October 2006 Rev 2 1/9
STTH2R02
Ultrafast recovery diode
Main product characteristics
Features and benefits
■Very low conduction losses
■Negligible switching losses
■Low forward and reverse recovery times
■High junction temperature
Description
The STTH2R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
Packaged in DO-15, SMA, and SMB, this device
is intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection.
Order codes
IF(AV) 2 A
VRRM 200 V
Tj (max) 175° C
VF (typ) 0.7 V
trr (typ) 15 ns
Part Number Marking
STTH2R02Q STTH2R02
STTH2R02QRL STTH2R02
STTH2R02A R2A
STTH2R02U R2U
KA
K
A
DO-15
STTH2R02Q
SMA
STTH2R02A
SMB
STTH2R02U
K
K
A
A
www.st.com
Characteristics STTH2R02
2/9
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.68 x IF(AV) + 0.06 IF2(RMS)
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IFRM Repetitive peak forward current DO-15(1) tp = 5 µs, F = 5 kHz
60 A
SMA, SMB
IF(RMS) RMS forward current DO-15 60 A
SMA, SMB
IF(AV) Average forward current, δ = 0.5 DO-15 Tlead = 90° C 2A
SMA, SMB Tc = 90° C
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A
Tstg Storage temperature range -65 to + 175 ° C
TjMaximum operating junction temperature 175 ° C
1. On infinite heatsink with 10 mm lead length
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-c)
Junction to lead Lead Length = 10 mm on infinite heatsink DO-15 45 ° C/W
Junction to case SMA, SMB 30
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR(1) Reverse leakage current Tj = 25° C VR = VRRM
3µA
Tj = 125° C 2 20
VF(2) Forward voltage drop
Tj = 25° C IF = 6 A 1.20
V
Tj = 25° C
IF = 2 A
0.89 1.0
Tj = 100° C 0.76 0.85
Tj = 150° C 0.70 0.80
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
STTH2R02 Characteristics
3/9
Table 4. Dynamic characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
trr Reverse recovery time
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25° C 23 30
ns
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25° C 15 20
IRM Reverse recovery current IF = 2 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125° C 34 A
tfr Forward recovery time IF = 2 A, dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25° C 40 ns
VFP Forward recovery voltage IF = 2 A, dIF/dt = 100 A/µs,
Tj = 25° C 2.0 V
Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus
forward current (typical values)
I
M
(A)
0
20
40
60
80
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
T
d
=tp/T tp
I
M
T
δ
=tp/T tp
I
M
P = 2 WP = 2 W P = 1 WP = 1 W
P = 5 WP = 5 W
δ
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
I
FM
(A)
Tj=25°C
Tj=150°C
VFM(V)
Figure 3. Forward voltage drop versus
forward current (maximum values)
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration (SMA)
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
I
FM
(A)
Tj=25°C
Tj=150°C
V
FM
(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMA
Scu=1cm²
tP(s)
Characteristics STTH2R02
4/9
Figure 5. Relative variation of thermal
impedance junction to case versus
pulse duration (SMB)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration (DO-15)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMB
Scu=1cm²
tP(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
DO-15
Lleads=10mm
tP(s)
Figure 7. Junction capacitance versus
reverse applied voltage (typical
values)
Figure 8. Reverse recovery charges versus
dIF/dt (typical values)
1
10
100
1 10 100 1000
C(pF)
F=1MHz
Vosc=30mVRMS
Tj=25°C
VR(V)
0
10
20
30
40
50
60
10 100 1000
Q
RR
(nC)
IF=2A
VR=160V
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
Figure 9. Reverse recovery time versus dIF/dt
(typical values)
Figure 10. Peak reverse recovery current
versus dIF/dt (typical values)
0
10
20
30
40
50
60
10 100 1000
t
RR
(ns)
I
F
=2A
V
R
=160V
T
j
=125°C
T
j
=25°C
dIF/dt(A/µs)
0
1
2
3
4
5
6
10 100 1000
I
RM
(A)
IF=2A
VR=160V
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
STTH2R02 Ordering information scheme
5/9
L
2 Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMA/SMB
(epoxy FR4, ecu = 35 µm)
Figure 13. Thermal resistance, junction to
ambient, versus copper surface
under each lead DO-15
(epoxy FR4, ecu = 35 µm)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
IRM
QRR
IF=2A
VR=160V
Tj(°C)
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMA
SMB
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
DO-15
S
CU
(cm²)
STTH 2 R 02 XXX
Ultrafast switching diode
Average forward current
2 = 2 A
02 = 200 V
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
A = SMA in Tape and reel
U = SMB in Tape and reel
Model R
Package
Repetitive peak reverse voltage
Package information STTH2R02
6/9
3 Package information
Epoxy meets UL94, V0
Table 5. DO-15 Dimensions
Figure 14. SMA footprint (dimensions in mm)
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
Table 6. SMA dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.03 0.075 0.080
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
D
B
A
CC
1.67
4.94
1.73 1.48 1.73
STTH2R02 Package information
7/9
Figure 15. SMB footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. SMB dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.15 2.45 0.075 0.085 0.096
A2 0.05 0.15 0.20 0.002 0.006 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.40 5.60 0.201 0.213 0.220
E1 4.05 4.30 4.60 0.159 0.169 0.181
D 3.30 3.60 3.95 0.130 0.142 0.156
L 0.75 1.15 1.60 0.030 0.045 0.063
D
E
E1
cA1
A2 b
L
2.22
1.751.751.75
5.25
Ordering information STTH2R02
8/9
4 Ordering information
5 Revision history
Part Number Marking Package Weight Base qty Delivery mode
STTH2R02Q STTH2R02 DO-15 0.4 g 1000 Ammopack
STTH2R02QRL STTH2R02 DO-15 0.4 g 6000 Tape and reel
STTH2R02A R2A SMA 0.068 g 5000 Tape and reel
STTH2R02U R2U SMB 0.12 g 2500 Tape and reel
Date Revision Description of Changes
03-May-2006 1 First issue
13-Oct-2006 2 Maximum Tj set to 175° C for all packages in Table 1.
STTH2R02
9/9
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