Issue No. : 151EXB008058 Date of Issue : November 26.2008 Classification : New DIGI-KEY CORPORATION Changed PRODUCT SPECIFICATION FOR APPROVAL Product Description Product Part Number Chip Resistor Array (RoHS Compliance) : Country of Origin : JAPAN, CHINA, MALAYSIA Applications : Standard electronic equipment : *If you approve this specification, please fill in and sign the below and return 1 copy to us. Approval No : Approval Date : Executed by : (signature) Title : Dept. : Circuit Components Business Unit Prepared by : Panasonic Electronic Devices Co., Ltd. Contact Person : Engineering Section Signature 401 Sadamasa-cho, Fukui City 910-8502 Japan Phone : +81-776-56-8034 Fax : +81-776-56-3114 Name(Print) Title H.Yabukoshi : Authorized by : Signature Name(Print) Title : T.Watanabe Manager of Engineering Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-1 1. Dimension A 2-D a (1)Substrate W B Alumina (4)Termination (Inner) Ag or Ag/Pd Ni Plating Side:Resin+Metal (3)Resistive element Ruthenium oxide (6) Termination (Outer) Sn Plating a' a-a' sectional (1) (2) (3) (4) (5) (6) C C L T B P (2)Protective coating Resin (5)Termination (Between) Dimension(mm) L 1.000.10 W 1.000.10 T 0.350.10 Dimension(mm) D (0.30) P (0.65) C 0.250.10 A 0.400.10 B 0.180.10 ( ) : Reference % of rated dissipation 2. Power derating curve 100 80 -55C 70C Category temperature range 60 40 -55C to +125C 20 125C 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 Ambient Temperature(C) Fig. 1 3. Ratings Item Rated Dissipation Rated voltage & Rated Continuous Working Voltage (RCWV) Rated Value Explanation When used at ambient temperature over 70 C, 0.063 W / element the rated dissipation should be reduced as shown in Fig.1 Chip jumper : Rated current 1 A (Resistance is less than 50 m) The rated voltage of each resistor should be calculated from the equation below, and when the rated voltage exceeds the limiting element voltage, the limiting element voltage should the maximum working voltage. E= PxR Limiting element voltage : 50 V E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance()) Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V Item 8-2 Rated Value Explanation Voltage should be 2.5 x E. When the voltage exceeds the maximum overload voltage, the value shown below should be the maximum overload voltage. Maximum overload voltage: 100V Chip jumper: Max. overload current 2A Maximum overload voltage Sign J 0 Resistance tolerance Range of rated resistance for manufacture Tolerance J 0 Tolerance for resistance 5% Chip Jumper Resistance range 1.0 to 1.0 M Less than 50 m Series E-24 - 4. Explanation of part number E X B Thick Film Resistor Networks 2 4 V Chip Isolated Resistor Circuit Array Number of terminals Part No. 24V 4 3 Circuit 1 2 1 0 2 J X Rated Resistance Tolerance Packaging R 0 0 0 Chip Jumper Packaging Taping (10,000pcs/reel) Code X 5. Appearance & Construction Item Appearance & Construction Specifications Explanation 1.The resistive element should be covered with protective coating that do not fade easily. The surface of coating should avoid unevenness, flaw, pinhole and discoloration. 2.The electrode should be printed uniformly, as shown in the dimensions. The plating should not fade easily, and should avoid unevenness, flaw, pinhole, projection and discoloration. 3.The electrode should be connected electrically, mechanically to resistive element. 4.Substrate should not have chipping, flaw, flash and crack. Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-3 As far as there shall be not designation especially, the following test and measurement shall be operated under normal temperature(15 C to 35 C), normal humidity(25 %RH to 75 %RH), normal atmospheric pressure(86 kPa to 106 kPa). 6. Performance Specification Item DC resistance Temperature coefficient Overload Intermittent Overload Dielectric Withstanding Insulation Resistance Specification Test methods Resistor Jumper DC resistance value shall be Measuring voltage: refer to JIS-C5201-1 within the specified tolerance At 20 C, 65 %RH Natural resistance change per temperature Resistance TCR degree centigrade. +600 -6 / C x10 R2 - R1 <10 -100 TCR= R1x(t2 - t1) 10 to 1M 200x10-6 / C R1 : Resistance value at reference temperature(t1) R 2 : Resistance value at test Chip jumper : temperature(t2) Less than 50 m t2 - t1 = 100 C, t1 = 25 C Resistors shall be applied 2.5 times the rated Less than voltage for 5 seconds. (2 %+0.1 ) 50 m Maximum over load voltage shall be 100 V. Resistors shall be subjected to 10000 cycles of 2.5 times the rated voltage applied for 1 Less than second with pause of 25 seconds between (5 %+0.1 ) 50 m tests. Maximum over load voltage shall be 100 V No evidence of flashover, AC 100V between substrate and termination mechanical damage, arcing or for 1 minute. insulation breakdown. Insulation resistance between substrate and Min. 1,000 M termination shall be measured at DC 100V. 7. Mechanical characteristic Item Specification Resistor Jumper No mechanical damage Adhesion (1 %+0.05 ) Bend strength of the face plating Solderability Less than 50 m No mechanical damage (1 %+0.05 ) Less than 50 m Test methods Load of 9.8N shall be applied to a side of resistor for 10s, which is placed on printing board Printing board: Glass epoxy (t = 1.0 mm) Substrate: Glass epoxy(t = 1.0 mm) Span: 90 mm Bending distance: 3 mm (10 seconds) Resistors shall be dipped in the melted solder Termination should be covered bath at 235 C 5 C for 2 s 0.5 s. Flux shall uniformly with solder. be removed from the surface of termination (min. 95 % coverage) with clean organic solvent. Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V Item Resistance to soldering heat Vibration Solvent resistance Specification Resistor Jumper Less than 50 m 8-4 Test methods Resistors shall be dipped in the melted solder bath at 270 C 5 C for 10s 1s. Resistors shall be subjected to a single vibration having as double amplitude of 1.5 mm for 2 hours in each three mutually Less than perpendicular directions for total 6 hours. (1 %+0.05 ) 50 m The vibration frequency shall be varied uniformly 10 Hz to 55 Hz and return to 10 Hz traversing for 1 minute. Without distinct deformation in Solvent solution: Isopropyl alcohol appearance (1) Dipping 10 hours 1 hour, dry in room condition for 30 min 10 min. (2) Ultrasonic wave washing: 5 min 1 min Less than (0.3 W/cm,28 kHz) (0.5 %+0.05 ) 50 m Dry in room condition for 30 min 10 min. (1 %+0.05 ) 8. Environmental Test Item Low temperature exposure Endurance at upper category temperature Specification Resistor (1 %+0.05 ) (1 %+0.05 ) Jumper Less than 50 m Less than 50 m Temperature cycling (1 %+0.05 ) Less than 50 m Humidity (Steady state) (1 %+0.05 ) Less than 50 m Endurance at 70 C (3 %+0.1 ) Less than 50 m Load life in humidity (3 %+0.1 ) Less than 50 m Test methods Resistors shall be exposed at -55 C 3 C for +48 1000 hours 0 hours Resistors shall be exposed at +125 C3 C for +48 1000 hours 0 hours. -55 C 3 C, 30 minutes Nominal temp., 30minutes 25cycles +125 C 3 C, 30minutes Resistors shall be exposed at 60 C 2 C and 90 % to 95 % relative humidity in a humidity +48 test chamber for 1000 hours 0 hours. Resistors shall be exposed at 70 C 2 C for +48 1000 hours 0 hours. During this time, the rated voltage shall be applied intermittently for 1.5 hours ON, 0.5 hour OFF. Resistor shall be exposed at 60 C 2 C and 90 % to 95 % relative humidity for 1000 hours +48 0 hours. During this time, the rated voltage shall be applied intermittently for 1.5 hours ON, 0.5 hour OFF. 9. Resistance value marking No marking. Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-5 10. Notice for use ! Notice for use (1)This specification shows the quality and performance of the product in a unit component. Before adoption, be sure to evaluate and verify the product mounting it in your product. (2)We take no responsibility for troubles caused by the product usage that is not specified in this specification. (3)In traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical equipment, aerospace equipment, electric heating appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast that the failure of this product gives serious damage to human life and others, use fail-safe design and ensure safety by studying the following items to Ensure safety as the system by setting protective circuits and protective equipment. Ensure safety as the system by setting such redundant circuits as do not cause danger by a single failure. (4)When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate your technical examination. (5) The product is designed to use in general standard applications of general electric equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, it do not take the use under the following special environments into consideration. Accordingly, the use in the following special environments, and such environmental conditions may affect the performance of the product; prior to use, verify the performance, reliability, etc. thoroughly. 1) Use in liquids such as water, oil, chemical, and organic solvent. 2) Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 3) Where the product is sealed or coated with resin, etc. 4) Where water or a water-soluble detergent is used in cleaning free soldering (Pay particular attention to soluble flux.) 5) Use in such a place where the product is wetted due to dew condensation. 6) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX. 7) Use under direct sunlight, in outdoor or in dusty atmospheres. 8) Use in environment with large static electricity or strong electromagnetic waves. (6)If transient load (heavy load on a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. When the product shall be used under special condition, be sure to ask us in advance. (7)Halogen type (chlorine type, bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. (8)When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible. (Three seconds or less up to 350 C) (9)Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective firm or the body of resistor and may affect resistor's performance. (10)Reflow soldering method shall apply to this product in principle. Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-6 11. Storage method If the product is stored in the following environments and conditions, the performance and solderability may be badly affected. Avoid the storage in the following environments. (1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX. (2) Storage in places exposed to direct sunlight. (3) Storage in places outside the temperature range of 5 C to 35 C and humidity range of 45 %RH to 85 %RH. (4) Storage over a year after our delivery (This item also applies to the case where the storage method specified in item (1) to (3) has been followed.). 12. Laws and Regulations (1) No ODCs or other ozone-depleting substances that are subject to regulation under the Montreal Protocol are used in our manufacturing processes, including in the manufacture of this product. (2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)). (3) All materials used in this product are existing chemical substances recognized under "lows on examination of chemical substances and regulations of manufacturing and others." (4) None of the materials used in this product contain the designated incombustible bromic substances, PBBOs and PBBs. (5) Please contact us to obtain a notice as to whether this product has passed inspection under review criteria primarily based on Foreign Exchange and Foreign Trade Control Laws, and appended table in the Export Control Laws. 13. Production Place Production Country :Japan Production Plant : Panasonic Electronic Devices Japan Co.,Ltd. Production Country :China Production Plant : Panasonic Electronic Devices (Tianjin) Co., Ltd.(PEDTJ) Production Country :Malaysia Production Plant : Panasonic Electronic Devices Malaysia Sdn. Bhd. (PEDMA) Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-7 14. Tape and Reel Package 14-1. Physical Dimensions Structure and reel dimensions shall be as shown in the figure below. Inaccordance with EIAJ ET-7200. Min. 60.0 13.0 +/- 1.0 Carrier tape Top tape 180.0 +0 / -3.0 Min. 60.0 9.0 +/- 1.0 11.4 +/- 1.0 Adhesive tape Unit : mm 14-2. Carrier Tape Dimensions P2 P0 P1 Sprocket Hole B W F E D0 A T Chip Hole Chip Resistor Array (mm) (mm) A B W F E 1.200.10 1.200.10 8.000.20 3.500.05 1.750.10 P1 P2 P0 T D0 2.000.10 2.000.05 4.000.10 0.520.05 +0.10 1.50 0 14-3. Specification 14-3-1. Taping (1) When the test shall be operated with the below conditions, peel strength should be 0.049N to 0.49N, should not have flash and tear after peeling. <Test Method> Carrier Tape Peeling Direction 10 Top Tape (2) Minimum Bending Radius When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and no break of carrier tape. However minimum bending radius shall be tested for 1 times. Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION 151-EXB-24V01NE Part No. EXB24V 8-8 (3) Resistance to climate When resistors shall be exposed at 60 C 2 C, 90 %RH to 95 %RH for 120 hours, no defection of chip and no break off carrier tape. When the top tape shall be peeled, tape should not have flash and tear. 14-3-2. Quantity in Taping: 10,000 pcs. / reel 14-3-3. Tape packaging (1) Resistor side shall be facing upward. (2) Chip resistor shall not be sticking to top tape and bottom tape. (3) Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break. 14-4. Outer Packaging Quantity: 20 reels(Max.200,000 pcs.) Tape Marking (1) When packaging quantity does not reach max quantity, the remaining empty space shall be buried with buffer material. (2) When quantity shall be few, alternative packaging methods may used. No problem must occur during the exportation of the product.. 14-5. Marking At last, production country is displayed in English. * Side of reel (Marking shall be on one side.) (1)Part name (2)Part number (3)Quantity (4)Lot number (5)Maker name (6)Production country *Packaging box (1)Customer name (5)Quantity (2)Part name (3)Part number (4)Customer part number (6)Maker name (7) Production country Panasonic Electronic Devices Co., Ltd. Spec. No. Subject Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION APPEARANCE QUALITY CRITERIA Resin Chipping Appearance Criteria C Defect Criteria B Item A W/8 B C/2 Attached Sheet 1-1 Remark Both side chipping shall be judged defect A W C B A Terminal Chipping A C/4 B Top terminal width Oblique line show chipping This item is applied to One pin hole / pin holes which reach chip resistor to the resistive 0.2 mm materials Pin Hole A A 100 m Flash A Panasonic Electronic Devices Co., Ltd.