TCD2704D TOSHIBA CCD Linear Image Sensor CCD (charge coupled device) TCD2704D The TCD2704D is a high sensitive and low dark current 7500 elements x 4 line CCD color image sensor which includes CCD drive circuit, clamp circuit. The sensor is designed for scanner. The device contains a row of 7500 elements x 4 line photodiodes which provide a 24 lines/mm across a A3 size paper. The device is operated by 5 V pulse and 12 V power supply. Features x Number of image sensing elements: 7500 elements x 4 line x Image sensing element size: 5 m x 5 m on 5 m centers Weight: 5.2 g (typ.) x Photo sensing region: High sensitive PN photodiode x Distanced between photodiode array: Color (40 m, 8 lines), B/W-color (60 m, 12 lines) x Clock: 2 phase (5 V) x Power supply: 12 V power supply voltage x Internal circuit: Clamp circuit x Package: 22 pin CERDIP package Pin Connections (top view) x Color filter: Red, green, blue OS3 1 SS 22 OS2 2 21 OS1 RS 3 20 OD CP 4 19 SS V SW 2 5 18 SW 1 I1A3 6 17 I2A3 SS 7 16 NC I2A2 8 15 I2A1 I1A2 9 14 I1A1 SH3 10 13 SH0 12 SH1 1 1 1 1 Maximum Ratings (Note 1) Rating Unit Clock pulse voltage VI V Shift pulse voltage VSH V Reset pulse voltage V RS Clamp pulse voltage V CP V Changeover switch voltage V SW V Power supply voltage VOD 0.3~15 V Operating temperature Topr 0~60 C Storage temperature Tstg 25~85 C 0.3~8.0 Note 1: All voltage are with respect to SS terminals (ground). SH2 11 1 Red Green Blue Black & White Symbol 7500 7500 7500 7500 Characteristic 2002-03-22 TCD2704D Circuit Diagram OD SS SW 1 20 19 18 I1A3 I2A3 6 Clamp 17 CCD ANALOG SHIFT REGISTER (ODD) SW1 13 SH0 148 D149 PHOTO DIODE (Black & White) S7498 S7499 S7500 D128 D125 D126 D127 S1 S2 D26 D27 D28 SHIFT GATE SH0 SHIFT GATE SH0 Clamp CCD ANALOG SHIFT REGISTER (EVEN) 148 D149 PHOTO DIODE (blue) S7498 S7499 S7500 D128 D125 D126 D127 S1 S2 D26 D27 D28 SW1 12 SH1 SHIFT GATE SH1 SW2 14 I1A1 15 I2A1 148 D149 PHOTO DIODE (green) S7498 S7499 S7500 D128 CCD ANALOG SHIFT REGISTER D26 D27 D28 Clamp D125 D126 D127 S1 S2 OS1 21 11 SH2 SHIFT GATE SH2 SW2 148 D149 PHOTO DIODE (red) S7498 S7499 S7500 D128 CCD ANALOG SHIFT REGISTER D26 D27 D28 Clamp D125 D126 D127 S1 S2 OS2 22 10 SH3 SHIFT GATE SH3 OS3 1 Clamp CCD ANALOG SHIFT REGISTER 5 4 3 7 SW 2 CP RS SS 9 8 I1A2 I2A2 Pin Names OS3 Signal Output 3 (red) OS2 Signal Output 2 (green) SS Ground OS1 Signal Output 1 (blue) RS Reset Gate OD Power CP Clamp Gate SS Ground SW 2 Changeover Switch 2 (color and B/W) SW 1 Changeover Switch 1 (color and B/W) I1A3 Clock 3 (phase 1) I2A3 Clock 3 (phase 2) SS Ground NC Non Connection I2A2 Clock 2 (phase 2) I2A1 Clock 1 (phase 2) I1A2 Clock 2 (phase 1) I1A1 Clock 1 (phase 1) SH3 Shift Gate 3 SH0 Shift Gate 0 SH2 Shift Gate 2 SH1 Shift Gate 1 2 2002-03-22 TCD2704D Optical/Electrical Characteristics (Ta 25C, VOD 12 V, VI VRS VSH VCP 5 V (pulse), fI 1.0 MHz, fRS LOAD RESISTANCE 100 k: :, tINT (INTEGRATION TIME) 10 ms, LIGHT SOURCE A LIGHT SOURCE CM500S FILTER (t 1.0 mm)) Characteristics Sensitivity Symbol Min Typ. Max RB/W 8.6 10.8 13.0 RR 3.2 4.6 6.0 RG 3.7 5.4 7.1 1.0 MHz, Unit Note V/(lxs) (Note 