INV DIF_0# 9 40 OE_INV
GND 10 39 VDD GND 10 39 VDD
VDD 11 38 DIF_6 VDD 11 38 DIF_6
DIF_112 37DIF_6# DIF_112 37DIF_6#
DIF_1# 13 36 OE_6 DIF_1# 13 36 OE6#
OE_1 14 35 OE_5 OE1# 14 35 OE5#
OE_2 15 34 DIF_5 OE2# 15 34 DIF_5
DIF_216 33DIF_5# DIF_216 33DIF_5#
DIF_2# 17 32 GND DIF_2# 17 32 GND
GND 18 31 VDD GND 18 31 VDD
VDD 19 30 DIF_4 VDD 19 30 DIF_4
DIF_320 29DIF_4# DIF_320 29DIF_4#
DIF_3# 21 28 HIGH_BW# DIF_3# 21 28 HIGH_BW#
BYPASS#/PLL 22 27 DIF_STOP# BYPASS#/PLL 22 27 DIF_STOP
SCLK 23 26 PD# SCLK 23 26 PD
SDATA 24 25 GND SDATA 24 25 GND
OE_INV = 0 OE_INV = 1
ICS9DB803
(Same as ICS9DB108)
ICS9DB803
(Same as ICS9DB801)
VDD GND
2 3 SRC_IN/SRC_IN#
6,11,19,
31,39 10,18, 25,32 DIF(7:0)
N/A 47 IREF
48 47 Analog VDD & GND for PLL core
Description
Pin Number
01
6OE_0OE_0#
7OE_3OE_3#
14 OE_1 OE_1#
15 OE_2 OE_2#
26 PD# PD
27 DIF_STOP# DIF_STOP
35 OE_5 OE_5#
36 OE_6 OE_6#
43 OE_4 OE_4#
44 OE_7 OE_7#
OE_INV
Pins
ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Pin Descriptions for OE_INV=0
PIN # PIN NAME PIN TYPE DESCRIPTION
1SRC_DIV# IN Active low Input for determining SRC output frequency SRC or SRC/2.
0 = SRC/2, 1= SRC
2VDDR PWR 3.3V power for differential input clock (receiver). This VDD should be
treated as an analog power rail and filtered appropriately.
3 GND PWR Ground pin.
4 SRC_IN IN 0.7 V Differential SRC TRUE input
5 SRC_IN# IN 0.7 V Differential SRC COMPLEMENTARY input
6OE_0 IN Active high input for enabling output 0.
0 =disable outputs, 1= enable outputs
7OE_3 IN Active high input for enabling output 3.
0 =disable outputs, 1= enable outputs
8 DIF_0 OUT 0.7V differential true clock output
9 DIF_0# OUT 0.7V differential Complementary clock output
10 GND PWR Ground pin.
11 VDD PWR Power supply, nominal 3.3V
12 DIF_1 OUT 0.7V differential true clock output
13 DIF_1# OUT 0.7V differential Complementary clock output
14 OE_1 IN Active high input for enabling output 1.
0 =disable outputs, 1= enable outputs
15 OE_2 IN Active high input for enabling output 2.
0 =disable outputs, 1= enable outputs
16 DIF_2 OUT 0.7V differential true clock output
17 DIF_2# OUT 0.7V differential Complementary clock output
18 GND PWR Ground pin.
19 VDD PWR Power supply, nominal 3.3V
20 DIF_3 OUT 0.7V differential true clock output
21 DIF_3# OUT 0.7V differential Complementary clock output
22 BYPASS#/PLL IN Input to select Bypass(fan-out) or PLL (ZDB) mode
0 = Bypass mode, 1= PLL mode
23 SCLK IN Clock pin of SMBus circuitry, 5V tolerant.
24 SDATA I/O Data pin for SMBus circuitry, 5V tolerant.
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Pin Descriptions for OE_INV=0 (cont.)
PIN # PIN NAME PIN TYPE DESCRIPTION
25 GND PWR Ground pin.
26 PD# IN
Asynchronous active low input pin used to power down the
device. The internal clocks are disabled and the VCO and
the crystal osc. (if any) are stopped.
27 DIF_STOP# IN Active low input to stop differential output clocks.
28 HIGH_BW# PWR 3.3V input for selecting PLL Band Width
0 = High, 1= Low
29 DIF_4# OUT 0.7V differential Complementary clock output
30 DIF_4 OUT 0.7V differential true clock output
31 VDD PWR Power supply, nominal 3.3V
32 GND PWR Ground pin.
33 DIF_5# OUT 0.7V differential Complementary clock output
34 DIF_5 OUT 0.7V differential true clock output
35 OE_5 IN Active high input for enabling output 5.
0 =disable outputs, 1= enable outputs
36 OE_6 IN Active high input for enabling output 6.
0 =disable outputs, 1= enable outputs
37 DIF_6# OUT 0.7V differential Complementary clock output
38 DIF_6 OUT 0.7V differential true clock output
39 VDD PWR Power supply, nominal 3.3V
40 OE_INV IN This latched input selects the polarity of the OE pins.
0 = OE pins active high, 1 = OE pins active low (OE#)
41 DIF_7# OUT 0.7V differential Complementary clock output
42 DIF_7 OUT 0.7V differential true clock output
43 OE_4 IN Active high input for enabling output 4.
0 =disable outputs, 1= enable outputs
44 OE_7 IN Active high input for enabling output 7.
0 =disable outputs, 1= enable outputs
45 LOCK OUT 3.3V output indicating PLL Lock Status. This pin goes high
when lock is achieved.
46 IREF IN
This pin establishes the reference for the differential current-
mode output pairs. It requires a fixed precision resistor to
ground. 475ohm is the standard value for 100ohm
differential impedance. Other impedances require different
values. See data sheet.
47 GNDA PWR Ground pin for the PLL core.
48 VDDA PWR 3.3V power for the PLL core.
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EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Pin Descriptions for OE_INV=1
PIN # PIN NAME PIN TYPE DESCRIPTION
1SRC_DIV# IN Active low Input for determining SRC output frequency SRC or SRC/2.
0 = SRC/2, 1= SRC
2VDDR PWR 3.3V power for differential input clock (receiver). This VDD should be
treated as an analog power rail and filtered appropriately.
3 GND PWR Ground pin.
4 SRC_IN IN 0.7 V Differential SRC TRUE input
5 SRC_IN# IN 0.7 V Differential SRC COMPLEMENTARY input
6OE0# IN Active low input for enabling DIF pair 0.
1 =disable outputs, 0 = enable outputs
7OE3# IN Active low input for enabling DIF pair 3.
1 =disable outputs, 0 = enable outputs
8 DIF_0 OUT 0.7V differential true clock output
9 DIF_0# OUT 0.7V differential Complementary clock output
10 GND PWR Ground pin.
11 VDD PWR Power supply, nominal 3.3V
12 DIF_1 OUT 0.7V differential true clock output
13 DIF_1# OUT 0.7V differential Complementary clock output
14 OE1# IN Active low input for enabling DIF pair 1.
1 =disable outputs, 0 = enable outputs
15 OE2# IN Active low input for enabling DIF pair 2.
1 =disable outputs, 0 = enable outputs
16 DIF_2 OUT 0.7V differential true clock output
17 DIF_2# OUT 0.7V differential Complementary clock output
18 GND PWR Ground pin.
19 VDD PWR Power supply, nominal 3.3V
20 DIF_3 OUT 0.7V differential true clock output
21 DIF_3# OUT 0.7V differential Complementary clock output
22 BYPASS#/PLL IN Input to select Bypass(fan-out) or PLL (ZDB) mode
0 = Bypass mode, 1= PLL mode
23 SCLK IN Clock pin of SMBus circuitry, 5V tolerant.
24 SDATA I/O Data pin for SMBus circuitry, 5V tolerant.
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Pin Descriptions for OE_INV=1 (cont.)
PIN # PIN NAME PIN TYPE DESCRIPTION
25 GND PWR Ground pin.
26 PD IN Asynchronous active high input pin used to power down the device.
The internal clocks are disabled and the VCO is stopped.
27 DIF_STOP
IN Active High input to stop differential output clocks.
28 HIGH_BW# PWR 3.3V input for selecting PLL Band Width
0 = High, 1= Lo
29 DIF_4# OUT 0.7V differential Complementary clock output
30 DIF_4 OUT 0.7V differential true clock output
31 VDD PWR Power supply, nominal 3.3V
32 GND PWR Ground pin.
33 DIF_5# OUT 0.7V differential Complementary clock output
34 DIF_5 OUT 0.7V differential true clock output
35 OE5# IN Active low input for enabling DIF pair 5.
1 =disable outputs, 0 = enable outputs
36 OE6# IN Active low input for enabling DIF pair 6.
1 =disable outputs, 0 = enable outputs
37 DIF_6# OUT 0.7V differential Complementary clock output
38 DIF_6 OUT 0.7V differential true clock output
39 VDD PWR Power supply, nominal 3.3V
40 OE_INV IN This latched input selects the polarity of the OE pins.
0 = OE pins active high, 1 = OE pins active low (OE#)
41 DIF_7# OUT 0.7V differential Complementary clock output
42 DIF_7 OUT 0.7V differential true clock output
43 OE4# IN Active low input for enabling DIF pair 4
1 =disable outputs, 0 = enable outputs
44 OE7# IN Active low input for enabling DIF pair 7.
1 =disable outputs, 0 = enable outputs
45 LOCK OUT 3.3V output indicating PLL Lock Status. This pin goes high when lock
is achieved.
