SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 D D D D D D D D D D Meets IEEE Standard 488-1978 (GPIB) 8-Channel Bidirectional Transceiver Power-Up/Power-Down Protection (Glitch Free) High-Speed, Low-Power Schottky Circuitry Low Power Dissipation . . . 72 mW Max Per Channel Fast Propagation Times . . . 22 ns Max High-Impedance pnp Inputs Receiver Hysteresis . . . 650 mV Typ Open-Collector Driver Output Option No Loading of Bus When Device Is Powered Down (VCC = 0) DW OR N PACKAGE (TOP VIEW) GPIB I/O Ports TE B1 B2 B3 B4 B5 B6 B7 B8 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC D1 D2 D3 D4 D5 D6 D7 D8 PE Terminal I/O Ports description The SN75160B 8-channel general-purpose interface bus (GPIB) transceiver is a monolithic, high-speed, low-power Schottky device designed for two-way data communications over single-ended transmission lines. It is designed to meet the requirements of IEEE Standard 488-1978. The transceiver features driver outputs that can be operated in either the passive-pullup or 3-state mode. If talk enable (TE) is high, these ports have the characteristics of passive-pullup outputs when pullup enable (PE) is low and of 3-state outputs when PE is high. Taking TE low places these ports in the high-impedance state. The driver outputs are designed to handle loads up to 48 mA of sink current. Output glitches during power up and power down are eliminated by an internal circuit that disables both the bus and receiver outputs. The outputs do not load the bus when VCC = 0. When combined with the SN75161B or SN75162B management bus transceivers, the pair provides the complete 16-wire interface for the IEEE-488 bus. The SN75160B is characterized for operation from 0C to 70C. Function Tables EACH DRIVER INPUTS EACH RECEIVER OUTPUT D TE PE B H H H L H X H X X L INPUTS OUTPUT B TE PE D H L L X L H L X H L L Z X H X Z X Z H = high level, L = low level, X = irrelevant, Z = high impedance This is the high-impedance state of a normal 3-state output modified by the internal resistors to VCC and GND. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1995, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 logic symbol PE TE 11 1 logic diagram (positive logic) PE M1[3S] M2[0C] TE D3 D4 D5 D6 D7 D8 D1 19 19 3(1 4 D2 1 EN3[XMT] EN4[RCV] D1 11 /2 ) 2 2 B1 1 18 3 17 4 16 5 15 6 14 7 13 8 12 9 D2 B2 18 B3 3 B4 B5 D3 B6 B2 17 B7 4 B8 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Designates 3-state outputs Designates passive-pullup outputs D4 5 GPIB I/O Ports * DALLAS, TEXAS 75265 B7 12 9 POST OFFICE BOX 655303 B6 13 8 D8 B5 14 7 D7 B4 15 6 D6 B3 16 Terminal I/O Ports D5 2 B1 B8 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 schematics of inputs and outputs EQUIVALENT OF ALL CONTROL INPUTS VCC EQUIVALENT OF ALL INPUT/OUTPUT PORTS R(eq) 9 k NOM 1.7 k NOM 10 k NOM Input 4 k NOM 4 k NOM GND Input /Output Port Driver output R(eq) = 30 NOM Receiver output R(eq) = 110 NOM Circuit inside dashed lines is on the driver outputs only. R(eq) = equivalent resistor absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Low-level driver output current, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to network ground terminal. DISSIPATION RATING TABLE PACKAGE TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 70C POWER RATING DW 1125 mW 9.0 mW/C 720 mW N 1150 mW 9.2 mW/C 736 mW POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 recommended operating conditions Supply voltage, VCC High-level input voltage, VIH MIN NOM MAX UNIT 4.75 5 5.25 V 2 V Low-level