SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
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FEATURES
DRail-To-Rail Output
DVICR Includes Ground
DGain-Bandwidth Product ...9 MHz
DSupply Current ...730 µA/Channel
DSingle, Duals, and Quad Versions
DUltralow Power Down Mode
IDD(SHDN) = 4 µA/Channel
DSpecified Temperature Range
−40°C to 125°C...Industrial Grade
DSupply Voltage Range ...2.7 V to 5.5 V
DUltrasmall Packaging
5 or 6 Pin SOT-23 (TLV2630/1)
8 or 10 Pin MSOP (TLV2632/3)
DUniversal Op-Amp EVM (See SLOU060
for More Information)
Operational Amplifier
+
−
DESCRIPTION
The TLV263x single supply operational amplifiers
provide rail-to-rail output with an input range that
includes ground. The TLV263x takes the minimum
operating supply voltage down to 2.7 V over the
extended industrial temperature range (−40°C to
125°C) while adding the rail-to-rail output swing feature.
The TLV263x also provides a 9 MHz gain-bandwidth
product from only 730 µA of supply current. The
maximum recommended supply voltage is 5.5 V, which,
when coupled with a 2.7-V minimum, allows the devices
to be operated from lithium ion cells.
The combination of wide bandwidth, low noise, and low
distortion makes it ideal for high speed and high
resolution data converter applications. The ground
input range allows it to directly interface to ground rail
referred systems.
All members are available in PDIP and SOIC with the
singles in the small SOT-23 package, duals in the
MSOP, and quads in the TSSOP package.
The 2.7-V operation makes it compatible with Li-Ion
powered systems and the operating supply voltage
range of many micro-power microcontrollers available
today including TI’s MSP430.
AMPLIFIER SELECTION TABLE
DEVICE VDD
[V] IDD/ch
[µA] VICR
[V] GBW
[MHz] SLEW RATE
[V/µs] Vn, 1 kHz
[nV/√Hz]IO
[mA]
OPAx343 2.5−5.5 850 −0.3 to VDD + 0.3 5.5 6 25 40
OPAx743 3.5−12 1100 −0.1 to VDD + 0.1 7 10 30 20
TLV278x 1.8−3.6 650 −0.2 to VDD + 0.2 8 5 9 10
TLV263x 2.7−5.5 730 GND to VDD − 1 9 9.5 50 28
TLV262x 2.7−5.5 750 1 V to VDD + 0.2 11 10 27 28
OPAx353 2.7−5.5 8000 −0.1 to VDD + 0.1 44 22 7 40
Copyright 2001−2005, Texas Instruments Incorporated
!"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+0
$#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '1+ '+$%( #" +2&( !('$*%+!'(
('&!/&$/ 3&$$&!'40 $#/*)'#! ,$#)+((!5 /#+( !#' !+)+((&$.4 !).*/+
'+('!5 #" &.. ,&$&%+'+$(0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
2www.ti.com
PACKAGE/ORDERING INFORMATION(1)
PRODUCT PACKAGE PACKAGE
CODE SYMBOL SPECIFIED
TEMPERATURE RANGE ORDER NUMBER TRANSPORT MEDIA
Single with Shutdown
TLV2630ID SOIC−8 D — TLV2630ID
TLV2630IDR Tube
Tape and Reel
TLV2630IDBV SOT−23−6 DBV VAYI −40°C to 125°CTLV2630IDBVR†
TLV2630IDBVT‡Tape and Reel
TLV2630IP DIP−8 P — TLV2630IP Tube
Single without Shutdown
TLV2631ID SOIC−8 D — TLV2631ID
TLV2631IDR Tube
Tape and Reel
TLV2631IDBV SOT−23−5 DBV VAZI −40°C to 125°CTLV2631IDBVR†
TLV2631IDBVT‡Tape and Reel
TLV2631IP DIP−8 P — TLV2631IP Tube
Dual without Shutdown
TLV2632ID SOIC−8 D — TLV2632ID
TLV2632IDR Tube
Tape and Reel
TLV2632IDGK MSOP−8 DGK AKG −40°C to 125°CTLV2632IDGK
TLV2632IDGKR Tube
Tape and Reel
TLV2632IP DIP−8 P — TLV2632IP Tube
Dual with Shutdown
TLV2633ID SOIC−14 D — TLV2633ID
TLV2633IDR Tube
Tape and Reel
TLV2633IDGS MSOP−10 DGS AKK −40°C to 125°CTLV2633IDGS
TLV2633IDGSR Tube
Tape and Reel
TLV2633IN DIP−14 N — TLV2633IN Tube
Quad without Shutdown
TLV2634ID SOIC−14 D — TLV2634ID
TLV2634IDR Tube
Tape and Reel
TLV2634IN DIP−14 N — −40°C to 125°CTLV2634IN Tube
TLV2634IPW TSSOP−14 PW —
−40 C to 125 C
TLV2634IPW
TLV2634IPWR Tube
Tape and Reel
Quad with Shutdown
TLV2635ID SOIC−16 D — TLV2635ID
TLV2635IDR Tube
Tape and Reel
TLV2635IN DIP−16 N — −40°C to 125°CTLV2635IN Tube
TLV2635IPW TSSOP−16 PW —
−40 C to 125 C
TLV2635IPW
TLV2635IPWR Tube
Tape and Reel
†The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel).