2) RB 1.9 2.8 3.7 PRNU (1) 10 20 % (Note 3) PRNU (3) 3 12 mV (Note 4) IL 1 % (Note 5) Saturation output voltage (B/W) VSAT (B/W) 2.9 2.0 V (Note 6) Saturation output voltage (color) VSAT (color) 2.9 1.0 V (Note 6) Saturation exposure SE 0.26 lxs (Note 7) Dark signal voltage VDRK 0.4 2.0 mV (Note 8) Dark signal non uniformity DSNU 7 12 mV (Note 8) DC power dissipation PD 480 690 mW Total transfer efficiency TTE 92 % Output impedance ZO 0.3 1.0 k: DC signal output voltage VOS 5.0 6.0 7.0 V (Note 9) Random noise NDV 1.0 mV (Note 10) VRSN 0.5 1.0 V (Note 9) Photo response non uniformity Image lag Reset noise Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. 'X PRNU (1) u 100 (%) X When X is average of total signal output and 'X is the maximum deviation from X . The amount of incident light is shown below. 1 1 1 Ped SE, Green SE, Blue SE 2 2 4 Note 4: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (typ.) 3 2002-03-22 TCD2704D Note 5: Image lag is defined as follows. SH ON OFF LED OS Image lag Signal (500 mV) Note 6: VSAT is defined as minimum saturation output of all effective pixels. Note 7: Definition of SE: SE VSAT (lxs) RB/W Note 8: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. VDRK VMDK DSNU Note 9: DC signal output voltage and reset noise is defined as follows, but reset noise is a fixed pattern noise. VRSN OS VOS SS 4 2002-03-22 TCD2704D Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure. video output video output 200 ns 200 ns 'V pixel (n) pixel (n 1) Output waveform (effective pixels under dark condition) (1) (2) (3) (4) Two adjacent pixels (pixel n and n 1) in one reading are fixed as measurement points. Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n 1). V (n 1) is subtracted from V (n) to get 'V. 'V V (n) V (n 1) The standard deviation of 'V is calculated after procedure (2) and (3) are repeated 30 times (30 readings) (5) (6) 30 1 30 | 'Vi 30 i 1 'V V 2 1 (_ 'Vi _ 'V ) 30 i|1 Procedure (2), (3) and (4) are repeated 10 times to get sigma value. 10 sigma values are averaged. 10 V (7) 1 |V 10 j 1 j V value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows. N DV 1 V 2 5 2002-03-22 TCD2704D Operating Condition Characteristics Clock pulse voltage Symbol "H" Level "L" Level Min Typ. Max 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 0 0.5 11.4 12.0 13.0 VIA "H" Level Shift pulse voltage "L" Level VSH "L" Level "L" Level V V CP "H" Level Switch pulse voltage "L" Level Power supply voltage V V SW VOD Clock Characteristics (Ta Characteristics V 25C) Symbol Min Typ. Max Unit Clock pulse frequency fI 0.3 1.0 16 MHz Reset pulse frequency f RS 0.3 1.0 12 MHz Clamp pulse frequency f CP 0.3 1.0 12 MHz Clock1 capacitance (Note 11) CI1 260 390 pF Clock2 capacitance (Note 11) CI2 210 315 pF Shift gate capacitance CSH 30 60 pF Reset gate capacitance CRS 10 40 pF Clamp gate capacitance CCP 10 40 pF Switch gate capacitance CSW 10 40 pF Note 11: VOD V V V RS "H" Level Clamp pulse voltage Note V "H" Level Reset pulse voltage Unit 12 V 6 2002-03-22 TCD2704D Timing Chart 1: Bit Clamp Mode (color mode) SH0 ("H") tINT (integration time) SH1, 2, 3 I1A I2A RS CP D148 D149 D147 D146 D145 D134 D133 D132 D130 D131 D129 D128 S7500 S3698 S3697 S3696 S3690 S3689 S3688 S3687 S3686 S1 D127 D125 D126 D124 D123 D122 D121 D64 D63 D62 D60 D61 D26 D25 D13 D12 D1 D0 OS1, 2, 3 (color) DUMMY OUTPUTS (26 elements) LIGHT SHIELD OUTPUTS (96 elements) DUMMY OUTPUTS (128 elements) DUMMY OUTPUTS (6 elements) (6 elements) SIGNAL OUTPUTS (7500 elements) (12 elements) TEST OUTPUTS (1 elements) DUMMY OUTPUTS (3 elements) DUMMY OUTPUTS (22 elements) 1 LINE READOUT PERIOD (7650 elements) 7 2002-03-22 TCD2704D Timing Chart 2: Line Clamp Mode (color mode) SH0 ("H") tINT (integration time) SH1, 2, 3 I1A I2A RS CP CP SH "H" D148 D149 D147 D146 D145 D134 D133 D132 D130 D131 D129 D128 S7500 S3698 S3697 S3696 S3690 S3689 S3688 S3687 S3686 S1 D127 D125 D126 D124 D123 D122 D121 D64 D63 D62 D60 D61 D26 D25 D13 D12 D1 D0 OS1, 2, 3 (color) DUMMY OUTPUTS (26 elements) LIGHT SHIELD OUTPUTS (96 elements) DUMMY OUTPUTS (128 elements) DUMMY OUTPUTS (6 elements) (6 elements) SIGNAL OUTPUTS (7500 elements) (12 elements) TEST OUTPUTS (1 elements) DUMMY OUTPUTS (3 elements) DUMMY OUTPUTS (22 elements) 1 LINE READOUT PERIOD (7650 elements) 8 2002-03-22 TCD2704D Timing Chart 3 (color o B/W mode) tINT (integration time) SH0 SH1, 2, 3 I1A I2A RS CP SW1 SW 2 D146 D148 D0 D2 D133 D135 D147 D149 D1 D3 S7500 D134 S2 D132 S7499 D127 D129 S1 D125 D131 D126 D123 D130 D124 D27 D121 D25 D122 D26 D120 D24 2002-03-22 9 D3 D1 D149 D148 D147 D146 D145 D133 D134 D132 D128 S7500 S1 D127 D123 D122 D121 D26 D25 D1 D0 1 LINE READOUT PERIOD (3825 elements) 1 LINE READOUT PERIOD (7650 elements) D2 D0 D149 D148 D147 D146 D145 D134 D133 D132 D128 S7500 S1 D127 D123 D122 D121 D26 D25 D1 D0 OS2 (B/W) OS2 (green) D128 OS1 (B/W) OS1 (blue) TCD2704D Timing Chart 4: Bit Clamp Mode (B/W mode) SH1, 2, 3 ("H") tINT (integration time) SH0 I1A I2A RS CP D149 S7500 D147 S130 D148 S7499 S128 D146 S129 S126 D135 S127 S124 D133 S125 S122 D134 S123 S120 D131 S121 S118 D132 S119 S116 D129 S117 D130 S115 S2 D128 S1 D125 D123 D127 D121 D126 D122 D124 D120 D53 D25 D51 D3 D52 D24 D1 D50 D2 D26 D0 OS1 (B/W) D27 OS2 (B/W) DUMMY OUTPUTS (13 elements) LIGHT SHIELD OUTPUTS (3 elements) (48 elements) DUMMY OUTPUTS (64 elements) (3 elements) DUMMY OUTPUTS (6 elements) TEST OUTPUT (1 element) DUMMY OUTPUT (1 element) DUMMY OUTPUTS (11 elements) SIGNAL OUTPUTS (3750 elements) 1 LINE READOUT PERIOD (3825 elements) 10 2002-03-22 TCD2704D Timing Chart 5: Line Clamp Mode (B/W mode) SH1, 2, 3 ("H") tINT (integration time) SH0 I1A I2A RS CP CP SH "H" D149 S7500 D147 S130 D148 S7499 S128 D146 S129 S126 D135 S127 S124 D133 S125 S122 D134 S123 S120 D131 S121 S118 D132 S119 S116 D129 S117 D130 S115 S2 D128 S1 D125 D123 D127 D121 D126 D122 D124 D120 D53 D25 D51 D3 D52 D24 D1 D50 D2 D26 D0 OS1 (B/W) D27 OS2 (B/W) DUMMY OUTPUTS (13 elements) LIGHT SHIELD OUTPUTS (3 elements) (48 elements) DUMMY OUTPUTS (64 elements) (3 elements) DUMMY OUTPUTS (6 elements) TEST OUTPUT (1 element) DUMMY OUTPUT (1 element) DUMMY OUTPUTS (11 elements) SIGNAL OUTPUTS (3750 elements) 1 