General Description
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are
low-capacitance ±15kV ESD-protection diode arrays
designed to protect sensitive electronics attached to
communication lines. Each channel consists of a pair of
diodes that steer ESD current pulses to VCC or GND.
The MAX3202E/MAX3203E/MAX3204E/MAX3206E pro-
tect against ESD pulses up to ±15kV Human Body
Model, ±8kV Contact Discharge, and ±15kV Air-Gap
Discharge, as specified in IEC 61000-4-2. These
devices have a 5pF capacitance per channel, making
them ideal for use on high-speed data I/O interfaces.
The MAX3202E is a two-channel device intended for
USB and USB 2.0 applications. The MAX3203E is a
triple-ESD structure intended for USB On-the-Go (OTG)
and video applications. The MAX3204E is a quad-ESD
structure designed for Ethernet and FireWire™ applica-
tions, and the MAX3206E is a six-channel device
designed for cell phone connectors and SVGA video
connections.
All devices are available in tiny chip-scale (UCSP™)
and thin QFN packages, and are specified for -40°C to
+85°C operation.
Applications
USB Video
USB 2.0 Cell Phones
Ethernet SVGA Video Connections
FireWire
Features
♦High-Speed Data Line ESD Protection
±15kV—Human Body Model
±8kV—IEC 61000-4-2, Contact Discharge
±15kV—IEC 61000-4-2, Air-Gap Discharge
♦Tiny UCSP Package Available
♦Low 5pF Input Capacitance
♦Low 1nA (max) Leakage Current
♦Low 1nA Supply Current
♦+0.9V to +5.5V Supply Voltage Range
♦2-, 3-, 4-, or 6-Channel Devices Available
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2739; Rev 2; 11/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section for more
information.
**EP = Exposed pad.
PART TEMP
RANGE
PIN/BUMP-
PACKAGE
MAX3202EEBS-T -40°C to +85°C 2 x 2 UCSP-4*
MAX3202EETT-T -40°C to +85°C 6 Thin QFN-EP-6**
MAX3203EEBT-T -40°C to +85°C 3 x 2 UCSP-5*
MAX3203EETT-T -40°C to +85°C 6 Thin QFN-EP-6**
MAX3204EEBT-T -40°C to +85°C 3 x 2 UCSP-6*
MAX3204EETT-T -40°C to +85°C 6 Thin QFN-EP-6**
MAX3206EEBL-T -40°C to +85°C 3 x 3 UCSP-8*
MAX3206EETC -40°C to +85°C 12 Thi n Q FN - E P **
Selector Guide
PART
ESD-
PROTECTED
I/O PORTS
TOP MARK
MAX3202EEBS-T 2 AFV
MAX3202EETT 2 ADQ
MAX3203EEBT-T 3 ABA
MAX3203EETT 3 ADO
MAX3204EEBT-T 4 ABB
MAX3204EETT 4 ADP
MAX3206EEBL-T 6 ADU
MAX3206EETC 6 AACA
Pin Configurations appear at end of data sheet.
FireWire is a trademark of Apple Computer, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
MAX3202E
MAX3203E
MAX3204E
MAX3206E
PROTECTED
CIRCUIT
0.1µF
0.1µF
I/0_I/0
VCC
VCC
Typical Operating Circuit
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
2_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +5V ±5%, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: Limits over temperature are guaranteed by design, not production tested.
Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the Applications Information section for more information.
Note 4: Guaranteed by design. Not production tested.
VCC to GND...........................................................-0.3V to +7.0V
I/O_ to GND................................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA= +70°C)
2 ×2 UCSP (derate 3.0mW/°C above +70°C) ..............239mW
3 ×2 UCSP (derate 3.4mW/°C above +70°C) ..............273mW
3 ×2 UCSP (derate 3.9mW/°C above +70°C) ..............308mW
3 ×3 UCSP (derate 4.7mW/°C above +70°C) ..............379mW
6-Pin Thin QFN (derate 24.4mW/°C above +70°C) ....1951mW
12-Pin Thin QFN (derate 16.9mW/°C above +70°C) ..1349mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) ........................................................+215°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage VCC 0.9 5.5 V
Supply Current ICC 1100 nA
Diode Forward Voltage VFIF = 10mA
0.65
0.95 V
Positive transients
VCC + 25
TA = +25°C, ±15kV
Human Body Model,
IF = 10A Negative transients -25
Positive transients
VCC + 60
TA = +25°C, ±8kV
Contact Discharge
(IEC 61000-4-2), IF = 24A
Negative transients -60
Positive transients
VCC + 100
Channel Clamp Voltage
(Note 3) VC
TA = +25°C, ±15kV
Air-Gap Discharge
(IEC 61000-4-2), IF = 45A
Negative transients -100
V
Channel Leakage Current TA = 0°C to +50°C (Note 4) -1 +1 nA
Channel Input Capacitance
VCC = 5V, bias of VCC/2 5 7 pF
ESD PROTECTION
Human Body Model
±15
kV
IEC 61000-4-2
Contact Discharge
±8
kV
IEC 61000-4-2
Air-Gap Discharge
±15
kV
Note 1: The UCSP devices are constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles
recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
_______________________________________________________________________________________ 3
Typical Operating Characteristics
(VCC = +5V, TA = +25°C, unless otherwise noted.)
Pin Description
PIN
MAX3202E MAX3203E MAX3204E MAX3206E
UCSP
THIN
QFN
UCSP
THIN
QFN
UCSP
THIN
QFN
UCSP
THIN
QFN
NAME
FUNCTION
A1, B2
3, 6 A1,
A2, B3 1, 2, 4
A1, A2,
B2, B3 1, 2, 4, 5
A1, A3,
B1, B3,
C1, C3
1, 2, 3,
7, 8, 9 I/O_
ESD-Protected Channel
A2 4 B1 3 B1 3 A2 5
GND
Ground
B1 1 A3 6 A3 6 C2 11
VCC
Power-Supply Input. Bypass VCC to
GND with a 0.1µF ceramic capacitor.
—2, 5 — 5 — — — 4, 6,
10, 12 N.C.
No Connection. Not internally
connected.
—EP—EP — EP — EP EP Exposed Pad. Connect to GND.
0.30
0.70
0.50
1.10
0.90
1.30
1.50
CLAMP VOLTAGE vs. DC CURRENT
MAX3202E toc01
DC CURRENT (mA)
CLAMP VOLTAGE (V)
30 70 9050 110 130 150
1
10
100
1000
25 35 45 55 65 75 85
LEAKAGE CURRENT vs. TEMPERATURE
MAX3202E toc02
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
LEAKAGE CURRENT PER CHANNEL
2
4
8
6
10
12
021345
INPUT CAPACITANCE vs. INPUT VOLTAGE
MAX3202E toc03
INPUT VOLTAGE (V)
INPUT CAPACITANCE (pF)
VCC = 3.3V
VCC = 5.0V
Detailed Description
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are
diode arrays designed to protect sensitive electronics
against damage resulting from ESD conditions or tran-
sient voltages. The low input capacitance makes these
devices ideal for high-speed data lines. The
MAX3202E, MAX3203E, MAX3204E, and MAX3206E
protect two, three, four, and six channels, respectively.
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are
designed to work in conjunction with a device’s intrinsic
ESD protection. The MAX3202E/MAX3203E/MAX3204E/
MAX3206E limit the excursion of the ESD event to
below ±25V peak voltage when subjected to the
Human Body Model waveform. When subjected to the
IEC 61000-4-2 waveform, the peak voltage is limited to
±60V when subjected to Contact Discharge and ±100V
when subjected to Air-Gap Discharge. The device that
is being protected by the MAX3202E/MAX3203E/
MAX3204E/MAX3206E must be able to withstand these
peak voltages plus any additional voltage generated by
the parasitic board.
Applications Information
Design Considerations
Maximum protection against ESD damage results from
proper board layout (see the Layout Recommendations
section and Figure 2). A good layout reduces the para-
sitic series inductance on the ground line, supply line,
and protected signal lines.
The MAX3202E/MAX3203E/MAX3204E/MAX3206E ESD
diodes clamp the voltage on the protected lines during
an ESD event and shunt the current to GND or VCC. In
an ideal circuit, the clamping voltage, VC, is defined as
the forward voltage drop, VF, of the protection diode
plus any supply voltage present on the cathode.
For positive ESD pulses:
VC= VCC + VF
For negative ESD pulses:
VC= -VF
In reality, the effect of the parasitic series inductance
on the lines must also be considered (Figure 1).