‡The T Suffix denotes smaller quantities (250 pieces per mini-reel).
1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID ±VDD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) GND to VDD − 1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current, II (any input) ± 10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO±40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA: I-suffix −40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, TJ150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 2: All voltage values, except differential voltages, are with respect to GND.
recommended operating conditions
MIN MAX UNIT
Supply voltage, VDD
Single supply 2.7 5.5
V
Supply voltage, VDD Split supply ±1.35 ±2.75 V
Common-mode input voltage range, VICR GND VDD−1 V
Operating free-air temperature, TAI-suffix −40 125 °C
Shutdown on/off voltage level‡
VIL 0.4
V
Shutdown on/off voltage level‡
VIH 2
V
‡Relative to GND.
electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
dc performance
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
25°C 250 3500
V
VIO
Input offset voltage
Full range 4500 µV
VIO Input offset voltage V
IC
= V
DD
/2,
V = V /2
TLV2634/5
25°C 250 4200
V
VIC = VDD/2,
VO = VDD/2 TLV2634/5 Full range 5200 µV
αVIO Temperature coefficient of input offset
voltage
ODD
25°C 3 µV/°C
VDD = 2.7 V
25°C 76 100
CMRR
Common-mode rejection ratio
VIC = GND to VDD−1 V
V
DD
= 2.7 V
Full range 67
dB
CMRR
Common-mode rejection ratio
V
IC
= GND to V
DD
−1 V
VDD = 5 V
25°C 77 100
dB
V
DD
= 5 V
Full range 74
AVD
Large-signal differential voltage
RL = 2 kΩ, VO(PP) = VDD−1 V
25°C 90 100
dB
AVD
Large-signal differential voltage
amplification RL = 2 kΩ, VO(PP) = VDD−1 V Full range 82 dB
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electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(continued)
input characteristics
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
IIO
Input offset current
25°C 1 50
IIO Input offset current
VIC = VDD/2,
Full range 100
pA
IIB
Input bias current
VIC = VDD/2,
VO = VDD/2 25°C 1 50 pA
IIB Input bias current
VO = VDD/2
Full range 200
ri(d) Differential input resistance 25°C 1000 GΩ
Ci(c) Common-mode input capacitance f = 1 kHz 25°C 12 pF
†Full range is −40°C to 125°C for the I-suffix.
output characteristics
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
VDD = 2.7 V
25°C 2.6 2.67
VIC = VDD/2, IOH = −1 mA
VDD = 2.7 V Full range 2.55
VIC = VDD/2, IOH = −1 mA
VDD = 5 V
25°C 4.92 4.98
VOH
High-level output voltage
VDD = 5 V Full range 4.9
V
VOH High-level output voltage
VDD = 2.7 V
25°C 2.25 2.43 V
VIC = VDD/2, IOH = −10 mA
VDD = 2.7 V Full range 2.15
VIC = VDD/2, IOH = −10 mA
VDD = 5 V
25°C 4.7 4.8
VDD = 5 V Full range 4.65
VDD = 2.7 V
25°C 0.03 0.1
VIC = VDD/2, IOL = 1 mA
VDD = 2.7 V Full range 0.15
VIC = VDD/2, IOL = 1 mA
VDD = 5 V
25°C 0.025 0.08
VOL
Low-level output voltage
VDD = 5 V Full range 0.1
mV
VOL Low-level output voltage
VDD = 2.7 V
25°C 0.26 0.45 mV
VIC = VDD/2, IOL = 10 mA
VDD = 2.7 V Full range 0.47
VIC = VDD/2, IOL = 10 mA
VDD = 5 V
25°C 0.2 0.3
VDD = 5 V Full range 0.35
VDD = 2.7 V,
Sourcing 14
IO
Output current
VDD = 2.7 V,
VO = 0.5 V from rail Sinking
25°C
19
mA
IOOutput current
VDD = 5 V,
Sourcing 25°C28 mA
VDD = 5 V,
VO = 0.5 V from rail Sinking 28
Sourcing
VDD = 2.7 V 50
IOS
Short-circuit output current
Sourcing VDD = 5 V
25°C
95
mA
IOS Short-circuit output current
Sinking
VDD = 2.7 V 25°C50 mA
Sinking VDD = 5 V 95
†Full range is −40°C to 125°C for the I-suffix.
