SP2209EEY/TR - Exar Corporation - Datasheet.Directory

DESCRIPTION

The rugged, high ESD SP2209E device is a complete dual RS-232 port integrated onto a

single integrated circuit. Six drivers and ten receivers provide designers a dual port solution

fully meeting the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be

implemented in applications such as personal desktop computers and workstations.

Features include high transmission rates, low power consumption, an internal charge-pump

power supply that requires only two capacitors, space saving 38-pin TSSOP package

dimensions, and compatibility with the EU directive on electromagnetic compatibility.

This device is ideal for operation in electrically harsh environments or where RS-232 cables

are frequently being plugged and unplugged. This device is also immune to high RF field

strengths without special shielding precautions.

SP2209E

High ESD Dual Port RS-232 Transceiver

■ Meets True EIA/TIA-232-F Standards

■ Complies with 89/336/EEC EMC Directive

■ Single +12V Power Supply

■ <5mA Low Power CMOS Operation

■ 100µA Low Standby Current

■ Operates With +3V Or +5V Logic

■ Allows +3.3V to +5V Standby Supply

■ Two Complete Serial Ports, 6 Drivers and

10 Receivers

■ One Receiver On Each Port Active In

Standby

■ Failsafe Receiver Outputs

■ 460kbps Minimum Data Rate

■ Guaranteed LapLink® - Compatible

■ Ideal For High Speed RS-232 Applications

■ 0.1µF Charge Pump Capacitors

■ Low EMI Emissions (EN55022)

■ Pin Compatible To ADM2209E device

■ Enhanced ESD Specifications:

+15KV Human Body Model

+15KV EN61000-4-2 Air Discharge

+8KV EN61000-4-2 Contact Discharge

■ Fast Transient Burst (EFT) Immunity

(EN61000-4-2)

Now Available in Lead Free Packaging

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation

of the device at these ratings or any other above those

indicated in the operation sections of the specifications

below is not implied. Exposure to absolute maximum

rating conditions for extended periods of time may

affect reliability and cause permanent damage to the

device.

VDD......................................................-0.3V to +14.0V

VSTBY........................................................-0.3V to +7V

Input Voltages

TXINA........................................-0.3V to (VSTBY + 0.3V)

TXINB........................................-0.3V to (VSTBY + 0.3V)

RXINA..................................................................+15V

RXINB..................................................................+15V

Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%,

C1 = C2 = 0.1µF, and TAMB = TMIN to TMAX.

SPECIFICATIONS

Output Voltages

TXOUTA..............................................................+15V

TXOUTB..............................................................+15V

RXOUTA...................................-0.3V to (VSTBY + 0.3V)

RXOUTB...................................-0.3V to (VSTBY + 0.3V)

Short-Circuit Duration

TXOUTA....................................................Continuous

TXOUTB....................................................Continuous

Storage Temperature........................-65°C to +150°C

Power Dissipation per package

38-pin TSSOP (derate 14.3mW/oC above +70oC).....1200mW

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CMOS LOGIC INPUTS AND RECEIVER OUTPUTS

SPECIFICATIONS (continued)

Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%,

C1 = C2 = 0.1µF, and TAMB = TMIN to TMAX.

PARAMETER MIN. TYP. MAX. UNITS CONDITIONS

kbps

DRIVER OUTPUTS

Output Voltage Swing +5.0 +9.0 V all driver outputs loaded with 3KΩ to GND

Output Resistance 300 ΩVDD = VSTBY = 0V, VOUT = +2V

Output Short-Circuit Current +5 +15 +30 mA one driver output shorted, VIN = 0.8V,

VOUT = 0V

RECEIVER INPUTS

Input Voltage Range -15 +15 V

Input Threshold LOW 0.4 1.45 V

Input Threshold HIGH 1.7 2.4 V

Input Hysteresis 0.25 V

Input Resistance 3 5 7 kΩVIN = +15V

TIMING CHARACTERISTICS

Driver Maximum Data Rate 460 RL = 3kΩ to 7kΩ, CL = 50pF to 470pF

460 RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF

kbps TAMB = 0oC to +85oC, VSTBY = 5V + 10% only

920 RL = 3kΩ to 7kΩ, CL = 50pF to 470pF,

VSTBY = 5V + 5%, VDD = 12V + 5%

Driver Propagation Delay

tPHL 1.0 µsR

= 3kΩ, CL = 1000pF,

refer to

Figures 3

and

tPLH 1.0 RL = 3kΩ, CL = 1000pF,

refer to

Figures 3

and

Driver Transition-Region 6 16 RL = 3kΩ to 7kΩ, CL = 50pF to 470pF

Slew Rate 4 16 V/µsR

= 3kΩ to 7kΩ, CL = 50pF to 1000pF

VSTBY = 5V + 10% only, measurements

taken from -3.0V to +3.0V or +3.0V to -3.0V

Receiver Maximum Data Rate 460 CL = 150pF

920 CL = 150pF, VSTBY = 5V + 5% only

Receiver Propagation Delay

tPHL (R1x - R4x) 0.4 0.75 CL = 150pF, refer to

Figures 4

and

tPLH (R1x -R4x) 0.4 0.75 µsC

= 150pF, refer to

Figures 4

and

tPHL (R5x) 1.0 2.0 CL = 150pF, refer to

Figures 4

and

tPLH (R5x) 1.0 2.0 CL = 150pF, refer to

Figures 4

and

Receiver Output Rise Time 30 ns refer to

Figures 4 and 6

Receiver Output Fall Time 30 ns refer to

Figures 4 and 6

OPERATING CHARACTERISTICS

Operating Voltage Range, VDD +10.8 +12.0 +13.2 V

Standby Voltage Range, VSTBY +3.15 +5.5 V

Operating Temperature, TAMB -40 +85 oC

Table 1. Device Pin Description

EMANNOITCNUFREBMUNNIP

ATUO.AtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 1

ATUO.AtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 2

ATUO.AtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 3

ATUO.AtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 4

ATUO.AtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 5

ANI.AtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 6

ANI.AtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 7

ANI.AtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 8

YBTSRsreviecerrofylppusrewopybdnatsV5+otV3.3+

RdnaATUO

.BTUO9

ylppusrewopV21+ 01

+C.roticapacpmup-egrahc1CdeziralopehtroflanimretevitisoP 11

BNI.BtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 21

BNI.BtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 31

BNI.BtroproftupnirevirdlevelcigolSOMC/LTTV5+otV3.3+ 41

BTUO.BtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 51

BTUO.BtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 61

BTUO.BtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 71

BTUO.BtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 81

BTUO.BtroproftuptuoreviecerlevelcigolSOMC/LTTV5+otV3.3+ 91

BNI.Btroproftupnireviecer232-SR 02

BNI.Btroproftupnireviecer232-SR 12

BNI.Btroproftupnireviecer232-SR 22

BNI.Btroproftupnireviecer232-SR 32

BNI.Btroproftupnireviecer232-SR 42

BTUO.Btroproftuptuorevird232-SR 52

BTUO.Btroproftuptuorevird232-SR 62

BTUO.Btroproftuptuorevird232-SR 72

DNG.dnuorG 82

-C.roticapacpmup-egrahc1CdeziralopehtroflanimretevitageN 92

-V lanimretevitagenehttapmupegrahcehtybdetarenegtuptuoV21-

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Figure 1. SP2209E Pinout Configuration

R4INB

C-

R1INB

R2INB

R3INB

T3INB

T1OUTB

T2OUTB

T3OUTB

T1INB

T2INB

R5INB

SP2209E

T1INA

T2OUTA

T1OUTA

T3INA

T2INA

V-

C+

STBY

GND

R5OUTA

R4OUTA

R3OUTA

R2OUTA

R1OUTA

R1OUTB

R2OUTB

R3OUTB

R4OUTB

R5OUTB

T3OUTA

R1INA

R3INA

R2INA

R5INA

R4INA

Table 1. Device Pin Description (continued)

EMANNOITCNUFREBMUNNIP

ATUO.Atroproftuptuorevird232-SR 13

ATUO.Atroproftuptuorevird232-SR 23

ATUO.Atroproftuptuorevird232-SR 33

ANI.Atroproftupnireviecer232-SR 43

ANI.Atroproftupnireviecer232-SR 53

ANI.Atroproftupnireviecer232-SR 63

ANI.Atroproftupnireviecer232-SR 73

ANI.Atroproftupnireviecer232-SR 83

Figure 2. SP2209E Typical Operating Circuit

SP2209E

11 30

5KΩ

C+

C-

V-

0.1µF

RS-232

OUTPUTS

RS-232

INPUTS

TTL/CMOS

INPUTS

TTL/CMOS

OUTPUTS

+12V

INA

OUTA R

INA

OUTA

INA

INA T

OUTA

INA

OUTA

5KΩ

RS-232

OUTPUTS

RS-232

INPUTS

TTL/CMOS

INPUTS

TTL/CMOS

OUTPUTS

INB

OUTB R

INB

OUTB

INB

INB T

OUTB

INB

OUTB

GND

+3.3V

400KΩ

0.1µF

STBY

DESCRIPTION

The SP2209E device is a rugged, high ESD,

complete dual RS-232 port integrated onto a

single integrated circuit. Six drivers and ten

receivers provide a dual port solution fully

meeting the EIA/TIA-232 and ITU-T V.28/V.24

communication protocols and can be

implemented in applications such as personal

desktop computers and workstations. Refer to

Figure 2 for a typical operating circuit.

Features include high transmission rates, low

power consumption, space saving package

dimensions, and compatibility with the EU

directive on electromagnetic compatibility.

EM compatibility includes protection against

radiated and conducted interference including

high levels of electrostatic discharge. This device

is ideal for operation in electrically harsh

environments or where RS-232 cables are

frequently being plugged and unplugged. This

device is also immune to high RF field strengths

without special shielding precautions. Emissions

are also controlled to within very strict limits.

The SP2209E device features the inverter

portion of Sipex's proprietary and patented

(U.S. 5,306,954) on-board charge pump

circuitry that generates a -9V voltage level from

a single +12V power supply. The SP2209E

device can operate at data rates of at least

460kbps fully loaded.

Its low power CMOS operation makes the

SP2209E device an ideal choice for power

sensitive designs. The SP2209E device has two

receivers, one for each RS-232 port, that

remains active in the standby mode to allow the

monitoring of peripheral devices while the rest

of the system is in a power-saving standby

mode. This allows the SP2209E device to wake

up the entire system when any communication

is initiated in peripheral devices. The SP2209E

device has a low standby current of 100µA.

THEORY OF OPERATION

The SP2209E device is made up of four

basic circuit blocks: 1. Drivers, 2. Receivers,

3. the Sipex proprietary charge pump, and

4. Standby circuitry.

Drivers

The drivers are inverting level transmitters

that convert TTL or CMOS logic levels to

EIA/TIA-232 levels with an inverted sense

relative to the input logic levels. With VDD =

+12V, the typical RS-232 output voltage swing

is +9V with no load and +5V minimum fully

loaded. Unused driver input may be left

unconnected with an internal pull-up resistor

pulling the inputs high forcing the driver outputs

into a low state. The driver outputs are protected

against infinite short-circuits to ground without

degradation in reliability. These drivers comply

with the EIA-TIA-232F and all previous

RS-232 versions.

The drivers typically can operate at a minimum

data rate of 460kbps fully loaded with 3KΩ in

parallel with 1000pF, ensuring compatibility

with PC-to-PC communication software. The

SP2209E device is ideal for the new generation

modem standards which require data rates greater

than 460kbps. Refer to Figures 3 and 5 for driver

propagation delay test circuit and waveforms,

respectively.

Receivers

The receivers convert EIA/TIA-232 levels to

TTL or CMOS logic output levels. Should an

unused receiver input be left unconnected, an

internal 5kΩ pulldown resistor to ground will

commit the output of the receiver to a HIGH

state. Receiver inputs are also protected

against overvoltages of up to +15V. Refer to

Figures 4 and 6 for receiver propagation delay test

circuit and waveforms, respectively.