input voltage, VIL High level output current, High-level current IOH Low level output current, Low-level current IOL 0.8 V Bus ports with pullups active - 5.2 mA Terminal ports - 800 A Bus ports 48 Terminal ports 16 Operating free-air temperature, TA 0 70 mA C electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VIK Input clamp voltage Vhys Hysteresis voltage (VIT + - VIT -) VOH High level output voltage High-level VOL Low level output voltage Low-level II TEST CONDITIONS II = - 18 mA Bus See Figure 8 Terminal IOH = - 800 A, IOH = - 5.2 mA, IOL = 16 mA, IOL = 48 mA, TE at 0.8 V Bus Input current at maximum input voltage Terminal IIH IIL High-level input current Terminal Low-level input current Terminal VI/O(b I/O(bus)) Voltage at bus port Bus Terminal Current into bus port V TE at 0.8 V 2.7 3.5 PE and TE at 2 V 2.5 3.3 V V 0.3 0.5 0.5 VI = 5 5.5 5V 02 0.2 100 A VI = 2.7 V VI = 0.5 V 0.1 20 A - 10 - 100 A Driver disabled TE at 2 V II(bus) = 0 II(bus) = - 12 mA VCC = 0, 2.5 3.0 3.7 - 1.5 0 2.5 VI(b 2.5 5 V to 3 3.7 7V I(bus)) = 2 - 3.2 0 2.5 0.7 2.5 - 35 - 75 Bus - 25 - 50 - 125 Supply current No load CI/O(bus) I/O(b ) Bus port capacitance Bus-port VCC = 0 to 5 V, f = 1 MHz Receivers low and enabled 70 90 Drivers low and enabled 85 110 VI/O = 0 to 2 V, 16 All typical values are at VCC = 5 V, TA = 25C. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 mA - 40 - 15 ICC V - 3.2 VI(bus) = 0 to 2.5 V Short circuit output current Short-circuit V - 1.3 Terminal IOS 4 UNIT - 1.5 0.65 VI(bus) = 3.7 V to 5 V VI(bus) = 5 V to 5.5 V Power off MAX - 0.8 0.35 Driver disabled Power on TYP 0.4 VI(bus) = - 1.5 V to 0.4 V VI(bus) = 0.4 V to 2.5 V II/O(bus) ( ) MIN mA mA pF SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 switching characteristics, VCC = 5 V, CL = 15 pF, TA = 25C (unless otherwise noted) PARAMETER tPLH Propation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tPLH Propagation delay time, low- to high-level output tPHL FROM (INPUT) TO (OUTPUT) TEST CONDITIONS Terminal Bus CL = 30 pF, See Figure 1 Bus Terminal Propagation delay time, high- to low-level output CL = 30 pF, See Figure 2 MIN TYP MAX 14 20 14 20 10 20 15 22 ns ns tPZH tPHZ Output enable time to high level 25 35 Output disable time from high level 13 22 tPZL tPLZ Output enable time to low level 22 35 Output disable time from low level 22 32 tPZH tPHZ Output enable time to high level 20 30 Output disable time from high level 12 20 tPZL tPLZ Output enable time to low level 23 32 Output disable time from low level 19 30 ten tdis Output pullup enable time 15 22 13 20 Output pullup disable time TE TE PE POST OFFICE BOX 655303 BUS Terminal Bus See Figure 3 See Figure 4 See Figure 5 * DALLAS, TEXAS 75265 UNIT ns ns ns 5 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 PARAMETER MEASUREMENT INFORMATION 5V 3V PE 200 Output 3V D Input Generator (see Note A) D 1.5 V 1.5 V B 0V 480 50 CL = 30 pF (see Note B) tPLH B Output tPHL VOH 2.2 V 1.0 V VOH TE VOLTAGE WAVEFORMS 3V TEST CIRCUIT NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 1. Terminal-to-Bus Test Circuit and Voltage Waveforms TE 4.3 V Output 240 Generator (see Note A) B 3V B Input D 1.5 V 1.5 V 0V tPLH tPHL VOH 50 CL = 30 pF (see Note B) 3 k D Output 1.5 V 1.5 V VOH VOLTAGE WAVEFORMS TEST CIRCUIT NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 2. Bus-to-Terminal Test Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 PARAMETER MEASUREMENT INFORMATION 5V 3V 3V 200 Output PE S1 D TE Input S2 B CL = 30 pF (see Note B) Generator (see