power supply
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
IDD
Supply current (per channel)
VO = VDD/2,
SHDN = VDD
25°C 730 1000
A
IDD Supply current (per channel) VO = VDD/2,
SHDN = V
DD Full range 1350 µA
PSRR
Supply voltage rejection ratio
VDD = 2.7 V to 5.5 V,
No load
25°C 70 90
dB
PSRR
Supply voltage rejection ratio
(∆VDD /∆VIO)
VDD = 2.7 V to 5.5 V,
VIC = VDD/2 No load Full range 65 dB
†Full range is −40°C to 125°C for the I-suffix.
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electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(continued)
dynamic performance
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
GBWP Gain-bandwidth product RL = 2 kΩ, CL = 10 pF, f = 10 kHz 9 MHz
SR+
Positive slew rate at unity gain
RL = 2 kΩCL = 50 pF
VDD = 2.7 V,
VO(PP) = 1.7 V 6
V/ s
SR+ Positive slew rate at unity gain RL = 2 kΩ, CL = 50 pF VDD = 5 V,
VO(PP) = 3.5 V 6V/µs
SR−
Negative slew rate at unity gain
RL = 2 kΩCL = 50 pF
VDD = 2.7 V,
VO(PP) = 1.7 V 25°C10 V/µs
SR− Negative slew rate at unity gain RL = 2 kΩ, CL = 50 pF VDD = 5 V,
VO(PP) = 3.5 V 9.5 V/µs
φmPhase margin
RL = 2 kΩ,
CL = 10 pF
50 °
Gain margin
R
L
= 2 k
Ω
,
C
L
= 10 pF
20 dB
†Full range is −40°C to 125°C for the I-suffix.
noise/distortion performance
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
VO(PP) = VDD/2,
AV = 1 0.003%
THD + N Total harmonic distortion plus noise VO(PP) = VDD/2,
RL = 2 kΩ, f = 10 kHz
AV = 10 0.02%
THD + N
Total harmonic distortion plus noise
RL = 2 kΩ, f = 10 kHz
AV = 100
25°C
0.095%
Vn
Equivalent input noise voltage
f = 1 kHz 25°C50
nV/√Hz
VnEquivalent input noise voltage f = 10 kHz 30
nV/√Hz
InEquivalent input noise current f = 1 kHz 0.9 fA/√Hz
shutdown characteristics
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
IDD(SHDN)
Supply current, per channel in shutdown
SHDN = 0.4 V
25°C 4 17
A
IDD(SHDN
)
Supply current, per channel in shutdown
mode (TLV2630, TLV2633, TLV2635)
SHDN = 0.4 V
Full range 19 µA
t(on)
Amplifier turnon time‡
RL = 2 kΩ
VDD = 2.7 V 4.5
s
t(on)
Amplifier turnon time‡
RL = 2 kΩ,
CL = 10 pF
VDD = 5 V 25°C1.5 µs
t(off) Amplifier turnoff time‡
CL = 10 pF
25 C
200 ns
†Full range is −40°C to 125°C for the I-suffix.
‡Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current
has reached half its final value.