3kΩ1000pF

OUT

+3V

DRIVER

OUTPUT

1.5V 1.5V

PHL

PLH

SKEW =

PHL -

PLH

DRIVER

INPUT

+3V

0V -3V +3V

-3V

Data Transmission Rate > 460kbps, t

<5ns, t

<5ns

150pF

OUT

+3V

-3V

RECEIVER

OUTPUT

0V 0V

PHL

PLH

SKEW =

PHL -

PLH

RECEIVER

INPUT

80%

50% 20% 80%

20%

Data Transmission Rate > 460kbps, t

<200ns, t

<200ns

Figure 3. Driver Propagation Delay and Transition

Time Test Circuit Figure 4. Receiver Propagation Delay and Transition

Time Test Circuit

Figure 5. Driver Propagation Delays

Figure 6. Receiver Propagation Delays

One receiver in each RS-232 port can be kept

active by a low current, +3.3V to +5V power

supply while the rest of the channels are pow-

ered down. This allows the SP2209E device to

monitor peripheral devices while the rest of the

system is in a power-saving standby mode.

The SP2209E device can be implemented as a

power management device to wake up the entire

system when any communication is initiated in

peripheral devices. The SP2209E device has a

low standby current of 100µA.

Since receiver input is usually from a transmission

line where long cable lengths and system

interference can degrade the signal, the inputs

have a typical hysteresis margin of 300mV.

This ensures that the receiver is virtually

immune to noisy transmission lines and inputs

with slow transition times.

Charge Pump

The charge pump is a Sipex–patented design

(U.S. 5,306,954) and uses a unique approach

compared to older less–efficient designs.

The charge pump requires two external

capacitors using a two–phase voltage

shifting technique with a 200kHz internal

oscillator to attain a -9V power supply. Refer to

Figure 7 for the internal charge pump circuit.

The internal power supply consists of a charge

pump that provides output voltages of at least

+5V regardless of the input voltage (VDD). This

is important to maintain compliant RS-232

levels regardless of power supply fluctuations.

A description of each phase follows.

C1 C2

S2 S4

C2-

= -V

Figure 7. Charge Pump Circuit

Figure 8. Charge Pump Waveforms

ESD Tolerance

The SP2209E device incorporates ruggedized

ESD cells on all driver output and receiver input

pins. The ESD structure is improved over our

previous family for more rugged applications

and environments sensitive to electro-static

Phase 1

— VDD charge storage — S1 and S2 are closed.

S3 and S4 are open. During this phase of the

clock cycle, the positive side of capacitor, C1, is

connected to VDD. The negative side of C1 is

connected to GND. C1 is charged to +VDD.

Phase 2

— VDD transfer — S1 and S2 are open. S3 and

S4 are closed. The negative side of the capacitor,

C2, is connected to C2-. The positive side of C2

is connected to GND. This transfers a negative

generated voltage to C2. A negative voltage is

built up on the negative side of C2 with each

cycle of the oscillator. If the current drawn is

small, the output voltage at C2- will be close to

-VDD. As the current drawn at C2- increases, the

output voltage will decrease in magnitude. The

charge pump cycle will continue as long as the

operational conditions for the internal oscillator

are present. Refer to Figure 8 for the internal

charge pump waveforms.

Standby Circuitry

The SP2209E device incorporates power

saving, on board standby circuitry. The standby

current is typically less than 100µA.

The SP2209E device automatically enters a

standby mode when the VDD power supply is

removed. An internal comparator generates an

internal shutdown signal that disables the

internal oscillator disengaging the charge pump.

Refer to Figure 9 for the internal standby

detection circuit.

The inverted output V- goes to ground. All

driver outputs are disabled. The inputs of

receivers 1 through 4 for both ports A and B are

at high impedance. Receiver 5 for both ports A

and B remain fully active as power management

receiver lines to system peripherals that may

come online during the standby mode.

STBY

Internal

Shutdown

Signal

Figure 9. Internal Standby Detection Circuit

discharges and associated transients. The

improved ESD tolerance is at least +15kV

without damage nor latch-up.

There are different methods of ESD testing

applied: a) MIL-STD-883, Method 3015.7

b) EN61000-4-2 Air-Discharge

c) EN61000-4-2 Direct Contact

The Human Body Model has been the generally

accepted ESD testing method for semiconductors.

This method is also specified in MIL-STD-883,

Method 3015.7 for ESD testing. The premise of

this ESD test is to simulate the human body’s

potential to store electro-static energy and

discharge it to an integrated circuit. The

simulation is performed by using a test model as

shown in Figure 10. This method will test the

IC’s capability to withstand an ESD transient

during normal handling such as in manufacturing

areas where the ICs tend to be handled frequently.

The EN61000-4-2, formerly IEC801-2, is

generally used for testing ESD on equipment and

systems. For system manufacturers, they must

guarantee a certain amount of ESD protection

since the system itself is exposed to the outside

environment and human presence. The premise

with EN61000-4-2 is that the system is required

to withstand an amount of static electricity when

ESD is applied to points and surfaces of the

equipment that are accessible to personnel during

normal usage. The transceiver IC receives most

of the ESD current when the ESD source is

applied to the connector pins. The test circuit for

EN61000-4-2 is shown on Figure 11. There are

two methods within EN61000-4-2, the Air

Discharge method and the Contact Discharge

method.

With the Air Discharge Method, an ESD voltage

is applied to the equipment under test (EUT)

through air. This simulates an electrically charged

person ready to connect a cable onto the rear of

the system only to find an unpleasant zap just

before the person touches the back panel. The

high energy potential on the person discharges

through an arcing path to the rear panel of the

system before he or she even touches the system.

This energy, whether discharged directly or

through air, is predominantly a function of the

discharge current rather than the discharge

voltage. Variables with an air discharge such as

approach speed of the object carrying the ESD

potential to the system and humidity will tend to

change the discharge current. For example, the

rise time of the discharge current varies with the

approach speed.

The Contact Discharge Method applies the ESD

current directly to the EUT. This method was

devised to reduce the unpredictability of the

ESD arc. The discharge current rise time is

constant since the energy is directly transferred

without the air-gap arc. In situations such as

hand held systems, the ESD charge can be directly

discharged to the equipment from a person already

Figure 10. ESD Test Circuit for Human Body Model

holding the equipment. The current is transferred

on to the keypad or the serial port of the equipment

directly and then travels through the PCB and finally

to the IC.

The circuit model in Figures 10 and 11 represent

the typical ESD testing circuit used for all three

methods. The CS is initially charged with the DC

power supply when the first switch (SW1) is on.

Now that the capacitor is charged, the second

switch (SW2) is on while SW1 switches off. The

voltage stored in the capacitor is then applied

through RS, the current limiting resistor, onto the

device under test (DUT). In ESD tests, the SW2

switch is pulsed so that the device under test

receives a duration of voltage.

For the Human Body Model, the current limiting

resistor (RS) and the source capacitor (CS) are

1.5kΩ an 100pF, respectively. For EN61000-4-2,

the current limiting resistor (RS) and the source

capacitor (CS) are 330Ω an 150pF, respectively.

The higher CS value and lower RS value in the

EN61000-4-2 model are more stringent than the

Human Body Model. The larger storage capacitor

injects a higher voltage to the test point when

SW2 is switched on. The lower current limiting

resistor increases the current charge onto the test

point.

APPLICATIONS

With six drivers and ten receivers, the SP2209E

device is ideal for applications requiring two

RS-232 ports such as in desktop or portable

computers. Refer to Figure 13. For typical DB9

serial ports for Data Terminal Equipment (DTE)

SW1SW1 SW2SW2

Device

Under

Test

DC Power

Source

SW1 SW2

DEVICE PIN HUMAN BODY IEC1000-4-2

TESTED MODEL Air Discharge Direct Contact Level

Driver Outputs +15kV +15kV +8kV 4

Receiver Inputs +15kV +15kV +8kV 4

Figure 11. ESD Test Circuit for EN61000-4-2

Table 2. Transceiver ESD Tolerance Levels

to Data Circuit Terminating Equipment (DCE)

interface implementation, 2 data lines, TxD and

RxD, and 6 control lines, RTS, DTR, DSR,

CTS, and RI, are required. The straight-through

pinout for data lines in the SP2209E device

allows a simplified PCB layout allowing ground

lines to separate the signal lines and ground

planes to be placed beneath the IC without the

complication of a multi-layer PCB layout.

A receiver from each port, R5INA and R5INB,

are active while the rest of the channels are

powered down. This allows the SP2209E

device to monitor peripheral devices while the

rest of the system is in a power-saving standby

mode. Fail-Safe receiver outputs are pulled high

if the receiver inputs are left unconnected or at

zero input. The SP2209E device can be

implemented as a power management device to

wake up the entire system when any

communication is initiated in peripheral

devices. The SP2209E device has a low standby

current of 100µA.

A standard serial mouse can be powered from

the SP2209E drivers. Two driver outputs

connected in parallel and set to VOH can be used

to supply power to the V+ pin of the mouse. The

third driver is set to VOL to link current from the

V- terminal. Typical mouse specifications are

10mA at +6V and 5mA at -6V.

LapLink Compatibility

The SP2209E can operate up to 460kbps data

rate under maximum driveload conditions of

CL = 1000pF and RL = 3KΩ at minimum power

supply voltages.

RRS S andand RRV V add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.

RS and RV add up to 330Ω for IEC1000-4-2.

Contact-Discharge ModuleContact-Discharge Module

SW1SW1 SW2SW2

Device

Under

Test

DC Power

Source

SW1 SW2

Contact-Discharge Module

Figure 12. ESD Test Waveform for EN61000-4-2

t=0ns t=30ns

15A

30A

t ➙

i ➙

Figure 13. Dual Serial Port Application with Two DB9 Connectors

DB-9

Connector

COM1

5KΩ

OUTA R

INA

OUTA

INA

OUTA

INA

OUTA

633

INA T

OUTA

5KΩ

237

INA

OUTA

5KΩ

138

INA

OUTA

TXD

CTS

DTR

RXD

DSR

DCD

RTS

TXD

CTS

DTR

RXD

DSR

DCD

RTS

DB-9

Connector

COM2

5KΩ

OUTB R

INB

OUTB

INB

OUTB

INB

OUTB

14 25

INB T

OUTB

5KΩ

18 21

INB

OUTB

5KΩ

19 20

INB

OUTB

TXD

CTS

DTR

RXD

DSR

DCD

RTS

TXD

CTS

DTR

RXD

DSR

DCD

RTS

SP2209E

Super

I/O Chip

C+

C-

V-

0.1µF

GND

STBY

0.1µF

+3.3V to +5V

400KΩ

0.1µF

+12V

P ACKAGE: PLASTIC THIN SMALL

OUTLINE

(TSSOP)

DIMENSIONS

(mm)

Minimum/Maximum

(- /1.10)

(0.05/0.15)

(0.17/0.27)

(9.60/9.80)

(4.30/4.50)

(0.50 BSC)

(3.20 BSC)

(0.50/0.75)

0°/8°

38–PIN

Model Temperature Range Package Types

SP2209EEY -40°C to +85°C 38-pin TSSOP

○○○ ○○○○○○○○○○○○ ○○○○○○○○○○○○○

ORDERING INFORMATION

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the

application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.

Sipex Corporation

Headquarters and

Sales Office

22 Linnell Circle

Billerica, MA 01821

TEL: (978) 667-8700

FAX: (978) 670-9001

e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive

Milpitas, CA 95035

TEL: (408) 934-7500

FAX: (408) 935-7600

Please consult the factory for pricing and availability on a Tape-On-Reel option.

Available in lead free packaging. To order, add "-L" suffix to the part number.

Example: SP2209EEY = standard; SP2209EEY -L = lead free.