LINE READOUT PERIOD (3825 elements) 11 2002-03-22 TCD2704D Timing Requirements t2 t3 t4 SH I1 t1 t5 I2 I1A GND 3.5 V (max) 1.5 V (min) RS t6 CP t7 SH CP (line clamp mode) t8 B/W o Color mode: SW 1 ("L" o "H") Color o B/W mode: SW 2 ("L" o "H") B/W o Color mode: SW 2 ("H" o "L") Color o B/W mode: SW 1 ("H" o "L") I1 10% t10 t9 I2 10% t11 t12 90% RS t13 t14 t16 t15 t17 90% CP t18 t20 t19 10% to the peak OS (bit clamp mode) Peak 10% Video signal 10% to the peak OS (line clamp mode) t21 12 2002-03-22 TCD2704D Timing Requirements (cont.) Symbol Min Typ. (Note 12) Max t1 120 1000 t5 800 1000 t2, t4 0 50 ns SH pulse width t3 3000 5000 ns Pulse timing of SH and CP t6 200 500 ns Pulse timing of SH and CP (line clamp mode) t7 10 100 ns Pulse timing of SH and SW t8 100 500 t3 100 ns Characteristics Pulse timing of SH and I1 SH pulse rise time, fall time Unit ns I1, I2 pulse rise time, fall time t9, t10 0 50 ns RS pulse rise time, fall time t11, t12 0 20 ns RS pulse width t13 10 (20) 80 ns Pulse timing of RS and CP t14 0 40 ns Pulse timing of I1A, I2A and CP t15 0 20 ns t16, t17 0 20 ns t18 30 (3000) 80 (5000) ns t19 20 40 (Note 16) ns t20 20 40 (Note 15) ns t21 30 50 (Note 16) ns CP pulse rise time, fall time CP pulse width (Note 13) Reference level settle time (bit clamp mode) Video data delay time (Note 14) Reference level settle time (line clamp mode) Note 12: Typ. is the case of f RS 1.0 MHz. Note 13: Line clamp Mode inside ( ). Note 14: Load Resistance is 100 k:. Note 15: Typical settle time to about 1% of final value. Note 16: Typical settle time to about 1% of the peak. Clamp Mode Clamp Means CP Input Pulse Bit clamp CP Pulse Line clamp "H" or SH Changeover Switch Mode Output Type SW1 Input Pulse SW 2 Input Pulse SH Input Pulse Color "H" "L" SH1, 2, 3 SH Pulse, SH0 "H" B/W "L" "H" SH0 SH Pulse, SH1, 2, 3 "H" 13 2002-03-22 TCD2704D Typical Spectral Response Spectral response 1.0 Ta 25C Red Relative response 0.8 0.6 Blue Green 0.4 0.2 0 400 450 500 550 Wavelength O 14 600 650 700 (nm) 2002-03-22 TCD2704D Typical Drive Circuit 5 V 1 PF/25 V 47 PF/25 V SW 1 12 V SW 2 IC5 1 PF/25 V 5 V 47 PF/25 V I1A1 1 PF/25 V 47 PF/25 V I2A1 22 21 20 19 OS2 OS1 OD SS 18 17 SW 1 I2A3 16 15 14 13 12 NC I2A1 I1A1 SH0 SH1 IC1 5 V TCD2704D OS3 SS 1 2 RS CP 3 4 SW 2 I1A3 5 6 SS 7 I2A2 I1A2 SH3 SH2 8 9 10 11 I1A2 1 PF/25 V 47 PF/25 V I2A2 IC2 5 V I1A3 1 PF/25 V 47 PF/25 V I2A3 12 V 1 PF/25 V IC3 5 V 47 PF/25 V 1 PF/25 V 47 PF/25 V OS1 SH0 OS2 SH1 OS3 SH2 SH3 CP IC1, 2, 3 : TC74AC04 IC4, 5 : TC74HC04 RS IC4 15 2002-03-22 TCD2704D Caution 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 16 2002-03-22 TCD2704D Package Dimensions Weight: 5.2 g (typ.) 17 2002-03-22 TCD2704D RESTRICTIONS ON PRODUCT USE 000707EBA x TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. x The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. x The products described in this document are subject to the foreign exchange and foreign trade laws. x The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. x The information contained herein is subject to change without notice. 18 2002-03-22