Note A) 1.5 V 90% TE 50 VOH 2V 0.8 V tPLZ tPZL B Output S1 to GND S2 Closed 0V tPHZ tPZH B Output S1 to 3 V S2 Open 480 1.5 V 3.5 V 1.0 V 0.5 V VOL VOLTAGE WAVEFORMS TEST CIRCUIT NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 3. TE-to-Bus Test Circuit and Voltage Waveforms 4.3 V TE Generator (see Note A) S2 Output 240 50 D 3V S1 3 k CL = 15 pF (see Note B) B TEST CIRCUIT 3V TE Input 1.5 V 1.5 V 0V tPHZ tPZH D Output S1 TO 3 V S2 Open 90% 0V tPLZ tPZL D Output S1 TO GND S2 Closed VOH 1.5 V 4V 1.0 V 0.7 V VOL VOLTAGE WAVEFORMS NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 4. TE-to-Terminal Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 PARAMETER MEASUREMENT INFORMATION Generator (see Note A) 50 PE Output D 3V PE Input B 1.5 V 1.5 V 0V RL = 480 CL = 15 pF (see Note B) ten B Output tdis 90% VOH 2V VOL = 0.8 V 3V VOLTAGE WAVEFORMS TE TEST CIRCUIT NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 5. PE-to-Bus Pullup Test Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 TYPICAL CHARACTERISTICS TERMINAL I/O PORTS TERMINAL I/O PORTS HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT IIII IIII IIII 4 0.6 3.5 3 2.5 2 1.5 1 IIII IIII IIII VCC = 5 V TA = 25C VOL VOL - Low-Level Output Voltage - V VCC = 5 V TA = 25C 0.5 0.4 0.3 0.2 0.1 0.5 0 0 0 -5 - 10 - 15 - 20 - 25 - 30 - 35 0 - 40 10 20 30 40 50 60 IOL - Low-Level Output Current - mA IOH - High-Level Output Current - mA Figure 6 Figure 7 TERMINAL I/O PORTS OUTPUT VOLTAGE vs BUS INPUT VOLTAGE IIII IIII IIII IIII 4 VCC = 5 V No Load TA = 25C 3.5 VO VO - Output Voltage - V VOH - High-Level Output Voltage - V VOH LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 3 2.5 2 VIT- VIT+ 1.5 1 0.5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VI - Bus Input Voltage - V Figure 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SN75160B OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER SLLS004B - OCTOBER 1985 - REVISED MAY 1995 TYPICAL CHARACTERISTICS GPIB I/O PORTS GPIB I/O PORTS HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT V VOH OH - High-Level Output Voltage - V VCC = 5 V TA = 25C 3 2 1 0.6 VOL - Low-Level Output Voltage - V VOL IIII IIII IIII 0 0 0 - 10 - 20 - 40 - 30 - 50 IIII IIII IIII VCC = 5 V TA = 25C 0.5 0.4 0.3 0.2 0.1 0 - 60 0 10 IOH - High-Level Output Current - mA 20 Figure 9 40 60 GPIB I/O PORTS GPIB I/O PORTS OUTPUT VOLTAGE vs THERMAL INPUT VOLTAGE CURRENT vs VOLTAGE IIIII IIIII IIIII VCC = 5 V No Load TA = 25C 2 1 IIII IIII 70 80 90 100 VCC = 5 V TA = 25C I I/O - Current - mA 3 2 1 0 -1 -2 -3 -4 -5 0 0.9 -7 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 IIIIIIII AAAAAAAA IIIIIII AAAAAAAA IIIIIIII IIIIIII AAAAAAAA IIIIIIII AAAAAAAA IIIIIIII The Unshaded Area Conforms to Paragraph 3.5.3 of IEEE Standard 488-1978 -6 -2 -1 0 1 2 Figure 11 Figure 12 POST OFFICE BOX 655303 3 VI/O - Voltage - V VI - Thermal Input Voltage - V 10 50 Figure 10 4 V VO O - Output Voltage - V 30 IOL - Low-Level Output Current - mA * DALLAS, TEXAS 75265 4 5 6 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN75160BDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BDWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75160BN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75160BNE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN75160BDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN75160BDWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN75160BDWR SOIC DW 20 2000 367.0 367.0 45.0 SN75160BDWR SOIC DW 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated