Technical Data 4084 Effective September 2015 Supersedes November 2009 SD3118 Low profile power inductors Applications * Mobile/smart phones * Tablets/e-readers * Media players * Digital cameras * Small LED driver and LCD displays * Handheld/mobile equipment Environmental Data Description * Low profile shielded drum core * Compact footprint utilizes less board space * Inductance Range from 1.0H to 1,000H * Current range from 0.083 to 2.94 amps * 3.2 x 3.2mm footprint surface mount package in a 1.8mm height * Ferrite core material * Halogen free, lead free, RoHS compliant * Storage temperature range (Component): -40C to +125C * Operating temperature range: -40C to +125C (ambient + self-temperature rise) * Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE SD3118 Low profile power inductors Technical Data 4084 Effective September 2015 Product Specifications Part Number6 OCL1 (H) Part marking designator Irms2 (amps) Isat3 (amps) DCR () typical @ +20C K-factor4 SD3118-1R0-R 1.0430% A 2.01 3.07 0.041 84 SD3118-1R5-R 1.4430% B 1.81 2.42 0.051 68 SD3118-2R2-R 2.1230% C 1.50 2.00 0.074 57 SD3118-3R3-R 3.3630% D 1.22 1.59 0.11 56 SD3118-4R7-R 4.9030% E 1.02 1.31 0.16 39 SD3118-6R8-R 6.7230% F 0.85 1.12 0.23 32 SD3118- 8R2-R 8.1030% G 0.81 1.02 0.26 29 SD3118- 100-R 10.430% H 0.75 0.90 0.30 26 SD3118-150-R 14.930% I 0.62 0.75 0.44 21 SD3118-220-R 22.530% J 0.50 0.61 0.68 18 SD3118-330-R 33.130% K 0.41 0.51 0.99 14 SD3118-470-R 47.530% L 0.37 0.42 1.2 12 SD3118-221-R 22220% M 0.182 0.177 4.8 6 SD3118-331-R 33020% N 0.146 0.145 7.4 5 SD3118-471-R 47020% O 0.130 0.122 9.2 4 SD3118-681-R 68020% P 0.107 0.101 14 3 SD3118-102-R 99920% Q 0.087 0.083 21 3 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25C 2. Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 30% rolloff @ +20C 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p: (mTesla), K: (K-factor from table), L: (Inductance in H), I (Peak to peak ripple current in Amps). 5. Part Number Definition: SD3118-xxx-R SD3118 = Product code and size xxx= Inductance value in uH, R= decimal point, if no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Pin #1 indicator 1.8 max Recommended Pad Layout 3.9 max 1.5 typ 2.40 Schematic 1 1.70 3.2 max 3.2 max Part marking: dot for pin 1 indicator (orientation purposes only) xxx = 3 digit marking (first digit indicates inductance value per letter in Part marking designator, second digit is bi-weekly date code, third digit is last digit of year produced) All soldering surfaces to be coplanar within 0.10 millimeters PCB tolerances are 0.1 millimeters unless stated otherwise Do not route traces or vias underneath the inductor 2 www.eaton.com/elx 0.8 2 SD3118 Low profile power inductors Technical Data 4084 Effective September 2015 Packaging information (mm) Supplied in tape and reel packaging, 4,100 parts per 13" diameter reel 4.00 1.2 Dia. min. 1.5 Dia. +0.1/-0.0 2.00 1.75 A Ao = 4.0mm A1 = 0.93mm Bo = 4.20mm B1 = 1.25mm Ko = 2.00mm 1 B1 10.25 Bo 5.50 12.0 0.3 2 3.4 Ko A1 SECTION A-A Ao 3.4 A 8.0 Direction of feed Temperature Rise (C) Temperature rise vs. total loss 90 80 70 60 50 40 30 20 10 0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 Total Loss(W) www.eaton.com/elx 3 SD3118 Low profile power inductors Technical Data 4084 Effective September 2015 Core loss vs. Bp-p 10 Core Loss (W) 1MHz 1 500kHz 0.1 300kHz 200kHz 100kHz 50kHz 0.01 0.001 0.0001 0.00001 10 10 100 1000 Bp-p (mT) Inductance characteristics OCL vs. lsat 120% 110% 100% % of L initial 90% 80% 70% -40C 60% 50% 40% 25C 30% 85C 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% % of lsat 4 www.eaton.com/elx 90% 100% 110% 120% 130% 140% SD3118 Low profile power inductors Technical Data 4084 Effective September 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. 4084 BU-MC15028 September 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners.