MPC8572LVJAVNE - Freescale Semiconductor

Freescale Semiconductor

Technical Data

Freescale reserves the right to change the detail specifications as may be required

to permit improvements in the design of its products.

1 Overview

This section provides a high-level overview of the features

of the MPC8572E processor. Figure 1 shows the major

functional units within the MPC8572E.

1.1 Key Features

The following list provides an overview of the MPC8572E

feature set:

• Two high-performance, 32-bit, Book E-enhanced

cores that implement the Power Architecture®

technology:

— Each core is identical to the core within the

MPC8572E processor.

— 32-Kbyte L1 instruction cache and 32-Kbyte L1

data cache with parity protection. Caches can be

locked entirely or on a per-line basis, with

separate locking for instructions and data.

— Signal-processing engine (SPE) APU (auxiliary

processing unit). Provides an extensive

instruction set for vector (64-bit) integer and

fractional operations. These instructions use both

Contents

1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . 10

3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15

4. Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18

6. DDR2 and DDR3 SDRAM Controller . . . . . . . . . . . 19

7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

8. Ethernet: Enhanced Three-Speed Ethernet (eTSEC) 28

9. Ethernet Management Interface

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 50

10. Local Bus Controller (eLBC) . . . . . . . . . . . . . . . . . . 53

11. Programmable Interrupt Controller . . . . . . . . . . . . . 65

12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

15. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 71

16. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

17. Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

18. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 99

19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

21. System Design Information . . . . . . . . . . . . . . . . . . 123

22. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 134

23. Document Revision History . . . . . . . . . . . . . . . . . . 136

MPC8572E PowerQUICC III

Integrated Processor

Hardware Specifications

Document Number: MPC8572EEC

Rev. 6, 06/2014

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

2Freescale Semiconductor

Overview

the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU.

— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set

for single-precision (32-bit) floating-point instructions.

— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)

floating-point instructions that use the 64-bit GPRs.

— 36-bit real addressing

— Memory management unit (MMU). Especially designed for embedded applications. Supports

4-Kbyte to 4-Gbyte page sizes.

— Enhanced hardware and software debug support

— Performance monitor facility that is similar to, but separate from, the MPC8572E performance

monitor

The e500 defines features that are not implemented on this device. It also generally defines some

features that this device implements more specifically. An understanding of these differences can

be critical to ensure proper operation.

• 1 Mbyte L2 cache/SRAM

— Shared by both cores.

— Flexible configuration and individually configurable per core.

— Full ECC support on 64-bit boundary in both cache and SRAM modes

— Cache mode supports instruction caching, data caching, or both.

— External masters can force data to be allocated into the cache through programmed memory

ranges or special transaction types (stashing).

– 1, 2, or 4 ways can be configured for stashing only.

— Eight-way set-associative cache organization (32-byte cache lines)

— Supports locking entire cache or selected lines. Individual line locks are set and cleared through

Book E instructions or by externally mastered transactions.

— Global locking and Flash clearing done through writes to L2 configuration registers

— Instruction and data locks can be Flash cleared separately.

— Per-way allocation of cache region to a given processor.

— SRAM features include the following:

– 1, 2, 4, or 8 ways can be configured as SRAM.

– I/O devices access SRAM regions by marking transactions as snoopable (global).

– Regions can reside at any aligned location in the memory map.

– Byte-accessible ECC is protected using read-modify-write transaction accesses for

smaller-than-cache-line accesses.

• e500 coherency module (ECM) manages core and intrasystem transactions

• Address translation and mapping unit (ATMU)

— Twelve local access windows define mapping within local 36-bit address space.

— Inbound and outbound ATMUs map to larger external address spaces.

– Three inbound windows plus a configuration window on PCI Express

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Overview

– Four inbound windows plus a default window on Serial RapidIO®

– Four outbound windows plus default translation for PCI Express

– Eight outbound windows plus default translation for Serial RapidIO with segmentation and

sub-segmentation support

• Two 64-bit DDR2/DDR3 memory controllers

— Programmable timing supporting DDR2 and DDR3 SDRAM

— 64-bit data interface per controller

— Four banks of memory supported, each up to 4 Gbytes, for a maximum of 16 Gbytes per

controller

— DRAM chip configurations from 64 Mbits to 4 Gbits with x8/x16 data ports

— Full ECC support

— Page mode support

– Up to 32 simultaneous open pages for DDR2 or DDR3

— Contiguous or discontiguous memory mapping

— Cache line, page, bank, and super-bank interleaving between memory controllers

— Read-modify-write support for RapidIO atomic increment, decrement, set, and clear

transactions

— Sleep mode support for self-refresh SDRAM

— On-die termination support when using DDR2 or DDR3

— Supports auto refreshing

— On-the-fly power management using CKE signal

— Registered DIMM support

— Fast memory access through JTAG port

— 1.8-V SSTL_1.8 compatible I/O

— Support 1.5-V operation for DDR3. The detail is TBD pending on official release of

appropriate industry specifications.

— Support for battery-backed main memory

• Programmable interrupt controller (PIC)

— Programming model is compliant with the OpenPIC architecture.

— Supports 16 programmable interrupt and processor task priority levels

— Supports 12 discrete external interrupts

— Supports 4 message interrupts per processor with 32-bit messages

— Supports connection of an external interrupt controller such as the 8259 programmable

interrupt controller

— Four global high resolution timers/counters per processor that can generate interrupts

— Supports a variety of other internal interrupt sources

— Supports fully nested interrupt delivery

— Interrupts can be routed to external pin for external processing.

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Overview

— Interrupts can be routed to the e500 core’s standard or critical interrupt inputs.

— Interrupt summary registers allow fast identification of interrupt source.

• Integrated security engine (SEC) optimized to process all the algorithms associated with IPSec,

IKE, SSL/TLS, SRTP, 802.16e, and 3GPP

— Four crypto-channels, each supporting multi-command descriptor chains

– Dynamic assignment of crypto-execution units through an integrated controller

– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes

— PKEU—public key execution unit

– RSA and Diffie-Hellman; programmable field size up to 4096 bits

– Elliptic curve cryptography with F2m and F(p) modes and programmable field size up to

1023 bits

— DEU—Data Encryption Standard execution unit

– DES, 3DES

– Two key (K1, K2, K1) or three key (K1, K2, K3)

– ECB, CBC and OFB-64 modes for both DES and 3DES

— AESU—Advanced Encryption Standard unit

– Implements the Rijndael symmetric key cipher

– ECB, CBC, CTR, CCM, GCM, CMAC, OFB-128, CFB-128, and LRW modes

– 128-, 192-, and 256-bit key lengths

— AFEU—ARC four execution unit

– Implements a stream cipher compatible with the RC4 algorithm

– 40- to 128-bit programmable key

— MDEU—message digest execution unit

– SHA-1 with 160-bit message digest

– SHA-2 (SHA-256, SHA-384, SHA-512)

– MD5 with 128-bit message digest

– HMAC with all algorithms

— KEU—Kasumi execution unit

– Implements F8 algorithm for encryption and F9 algorithm for integrity checking

– Also supports A5/3 and GEA-3 algorithms

— RNG—random number generator

— XOR engine for parity checking in RAID storage applications

— CRC execution unit

– CRC-32 and CRC-32C

• Pattern Matching Engine with DEFLATE decompression

— Regular expression (regex) pattern matching

– Built-in case insensitivity, wildcard support, no pattern explosion

– Cross-packet pattern detection

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Overview

– Fast pattern database compilation and fast incremental updates

– 16000 patterns, each up to 128 bytes in length

– Patterns can be split into 256 sets, each of which can contain 16 subsets

— Stateful rule engine enables hardware execution of state-aware logic when a pattern is found

– Useful for contextual searches, multi-pattern signatures, or for performing additional checks

after a pattern is found

– Capable of capturing and utilizing data from the data stream (such as LENGTH field) and

using that information in subsequent pattern searches (for example, positive match only if

pattern is detected within the number of bytes specified in the LENGTH field)

– 8192 stateful rules

— Deflate engine

– Supports decompression of DEFLATE compression format including zlib and gzip

– Can work independently or in conjunction with the Pattern Matching Engine (that is

decompressed data can be passed directly to the Pattern Matching Engine without further

software involvement or memory copying)

• Two Table Lookup Units (TLU)

— Hardware-based lookup engine offloads table searches from e500 cores

— Longest prefix match, exact match, chained hash, and flat data table formats

— Up to 32 tables, with each table up to 16M entries

— 32-, 64-, 96-, or 128-bit keys

•Two I

2C controllers

— Two-wire interface

— Multiple master support

— Master or slave I2C mode support

— On-chip digital filtering rejects spikes on the bus

• Boot sequencer

— Optionally loads configuration data from serial ROM at reset the I2C interface

— Can be used to initialize configuration registers and/or memory

— Supports extended I2C addressing mode

— Data integrity checked with preamble signature and CRC

• DUART

— Two 4-wire interfaces (SIN, SOUT, RTS, CTS)

— Programming model compatible with the original 16450 UART and the PC16550D

• Enhanced local bus controller (eLBC)

— Multiplexed 32-bit address and data bus operating at up to 150 MHz

— Eight chip selects support eight external slaves

— Up to 8-beat burst transfers

— The 32-, 16-, and 8-bit port sizes are controlled by an on-chip memory controller.

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Overview

— Three protocol engines available on a per-chip select basis:

– General-purpose chip select machine (GPCM)

– Three user programmable machines (UPMs)

– NAND Flash control machine (FCM)

— Parity support

— Default boot ROM chip select with configurable bus width (8, 16, or 32 bits)

• Four enhanced three-speed Ethernet controllers (eTSECs)

— Three-speed support (10/100/1000 Mbps)

— Four IEEE Std 802.3®, 802.3u, 802.3x, 802.3z, 802.3ac, 802.3ab-compatible controllers

— Support for various Ethernet physical interfaces:

– 1000 Mbps full-duplex IEEE 802.3 GMII, IEEE 802.3z TBI, RTBI, RGMII, and SGMII

– 10/100 Mbps full and half-duplex IEEE 802.3 MII, IEEE 802.3 RGMII, and RMII

— Flexible configuration for multiple PHY interface configurations

— TCP/IP acceleration and QoS features available

– IP v4 and IP v6 header recognition on receive

– IP v4 header checksum verification and generation

– TCP and UDP checksum verification and generation

– Per-packet configurable acceleration

– Recognition of VLAN, stacked (Q-in-Q) VLAN, 802.2, PPPoE session, MPLS stacks, and

ESP/AH IP-security headers

– Supported in all FIFO modes

— Quality of service support:

– Transmission from up to eight physical queues

– Reception to up to eight physical queues

— Full- and half-duplex Ethernet support (1000 Mbps supports only full duplex):

– IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or

software-programmed PAUSE frame generation and recognition)

— Programmable maximum frame length supports jumbo frames (up to 9.6 Kbytes) and

IEEE Std 802.1™ virtual local area network (VLAN) tags and priority

— VLAN insertion and deletion

– Per-frame VLAN control word or default VLAN for each eTSEC

– Extracted VLAN control word passed to software separately

— Retransmission following a collision

— CRC generation and verification of inbound/outbound frames

— Programmable Ethernet preamble insertion and extraction of up to 7 bytes

— MAC address recognition:

– Exact match on primary and virtual 48-bit unicast addresses

– VRRP and HSRP support for seamless router fail-over

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Overview

– Up to 16 exact-match MAC addresses supported

– Broadcast address (accept/reject)

– Hash table match on up to 512 multicast addresses

– Promiscuous mode

— Buffer descriptors backward compatible with MPC8260 and MPC860T 10/100 Ethernet

programming models

— RMON statistics support

— 10-Kbyte internal transmit and 2-Kbyte receive FIFOs

— Two MII management interfaces for control and status

— Ability to force allocation of header information and buffer descriptors into L2 cache

• 10/100 Fast Ethernet controller (FEC) management interface

— 10/100 Mbps full and half-duplex IEEE 802.3 MII for system management

— Note: When enabled, the FEC occupies eTSEC3 and eTSEC4 parallel interface signals. In such

a mode, eTSEC3 and eTSEC4 are only available through SGMII interfaces.

• OCeaN switch fabric

— Full crossbar packet switch

— Reorders packets from a source based on priorities

— Reorders packets to bypass blocked packets

— Implements starvation avoidance algorithms

— Supports packets with payloads of up to 256 bytes

• Two integrated DMA controllers

— Four DMA channels per controller

— All channels accessible by the local masters

— Extended DMA functions (advanced chaining and striding capability)

— Misaligned transfer capability

— Interrupt on completed segment, link, list, and error

— Supports transfers to or from any local memory or I/O port

— Selectable hardware-enforced coherency (snoop/no snoop)

— Ability to start and flow control up to 4 (both Channel 0 and 1 for each DMA Controller) of the

8 total DMA channels from external 3-pin interface by the remote masters

— The Channel 2 of DMA Controller 2 is only allowed to initiate and start a DMA transfer by the

remote master, because only one of the 3-external pins (DMA2_DREQ[2]) is made available

— Ability to launch DMA from single write transaction

• Serial RapidIO interface unit

— Supports RapidIO Interconnect Specification, Revision 1.2

— Both 1x and 4x LP-serial link interfaces

— Long- and short-haul electricals with selectable pre-compensation

— Transmission rates of 1.25, 2.5, and 3.125 Gbaud (data rates of 1.0, 2.0, and 2.5 Gbps) per lane

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Overview

— Auto-detection of 1x- and 4x-mode operation during port initialization

— Link initialization and synchronization

— Large and small size transport information field support selectable at initialization time

— 34-bit addressing

— Up to 256 bytes data payload

— All transaction flows and priorities

— Atomic set/clr/inc/dec for read-modify-write operations

— Generation of IO_READ_HOME and FLUSH with data for accessing cache-coherent data at

a remote memory system

— Receiver-controlled flow control

— Error detection, recovery, and time-out for packets and control symbols as required by the

RapidIO specification

— Register and register bit extensions as described in part VIII (Error Management) of the

RapidIO specification

— Hardware recovery only

— Register support is not required for software-mediated error recovery.

— Accept-all mode of operation for fail-over support

— Support for RapidIO error injection

— Internal LP-serial and application interface-level loopback modes

— Memory and PHY BIST for at-speed production test

• RapidIO–compliant message unit

— 4 Kbytes of payload per message

— Up to sixteen 256-byte segments per message

— Two inbound data message structures within the inbox

— Capable of receiving three letters at any mailbox

— Two outbound data message structures within the outbox

— Capable of sending three letters simultaneously

— Single segment multicast to up to 32 devIDs

— Chaining and direct modes in the outbox

— Single inbound doorbell message structure

— Facility to accept port-write messages

• Three PCI Express controllers

— PCI Express 1.0a compatible

— Supports x8, x4, x2, and x1 link widths (see following bullet for specific width configuration

options)

— Auto-detection of number of connected lanes

— Selectable operation as root complex or endpoint

— Both 32- and 64-bit addressing

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Overview

— 256-byte maximum payload size

— Virtual channel 0 only

— Full 64-bit decode with 36-bit wide windows

• Pin multiplexing for the high-speed I/O interfaces supports one of the following configurations:

— Single x8/x4/x2/x1 PCI Express

— Dual x4/x2/x1 PCI Express

— Single x4/x2/x1 PCI Express and dual x2/x1 PCI Express

— Single 1x/4x Serial RapidIO and single x4/x2/x1 PCI Express

• Power management

— Supports power saving modes: doze, nap, and sleep

— Employs dynamic power management, that automatically minimizes power consumption of

blocks when they are idle

• System performance monitor

— Supports eight 32-bit counters that count the occurrence of selected events

— Ability to count up to 512 counter-specific events

— Supports 64 reference events that can be counted on any of the eight counters

— Supports duration and quantity threshold counting

— Permits counting of burst events with a programmable time between bursts

— Triggering and chaining capability

— Ability to generate an interrupt on overflow

• System access port

— Uses JTAG interface and a TAP controller to access entire system memory map

— Supports 32-bit accesses to configuration registers

— Supports cache-line burst accesses to main memory

— Supports large block (4-Kbyte) uploads and downloads

— Supports continuous bit streaming of entire block for fast upload and download

• IEEE Std 1149.1™ compatible, JTAG boundary scan

• 1023 FC-PBGA package

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Electrical Characteristics

Figure 1 shows the MPC8572E block diagram.

Figure 1. MPC8572E Block Diagram

2 Electrical Characteristics

This section provides the AC and DC electrical specifications for the MPC8572E. The MPC8572E is

currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but

are included for a more complete reference. These are not purely I/O buffer design specifications.

Core

x8/x4/x2/x1 PCI Express

4x Serial RapidIO

10/100/1Gb

MII, GMII, TBI,

RTBI, RGMII,

Serial

IRQs

SDRAM

DDR2/3

(NOR/NAND)

GPIO

I2CI2C

Controller

eTSEC

Serial RapidIO

Messaging Unit

e500

Coherency

Module

64b DDR2/DDR3

Memory Controller

Enhanced Local Bus

Controller

Programmable Interrupt

Controller (PIC)

DUART

e500 Core

1-Mbyte L2

Cache/

SRAM

4-Channel DMA

Controller

32-Kbyte L1

Instruction

Cache

32-Kbyte

L1 Data

Cache

OceaN

Switch

Fabric

Serial RapidIO

PCI Express

I2CI2C

Controller

RMII, SGMII, FIFO

MPC8572E

10/100/1Gb

MII, GMII, TBI,

RTBI, RGMII,

eTSEC

RMII, SGMII, FIFO

Security

Engine

XOR

Engine

10/100/1Gb

RTBI, RGMII, eTSEC

RMII, SGMII

10/100/1Gb

MII, GMII, TBI,

RTBI, RGMII,

eTSEC

RMII, SGMII, FIFO

SDRAM

DDR2/3 64b DDR2/DDR3

Memory Controller

Table Lookup

Unit

Pattern Matching

Engine

Deflate

Engine

e500 Core

32-Kbyte L1

Instruction

Cache

32-Kbyte

L1 Data

Cache

Complex

Bus

Table Lookup

Unit

External control

4-Channel DMA

Controller External control

Flash

FEC

MII

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Freescale Semiconductor 11

Electrical Characteristics

2.1 Overall DC Electrical Characteristics

This section covers the ratings, conditions, and other characteristics.

2.1.1 Absolute Maximum Ratings

Table 1 provides the absolute maximum ratings.

Table 1. Absolute Maximum Ratings1

Characteristic Symbol Range Unit Notes

Core supply voltage VDD –0.3 to 1.21 V —

PLL supply voltage AVDD –0.3 to 1.21 V —

Core power supply for SerDes transceivers SVDD –0.3 to 1.21 V —

Pad power supply for SerDes transceivers XVDD –0.3 to 1.21 V —

DDR SDRAM

Controller I/O

supply voltage

DDR2 SDRAM Interface GVDD –0.3 to 1.98 V —

DDR3 SDRAM Interface — –0.3 to 1.65 —

Three-speed Ethernet I/O, FEC management interface, MII

management voltage

LVDD (for eTSEC1

and eTSEC2)

–0.3 to 3.63

–0.3 to 2.75

TVDD (for eTSEC3

and eTSEC4, FEC)

–0.3 to 3.63

–0.3 to 2.75

—2

DUART, system control and power management, I2C, and JTAG

I/O voltage

OVDD –0.3 to 3.63 V —

Local bus and GPIO I/O voltage BVDD –0.3 to 3.63

–0.3 to 2.75

–0.3 to 1.98

V—

Input voltage DDR2 and DDR3 SDRAM interface signals MVIN –0.3 to (GVDD + 0.3) V 3

DDR2 and DDR3 SDRAM interface reference MVREFn–0.3 to (GVDD/2 + 0.3) V —

Three-speed Ethernet signals LVIN

TVIN

–0.3 to (LVDD + 0.3)

–0.3 to (TVDD + 0.3)

Local bus and GPIO signals BVIN –0.3 to (BVDD + 0.3) — —

DUART, SYSCLK, system control and power

management, I2C, and JTAG signals

OVIN –0.3 to (OVDD + 0.3) V 3

Storage temperature range TSTG –55 to 150 °C —

Notes:

1. Functional operating conditions are given in Ta b l e 2 . Absolute maximum ratings are stress ratings only, and functional

operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent

damage to the device.

2. The 3.63V maximum is only supported when the port is configured in GMII, MII, RMII or TBI modes; otherwise the 2.75V

maximum applies. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications,” for details on

the recommended operating conditions per protocol.

3. (M,L,O)VIN may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.

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12 Freescale Semiconductor

Electrical Characteristics

2.1.2 Recommended Operating Conditions

Table 2 provides the recommended operating conditions for this device. Note that the values shown are the

recommended and tested operating conditions. Proper device operation outside these conditions is not

guaranteed.

Table 2. Recommended Operating Conditions

Characteristic Symbol Recommended Value Unit Notes

Core supply voltage VDD 1.1 V ± 55 mV V —

PLL supply voltage AVDD 1.1 V ± 55 mV V 1

Core power supply for SerDes transceivers SVDD 1.1 V ± 55 mV V —

Pad power supply for SerDes transceivers XVDD 1.1 V ± 55 mV V —

DDR SDRAM

Controller I/O

supply voltage

DDR2 SDRAM Interface GVDD 1.8 V ± 90 mV V —

DDR3 SDRAM Interface 1.5 V ± 75 mV —

Three-speed Ethernet I/O voltage LVDD 3.3 V ± 165 mV

2.5 V ± 125 mV

TVDD 3.3 V ± 165 mV

2.5 V ± 125 mV

DUART, system control and power management, I2C, and JTAG I/O voltage OVDD 3.3 V ± 165 mV V 3

Local bus and GPIO I/O voltage BVDD 3.3 V ± 165 mV

2.5 V ± 125 mV

1.8 V ± 90 mV

V—

Input voltage DDR2 and DDR3 SDRAM Interface signals MVIN GND to GVDD V2

DDR2 and DDR3 SDRAM Interface reference MVREFnGVDD/2 ± 1% V —

Three-speed Ethernet signals LVIN

TVIN

GND to LVDD

GND to TVDD

Local bus and GPIO signals BVIN GND to BVDD V—

Local bus, DUART, SYSCLK, Serial RapidIO, system

control and power management, I2C, and JTAG

signals

OVIN GND to OVDD V3

Junction temperature range TJ0 to 105 °C—

Notes:

1. This voltage is the input to the filter discussed in Section 21.2.1, “PLL Power Supply Filtering,” and not necessarily the

voltage at the AVDD pin, that may be reduced from VDD by the filter.

2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during

power-on reset and power-down sequences.

3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during

power-on reset and power-down sequences.

4. Caution: L/TVIN must not exceed L/TVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during

power-on reset and power-down sequences.

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Freescale Semiconductor 13

Electrical Characteristics

Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8572E.

Figure 2. Overshoot/Undershoot Voltage for TVDD/BVDD/GVDD/LVDD/OVDD

The core voltage must always be provided at nominal 1.1 V. (See Table 2 for actual recommended core

voltage.) Voltage to the processor interface I/Os are provided through separate sets of supply pins and must

be provided at the voltages shown in Table 2. The input voltage threshold scales with respect to the

associated I/O supply voltage. TVDD, BVDD, OVDD, and LVDD based receivers are simple CMOS I/O

circuits and satisfy appropriate LVCMOS type specifications. The DDR2 and DDR3 SDRAM interface

uses differential receivers referenced by the externally supplied MVREFn signal (nominally set to GVDD/2)

as is appropriate for the SSTL_1.8 electrical signaling standard for DDR2 or 1.5-V electrical signaling for

DDR3. The DDR DQS receivers cannot be operated in single-ended fashion. The complement signal must

be properly driven and cannot be grounded.

GND

GND – 0.3 V

GND – 0.7 V Not to Exceed 10%

T/B/G/L/OVDD + 20%

T/B/G/L/OVDD

T/B/G/L/OVDD + 5%

of tCLOCK1

tCLOCK refers to the clock period associated with the respective interface:

VIH

VIL

Note:

For I2C and JTAG, tCLOCK references SYSCLK.

For DDR, tCLOCK references MCLK.

For eTSEC, tCLOCK references EC_GTX_CLK125.

For eLBC, tCLOCK references LCLK.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

14 Freescale Semiconductor

Electrical Characteristics

2.1.3 Output Driver Characteristics

Table 3 provides information on the characteristics of the output driver strengths.

2.2 Power Sequencing

The MPC8572E requires its power rails to be applied in a specific sequence to ensure proper device

operation. These requirements are as follows for power up:

1. VDD, AVDD_n, BVDD, LVDD, OVDD, SVDD_SRDS1 and SVDD_SRDS2, TVDD, XVDD_SRDS1 and

XVDD_SRDS2

2. GVDD

All supplies must be at their stable values within 50 ms.

Items on the same line have no ordering requirement with respect to one another. Items on separate lines

must be ordered sequentially such that voltage rails on a previous step must reach 90% of their value before

the voltage rails on the current step reach 10% of theirs.

To guarantee MCKE low during power-on reset, the above sequencing for GVDD is required. If there is no

concern about any of the DDR signals being in an indeterminate state during power-on reset, then the

sequencing for GVDD is not required.

NOTE

From a system standpoint, if any of the I/O power supplies ramp prior to the

VDD core supply, the I/Os associated with that I/O supply may drive a logic

one or zero during power-on reset, and extra current may be drawn by the

device.

Table 3. Output Drive Capability

Driver Type

Programmable

Output Impedance

(Ω)

Supply

Voltage Notes

Local bus interface utilities signals 25

BVDD = 3.3 V

BVDD = 2.5 V

45(default)

125

BVDD = 3.3 V

BVDD = 2.5 V

BVDD = 1.8 V

DDR2 signal 18

36 (half strength mode)

GVDD = 1.8 V 2

DDR3 signal 20

40 (half strength mode)

GVDD = 1.5 V 2

eTSEC/10/100 signals 45 L/TVDD = 2.5/3.3 V —

DUART, system control, JTAG 45 OVDD = 3.3 V —

I2C 150 OVDD = 3.3 V —

Notes:

1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.

2. The drive strength of the DDR2 or DDR3 interface in half-strength mode is at Tj = 105°C and at GVDD (min).

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 15

Power Characteristics

3 Power Characteristics

The estimated typical power dissipation for the core complex bus (CCB) versus the core frequency for this

family of PowerQUICC III devices with out the L in its part ordering is shown in Table 4.

The estimated typical power dissipation for the core complex bus (CCB) versus the core frequency for this

family of PowerQUICC III devices with the L in its port ordering is shown in Table 5.

Table 4. MPC8572E Power Dissipation 1

1This reflects the MPC8572E power dissipation excluding the power dissipation from B/G/L/O/T/XVDD rails.

CCB Frequency Core Frequency Typical-652

2Typical-65 is based on VDD = 1.1 V, Tj = 65 °C, running Dhrystone.

Typical-1053

3Typical-105 is based on VDD = 1.1 V, Tj = 105 °C, running Dhrystone.

Maximum4

4Maximum is based on VDD = 1.1 V, Tj = 105 °C, running a smoke test.

Unit

533 1067 12.3 17.8 18.5 W

533 1200 12.3 17.8 18.5 W

533 1333 16.3 22.8 24.5 W

600 1500 17.3 23.9 25.9 W

Notes:

Table 5. MPC8572EL Power Dissipation 1

1This reflects the MPC8572E power dissipation excluding the power dissipation from B/G/L/O/T/XVDD rails.

CCB Frequency Core Frequency Typical-652

2Typical-65 is based on VDD = 1.1 V, Tj = 65 °C, running Dhrystone.

Typical-1053

3Typical-105 is based on VDD = 1.1 V, Tj = 105 °C, running Dhrystone.

Maximum4

4Maximum is based on VDD = 1.1 V, Tj = 105 °C, running a smoke test.

Unit

533 1067 12 15 15.8 W

533 1200 12 15.5 16.3 W

533 1333 12 15.9 16.9 W

600 1500 13 18.7 20.0 W

Notes:

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

16 Freescale Semiconductor

Input Clocks

4 Input Clocks

4.1 System Clock Timing

Table 6 provides the system clock (SYSCLK) AC timing specifications for the MPC8572E.

4.2 Real Time Clock Timing

The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then

used as an input to the counters of the PIC and the TimeBase unit of the e500. There is no jitter

specification. The minimum pulse width of the RTC signal should be greater than 2x the period of the CCB

clock. That is, minimum clock high time is 2 × tCCB, and minimum clock low time is 2 × tCCB. There is

no minimum RTC frequency; RTC may be grounded if not needed.

4.3 eTSEC Gigabit Reference Clock Timing

Table 7 provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications for

the MPC8572E.

Table 6. SYSCLK AC Timing Specifications

At recommended operating conditions with OVDD of 3.3V ± 5%.

Parameter/Condition Symbol Min Typical Max Unit Notes

SYSCLK frequency fSYSCLK 33 — 133 MHz 1

SYSCLK cycle time tSYSCLK 7.5 — 30.3 ns —

SYSCLK rise and fall time tKH, tKL 0.6 1.0 1.2 ns 2

SYSCLK duty cycle tKHK/tSYSCLK 40 — 60 % 3

SYSCLK jitter — — — +/– 150 ps 4, 5, 6

Notes:

1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting

SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum

operating frequencies.Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio

settings.

2. Rise and fall times for SYSCLK are measured at 0.6 V and 2.7 V.

3. Timing is guaranteed by design and characterization.

4. This represents the total input jitter—short term and long term—and is guaranteed by design.

5. The SYSCLK driver’s closed loop jitter bandwidth should be <500 kHz at –20 dB. The bandwidth must be set low to allow

cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.

6. For spread spectrum clocking, guidelines are +0% to –1% down spread at a modulation rate between 20 kHz and 60 kHz on

SYSCLK.

Table 7. EC_GTX_CLK125 AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 3.3V ± 5% or 2.5V ± 5%

Parameter/Condition Symbol Min Typical Max Unit Notes

EC_GTX_CLK125 frequency fG125 — 125 — MHz —

EC_GTX_CLK125 cycle time tG125 —8—ns—

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 17

Input Clocks

4.4 DDR Clock Timing

Table 8 provides the DDR clock (DDRCLK) AC timing specifications for the MPC8572E.

EC_GTX_CLK125 rise and fall time

L/TVDD=2.5V

L/TVDD=3.3V

tG125R, tG125F ——

0.75

1.0

ns 1

EC_GTX_CLK125 duty cycle

GMII, TBI

1000Base-T for RGMII, RTBI

tG125H/tG125

—

%2, 3

Notes:

1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5V and 2.0V for L/TVDD=2.5V, and from 0.6V and 2.7V

for L/TVDD=3.3V.

2. Timing is guaranteed by design and characterization.

3. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation.

EC_GTX_CLK125 duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle

generated by the TSECn_GTX_CLK. See Section 8.2.6, “RGMII and RTBI AC Timing Specifications,” for duty cycle

for 10Base-T and 100Base-T reference clock.

Table 8. DDRCLK AC Timing Specifications

At recommended operating conditions with OVDD of 3.3V ± 5%.

Parameter/Condition Symbol Min Typical Max Unit Notes

DDRCLK frequency fDDRCLK 66 — 100 MHz 1

DDRCLK cycle time tDDRCLK 10.0 — 15.15 ns —

DDRCLK rise and fall time tKH, tKL 0.6 1.0 1.2 ns 2

DDRCLK duty cycle tKHK/tDDRCLK 40 — 60 % 3

DDRCLK jitter — — — +/– 150 ps 4, 5, 6

Notes:

1. Caution: The DDR complex clock to DDRCLK ratio settings must be chosen such that the resulting DDR complex

clock frequency does not exceed the maximum or minimum operating frequencies. Refer to Section 19.4,

“DDR/DDRCLK PLL Ratio,” for ratio settings.

2. Rise and fall times for DDRCLK are measured at 0.6 V and 2.7 V.

3. Timing is guaranteed by design and characterization.

4. This represents the total input jitter—short term and long term—and is guaranteed by design.

5. The DDRCLK driver’s closed loop jitter bandwidth should be <500 kHz at –20 dB. The bandwidth must be set low to

allow cascade-connected PLL-based devices to track DDRCLK drivers with the specified jitter.

6. For spread spectrum clocking, guidelines are +0% to –1% down spread at a modulation rate between 20 kHz and

60 kHz on DDRCLK.

Table 7. EC_GTX_CLK125 AC Timing Specifications (continued)

At recommended operating conditions with LVDD/TVDD of 3.3V ± 5% or 2.5V ± 5% (continued)

Parameter/Condition Symbol Min Typical Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

18 Freescale Semiconductor

RESET Initialization

4.5 Platform to eTSEC FIFO Restrictions

Note the following eTSEC FIFO mode maximum speed restrictions based on platform (CCB) frequency.

For FIFO GMII modes (both 8 and 16 bit) and 16-bit encoded FIFO mode:

FIFO TX/RX clock frequency <= platform clock (CCB) frequency/4.2

For example, if the platform (CCB) frequency is 533 MHz, the FIFO TX/RX clock frequency

should be no more than 127 MHz.

For 8-bit encoded FIFO mode:

FIFO TX/RX clock frequency <= platform clock (CCB) frequency/3.2

For example, if the platform (CCB) frequency is 533 MHz, the FIFO TX/RX clock frequency

should be no more than 167 MHz.

4.6 Other Input Clocks

For information on the input clocks of other functional blocks of the platform, such as SerDes and eTSEC,

see the respective sections of this document.

5 RESET Initialization

Table 9 describes the AC electrical specifications for the RESET initialization timing.

Table 9. RESET Initialization Timing Specifications

Parameter/Condition Min Max Unit Notes

Required assertion time of HRESET 100 — μs2

Minimum assertion time for SRESET 3 — SYSCLKs 1

PLL config input setup time with stable SYSCLK before HRESET

negation

100 — μs—

Input setup time for POR configs (other than PLL config) with respect to

negation of HRESET

4 — SYSCLKs 1

Input hold time for all POR configs (including PLL config) with respect to

negation of HRESET

2 — SYSCLKs 1

Maximum valid-to-high impedance time for actively driven POR configs

with respect to negation of HRESET

— 5 SYSCLKs 1

Notes:

1. SYSCLK is the primary clock input for the MPC8572E.

2. Reset assertion timing requirements for DDR3 DRAMs may differ.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 19

DDR2 and DDR3 SDRAM Controller

Table 10 provides the PLL lock times.

6 DDR2 and DDR3 SDRAM Controller

This section describes the DC and AC electrical specifications for the DDR2 and DDR3 SDRAM

controller interface of the MPC8572E. Note that the required GVDD(typ) voltage is 1.8Vor 1.5 V when

interfacing to DDR2 or DDR3 SDRAM, respectively.

6.1 DDR2 and DDR3 SDRAM Interface DC Electrical Characteristics

Table 11 provides the recommended operating conditions for the DDR SDRAM controller of the

MPC8572E when interfacing to DDR2 SDRAM.

Table 10. PLL Lock Times

Parameter/Condition Symbol Min Typical Max

PLL lock times — 100 μs—

Local bus PLL — 50 μs—

Table 11. DDR2 SDRAM Interface DC Electrical Characteristics for GVDD(typ) = 1.8 V

Parameter/Condition Symbol Min Max Unit Notes

I/O supply voltage GVDD 1.71 1.89 V 1

I/O reference voltage MVREFn0.49 ×GVDD 0.51 ×GVDD V2

I/O termination voltage VTT MVREFn–0.04 MV

REFn+0.04 V 3

Input high voltage VIH MVREFn + 0.125 GVDD +0.3 V —

Input low voltage VIL –0.3 MVREFn – 0.125 V —

Output leakage current IOZ –50 50 μA4

Output high current (VOUT = 1.420 V) IOH –13.4 — mA —

Output low current (VOUT = 0.280 V) IOL 13.4 — mA —

Notes:

1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.

2. MVREFn is expected to be equal to 0.5 ×GVDD, and to track GVDD DC variations as measured at the receiver.

Peak-to-peak noise on MVREFn may not exceed ±2% of the DC value.

3. VTT is not applied directly to the device. It is the supply to that far end signal termination is made and is expected to be

equal to MVREFn. This rail should track variations in the DC level of MVREFn.

4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

20 Freescale Semiconductor

DDR2 and DDR3 SDRAM Controller

Table 12 provides the recommended operating conditions for the DDR SDRAM controller of the

MPC8572E when interfacing to DDR3 SDRAM.

Table 13 provides the DDR SDRAM controller interface capacitance for DDR2 and DDR3.

Table 14 provides the current draw characteristics for MVREFn.

6.2 DDR2 and DDR3 SDRAM Interface AC Electrical Characteristics

This section provides the AC electrical characteristics for the DDR SDRAM controller interface. The

DDR controller supports both DDR2 and DDR3 memories. Note that although the minimum data rate for

most off-the-shelf DDR3 DIMMs available is 800 MHz, JEDEC specification does allow the DDR3 to run

at the data rate as low as 606 MHz. Unless otherwise specified, the AC timing specifications described in

Table 12. DDR3 SDRAM Interface DC Electrical Characteristics for GVDD(typ) = 1.5 V

Parameter/Condition Symbol Min Typical Max Unit

I/O supply voltage GVDD 1.425 1.575 V 1

I/O reference voltage MVREFn0.49 ×GVDD 0.51 ×GVDD V2

Input high voltage VIH MVREFn + 0.100 GVDD V—

Input low voltage VIL GND MVREFn – 0.100 V —

Output leakage current IOZ –50 50 μA3

Notes:

1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.

2. MVREFn is expected to be equal to 0.5 ×GVDD, and to track GVDD DC variations as measured at the receiver.

Peak-to-peak noise on MVREFn may not exceed ±1% of the DC value.

3. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD.

Table 13. DDR2 and DDR3 SDRAM Interface Capacitance for GVDD(typ)=1.8 V and 1.5 V

Parameter/Condition Symbol Min Typical Max Unit

Input/output capacitance: DQ, DQS, DQS CIO 6 8 pF 1, 2

Delta input/output capacitance: DQ, DQS, DQS CDIO — 0.5 pF 1, 2

Note:

1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V (for DDR2), f = 1 MHz, TA =25°C, V

OUT =GV

DD/2, VOUT

(peak-to-peak) = 0.2 V.

2. This parameter is sampled. GVDD = 1.5 V ± 0.075 V (for DDR3), f = 1 MHz, TA= 25°C, VOUT =GV

DD/2, VOUT

(peak-to-peak) = 0.175 V.

Table 14. Current Draw Characteristics for MVREF n

Parameter / Condition Symbol Min Max Unit Note

Current draw for MVREFnDDR2 SDRAM IMVREFn— 1500 μA1

DDR3 SDRAM 1250

1. The voltage regulator for MVREFn must be able to supply up to 1500 μA or 1250 uA current for DDR2 or DDR3, respectively.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 21

DDR2 and DDR3 SDRAM Controller

this section for DDR3 is applicable for data rate between 606 MHz and 800 MHz, as long as the DC and

AC specifications of the DDR3 memory to be used are compliant to both JEDEC specifications as well as

the specifications and requirements described in this MPC8572E hardware specifications document.

6.2.1 DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications

Table 15, Table 16, and Table 17 provide the input AC timing specifications for the DDR controller when

interfacing to DDR2 and DDR3 SDRAM.

Table 15. DDR2 SDRAM Interface Input AC Timing Specifications for 1.8-V Interface

At recommended operating conditions with GVDD of 1.8 V ± 5%

Parameter Symbol Min Max Unit Notes

AC input low voltage >=667 MHz VILAC —MV

REFn – 0.20 V —

<= 533 MHz — MVREFn – 0.25

AC input high voltage >=667 MHz VIHAC MVREFn + 0.20 — V —

— <= 533 MHz MVREFn + 0.25 —

Table 16. DDR3 SDRAM Interface Input AC Timing Specifications for 1.5-V Interface

At recommended operating conditions with GVDD of 1.5 V ± 5%. DDR3 data rate is between 606 MHz and 800 MHz.

Parameter Symbol Min Max Unit Notes

AC input low voltage VILAC —MV

REFn – 0.175 V —

AC input high voltage VIHAC MVREFn + 0.175 — V —

Table 17. DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications

At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.

Parameter Symbol Min Max Unit Notes

Controller Skew for MDQS—MDQ/MECC tCISKEW ——ps1, 2

800 MHz — –200 200 — —

667 MHz — –240 240 — —

533 MHz — –300 300 — —

400 MHz — –365 365 — —

Note:

1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding

bit that is captured with MDQS[n]. This should be subtracted from the total timing budget.

2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be

determined by the following equation: tDISKEW =+/–(T/4 – abs(tCISKEW)) where T is the clock period and

abs(tCISKEW) is the absolute value of tCISKEW.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

22 Freescale Semiconductor

DDR2 and DDR3 SDRAM Controller

Figure 3 shows the DDR2 and DDR3 SDRAM interface input timing diagram.

Figure 3. DDR2 and DDR3 SDRAM Interface Input Timing Diagram

6.2.2 DDR2 and DDR3 SDRAM Interface Output AC Timing Specifications

Table 18 contains the output AC timing targets for the DDR2 and DDR3 SDRAM interface.

Table 18. DDR2 and DDR3 SDRAM Interface Output AC Timing Specifications

At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.