46 IREF IN
This pin establishes the reference for the differential current-mode
output pairs. It requires a fixed precision resistor to ground. 475ohm is
the standard value for 100ohm differential impedance. Other
impedances require different values. See data sheet.
47 GNDA PWR Ground pin for the PLL core.
48 VDDA PWR 3.3V power for the PLL core.
ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS9DB803D. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any
other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over
the recommended operating temperature range.
Electrical Characteristics–Clock Input Parameters
Symbol Parameter Min Max Units
VDDA/R 3.3V Core Supply Voltage 4.6 V
VDD 3.3V Logic Supply Voltage 4.6 V
V
IL
Input Low Voltage GND-0.5 V
V
IH
Input High Voltage V
D
D
+0.5V V
Ts Storage Temperature -65 150 °
C
Commerical Operating Range 0 70 °C
Industrial Operating Range -40 85 °C
Tcase Case Temperature 115 °C
ESD prot
Input ESD protection
human body model 2000 V
Tambient
TA = Tambient for the desired operating range, Supply Voltage VDD = 3.3 V +/-5%
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Input High Voltage -
DIF_IN VIHDIF
Differential inputs
(single-ended measurement) 600 800 1150 mV 1
Input Low Voltage -
DIF_IN VILDIF
Differential inputs
(single-ended measurement) VSS - 300 0 300 mV 1
Input Common Mode
Volta
g
e - DIF_IN
VCOM Common Mode Input Voltage 300 1000 mV 1
Input Amplitude - DIF_IN VSWING
Peak to Peak value
(single-ended measurement) 300 1450 mV 1
Input Slew Rate - DIF_IN dv/dt Measured differentially 0.4 8 V/ns 1,2
Input Leakage Current I
IN
V
IN
= V
DD ,
V
IN
=GND -5 5 uA 1
Input Duty Cycle d
tin
Measurement from differential wavefrom 45 55 % 1
Input Jitter - Cycle to
Cycle JDIFI n Differential Measurement 0 125 ps 1
1 Guaranteed by design and characterization, not 100% tested in production.
2Slew rate measured through Vswing min centered around differential zero
ICS9DB803D
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Electrical Characteristics–Input/Supply/Common Output Parameters
T
A
= Tambient for the desired operating range, Supply Voltage V
DD
= 3.3 V +/-5%
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Input High Voltage V
IHSE
2V
DD
+ 0.3 V 1
Input Low Voltage V
ILSE
GND - 0.3 0.8 V 1
Input High Current I
IHSE
V
IN
= V
DD
-5 5 uA 1
IIL1 VIN = 0 V; Inputs with no pull-up resistors -5 uA 1
I
IL2
V
IN
= 0 V; Inputs with pull-up resistors -200 uA 1
IDD3.3OPC Full Active, CL = Full load; Commerical
Tem
p
Ran
g
e
175 200 mA 1
IDD3.3OPI Full Active, CL = Full load; Industrial
Tem
p
Ran
g
e
190 225 mA 1
all diff pairs driven, C-Temp 50 60 mA 1
all differential pairs tri-stated, C-Temp 4 6 mA 1
all diff pairs driven, I-temp 55 65 mA 1
all differential pairs tri-stated, I-temp 6 8 mA 1
IDD3.3OPC Full Active, CL = Full load; Commerical
Tem
p
Ran
g
e
105 125 mA 1
IDD3.3OPI Full Active, CL = Full load; Industrial
Tem
p
Ran
g
e
115 150 mA 1
all diff pairs driven, C-Temp 25 30 mA 1
all differential pairs tri-stated, C-Temp 2 3 mA 1
all diff pairs driven, I-Temp 30 35 mA 1
all differential pairs tri-stated, I-Temp 3 4 mA 1
F
iPLL
PCIe Mode (Bypass#/PLL= 1) 50 100 MHz 1
F
iBYPASS
Bypass Mode ((Bypass#/PLL= 0) 33 400 MHz 1
Pin Inductance L
p
in
7nH1
C
IN
Logic Inputs, except SRC_IN 1.5 5 pF 1
C
INSRC_IN
SRC_IN differential clock inputs 1.5 2.7 pF 1,4
C
OUT
Output pin capacitance 6 pF 1
-3dB point in High BW Mode 2 3 4 MHz 1
-3dB point in Low BW Mode 0.7 1 1.4 MHz 1
PLL Jitter Peaking t
JPEAK
Peak Pass band Gain 1.5 2 dB 1
Clk Stabilization TSTAB
From VDD Power-Up and after input clock
stabilization or de-assertion of PD# to 1st
clock
1ms1,2
Input SS Modulation
Frequency fMODI N
Allowable Frequency
(Triangular Modulation) 30 33 kHz 1
OE# Latency tLATOE#
DIF start after OE# assertion
DIF stop after OE# deassertion 1 3 cycles 1,3
Tdrive_SRC_STOP# tDRVSTP
DIF output enable after
SRC_Stop# de-assertion 10 ns 1,3
Tdrive_PD# tDRVPD
DIF output enable after
PD# de-assertion 300 us 1,3
Tfall t
F
Fall time of PD# and SRC_STOP# 5 ns 1
Trise t
R
Rise time of PD# and SRC_STOP# 5 ns 2
SMBus Voltage V
MAX
Maximum input voltage 5.5 V 1
Low-level Output Voltage V
OL
@ I
PULLUP
0.4 V 1
Current sinking at V
OL
I
PULLUP
4mA1
SCLK/SDATA
Clock/Data Rise Time tRSMB
(Max VIL - 0.15) to
(Min VIH + 0.15) 1000 ns 1
SCLK/SDATA
Clock/Data Fall Time tFSMB
(Min VIH + 0.15) to
(Max VIL - 0.15) 300 ns 1
SMBus Operating
Frequency fMAXSMB Maximum SMBus operating frequency 100 kHz 1,5
1Guaranteed by design and characterization, not 100% tested in production.
