NL17SZ08 Single 2-Input AND Gate The NL17SZ08 is a single 2-input AND Gate in two tiny footprint packages. The device performs much as LCX multi-gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed. http://onsemi.com Features * * * * * * * * * Tiny SOT-353 and SOT-553 Packages 2.7 ns TPD at 5.0 V (typ) Source/Sink 24 mA at 3.0 V Overvoltage Tolerant Inputs Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation These Devices are Pb-Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable MARKING DIAGRAMS 5 1 SC-88A (SC-70-5/SOT-353) DF SUFFIX CASE 419A 5 1 SOT-553 XV5 SUFFIX CASE 463B L2 M G IN B 1 IN A 2 GND 3 L2 MG G L2 MG G = Specific Device Marking = Date Code* = Pb-Free Package (Note: Microdot may be in either location) 5 VCC *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT 4 OUT Y Figure 1. Pinout (Top View) Pin Function 1 In B 2 In A 3 GND 4 Out Y 5 VCC FUNCTION TABLE IN A IN B & Output OUT Y Input Figure 2. Logic Symbol A Y = AB B Y L L L L H L H L L H H H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. (c) Semiconductor Components Industries, LLC, 2012 April, 2012 - Rev. 14 1 Publication Order Number: NL17SZ08/D NL17SZ08 MAXIMUM RATINGS Symbol Parameter Value Units VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V -0.5 to VCC +0.5 V VOUT DC Output Voltage IIK DC Input Diode Current -50 mA IOK DC Output Diode Current -50 mA IOUT DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA -65 to +150 C 260 C TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification +150 C SOT-353 (Note 1) SOT-553 350 496 C/W SOT-353 SOT-553 186 135 mW Level 1 Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) 2 kV 400 V N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A, rated to EIA/JESD22-A114-B. 3. Tested to EIA/JESD22-A115-A, rated to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 1.65 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V DC Output Voltage 0 5.5 V -55 +125 C 0 0 100 20 ns/V VOUT TA Operating Temperature Range tr, tf Input Rise and Fall Time VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V http://onsemi.com 2 NL17SZ08 DC ELECTRICAL CHARACTERISTICS Condition TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High-Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low-Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High-Level Output Voltage VIN = VIL or VIH VOL Low-Level Output Voltage VIN = VIH or VOH IOH = 100 mA IOH = -3 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA -555C 3 TA 3 1255C Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC - 0.1 VCC VCC - 0.1 1.65 1.29 1.52 1.29 2.3 1.9 2.1 1.9 2.7 2.2 2.4 2.2 3.0 2.4 2.7 2.4 3.0 2.3 2.5 2.3 4.5 3.8 4.0 3.8 1.65 to 5.5 V 0.25 VCC 0.3 VCC 1.65 to 5.5 Units V V 0.1 0.1 1.65 0.08 0.24 0.24 2.3 0.20 0.3 0.3 2.7 0.22 0.4 0.4 3.0 0.28 0.4 0.4 3.0 0.38 0.55 0.55 4.5 0.42 0.55 0.55 V IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 0.1 1.0 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1 10 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 1 10 mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns TA = 255C VCC Symbol tPLH tPHL Condition (V) RL = 1 MW, CL = 15 pF 1.65 2.0 6.3 12 2.0 12.7 RL = 1 MW, CL = 15 pF 1.8 2.0 6.2 10 2.0 10.5 RL = 1 MW, CL = 15 pF 2.5 0.2 0.8 3.4 7.0 0.8 7.5 RL = 1 MW, CL = 15 pF 3.3 0.3 0.5 2.6 4.7 0.5 5.0 1.5 3.3 5.2 1.5 5.5 0.5 2.2 4.1 0.5 4.4 0.8 2.7 4.5 0.8 4.8 Parameter Propagation Delay (Figure 3 and 4) -555C 3 TA 3 1255C Min RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 0.5 RL = 500 W, CL = 50 pF Typ Max Min Max Units ns CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC u4.0 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 30 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL17SZ08 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC 90% VCC 50% 10% 10% GND OUTPUT INPUT RL tPHL 50% CL tPLH 50% OUTPUT Y A 1-MHz square input wave is recommended for propagation delay tests. VOH VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Type Tape and Reel Size NL17SZ08DFT2G SC-88A/SC-70-5/SOT-353 (Pb-Free) 3000 / Tape & Reel NLV17SZ08DFT2G* SC-88A/SC-70-5/SOT-353 (Pb-Free) 3000 / Tape & Reel NL17SZ08XV5T2G SOT-553 (Pb-Free) 4000 / Tape & Reel Device Order Number For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL17SZ08 PACKAGE DIMENSIONS SC-88A (SC-70-5/SOT-353) DF SUFFIX CASE 419A-02 ISSUE K A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 -B- S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N J C H K http://onsemi.com 5 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ08 PACKAGE DIMENSIONS SOT-553 XV5 SUFFIX CASE 463B ISSUE B D -X- 5 A 4 1 e 2 E -Y- 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A b c D E e L HE HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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