© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 1
One world. One KEMET
Overview
KEMET’s COTS program is an extension of KEMET knowledge
of high reliability test regimes and requirements. KEMET
regularly supplies “up-screened” products by working with
customer drawings and imposing specied design and test
requirements. The COTS program offers the same high quality
and high reliability components as up-screened products,
but at a lower cost to the customer. This is accomplished by
eliminating the need for customer-specic drawings to achieve
the reliability level required for customer applications. A series
of tests and inspections have been selected to provide the
accelerated conditioning and 100% screening necessary to
eliminate infant mortal failures from the population.
KEMET’s X7R dielectric features a 125°C maximum operating
temperature and is considered “temperature stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes X7R dielectric as a Class II material.
Components of this classication are xed, ceramic dielectric
capacitors suited for bypass and decoupling applications or
for frequency discriminating circuits where Q and stability of
capacitance characteristics are not critical. X7R exhibits a
predictable change in capacitance with respect to time and
voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is
limited to ±15% from -55°C to +125°C.
All COTS testing includes voltage conditioning and post-electrical
testing as per MIL–PRF–55681. For enhanced reliability, KEMET
also provides the following test level options and conformance
certications:
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability
Applications, X7R Dielectric, 6.3 – 250 VDC
Ordering Information
C1210 T104 K 5 R A C TU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance Voltage Dielectric Failure Rate/Design Termination
Finish1
Packaging/Grade
(C-Spec)2
0402
0603
0805
1206
1210
1812
2220
T = COTS 2 Signicant
Digits + Number
of Zeros
J = ±5%
K = ±10%
M = ±20%
9 = 6.3 V
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
R = X7R A = Group A Testing per MIL–
PRF–55681 PDA 8%
B= Group A Testing per MIL–
PRF–55681 PDA 8%, DPA
per EIA–469
C = Group A Testing per
MIL–PRF–55681 PDA 8%,
DPA per EIA–469, Humidity per
MIL–STD–202, Method 103,
Condition A
C = 100% Matte
Sn
L = SnPb (5%
minimum)
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1 Additional termination nish options may be available. Contact KEMET for details.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
Test Level A Test Level B Test Level C
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
PDA 8% PDA 8% PDA 8%
C of C DPA DPA
C of C 85/85
C of C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Dimensions – Millimeters (Inches)
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
L
Length W
Width T
Thickness B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402 1005 1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
See Table 2 for
Thickness
0.30 (.012) ± 0.10 (.004) 0.30 (.012) Solder Reow Only
0603 1608 1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)
Solder Wave or
Solder Reow
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030)
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Benets
• -55°C to +85°C operating temperature range
• Pb-Free and RoHS Compliant
• Voltage conditioning and post-electrical testing per MIL–PRF–
55681
• Destructive Physical Analysis (DPA) per EIA–469
• Biased humidity testing (85/85) per MIL–STD–202
• Certicate of Compliance
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, 200 V,
and 250 V
• Capacitance offerings ranging from 10 pF to 22 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination nish allowing for
excellent solderability
• SnPb termination nish option available upon request (5%
minimum)
Applications
Typical applications include military, space quality and high reliability electronics.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Environmental Compliance
Pb-Free and RoHS Compliant (excluding SnPb termination nish option).
