STTH2R02 Ultrafast recovery diode Main product characteristics IF(AV) 2A VRRM 200 V Tj (max) 175 C VF (typ) 0.7 V trr (typ) 15 ns A K A Features and benefits Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature K DO-15 STTH2R02Q A A Description K K The STTH2R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. SMA STTH2R02A SMB STTH2R02U Packaged in DO-15, SMA, and SMB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. Order codes October 2006 Part Number Marking STTH2R02Q STTH2R02 STTH2R02QRL STTH2R02 STTH2R02A R2A STTH2R02U R2U Rev 2 1/9 www.st.com Characteristics STTH2R02 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Symbol VRRM Parameter Unit 200 V 60 A 60 A 2 A 75 A -65 to + 175 C 175 C Value Unit Repetitive peak reverse voltage DO-15(1) IFRM Value Repetitive peak forward current tp = 5 s, F = 5 kHz SMA, SMB DO-15 IF(RMS) RMS forward current SMA, SMB DO-15 IF(AV) Average forward current, = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Tlead = 90 C SMA, SMB Tc = 90 C tp = 10 ms Sinusoidal Maximum operating junction temperature 1. On infinite heatsink with 10 mm lead length Table 2. Thermal parameters Symbol Parameter Junction to lead Rth(j-c) Table 3. Symbol IR(1) Lead Length = 10 mm on infinite heatsink DO-15 C/W Junction to case SMA, SMB Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Forward voltage drop Typ Max. Unit A 2 IF = 6 A Tj = 25 C Tj = 100 C Min. 3 VR = VRRM 20 1.20 0.89 1.0 0.76 0.85 0.70 0.80 V IF = 2 A Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.06 IF2(RMS) 2/9 30 Static electrical characteristics Tj = 25 C VF(2) 45 STTH2R02 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C 23 30 IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C 15 20 Reverse recovery current IF = 2 A, dIF/dt = -200 A/s, VR = 160 V, Tj = 125 C 3 4 Forward recovery time IF = 2 A, dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C 40 ns Forward recovery voltage IF = 2 A, dIF/dt = 100 A/s, Tj = 25 C 2.0 V Reverse recovery time IRM tfr VFP Figure 1. Peak current versus duty cycle Figure 2. IM(A) Min. Unit ns A Forward voltage drop versus forward current (typical values) IFM(A) 100 50 T IM d=tp/T 80 tp 40 60 30 20 40 P=5W Tj=150C P=2W P=1W Tj=25C 10 20 VFM(V) 0 0 0.0 0.0 Figure 3. 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.5 1.0 1.5 2.0 2.5 1.0 Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-a) /Rth(j-a) IFM(A) 50 1.0 SMA Scu=1cm 0.9 40 0.8 0.7 30 0.6 0.5 Tj=150C 20 0.4 Tj=25C 0.3 10 0.2 0.1 VFM(V) Single pulse tP(s) 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/9 Characteristics Figure 5. STTH2R02 Relative variation of thermal Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal impedance junction to case versus pulse duration (DO-15) Zth(j-a) /Rth(j-a) Zth(j-a) /Rth(j-a) 1.0 1.0 SMB Scu=1cm 0.9 DO-15 Lleads=10mm 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 0.1 tP(s) 0.0 1.E-03 Figure 7. tP(s) Single pulse 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Junction capacitance versus reverse applied voltage (typical values) 1.E-03 1.E-02 Figure 8. C(pF) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Reverse recovery charges versus dIF/dt (typical values) QRR(nC) 100 60 F=1MHz Vosc=30mVRMS Tj=25C IF=2A VR=160V 50 40 Tj=125C 10 30 20 Tj=25C 10 VR(V) dIF/dt(A/s) 1 0 1 Figure 9. 10 100 1000 10 100 1000 Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current (typical values) versus dIF/dt (typical values) tRR(ns) IRM(A) 60 6 IF=2A VR=160V IF=2A VR=160V 50 5 40 4 30 3 Tj=125C Tj=125C 20 2 1 Tj=25C 10 Tj=25C dIF/dt(A/s) dIF/dt(A/s) 0 0 10 4/9 100 1000 10 100 1000 STTH2R02 Ordering information scheme Figure 11. Dynamic parameters versus junction temperature Figure 12. Thermal resistance, junction to ambient, versus copper surface under each lead - SMA/SMB (epoxy FR4, ecu = 35 m) Rth(j-a) (C/W) QRR; IRM [T j] / Q RR; IRM [T j=125C] 120 1.4 IF=2A VR=160V 1.2 100 SMA 1.0 80 SMB IRM 0.8 60 0.6 QRR 40 0.4 20 0.2 Tj(C) SCU(cm) 0.0 0 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 L Figure 13. Thermal resistance, junction to ambient, versus copper surface under each lead DO-15 (epoxy FR4, ecu = 35 m) Rth(j-a) (C/W) 100 DO-15 90 80 70 60 50 40 30 20 10 SCU(cm) 0 0.0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Ordering information scheme STTH 2 R 02 XXX Ultrafast switching diode Average forward current 2=2A Model R Repetitive peak reverse voltage 02 = 200 V Package Q = DO-15 in Ammopack QRL = DO-15 in Tape and reel A = SMA in Tape and reel U = SMB in Tape and reel 5/9 Package information 3 STTH2R02 Package information Epoxy meets UL94, V0 Table 5. DO-15 Dimensions DIMENSIONS C C A REF. D Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 B Table 6. SMA dimensions DIMENSIONS REF. Millimeters Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 Figure 14. SMA footprint (dimensions in mm) 1.73 1.48 1.73 1.67 4.94 6/9 Inches STTH2R02 Package information Table 7. SMB dimensions DIMENSIONS E1 REF. Millimeters Min. D E c A1 A2 L b Max. Inches Min. Max. A1 1.90 2.15 2.45 0.075 0.085 0.096 A2 0.05 0.15 0.20 0.002 0.006 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.40 5.60 0.201 0.213 0.220 E1 4.05 4.30 4.60 0.159 0.169 0.181 D 3.30 3.60 3.95 0.130 0.142 0.156 L 0.75 1.15 1.60 0.030 0.045 0.063 Figure 15. SMB footprint (dimensions in mm) 5.25 2.22 1.75 1.75 1.75 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 4 5 8/9 STTH2R02 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH2R02Q STTH2R02 DO-15 0.4 g 1000 Ammopack STTH2R02QRL STTH2R02 DO-15 0.4 g 6000 Tape and reel STTH2R02A R2A SMA 0.068 g 5000 Tape and reel STTH2R02U R2U SMB 0.12 g 2500 Tape and reel Revision history Date Revision Description of Changes 03-May-2006 1 First issue 13-Oct-2006 2 Maximum Tj set to 175 C for all packages in Table 1. STTH2R02 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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