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
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DISSIPATION RATING TABLE
PACKAGE
Θ
JC
Θ
JA
TA
≤
25
°
C
TA = 125
°
C
PACKAGE
ΘJC
(°C/W)
ΘJA
(°C/W)
TA ≤ 25 C
POWER RATING
TA = 125 C
POWER RATING
D (8) 38.3 176 710 mW 142 mW
D (14) 26.9 122.3 1022 mW 204.4 mW
D (16) 25.7 114.7 1090 mW 218 mW
DBV (5) 55 324.1 385 mW 77.1 mW
DBV (6) 55 294.3 425 mW 85 mW
DGK (8) 54.2 259.9 481 mW 96.1 mW
DGS (10) 54.1 259.7 485 mW 97 mW
N (14, 16) 32 78 1600 mW 320.5 mW
P (8) 41 104 1200 mW 240.4 mW
PW (14) 29.3 173.6 720 mW 144 mW
PW (16) 28.7 161.4 774 mW 154.9 mW
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
VIO Input offset voltage vs Common-mode input voltage 1, 2
CMRR Common-mode rejection ratio vs Frequency 3
VOH High-level output voltage vs High-level output current 4, 6
VOL Low-level output voltage vs Low-level output current 5, 7
IDD Supply current vs Supply voltage 8
IDD Supply current vs Free-air temperature 9
PSRR Power supply rejection ratio vs Frequency 10
AVD Differential voltage amplification & phase vs Frequency 11
Gain-bandwidth product
vs Supply voltage 12
Gain-bandwidth product vs Free-air temperature 13
SR
Slew rate
vs Supply voltage 14
SR Slew rate vs Free-air temperature 15, 16
φmPhase margin vs Load capacitance 17
VnEquivalent input noise voltage vs Frequency 18
Crosstalk vs Frequency 19
Voltage-follower large-signal pulse response 20
Voltage-follower small-signal pulse response 21
IDD(SHDN) Shutdown supply current vs Free-air temperature 22
IDD(SHDN) Shutdown supply current vs Supply voltage 23
IDD(SHDN) Shutdown supply current/output voltage vs Time 24
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TYPICAL CHARACTERISTICS
Figure 1
−200
0
200
400
600
800
1000
1200
−0.3 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
VDD = 2.7 V
TA = 25° C
IO
VInput Offset Voltage −
−V
µ
VICR − Common-Mode Input Voltage − V
2.4 2.7
Figure 2
−200
0
200
400
600
800
1000
1200
−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
VDD = 5 V
TA = 25° C
IO
VInput Offset Voltage −−Vµ
VICR − Common-Mode Input Voltage − V
Figure 3
0
10
20
30
40
50
60
70
80
90
100
110
120 VDD = 2.7 V and 5 V
TA = 25° C
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
f − Frequency − Hz
CMRR − Common-Mode Rejection Ratio − dB
10 1k 1M10k 100k100
Figure 4
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
0 5 10 15 20 25 30 35 40 45
VDD = 2.7 V
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
VOH − High-Level Output Voltage − V
IOH − High-Level Output Current − mA
TA = 25°C
TA = 0°C
TA = −40°C
TA = 125°C
TA = 70°C
Figure 5
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
0 5 10 15 20 25 30 35 40 45
VDD = 2.7 V
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
TA = 25°C
TA = 0°C
TA = −40°C
TA = 125°C
TA = 70°C
IOL − Low-Level Output Current − mA
OL
V − Low-Level Output Voltage − V
Figure 6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 102030405060708090100
TA = 25°C
TA = 0°C
TA = −40°C
VDD = 5 V
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
VOH − High-Level Output Voltage − V
IOH − High-Level Output Current − mA
TA = 125°C
TA = 70°C
Figure 7
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 102030405060708090100
VDD = 5 V
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
IOL − Low-Level Output Current − mA
OL
V − Low-Level Output Voltage − V
TA = 125°C
TA = 70°C
TA = 25°C
TA = 0°C
TA = −40°C
Figure 8
0
100
200
300
400
500
600
700
800
900
1000
1100
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
AV= 1
VIC = VDD/2
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
VDD − Supply Voltage − V
DD
I Supply Current − − A/chµ
TA = 125°C
TA = 70°C
TA = 25°C
TA = 0°C
TA = −40°C
Figure 9
0
100
200
300
400
500
600
700
800
900
1000
1100
−40 −25 −10 5 20 35 50 65 80 95 110 125