2See timing diagrams for timing requirements.
IDD3.3PDI
IDD3.3PDI
9DB803 Powerdown
Current
Single Ended Inputs, 3.3 V +/-5%
Input Low Current
IDD3.3PDC
9DB803 Supply Current
9DB403 Supply Current
9DB403 Powerdown
Current
5The differential input clock must be running for the SMBus to be active
Input Frequency
4SRC_IN input
IDD3.3PDC
3Time from deassertion until outputs are >200 mV
PLL Bandwidth BW
Capacitance
ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Electrical Characteristics–DIF 0.7V Current Mode Differential Pair
T
A
=Tambient; V
DD
= 3.3 V +/-5%; C
L
=2pF, R
S
=33, R
P
=49.9, R
REF
=475
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Current Source Output
Impedance Zo1 3000 1
Voltage High VHigh 660 850 1,2
Voltage Low VLow -150 150 1,2
Max Voltage Vovs 1150 1
Min Voltage Vuds -300 1
Crossing Voltage (abs) Vcross(abs) 250 550 mV 1
Crossing Voltage (var) d-Vcross Variation of crossing over all
edges 140 mV 1
Rise Time t
r
V
OL
= 0.175V, V
OH
= 0.525V 175 700 ps 1
Fall Time t
f
V
OH
= 0.525V V
OL
= 0.175V 175 700 ps 1
Rise Time Variation d-t
r
125 ps 1
Fall Time Variation d-t
f
125 ps 1
Duty Cycle dt3
Measurement from differential
wavefrom
45 55 % 1
t
p
dBYP
Bypass Mode, V
T
= 50% 2500 4500 ps 1
t
p
dPLL
PLL Mode V
T
= 50% -250 250 ps 1
Skew, Output to Output t
sk3
V
T
= 50% 50 ps 1
PLL mode 50 ps 1,3
Additiv
e
Jitter in Bypass Mode 50 ps 1,3
PCIe Gen1 phase jitter
(Additive in Bypass Mode)
710ps
(pk2pk)
1,4,5
PCIe Gen 2 Low Band phase jitter
(Additive in Bypass Mode) 00.1ps
(rms) 1,4,5
PCIe Gen 2 High Band phase jitter
(Additive in Bypass Mode) 0.3 0.5 ps
(rms) 1,4,5
PCIe Gen 1 phase jitter 40 86 ps
(pk2pk)
1,4,5
PCIe Gen 2 Low Band phase jitter 1.5 3 ps
(rms) 1,4,5
PCIe Gen 2 High Band phase jitter 2.7/
2.2
3.1 ps
(rms)
1,4,5,6
1Guaranteed by design and characterization, not 100% tested in production.
2
IRE
F
= VDD/(3xR
R
). For R
R
= 475
(1%), IRE
F
= 2.32mA. IOH = 6 x IRE
F
and VOH = 0.7V @ ZO=50
.
3 Measured from differential waveform
4
See http://www.pcisig.com for complete specs
5
Device driven by 932S421C or equivalent.
