SO T2 23 BT168GWF SCR, fast, logic level Rev. 01 -- 27 December 2010 Product data sheet 1. Product profile 1.1 General description Planar passivated, fast, sensitive gate Silicon Controlled Rectifier in a SOT223 surface-mounted plastic package 1.2 Features and benefits Fast commutation performance for higher frequency Sensitive gate suitable for logic level controls Full wave rectified AC applications 1.3 Applications Earth leakage circuit breakers (ELCB/GFI) Ignition circuits (gas appliances, small engines and HID lighting) 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Min Typ Max Unit VDRM repetitive peak off-state voltage Conditions - - 600 V VRRM repetitive peak reverse voltage - - 600 V ITSM non-repetitive peak on-state current half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 - - 8 A IT(AV) average on-state current half sine wave; Tsp 112 C; see Figure 3 - - 0.63 A IT(RMS) RMS on-state current half sine wave; Tsp 112 C; see Figure 1; see Figure 2 - - 1 A VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 9 70 200 450 A Static characteristics IGT gate trigger current BT168GWF NXP Semiconductors SCR, fast, logic level 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 K cathode 2 A anode 3 G gate 4 A anode Simplified outline Graphic symbol 4 A K G sym037 1 2 3 SOT223 (SC-73) 3. Ordering information Table 3. Ordering information Type number Package BT168GWF Name Description Version SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage VRRM repetitive peak reverse voltage IT(AV) average on-state current half sine wave; Tsp 112 C; see Figure 3 IT(RMS) RMS on-state current ITSM non-repetitive peak on-state current I2t Conditions Min Max Unit - 600 V - 600 V - 0.63 A half sine wave; Tsp 112 C; see Figure 1; see Figure 2 - 1 A half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 - 8 A half sine wave; Tj(init) = 25 C; tp = 8.3 ms - 9 A I2t for fusing tp = 10 ms; sine-wave pulse - 0.32 A2 s IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/s dIT/dt rate of rise of on-state current - 50 A/s IGM peak gate current - 1 A VRGM peak reverse gate voltage - 5 V PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 C Tj junction temperature - 125 C BT168GWF Product data sheet over any 20 ms period All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 2 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 001aab498 1.2 IT(RMS) (A) (1) IT(RMS) (A) 001aab500 2 1.5 0.8 1 0.4 0.5 0 -50 Fig 1. 0 50 100 0 10-2 150 10-1 1 10 surge duration (s) Tsp (C) RMS on-state current as a function of solder point temperature; maximum values Fig 2. RMS on-state current as a function of surge duration; maximum values 001aab496 1 Ptot (W) 0.8 110 Tsp(max) (C) a= 1.57 1.9 113 2.2 2.8 116 0.6 4 0.4 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 0.2 119 122 125 0.8 0 0 0.2 0.4 0.6 IT(AV) (A) Fig 3. Total power dissipation as a function of average on-state current; maximum values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 3 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 001aab497 103 IT ITSM (A) 102 ITSM t tp Tj(init) = 25 C max 10 1 10-5 10-4 10-3 10-2 tp (s) Fig 4. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values 001aab499 10 ITSM (A) 8 6 4 IT ITSM 2 t tp Tj(init) = 25 C max 0 1 102 10 103 number of cycles Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 4 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; see Figure 8 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient free air minimum footprint; printed-circuit board mounted; in free air; see Figure 6 - 156 - K/W pad area; printed-circuit board mounted; in free air; see Figure 7 - 70 - K/W 3.8 min 36 1.5 min 18 6.3 1.5 min (3x) 60 9 4.5 4.6 2.3 10 1.5 min 4.6 001aab508 7 All dimensions are in mm 15 50 001aab509 All dimensions are in mm Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick). Fig 6. Minimum footprint SOT223 BT168GWF Product data sheet Fig 7. Printed-circuit board pad area SOT223 All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 5 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 003aae245 102 Z th(j-sp) (K/W) 10 1 P 10-1 t tp 10-2 10-5 Fig 8. 10-4 10-3 10-2 10-1 1 tp (s) 10 Transient thermal impedance from junction to solder point as a function of pulse width BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 6 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 9 70 200 450 A IL latching current VD = 12 V; IG = 0.5 mA; RGK = 1 k; Tj = 25 C; see Figure 10 3 7.5 13 mA IH holding current VD = 12 V; RGK = 1 k; Tj = 25 C; see Figure 11 0.5 4.1 10 mA VT on-state voltage IT = 1.2 A; Tj = 25 C; see Figure 12 - 1.35 1.7 V VGT gate trigger voltage VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 13 - 0.5 0.8 V VD = 600 V; IT = 10 mA; Tj = 125 C 0.2 0.3 - V ID off-state current VD = 600 V; Tj = 125 C; RGK = 1 k - 0.05 0.1 mA IR reverse current VR = 600 V; Tj = 125 C; RGK = 1 k - 0.05 0.1 mA 350 800 - V/s VDM = 402 V; Tj = 125 C; exponential waveform; gate open circuit; see Figure 14 - 25 - V/s ITM = 2 A; VD = 600 V; IG = 10 mA; dIG/dt = 0.1 A/s; Tj = 25 C - 2 - s Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 125 C; RGK = 1 k; exponential waveform; see Figure 14 tgt gate-controlled turn-on time 001aab502 3 IGT IGT(25C) IL IL(25C) 2 2 1 1 0 -50 Fig 9. 001aab503 3 0 50 100 150 Tj (C) Normalized gate trigger current as a function of junction temperature BT168GWF Product data sheet 0 -50 0 50 100 150 Tj (C) Fig 10. Normalized latching current as a function of junction temperature All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 7 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 001aab504 3 001aab505 5 IT (A) IH (1) (2) (3) 4 IH(25C) 2 3 2 1 1 0 -50 0 50 100 150 0 0.4 1.2 2 Fig 11. Normalized holding current as a function of junction temperature 001aab501 1.6 2.8 VT (V) Tj (C) Fig 12. On-state current as a function of on-state voltage 001aab507 104 VGT VGT(25C) dVD/dt (V/s) 1.2 103 0.8 102 (1) (2) 0.4 -50 10 0 50 100 150 Fig 13. Normalized gate trigger voltage as a function of junction temperature BT168GWF Product data sheet 0 Tj (C) 50 100 150 Tj (C) Fig 14. Critical rate of rise of off-state voltage as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 8 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 7. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA SC-73 EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 Fig 15. Package outline SOT223 (SC-73) BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 9 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 8. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4x) (4x) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3x) 1.3 (3x) 6.15 sot223_fr Fig 16. Reflow soldering footprint for SOT223 (SC-73) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 8.7 occupied area Dimensions in mm 1 2 3 1.9 (3x) 2.7 preferred transport direction during soldering 2.7 1.1 1.9 (2x) sot223_fw Fig 17. Wave soldering footprint for SOT223 (SC-73) BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 10 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BT168GWF v.1 20101227 Product data sheet - - BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 11 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 12 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE -- are trademarks of NXP B.V. HD Radio and HD Radio logo -- are trademarks of iBiquity Digital Corporation. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 27 December 2010 (c) NXP B.V. 2010. All rights reserved. 13 of 14 BT168GWF NXP Semiconductors SCR, fast, logic level 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 December 2010 Document identifier: BT168GWF