AV= 1
VIC = VDD/2
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
VDD = 5 V
VDD = 2.7 V
DD
I Supply Current − − A/chµ
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TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
70
80
90
100 VDD = 2.7 V and 5 V
TA = 25° C
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
f − Frequency − Hz
10 1k 10M10k 100k100
− Power Supply Rejection Ratio − dBPSRR
PSSR+
PSSR−
1M −10
0
10
20
30
40
50
60
70
80
90
100
1 k 10 k 100 k 1 M 10 M
−90
−60
−30
0
30
60
90
120
f − Frequency − Hz
DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE
vs
FREQUENCY
− Differential Voltage Amplification − dBAVD
Gain
Phase
VDD = 2.7 V
RL= 2 kΩ
CL = 10 pF
TA = 25° C
Phase −°
Figure 10 Figure 11
Figure 12
0
1
2
3
4
5
6
7
8
9
10
2 2.5 3 3.5 4 4.5 5 5.5 6
GAIN-BANDWIDTH PRODUCT
vs
SUPPLY VOLTAGE
Gain-Bandwidth Product − MHz
VDD − Supply Voltage − V
RL = 2 kΩ
CL = 10 pF
f = 10 kHz
Figure 13
0
1
2
3
4
5
6
7
8
9
10
−40 −25 −10 5 20 35 50 65 80 95 110125
GAIN-BANDWIDTH PRODUCT
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
Gain-Bandwidth Product − MHz
VDD = 2.7 and 5 V
RL = 2 kΩ
CL = 10 pF
f = 10 kHz
Figure 14
0
1
2
3
4
5
6
7
8
9
10
11
2.5 3 3.5 4 4.5 5 5.5 6
SR−
SR+
VDD − Supply Voltage − V
SR − Slew Rate − V/µs
AV = 1
RL = 2 kΩ
CL = 50 pF
V(step) = 1 Vpp
TA = 25° C
SLEW RATE
vs
SUPPLY VOLTAGE
Figure 15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
−40 −25 −10 5 20 35 50 65 80 95 110 125
VDD = 2.7 V
AV = 1
RL = 2 kΩ
CL = 50 pF
V(step) = 1 Vpp
SLEW RATE
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
SR − Slew Rate − V/µs
SR−
SR+
Figure 16
0
1
2
3
4
5
6
7
8
9
10
11
12
13
−40 −25 −10 5 20 35 50 65 80 95 110 125
SR−
SR+
SLEW RATE
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
SR − Slew Rate − V/µs
VDD = 5 V
AV = 1
V(step) = 1 Vpp
RL = 2 kΩ
CL = 50 pF
Figure 17
0
5
10
15
20
25
30
35
40
45
50
55
10 100 1 k
PHASE MARGIN
vs
LOAD CAPACITANCE
CL − Load Capacitance − pF
φm− Phase Margin − °
VDD = 2.7 V and 5 V
RL = 2 kΩ
AV = 1
TA = 25°C
Rnull = 100 Ω
Rnull = 20 Ω
Rnull = 0 Ω
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
9
www.ti.com
TYPICAL CHARACTERISTICS
Figure 18
0
50
100
150
200
250
300
350
400
450
500 VDD = 2.7 V and 5 V
TA = 25° C
f − Frequency − Hz
10 1k 100k10k100
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
nV/ Hz− Equivalent Input Noise Voltage −Vn
Figure 19
f − Frequency − Hz
10 1k 100k10k100
CROSSTALK
vs
FREQUENCY
Crosstalk − dB
Shutdown Crosstalk
VDD = 2.7 V and 5 V
RL = 2 kΩ
CL = 10 pF
AV = 1
VO(PP) = VDD/2
TA = 25°C
All Channels
Crosstalk
0
−20
−40
−60
−80
−100
−120
−140
Figure 20
0
1
2
3
4
5
6
7
8
0123456
−2
−1
0
1
2
VOLTAGE-FOLLOWER LARGE-SIGNAL
PULSE RESPONSE
t − Time − µs
− Common-Mode Input Voltage − VVIC
− Output Voltage − VVO
VDD = 5 V
VIC = VDD/2
RL = 2 kΩ
CL = 10 pF
AV = 1
TA = 25°C
VIC
VO
Figure 21
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
2.80
0 0.2 0.4 0.6 0.8 1 1.4
2.40
2.45
2.50
2.55
2.60
VOLTAGE-FOLLOWER SMALL-SIGNAL
PULSE RESPONSE
t − Time − µs
VDD = 5 V
VIC = 100 mV
RL = 2 kΩ
CL = 10 pF
AV = 1
TA = 25°C
VO
VIC
− Output Voltage − VVO
− Common-Mode Input Voltage − VVIC
1.2
Figure 22
0
1
2
3
4
5
6
7
8
−40 −25−10 5 20 35 50 65 80 95 110 125
TA − Free-Air Temperature − °C
VDD = 5 V
VDD = 2.7 V
Shutdown = 0 V
AV = 1
VIC = VDD/2
VDD = 3.6 V
SHUTDOWN SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
DD(SD)
I Shutdown Supply Current −− A/chµ
Figure 23
0
1
2
3
4
5
6
7
8
9
10
11
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VDD − Supply Voltage − V
Shutdown = 0 V
AV = 1
VIC = VDD/2
SHUTDOWN SUPPLY CURRENT
vs
SUPPLY VOLTAGE
DD(SD)
I Shutdown Supply Current −− A/chµ
TA = 125°C
TA = 70°C
TA = 25°C
TA = 0°C
TA = −40°C
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
10 www.ti.com
TYPICAL CHARACTERISTICS
012345
SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE
vs
TIME
678
SD − Shutdown Pulse − V
9
t − Time − µs
0.0
1.0
2.0
3.0
4.0
5.0
− Output Voltage − mVVO
0.0
0.5
1.0
1.5
2.0
2.5
1.0
0.5
0.0
1.5
SD
IDD(SD)
VO
DD(SD)
I Shutdown Supply Current −−Aµ
2.0
VDD = 5 V
AV = 1
RL = 2 kΩ
CL = 10 pF
VIC = VDD/2
TA = 25°C
Figure 24
SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005
11
www.ti.com
TLV263x PACKAGE PINOUTS
3
2
4
5
(TOP VIEW)
1
OUT
GND
IN+
VDD
IN−
TLV2631
DBV PACKAGE
1
2
3
4
5
10
9
8
7
6
1OUT
1IN−
1IN+
GND
1SHDN
VDD
2OUT
2IN−
2IN+
2SHDN
3
2
4
6
(TOP VIEW)
1
OUT
GND
IN+
VDD
IN−
TLV2630
DBV PACKAGE
5SHDN
TLV2633
DGS PACKAGE
(TOP VIEW)
NC − No internal connection
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
SHDN
VDD
OUT
NC
TLV2630
D OR P PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
NC
VDD
OUT
NC
TLV2631
D OR P PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
GND
NC
1SHDN
NC
VDD
2OUT
2IN−
2IN+
NC
2SHDN
NC
(TOP VIEW)
TLV2633
D OR N PACKAGE
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
VDD
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
(TOP VIEW)
TLV2634
D, N, OR PW PACKAGE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1OUT
1IN−
1IN+
VDD
2IN+
2IN−
2OUT
1/2SHDN
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4SHDN
(TOP VIEW)
TLV2635
D, N, OR PW PACKAGE
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VDD
2OUT
2IN−
2IN+
TLV2632
D, DGK, OR P PACKAGE
(TOP VIEW)
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TLV2630ID ACTIVE SOIC D 8 75 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2630IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2630IDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2630IDR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2630IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
TLV2631ID ACTIVE SOIC D 8 75 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2631IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2631IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2631IDR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2631IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
TLV2632ID ACTIVE SOIC D 8 75 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2632IDGK ACTIVE MSOP DGK 8 80 None CU NIPDAU Level-1-220C-UNLIM
TLV2632IDGKR ACTIVE MSOP DGK 8 2500 None CU NIPDAU Level-1-220C-UNLIM
TLV2632IDR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2632IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
TLV2633ID ACTIVE SOIC D 14 50 Pb-Free
(RoHS) CU NIPD Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2633IDGS ACTIVE MSOP DGS 10 80 None CU SNPB Level-1-220C-UNLIM
TLV2633IDGSR ACTIVE MSOP DGS 10 2500 None CU SNPB Level-1-220C-UNLIM
TLV2633IDR ACTIVE SOIC D 14 2500 Pb-Free
(RoHS) CU NIPD Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2633IN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPD Level-NC-NC-NC
TLV2634ID ACTIVE SOIC D 14 50 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2634IDR ACTIVE SOIC D 14 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2634IN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPD Level-NC-NC-NC
TLV2634IPW ACTIVE TSSOP PW 14 90 None CU NIPDAU Level-1-220C-UNLIM
TLV2634IPWR ACTIVE TSSOP PW 14 2000 None CU NIPDAU Level-1-220C-UNLIM
TLV2635ID ACTIVE SOIC D 16 40 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV2635IDR ACTIVE SOIC D 16 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 22-Feb-2005
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TLV2635IN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
TLV2635IPW ACTIVE TSSOP PW 16 90 None CU NIPDAU Level-1-220C-UNLIM
TLV2635IPWR ACTIVE TSSOP PW 16 2000 None CU NIPDAU Level-1-220C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 22-Feb-2005
Addendum-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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