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 V to 250 V)
Insulation Resistance (IR) Limit @ 25°C See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage Capacitance
Value
Dissipation Factor
(Maximum %) Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial Limit16/25 5.0
< 16 7.5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201 N/A ALL
0402 < 0.012 µF ≥ 0.012 µF
0603 < 0.047 µF ≥ 0.047 µF
0805 < 0.047 µF ≥ 0.047 µF
1206 < 0.22 µF ≥ 0.22 µF
1210 < 0.39 µF ≥ 0.39 µF
1808 ALL N/A
1812 < 2.2 µF ≥ 2.2 µF
1825 ALL N/A
2220 < 10 µF ≥ 10 µF
2225 ALL N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Capacitance Cap
Code
Series C0402 C0603 C0805 C1206
Voltage Code 9843598435129843512A9843512A
Voltage DC
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10 – 91 pF 100 – 910 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC EB EB EB EB EB EB EB
100 – 150 pF 101 – 821 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC EB EB EB EB EB EB EB
180 – 820 pF 181 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB
1,000 pF 102 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
1,200 pF 122 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
1,500 pF 152 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
1,800 pF 182 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
2,200 pF 222 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
2,700 pF 272 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
3,300 pF 332 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
3,900 pF 392 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
4,700 pF 472 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
5,600 pF 562 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
6,800 pF 682 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
8,200 pF 822 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
10,000 pF 103 J K M BB BB BB BB BB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
12,000 pF 123 J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB
15,000 pF 153 J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DC DC EB EB EB EB EB EB EB EB
18,000 pF 183 J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DC DC EB EB EB EB EB EB EB EB
22,000 pF 223 J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DC DC EB EB EB EB EB EB EB EB
27,000 pF 273 J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DE EB EB EB EB EB EB EB EB
33,000 pF 333 J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DE EB EB EB EB EB EB EB EB
39,000 pF 393 J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DD DE EB EB EB EB EB EC EB EB
47,000 pF 473 J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DE DG EB EB EB EB EB EC ED ED
56,000 pF 563 J K M BB BB BB CB CB CB CB CB DD DD DD DD DD DE DG EB EB EB EB EB EB ED ED
68,000 pF 683 J K M BB BB BB CB CB CB CB CB DD DD DD DD DD DE EB EB EB EB EB EB ED ED
82,000 pF 823 J K M BB BB BB CB CB CB CB CB DD DD DD DD DD DE EB EB EB EB EB EB ED ED
0.10 µF 104 J K M BB BB BB CB CB CB CB CB DC DC DC DC DC DE EB EB EB EB EB EB EM EM
0.12 µF 124 J K M CB CB CB CB CB DC DC DC DC DD DG EC EC EC EC EC EC EG
0.15 µF 154 J K M CB CB CB CB CB DC DC DC DC DD DG EC EC EC EC EC EC EG
0.18 µF 184 J K M CB CB CB CB DC DC DC DC DD DG EC EC EC EC EC EC
0.22 µF 224 J K M CB CB CB CD DC DC DC DC DD DG EC EC EC EC EC EC
0.27 µF 274 J K M CB CB CB DD DD DD DD DD EB EB EB EB EC EM
0.33 µF 334 J K M CB CB CB DD DD DD DD DD EB EB EB EB EC EG
0.39 µF 394 J K M CB CB CB DG DG DG DG DE EB EB EB EB EC EG
0.47 µF 474 J K M CB CB CB DD DD DD DD DE EC EC EC EC EC EG
0.56 µF 564 J K M DD DD DD DG DH ED ED ED ED EC
0.68 µF 684 J K M DD DD DD DG DH EE EE EE EE ED
0.82 µF 824 J K M DD DD DD DG EF EF EF EF ED
1.0 µF 105 J K M DD DD DD DG EF EF EF EG ED
1.2 µF 125 J K M DE DE DE ED ED ED EG EH
1.5 µF 155 J K M DG DG DG EF EF EF EG EH
1.8 µF 185 J K M DG DG DG ED ED ED EF EH
2.2 µF 225 J K M DG DG DG ED ED ED EF EH
2.7 µF 275 J K M EN EN EN EH
3.3 µF 335 J K M ED ED ED EH
3.9 µF 395 J K M EF EF EF EH
4.7 µF 475 J K M EF EF EF EH
5.6 µF 565 J K M EH EH EH
6.8 µF 685 J K M EH EH EH
8.2 µF 825 J K M EH EH EH
10 µF 106 J K M EH EH EH
12 µF 126 J K M
Capacitance Cap
Code
Voltage DC
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Voltage Code 9843598435129843512A9843512A
Series C0402 C0603 C0805 C1206
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Capacitance Cap
Code
Series C1210 C1812 C1825 C2220
Voltage Code 9 8 4 3 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Voltage DC
6.3
10
16
25
50
100
200
250
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10 – 91 pF 100 – 910 J K M FB FB FB FB FB FB FB
100 – 390 pF 101 – 391 J K M FB FB FB FB FB FB FB
470 – 820 pF 471 – 821 J K M FB FB FB FB FB FB FB GB GB GB GB
560 pF 561 J K M FB FB FB FB FB FB FB GB GB GB GB
680 pF 681 J K M FB FB FB FB FB FB FB GB GB GB GB
820 pF 821 J K M FB FB FB FB FB FB FB GB GB GB GB
1,000 pF 102 J K M FB FB FB FB FB FB FB GB GB GB GB
1,200 pF 122 J K M FB FB FB FB FB FB FB GB GB GB GB
1,500 pF 152 J K M FB FB FB FB FB FB FE GB GB GB GB
1,800 pF 182 J K M FB FB FB FB FB FB FE GB GB GB GB
2,200 pF 222 J K M FB FB FB FB FB FB FB FB GB GB GB GB
2,700 pF 272 J K M FB FB FB FB FB FB FB FB GB GB GB GB
3,300 pF 332 J K M FB FB FB FB FB FB FB FB GB GB GB GB
3,900 pF 392 J K M FB FB FB FB FB FB FB FB GB GB GB GB
4,700 pF 472 J K M FB FB FB FB FB FB FB FB GB GB GB GD
5,600 pF 562 J K M FB FB FB FB FB FB FB FB GB GB GB GH
6,800 pF 682 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
8,200 pF 822 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
10,000 pF 103 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
12,000 pF 123 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
15,000 pF 153 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
18,000 pF 183 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB JE JE JE
22,000 pF 223 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB HB HB HB HB JE JE JE
27,000 pF 273 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB HB HB HB HB JE JE JE
33,000 pF 333 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB HB HB HB HB JB JB JB
39,000 pF 393 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB HB HB HB HB JB JB JB
47,000 pF 473 J K M FB FB FB FB FB FB FB FB GB GB GB GB GB HB HB HB HB JB JB JB
56,000 pF 563 J K M FB FB FB FB FB FB FC FC GB GB GB GB GB HB HB HB HB JB JB JB
68,000 pF 683 J K M FB FB FB FB FB FB FC FC GB GB GB GB GB HB HB HB HB JB JB JB
82,000 pF 823 J K M FB FB FB FB FB FC FF FF GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.10 µF 104 J K M FB FB FB FB FB FD FG FG GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.12 µF 124 J K M FB FB FB FB FB FD GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.15 µF 154 J K M FC FC FC FC FC FD GB GB GB GE GE HB HB HB HB JB JB JC JC JC
0.18 µF 184 J K M FC FC FC FC FC FD GB GB GB GG GG HB HB HB HB JB JB JC JC JC
0.22 µF 224 J K M FC FC FC FC FC FD GB GB GB GG GG HB HB HB HB JB JB JC JC JC
0.27 µF 274 J K M FC FC FC FC FC FD GB GB GG GG GG HB HB HB HB JC JC JC JC JC
0.33 µF 334 J K M FD FD FD FD FD FD GB GB GG GG GG HB HB HB HB JC JC JC JC JC
0.39 µF 394 J K M FD FD FD FD FD FD GB GB GG GG GG HD HD HD HD JC JC JC JC JC
0.47 µF 474 J K M FD FD FD FD FD FD GB GB GG GJ GJ HD HD HD HD JC JC JC JC JC
0.56 µF 564 J K M FD FD FD FD FD FF GC GC GG HD HD HD HD JC JD JD JD JD
0.68 µF 684 J K M FD FD FD FD FD FG GC GC GG HD HD HD HD JC JD JD JD JD
0.82 µF 824 J K M FF FF FF FF FF FL GE GE GG HF HF HF HF JC JF JF JF JF