For positive ESD pulses:
For negative ESD pulses:
where IESD is the ESD current pulse.
VV Lx
dI
dt Lx
dI
dt
CFD ESD ESD
() ()
=−+
+
()
213
VV V Lx
dI
dt Lx
dI
dt
CCCFD ESD ESD
() ()
=+ +
+
()
112
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
4_______________________________________________________________________________________
L1
PROTECTED
LINE
L3
D2
GROUND RAIL
POSITIVE SUPPLY RAIL
I/O_
D1
L2
Figure 1. Parasitic Series Inductance
VCC
PROTECTED LINE
NEGATIVE ESD
CURRENT
PULSE
PATH TO
GROUND
PROTECTED
CIRCUIT
GND
D1
I/O_
VC
D2
L1
L3
L2
Figure 2. Layout Considerations
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
_______________________________________________________________________________________ 5
During an ESD event, the current pulse rises from zero
to peak value in nanoseconds (Figure 3). For example,
in a 15kV IEC-61000 Air-Gap Discharge ESD event,
the pulse current rises to approximately 45A in 1ns
(di/dt = 45 x 109). An inductance of only 10nH adds an
additional 450V to the clamp voltage. An inductance of
10nH represents approximately 0.5in of board trace.
Regardless of the device’s specified diode clamp volt-
age, a poor layout with parasitic inductance significantly
increases the effective clamp voltage at the protected
signal line.
A low-ESR 0.1µF capacitor must be used between VCC
and GND. This bypass capacitor absorbs the charge
transferred by an +8kV IEC-61000 Contact Discharge
ESD event.
Ideally, the supply rail (VCC) would absorb the charge
caused by a positive ESD strike without changing its
regulated value. In reality, all power supplies have an
effective output impedance on their positive rails. If a
power supply’s effective output impedance is 1Ω, then
by using V = I ×R, the clamping voltage of VCincreas-
es by the equation VC= IESD x ROUT. An +8kV IEC
61000-4-2 ESD event generates a current spike of 24A,
so the clamping voltage increases by VC= 24A ×1Ω,
or VC= 24V. Again, a poor layout without proper
bypassing increases the clamping voltage. A ceramic
chip capacitor mounted as close to the MAX3202E/
MAX3203E/MAX3204E/MAX3206E VCC pin is the best
choice for this application. A bypass capacitor should
also be placed as close to the protected device as
possible.
±15kV ESD Protection
ESD protection can be tested in various ways; the
MAX3202E/MAX3203E/MAX3204E/MAX3206E are
characterized for protection to the following limits:
•±15kV using the Human Body Model
•±8kV using the Contact Discharge method speci-
fied in IEC 61000-4-2
•±15kV using the IEC 61000-4-2 Air-Gap Discharge
method
ESD Test Conditions
ESD performance depends on a number of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 4 shows the Human Body Model, and Figure 5
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the device through a
1.5kΩresistor.
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1MΩ
RD
1.5kΩ
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 4. Human Body ESD Test Model
IP 100%
90%
36.8%
tRL TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
0
AMPERES
Figure 5. Human Body Model Current Waveform
tR = 0.7ns to 1ns 30ns
60ns
t
100%
90%
10%
I
PEAK
I
Figure 3. IEC 61000-4-2 ESD Generator Current Waveform
MAX3202E/MAX3203E/MAX3204E/MAX3206E
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment. The MAX3202E/
MAX3203E/MAX3204E/MAX3206E help users design
equipment that meets Level 4 of IEC 61000-4-2.
The main difference between tests done using the
Human Body Model and IEC 61000-4-2 is higher peak
current in IEC 61000-4-2. Because series resistance is
lower in the IEC 61000-4-2 ESD test model (Figure 6)
the ESD-withstand voltage measured to this standard is
generally lower than that measured using the Human
Body Model. Figure 3 shows the current waveform for
the ±8kV IEC 61000-4-2 Level 4 ESD Contact
Discharge test.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
Layout Recommendations
Proper circuit-board layout is critical to suppress ESD-
induced line transients. The MAX3202E/MAX3203E/
MAX3204E/MAX3206E clamp to 100V; however, with
improper layout, the voltage spike at the device is
much higher. A lead inductance of 10nH with a 45A
current spike at a dv/dt of 1ns results in an ADDITION-
AL 450V spike on the protected line. It is essential that
the layout of the PC board follows these guidelines:
1) Minimize trace length between the connector or
input terminal, I/O_, and the protected signal line.