6
First number is High Bandwidth Mode, second number is Low Bandwidth Mode
Statistical measurement on single
ended signal using oscilloscope
math function.
mV
Measurement on single ended
signal using absolute value.
mV
tjphaseBYP
Jitter, Phase
tjphasePLL
Skew, Input to Output
Jitter, Cycle to cycle tjcyc-cyc
ICS9DB803D
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Clock Periods–Differential Outputs with Spread Spectrum Enabled
Clock Periods–Differential Outputs with Spread Spectrum Disabled
1 Clock 1us 0.1s 0.1s 0.1s 1us 1 Clock
Lg- -SSC -ppm error 0ppm + ppm error +SSC Lg+
Absolute
Period
Short-term
Avera
g
e
Long-Term
Avera
g
e
Period Long-Term
Avera
g
e
Short-term
Avera
g
e
Period
Minimum
Absolute
Period
Minimum
Absolute
Period
Minimum
Absolute
Period
Nominal Maximum Maximum Maximum
DIF 100 9.87400 9.99900 9.99900 10.00000 10.00100 10.05130 10.17630 ns 1,2,3
DIF 133 7.41425 7.49925 7.49925 7.50000 7.50075 7.53845 7.62345 ns 1,2,4
DIF 166 5.91440 5.99940 5.99940 6.00000 6.00060 6.03076 6.11576 ns 1,2,4
DIF 200 4.91450 4.99950 4.99950 5.00000 5.00050 5.02563 5.11063 ns 1,2,4
DIF 266 3.66463 3.74963 3.74963 3.75000 3.75038 3.76922 3.85422 ns 1,2,4
DIF 333 2.91470 2.99970 2.99970 3.00000 3.00030 3.01538 3.10038 ns 1,2,4
DIF 400 2.41475 2.49975 2.49975 2.50000 2.50025 2.51282 2.59782 ns 1,2,4
Notes
Definition
Units
Signal Name
Measurement
Window
Symbol
1 Clock 1us 0.1s 0.1s 0.1s 1us 1 Clock
Lg- -SSC -ppm error 0ppm + ppm error +SSC Lg+
Absolute
Period
Short-term
Avera
g
e
Long-Term
Avera
g
e
Period Long-Term
Avera
g
e
Short-term
Avera
g
e
Period
Minimum
Absolute
Period
Minimum
Absolute
Period
Minimum
Absolute
Period
Nominal Maximum Maximum Maximum
DIF 100 9.87400 9.99900 10.00000 10.00100 10.17630 ns 1,2,3
DIF 133 7.41425 7.49925 7.50000 7.50075 7.62345 ns 1,2,4
DIF 166 5.91440 5.99940 6.00000 6.00060 6.11576 ns 1,2,4
DIF 200 4.91450 4.99950 5.00000 5.00050 5.11063 ns 1,2,4
DIF 266 3.66463 3.74963 3.75000 3.75038 3.85422 ns 1,2,4
DIF 333 2.91470 2.99970 3.00000 3.00030 3.10038 ns 1,2,4
DIF 400 2.41475 2.49975 2.50000 2.50025 2.59782 ns 1,2,4
1
Guaranteed by design and characterization, not 100% tested in production.
3
Driven by SRC output of main clock, PLL or Bypass mode
4 Driven by CPU output of CK410/CK505 main clock,
B
yp
ass mode onl
y
2 All Long Term Accuracy specifications are guaranteed with the assumption that the input clock complies with
CK409/CK410/CK505 accuracy requirements. The 9DB403/803 itself does not contribute to ppm error.
Notes
Measurement
Window
Units
Symbol
Definition
Signal Name
ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2
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Common Recommendations for Differential Routing Dimension or Value Unit Figure
L1 length, route as non-coupled 50ohm trace 0.5 max inch 1
L2 length, route as non-coupled 50ohm trace 0.2 max inch 1
L3 length, route as non-coupled 50ohm trace 0.2 max inch 1
Rs 33 ohm 1
Rt 49.9 ohm 1
Down Device Differential Routing
L4 length, route as coupled microstrip 100ohm differential trace 2 min to 16 max inch 1
L4 length, route as coupled stripline 100ohm differential trace 1.8 min to 14.4 max inch 1
Differential Routing to PCI Express Connector
L4 length, route as coupled microstrip 100ohm differential trace 0.25 to 14 max inch 2
L4 length, route as coupled stripline 100ohm differential trace 0.225 min to 12.6 max inch 2
S RC R efer en ce Clo ck
HCSL Output Buffer
L1
L1'
Rs
L2
L2'
Rs
L4'
L4
L3L3'
Rt Rt PCI Express
Down Device
REF_CLK Input
Figure 1: Down Device Routing
HCSL Output Buffer
L1
L1'
Rs
L2
L2'
Rs
L4'
L4
L3L3'
Rt Rt PCI Express
Add-in Board
REF_CLK Input
Figure 2: PCI Express Connector Routing
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Vdiff Vp-p Vcm R1 R2 R3 R4 Note
0.45v 0.22v 1.08 33 150 100 100
0.58 0.28 0.6 33 78.7 137 100
0.80 0.40 0.6 33 78.7 none 100 ICS874003i-02 input compatible