1.0 µF 105 J K M FH FH FH FH FH FM GE GE GG HF HF HF HF JC JF JF JF JF
1.2 µF 125 J K M FH FH FH FH FG JC JC
1.5 µF 155 J K M FH FH FH FH FG JC JC
1.8 µF 185 J K M FH FH FH FH FG JD JD
2.2 µF 225 J K M FJ FJ FJ FJ FG GO GO JF JF
2.7 µF 275 J K M FE FE FE FG FH
3.3 µF 335 J K M FF FF FF FM FM
3.9 µF 395 J K M FG FG FG FG FK
4.7 µF 475 J K M FC FC FC FG FS GK GK
5.6 µF 565 J K M FF FF FF FH
6.8 µF 685 J K M FG FG FG FM
8.2 µF 825 J K M FH FH FH FK
Capacitance Cap
Code
Voltage DC
6.3
10
16
25
50
100
200
250
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Voltage Code 9 8 4 3 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Series C1210 C1812 C1825 C2220
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont'd
Table 2 – Chip Thickness/Packaging Quantities
Package quantity based on nished chip thickness specications.
Capacitance Cap
Code
Series C1210 C1812 C1825 C2220
Voltage Code 9 8 4 3 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Voltage DC
6.3
10
16
25
50
100
200
250
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10 µF 106 J K M FH FH FH FS GK JF JO
12 µF 126 J K M
15 µF 156 J K M JO
18 µF 186 J K M
22 µF 226 J K M FS FS JO
47 µF 476 J K M
Capacitance Cap
Code
Voltage DC
6.3
10
16
25
50
100
200
250
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Voltage Code 9 8 4 3 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Series C1210 C1812 C1825 C2220
Thickness
Code Case
Size Thickness ±
Range (mm) Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50 ± 0.05
10,000
50,000
0
0
CB
0603
0.80 ± 0.07
4,000
10,000
0
0
CD
0603
0.80 ± 0.15
4,000
10,000
0
0
DC
0805
0.78 ± 0.10
4,000
10,000
0
0
DD
0805
0.90 ± 0.10
4,000
10,000
0
0
DE
0805
1.00 ± 0.10
0
0
2,500
10,000
DG
0805
1.25 ± 0.15
0
0
2,500
10,000
DH
0805
1.25 ± 0.20
0
0
2,500
10,000
EB
1206
0.78 ± 0.10
4,000
10,000
4,000
10,000
EC
1206
0.90 ± 0.10
0
0
4,000
10,000
EN
1206
0.95 ± 0.10
0
0
4,000
10,000
ED
1206
1.00 ± 0.10
0
0
2,500
10,000
EE
1206
1.10 ± 0.10
0
0
2,500
10,000
EF
1206
1.20 ± 0.15
0
0
2,500
10,000
EM
1206
1.25 ± 0.15
0
0
2,500
10,000
EG
1206
1.60 ± 0.15
0
0
2,000
8,000
EH
1206
1.60 ± 0.20
0
0
2,000
8,000
FB
1210
0.78 ± 0.10
0
0
4,000
10,000
FC
1210
0.90 ± 0.10
0
0
4,000
10,000
FD
1210
0.95 ± 0.10
0
0
4,000
10,000
FE
1210
1.00 ± 0.10
0
0
2,500
10,000
FF
1210
1.10 ± 0.10
0
0
2,500
10,000
FG
1210
1.25 ± 0.15
0
0
2,500
10,000
FL
1210
1.40 ± 0.15
0
0
2,000
8,000
FH
1210
1.55 ± 0.15
0
0
2,000
8,000
FM
1210
1.70 ± 0.20
0
0
2,000
8,000
FJ
1210
1.85 ± 0.20
0
0
2,000
8,000
FK
1210
2.10 ± 0.20
0
0
2,000
8,000
FS
1210
2.50 ± 0.20
0
0
1,000
4,000
GB
1812
1.00 ± 0.10
0
0
1,000
4,000
Thickness
Code Case
Size Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Thickness
Code Case
Size Thickness ±
Range (mm) Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GD
1812
1.25 ± 0.15
0
0
1,000
4,000
GE
1812
1.30 ± 0.10
0
0
1,000
4,000
GH
1812
1.40 ± 0.15
0
0
1,000
4,000
GG
1812
1.55 ± 0.10
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
GJ
1812
1.70 ± 0.15
0
0
1,000
4,000
GO
1812
2.50 ± 0.20
0
0
500
2,000
HB
1825
1.10 ± 0.15
0
0
1,000
4,000
HD
1825
1.30 ± 0.15
0
0
1,000
4,000
HF
1825
1.50 ± 0.15
0
0
1,000
4,000
JB
2220
1.00 ± 0.15
0
0
1,000
4,000
JC
2220
1.10 ± 0.15
0
0
1,000
4,000
JD
2220
1.30 ± 0.15
0
0
1,000
4,000
JE
2220
1.40 ± 0.15
0
0
1,000
4,000
JF
2220
1.50 ± 0.15
0
0
1,000
4,000
JO
2220
2.40 ± 0.15
0
0
500
2,000
Thickness
Code Case
Size Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Table 2 – Chip Thickness/Packaging Quantities cont'd
Package quantity based on nished chip thickness specications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805, and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Construction
Reference Item Material
A
Termination
System
Finish 100% Matte Sn SnPb (5% min)
B Barrier Layer Ni
D Base Metal Cu
EInner Electrode Ni
FDielectric Material BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identi er(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
_
KA8
Capacitance (pF) For Various Alpha/Numeral Identi ers
Alpha
Character
Numeral
9 0 1 2 3 4 5 6 7 8
Capacitance (pF)
A 0.1 1 0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
B 0.11 1.1 11 110 1,10 0 11,000 110,000 1,100,000 11,000,000 110,000,000
C 0.12 1 2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000
D 0.13 1 3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000
E 0.15 1 5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000
F 0.16 1 6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000
G 0.18 1 8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H 0.2 2 0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000
J 0.22 2 2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000
K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000
L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000
M 0.3 3 0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N 0.33 3 3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000
P 0.36 3 6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000
Q 0.39 3 9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000
R 0.43 4 3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000
U 0.56 5 6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000
V 0.62 6 2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000
W 0.68 6 8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000
X 0.75 7 5 75 750 7,50 0 75,000 750,000 7,500,000 75,000,000 750,000,000
Y 0.82 8 2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000
Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000
a 0.25 2 5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000
b 0.35 3 5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000
d 0.4 4 0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e 0.45 4 5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000
f 0.5 5 0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000
m 0.6 6 0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000
n 0.7 7 0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000
t 0.8 8 0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y 0.9 9 0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape Size (W)* Pitch (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm) 4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm) 12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC–286 and EIAJ 7201
Unit mm *Reference
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
68 ± 0.1
88 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
EIA Size
Code
Metric Size
Code
L Length W Width B Bandwidth
S Separation
Minimum
T Thickness
Number of
Pieces/Cassette
0402 1005 1.0 ±0.05 0.5 ±0.05 0.2 to 0.4 0.3 0.5 ±0.05 50,000
0603 1608 1.6 ±0.07 0.8 ±0.07 0.2 to 0.5 0.7 0.8 ±0.07 15,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
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Tel: 954-766-2800
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Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
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Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) are subject to change without notice.
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we
speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1027_X7R_COTS_SMD • 1/9/2013 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Digitally signed by Jeannette Calvo
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing
Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com
Date: 2013.01.11 16:06:24 -05'00'