2) Use separate planes for power and ground to reduce
parasitic inductance and to reduce the impedance to
the power rails for shunted ESD current.
3) Ensure short ESD transient return paths to GND
and VCC.
4) Minimize conductive power and ground loops.
5) Do not place critical signals near the edge of the
PC board.
6) Bypass VCC to GND with a low-ESR ceramic capac-
itor as close to VCC as possible.
7) Bypass the supply of the protected device to GND
with a low-ESR ceramic capacitor as close to the
supply pin as possible.
UCSP Considerations
For general UCSP package information and PC layout
considerations, refer to Maxim Application Note 263,
Wafer-Level Chip-Scale Package.
___________________UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly meth-
ods, circuit-board material, and usage environment.
The user should closely review these areas when con-
sidering use of a UCSP. Performance through operat-
ing life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer-fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP. UCSPs
are attached through direct solder contact to the user’s
PC board, foregoing the inherent stress relief of a pack-
aged product lead frame. Solder-joint contact integrity
must be considered. Table 1 shows the testing done to
characterize the UCSP reliability performance. In con-
clusion, the UCSP is capable of performing reliably
through environmental stresses as indicated by the
results in the table. Additional usage data and recom-
mendations are detailed in the UCSP application note,
which can be found on Maxim’s website at
www.maxim-ic.com.
Chip Information
DIODE COUNT:
MAX3202E: 4
MAX3203E: 6
MAX3204E: 8
MAX3206E: 12
PROCESS: BiCMOS
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
6_______________________________________________________________________________________
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50Ω to 100Ω
RD
330Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 6. IEC 61000-4-2 ESD Test Model
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
_______________________________________________________________________________________ 7
Table 1. Reliability Test Data
TEST CONDITIONS DURATION FAILURES PER SAMPLE SIZE
Temperature Cycle -35°C to +85°C,
-40°C to +100°C
150 cycles,
900 cycles
0/10,
0/200
Operating Life TA = +70°C 240hr 0/10
Moisture Resistance -20°C to +60°C, 90% RH 240hr 0/10
Low-Temperature Storage -20°C 240hr 0/10
Low-Temperature Operational -10°C 24hr 0/10
Solderability 8hr steam age — 0/15
ESD
±2000V, Human Body Model
— 0/5
High-Temperature Operating Life TJ = +150°C 168hr 0/45
MAX3202E
VCC
GND
I/O1 I/O2
MAX3203E
VCC
GND
I/O1 I/O3
I/O2
MAX3204E
VCC
GND
I/O1 I/O2 I/O3 I/O4
MAX3206E
VCC
GND
I/O1 I/O2 I/O5 I/O6
I/O3 I/O4
Functional Diagrams
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
8_______________________________________________________________________________________
12
N.C.
11
VCC
10
N.C.
45
GND
6
N.C.
1
2I/02
3
9
8
7I/03
I/06
I/05
I/04
MAX3206E
I/01
N.C.
THIN QFN
UCSP
A2 A3 I/O4
A1
I/O3
I/O2
I/O1
GND
B1 B3 I/O5
C1 C2 C3 I/O6
VCC
MAX3204E
UCSP
A2 A3A1
I/O2I/O3 VCC
I/O4GND I/O1
B1 B2 B3
MAX3203E
UCSP
A2 A3A1
I/O2I/O3 VCC
GND I/O1
B1 B3
MAX3202E
UCSP
A2A1
I/O1 GND
TOP VIEW
(BUMPS ON BOTTOM)
VCC I/O2
B1 B2
MAX3206E
1
2I/02
3
6
5
4GND
VCC
I/04
I/03
I/01
THIN QFN
MAX3204E
1
2I/02
3
6
5
4GND
VCC
N.C.
I/03
I/01
THIN QFN
MAX3203E
1
2N.C.
3
6
5
4I/01
I/02
N.C.
GND
VCC
THIN QFN
MAX3202E
Pin Configurations
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
_______________________________________________________________________________________ 9
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
4L, UCSP 2x2.EPS
G1
1
21-0117
PACKAGE OUTLINE, 2x2 UCSP
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
10 ______________________________________________________________________________________
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
6L, UCSP.EPS
G
1
1
21-0097
PACKAGE OUTLINE, 3x2 UCSP
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
______________________________________________________________________________________ 11
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
9LUCSP, 3x3.EPS
I1
1
21-0093
PACKAGE OUTLINE, 3x3 UCSP
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
12 ______________________________________________________________________________________
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
L
CL
C
PIN 1
INDEX
AREA
D
E
L
e
L
A
e
E2
DETAIL A
N
G
1
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
______________________________________________________________________________________ 13
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
COMMON DIMENSIONS
SYMBOL MIN. MAX.
A0.70 0.80
D2.90 3.10
E2.90 3.10
A1 0.00 0.05
L0.20 0.40
PKG. CODE ND2 E2 eJEDEC SPEC b[(N/2)-1] x e
PACKAGE VARIATIONS
0.25 MIN.k
A2 0.20 REF.
2.30±0.101.50±0.106T633-1 0.95 BSC MO229 / WEEA 1.90 REF0.40±0.05
1.95 REF0.30±0.05
0.65 BSC
2.30±0.108T833-1
2.00 REF0.25±0.050.50 BSC2.30±0.1010T1033-1
2.40 REF0.20±0.05- - - - 0.40 BSC1.70±0.10 2.30±0.1014T1433-1
1.50±0.10
1.50±0.10
MO229 / WEEC
MO229 / WEED-3
0.40 BSC - - - - 0.20±0.05 2.40 REFT1433-2 14 2.30±0.101.70±0.10
T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF
T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
-DRAWING NOT TO SCALE-
G
2
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
DOWNBONDS
ALLOWED
NO
NO
NO
NO
YES
NO
YES
NO
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
14 ______________________________________________________________________________________
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
24L QFN THIN.EPS
C
1
2
21-0139
PACKAGE OUTLINE
12, 16, 20, 24L THIN QFN, 4x4x0.8mm
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15
©2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
C
2
2
21-0139
PACKAGE OUTLINE
12, 16, 20, 24L THIN QFN, 4x4x0.8mm
ENGLISH • ???? • ??? • ???
WHAT'S NEW
PRODUCTS
SOLUTIONS
DESIGN
APPNOTES
SUPPORT
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MAX3202E
Part Number Table
Notes:
See the MAX3202E QuickView Data Sheet for further information on this product family or download the
MAX3202E full data sheet (PDF, 768kB).
1.
Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.2.
Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within
one business day.
3.
Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: See full
data sheet or Part Naming Conventions.
4.
* Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the
product uses.
5.
Part Number
Free
Sample
Buy
Direct
Package:
TYPE PINS SIZE
DRAWING CODE/VAR *
Temp
RoHS/Lead-Free?
Materials Analysis
MAX3202EETT+
THIN QFN (Dual);6 pin;3X3X0.8mm
Dwg: 21-0137I (PDF)
Use pkgcode/variation: T633+2*
-40C to +85C
RoHS/Lead-Free: Yes
Materials Analysis
MAX3202EETT
THIN QFN (Dual);6 pin;3X3X0.8mm
Dwg: 21-0137I (PDF)
Use pkgcode/variation: T633-2*
-40C to +85C
RoHS/Lead-Free: No
Materials Analysis
MAX3202EETT+T
THIN QFN (Dual);6 pin;3X3X0.8mm
Dwg: 21-0137I (PDF)
Use pkgcode/variation: T633+2*
-40C to +85C
RoHS/Lead-Free: Yes
Materials Analysis
MAX3202EEBS
UC SP;4 pin;
Dwg: 21-0117G (PDF)
Use pkgcode/variation: B4-2*
0C to +70C
RoHS/Lead-Free: No
Materials Analysis
MAX3202EEBS+
UC SP;4 pin;
Dwg: 21-0117G (PDF)
Use pkgcode/variation: B4+2*
0C to +70C
RoHS/Lead-Free: Yes
Materials Analysis
MAX3202EEBS-T
UC SP;4 pin;
Dwg: 21-0117G (PDF)
Use pkgcode/variation: B4-2*
0C to +70C
RoHS/Lead-Free: No
Materials Analysis
MAX3202EEBS+T
UC SP;4 pin;
Dwg: 21-0117G (PDF)
Use pkgcode/variation: B4+2*
0C to +70C
RoHS/Lead-Free: Yes
Materials Analysis
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