0.60 0.3 1.2 33 174 140 100 Standard LVDS
R1a = R1b = R1
R2a = R2b = R2
Al te rna tive Term i nation for LVDS a nd othe r Comm on Diffe rential Si gnal s (figure 3)
HCSL Output Buffer
L1
L1'
R1b
L2
L2'
R1a
L4'
L4
L3
R2a R2b Down Device
REF_CLK Input
Figure 3
L3'
R3 R4
Component Value Note
R5a, R5b 8.2K 5%
R6a, R6b 1K 5%
Cc 0.1 µF
Vcm 0.350 volts
Cable Conne cted AC Coupled Application (figure 4)
PCIe Device
REF_CLK Input
Figure 4
R5a
L4'
L4
3.3 Volts
R5b
R6a R6b
Cc
Cc
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General SMBus Serial Interface Information
How to Write
Controller (host) sends a start bit
Controller (host) sends the write address
IDT clock will acknowledge
Controller (host) sends the beginning byte location = N
IDT clock will acknowledge
Controller (host) sends the byte count = X
IDT clock will acknowledge
Controller (host) starts sending Byte N through Byte
N+X-1
IDT clock will acknowledge each byte one at a time
Controller (host) sends a Stop bit
How to Read
Controller (host) will send a start bit
Controller (host) sends the write address
IDT clock will acknowledge
Controller (host) sends the beginning byte location = N
IDT clock will acknowledge
Controller (host) will send a separate start bit
Controller (host) sends the read address
IDT clock will acknowledge
IDT clock will send the data byte count = X
IDT clock sends Byte N+X-1
IDT clock sends Byte 0 through Byte X (if X(H) was
written to Byte 8)
Controller (host) will need to acknowledge each byte
Controller (host) will send a not acknowledge bit
Controller (host) will send a stop bit
Index Block Write Operation
Controller (Host) IDT (Slave/Receiver)
TstarT bit
Slave Address
WR WRite
ACK
Beginning Byte = N
ACK
Data Byte Count = X
ACK
Beginning Byte N
X Byte
ACK
O
OO
OO
O
Byte N + X - 1
ACK
PstoP bit
Read Address Write Address
DD(H) DC(H)
Index Block Read Operation
Controller (Host) IDT (Slave/Receiver)
TstarT bit
Slave Address
WR WRite
ACK
Beginning Byte = N
ACK
RT Repeat starT
Slave Address
RD ReaD
ACK
Data Byte Count=X
ACK
X Byte
Beginning Byte N
ACK
O
OO
OO
O
Byte N + X - 1
N Not acknowledge
PstoP bit
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SMBus Table: Frequency Select Register, READ/WRITE ADDRESS (DC/DD)
Pin # Name Control Function T
yp
e0 1PWD
Bit 7 PD_Mode PD# drive mode RW driven Hi-Z 0
Bit 6
STOP_Mode DIF_Stop# drive mode RW driven Hi-Z 0
Bit 5 Reserved Reserved RW X
Bit 4
Reserved Reserved RW X
Bit 3 Reserved Reserved RW X
Bit 2
PLL_BW# Select PLL BW RW High BW Low BW 1
Bit 1 BYPASS# BYPASS#/PLL RW fan-out ZDB 1
Bit 0 SRC_DIV# SRC Divide by 2 Select RW x/2 1x 1
SMBus Table: Output Control Register
Pin # Name Control Function T
yp
e0 1PWD
Bit 7
DIF_7 Output Enable RW Disable Enable 1
Bit 6 DIF_6 Output Enable RW Disable Enable 1
Bit 5
DIF_5 Output Enable RW Disable Enable 1
Bit 4 DIF_4 Output Enable RW Disable Enable 1
Bit 3
DIF_3 Output Enable RW Disable Enable 1
Bit 2 DIF_2 Output Enable RW Disable Enable 1
Bit 1
DIF_1 Output Enable RW Disable Enable 1
Bit 0 DIF_0 Output Enable RW Disable Enable 1
SMBus Table: OE Pin Control Register Control Register
Pin # Name Control Function T
yp
e0 1PWD
Bit 7 DIF_7 DIF_7 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 6
DIF_6 DIF_6 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 5 DIF_5 DIF_5 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 4
DIF_4 DIF_4 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 3 DIF_3 DIF_3 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 2
DIF_2 DIF_2 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 1 DIF_1 DIF_1 Stoppable with DIFSTOP RW Free-run Stoppable 0
Bit 0 DIF_0 DIF_0 Stoppable with DIFSTOP RW Free-run Stoppable 0
SMBus Table: Reserved Register
Pin # Name Control Function T
yp
e0 1PWD
Bit 7
RW X
Bit 6 RW X
Bit 5
RW X
Bit 4 RW X
Bit 3
RW X
Bit 2 RW X
Bit 1
RW X
Bit 0 RW X
Reserved
Reserved Reserved
Reserved Reserved
Reserved Reserved
Reserved Reserved
Reserved Reserved
Reserved Reserved
Reserved Reserved
B
y
te 2
Reserved Reserved
B
y
te 3
Reserved
-
-
-Reserved
-
B
y
te 0
-
-
B
y
te 1
-
-
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SMBus Table: Vendor & Revision ID Register
Pin # Name Control Function T
yp
e0 1PWD
Bit 7 RID3 R - - X
Bit 6
RID2 R - - X
Bit 5 RID1 R - - X
Bit 4
RID0 R - - X
Bit 3 VID3 R - - 0
Bit 2
VID2 R - - 0
Bit 1 VID1 R - - 0
Bit 0 VID0 R - - 1
SMBus Table: DEVICE ID
Pin # Name Control Function T
yp
e0 1PWD
Bit 7
RW 0
Bit 6 RW X
Bit 5
RW X
Bit 4 RW 0
Bit 3
RW 0
Bit 2 RW 0
Bit 1
RW 1
Bit 0 RW 1
SMBus Table: Byte Count Register
Pin # Name Control
Function
Type 0 1 PWD
Bit 7
BC7 RW - - 0
Bit 6 BC6 RW - - 0
Bit 5
BC5 RW - - 0
Bit 4 BC4 RW - - 0
Bit 3
BC3 RW - - 0
Bit 2 BC2 RW - - 1
Bit 1
BC1 RW - - 1
Bit 0 BC0 RW - - 1
B
y
te 4
-
REVISION ID
-
-
-
Device ID 1
-
VENDOR ID
-
-
-
B
y
te 5
-
-
-
-
-
-
-
-
Byte 6
-
Writing to this register configures how
many bytes will be read back.
-
-
-
-
-
-
-
Device ID 6
Device ID 7 (MSB)
Device ID is 83 Hex
for 9DB803 and 43
Hex for 9DB403
Device ID 5
Device ID 4
Device ID 3
Device ID 0
Device ID 2
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Note: Polarities in timing diagrams are shown OE_INV = 0. They are similar to OE_INV = 1.
PD#, Power Down
The PD# pin cleanly shuts off all clocks and places the device into a power saving mode. PD# must be asserted before
shutting off the input clock or power to insure an orderly shutdown. PD is asynchronous active-low input for both powering
down the device and powering up the device. When PD# is asserted, all clocks will be driven high, or tri-stated (depending
on the PD# drive mode and Output control bits) before the PLL is shut down.
PD# Assertion
When PD# is sampled low by two consecutive rising edges of DIF#, all DIF outputs must be held High, or tri-stated
(depending on the PD# drive mode and Output control bits) on the next High-Low transition of the DIF# outputs. When the
PD# drive mode bit is set to ‘0’, all clock outputs will be held with DIF driven High with 2 x IREF and DIF# tri-stated. If the
PD# drive mode bit is set to ‘1’, both DIF and DIF# are tri-stated.
PD# De-assertion
Power-up latency is less than 1 ms. This is the time from de-assertion of the PD# pin, or VDD reaching 3.3V, or the time from
valid SRC_IN clocks until the time that stable clocks are output from the device (PLL Locked). If the PD# drive mode bit is
set to ‘1’, all the DIF outputs must driven to a voltage of >200 mV within 300 us of PD# de-assertion.
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SRC_STOP#
The SRC_STOP# signal is an active-low asynchronous input that cleanly stops and starts the DIF outputs. A valid clock must
be present on SRC_IN for this input to work properly. The SRC_STOP# signal is de-bounced and must remain stable for two
consecutive rising edges of DIF# to be recognized as a valid assertion or de-assertion.
SRC_STOP# - Assertion
Asserting SRC_STOP# causes all DIF outputs to stop after their next transition (if the control register settings allow the
output to stop). When the SRC_STOP# drive bit is ‘0’, the final state of all stopped DIF outputs is DIF = High and DIF# =
Low. There is no change in output drive current. DIF is driven with 6xIREF. DIF# is not driven, but pulled low by the
termination. When the SRC_STOP# drive bit is ‘1’, the final state of all DIF output pins is Low. Both DIF and DIF# are not
driven.
SRC_STOP# - De-assertion (transition from '0' to '1')
All stopped differential outputs resume normal operation in a glitch-free manner. The de-assertion latency to active outputs
is 2-6 DIF clock periods, with all DIF outputs resuming simultaneously. If the SRC_STOP# drive control bit is ‘1’ (tri-state),
all stopped DIF outputs must be driven High (>200 mV) within 10 ns of de-assertion.
SRC_STOP_1 (SRC_Stop = Driven, PD = Driven)
SRC_STOP_2 (SRC_Stop =Tristate, PD = Driven)
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SRC_STOP_3 (SRC_Stop = Driven, PD = Tristate)
SRC_STOP_4 (SRC_Stop = Tristate, PD = Tristate)
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Package Outline and Package Dimensions (48-pin TSSOP)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
48
D
E1 E
SEATING
PLANE
A1
A
A2
e
- C -
b
aaa C
c
L
*For reference only. Controlling dimensions in mm.
Millimeters Inches*
Symbol Min Max Min Max
A--1.20--0.047
A1 0.05 0.15 0.002 0.006
A2 0.80 1.05 0.032 0.041
b 0.17 0.27 0.007 0.011
c 0.09 0.20 0.0035 0.008
D 12.40 12.60 0.488 0.496
E 8.10 BASIC 0.319 BASIC
E1 6.00 6.20 0.236 0.244
e 0.50 Basic 0.020 Basic
L 0.45 0.75 0.018 0.030
0808
aaa -- 0.10 -- 0.004
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Package Outline and Package Dimensions (48-pin SSOP)
Package dimensions are kept current with JEDEC Publication No. 95
Ordering Information
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
“D” is the device revision designator (will not correlate with the datasheet revision).
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
INDEX
AREA
1 2
48
D
E1 E
SEATING
PLANE
A1
A
A2
e
- C -
b
aaa C
c
L
*For reference only. Controlling dimensions in mm.
Millimeters Inches*
Symbol Min Max Min Max
A 2.412.80.095.110
A1 0.20 0.40 .008 .016
b 0.200.34.008.0135
c 0.130.25.005.010
D 15.75 16.00 .620 .630
E 10.03 10.68 .395 .420
E1 7.40 7.60 .291 .299
e 0.635 BASIC 0.025 BASIC
h 0.380.64.015.025
L 0.501.02.020.040
0808
Part / Orde r Num ber M arking Shi pping P acka gi ng Packa ge Tem pera ture
9DB803DGLF 9DB803DGLF Tubes 48-pin TSSOP 0 to +70° C
9DB803DGLFT 9DB803DGLF Tape and Reel 48-pin TSSOP 0 to +70° C
9DB803DGILF 9DB803DGILF Tubes 48-pin TSSOP -40 to +85° C
9DB803DGILFT 9DB803DGILF Tape and Reel 48-pin TSSOP -40 to +85° C
9DB803DFLF 9DB803DFLF Tubes 48-pin SSOP 0 to +70° C
9DB803DFLFT 9DB803DFLF Tape and Reel 48-pin SSOP 0 to +70° C
9DB803DFILF 9DB803DFILF Tubes 48-pin SSOP -40 to +85° C
9DB803DFILFT 9DB803DFILF Tape and Reel 48-pin SSOP -40 to +85° C
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Revision History
Rev. Issue Date Issuer Description Page #
A 8/15/2006 Updated electrical characteristics for final data sheet -
B Added Input Clock Specs
C 2/29/2008 Updated Input Clock Specs
D 3/18/2008
Fixed typo in Input Clock Parameters
E 3/28/2008 Updated Electrical Char tables
F 4/10/2008 Updated Input Clock Specs
G 1/13/2009 Corrected part ordering information
H 10/7/2009
1. Clarified that Vih and Vil values were for Single ended inputs
2. Added Differential Clock input parameters.
3. Updated Electrical Characteristics to add propagation delay and
phase noise information.
4. Added SMBus electrical characteristics
5. Added foot note about DIF input running in order for the SMBus
interface to work
6. Added foot note to Byte 1 about functionality of OE bits and OE
pins.
7. Updated/Reformatted General Description Various
J 1/27/2011 Updated Termination Figure 4 12
K 5/9/2011
1. Update pin 2 pin-name and pin description from VDD to VDDR. This
highlights that optimal peformance is obtained by treating VDDR as in
analog pin. This is a document update only, there is no silicon change. Various
L 8/27/2012 Updated Vswing conditions to include "single-ended measurement" 7
M 9/18/2012
Updated Byte 2, bits 0~7 per char review. Outputs can be programmed
with Byte 2 to be Stoppable or Free-Run with DIF_Stop pin, not the OE
pins.
14
N 7/10/2013 R. Wei
Typo discovered on front page "Output Features" section. Was: “50 –
110MHz operation in PLL mode”; changed to: "50 – 100MHz operation
in PLL mode”
1
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ICS9DB803D
EIGHT OUTPUT DIFFERENTIAL BUFFER FOR PCIE GEN1 AND GEN2 SYNTHESIZERS