Parameter Symbol 1Min Max Unit Notes

MCK[n] cycle time tMCK 2.5 5 ns 2

ADDR/CMD output setup with respect to MCK tDDKHAS ns 3

800 MHz 0.917 —

667 MHz 1.10 —

533 MHz 1.48 —

400 MHz 1.95 —

ADDR/CMD output hold with respect to MCK tDDKHAX ns 3

800 MHz 0.917 —

667 MHz 1.10 —

533 MHz 1.48 —

400 MHz 1.95 —

MCS[n] output setup with respect to MCK tDDKHCS ns 3

800 MHz 0.917 —

667 MHz 1.10 —

533 MHz 1.48 —

MCK[n]

MCK[n] tMCK

MDQ[x]

MDQS[n]

tDISKEW

D1D0

tDISKEW

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 23

DDR2 and DDR3 SDRAM Controller

400 MHz tDDKHCS 1.95 — ns 3

MCS[n] output hold with respect to MCK tDDKHCX ns 3

800 MHz 0.917 —

667 MHz 1.10 —

533 MHz 1.48 —

400 MHz 1.95 —

MCK to MDQS Skew tDDKHMH ns 4

800 MHz –0.375 0.375

<= 667 MHz –0.6 0.6

MDQ/MECC/MDM output setup with respect

to MDQS

tDDKHDS,

tDDKLDS

ps 5

800 MHz 375 —

667 MHz 450 —

533 MHz 538 —

400 MHz 700 —

MDQ/MECC/MDM output hold with respect to

MDQS

tDDKHDX,

tDDKLDX

ps 5

800 MHz 375 —

667 MHz 450 —

533 MHz 538 —

400 MHz 700 —

MDQS preamble start tDDKHMP ns 6

800 MHz –0.5 × tMCK –

0.375

–0.5 × tMCK

+0.375

<= 667 MHz –0.5 × tMCK – 0.6 –0.5 × tMCK +0.6

MDQS epilogue end tDDKHME ns 6

800 MHz –0.375 0.375

Table 18. DDR2 and DDR3 SDRAM Interface Output AC Timing Specifications (continued)

At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.

Parameter Symbol 1Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

24 Freescale Semiconductor

DDR2 and DDR3 SDRAM Controller

NOTE

For the ADDR/CMD setup and hold specifications in Table 18, it is

assumed that the clock control register is set to adjust the memory clocks by

1/2 applied cycle.

<= 667 MHz tDDKHME –0.6 0.6 ns 6

Note:

1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)

(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can

be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went

invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference

(K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR

timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data

output hold time.

2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.

3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.

4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR

timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be

modified through control of the MDQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This

typically be set to the same delay as in DDR_SDRAM_CLK_CNTL[CLK_ADJUST]. The timing parameters listed in

the table assume that these 2 parameters have been set to the same adjustment value. See the MPC8572E

PowerQUICC™ III Integrated Host Processor Family Reference Manual for a description and understanding of the

timing modifications enabled by use of these bits.

5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ),

ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the

microprocessor.

6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows

the symbol conventions described in note 1.

Table 18. DDR2 and DDR3 SDRAM Interface Output AC Timing Specifications (continued)

At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.

Parameter Symbol 1Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 25

DDR2 and DDR3 SDRAM Controller

Figure 4 shows the DDR2 and DDR3 SDRAM Interface output timing for the MCK to MDQS skew

measurement (tDDKHMH).

Figure 4. Timing Diagram for tDDKHMH

Figure 5 shows the DDR2 and DDR3 SDRAM Interface output timing diagram.

Figure 5. DDR2 and DDR3 SDRAM Interface Output Timing Diagram

MDQS

MCK[n]

tMCK

tDDKHMHmax) = 0.6 ns or 0.375 ns

tDDKHMH(min) = –0.6 ns or -0.375 ns

MDQS

ADDR/CMD

tDDKHAS ,tDDKHCS

tDDKHMH

tDDKLDS

tDDKHDS

MDQ[x]

MDQS[n]

MCK[n]

MCK[n] tMCK

tDDKLDX

tDDKHDX

D1D0

tDDKHAX ,tDDKHCX

Write A0 NOOP

tDDKHME

tDDKHMP

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

26 Freescale Semiconductor

DDR2 and DDR3 SDRAM Controller

Figure 6 provides the AC test load for the DDR2 and DDR3 Controller bus.

Figure 6. DDR2 and DDR3 Controller bus AC Test Load

6.2.3 DDR2 and DDR3 SDRAM Differential Timing Specifications

This section describes the DC and AC differential electrical specifications for the DDR2 and DDR3

SDRAM controller interface of the MPC8572E.

NOTE

VID specifies the input differential voltage |VTR -VCP| required for

switching, where VTR is the true input signal (such as MCK or MDQS) and

VCP is the complementary input signal (such as MCK or MDQS).

Table 19 provides the differential specifications for the MPC8572E differential signals MDQS/MDQS and

MCK/MCK when in DDR2 mode.

Table 19. DDR2 SDRAM Differential Electrical Characteristics

Parameter/Condition Symbol Min Max Unit Notes

DC Input Signal Voltage VIN –0.3 GVDD + 0.3 V —

DC Differential Input Voltage VID ——mV—

AC Differential Input Voltage VIDAC ——mV—

DC Differential Output Voltage VOH ——mV—

AC Differential Output Voltage VOHAC JEDEC: 0.5 JEDEC: GVDD + 0.6 V —

AC Differential Cross-point Voltage VIXAC ——mV—

Input Midpoint Voltage VMP ——mV—

Output Z0 = 50 Ω

RL = 50 Ω

GVDD/2

VTR

VCP

GND

GVDD

VMP

VID or VOD

VIX or VOX

VIN

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 27

DUART

Table 20 provides the differential specifications for the MPC8572E differential signals MDQS/MDQS and

MCK/MCK when in DDR3 mode.

7DUART

This section describes the DC and AC electrical specifications for the DUART interface of the

MPC8572E.

7.1 DUART DC Electrical Characteristics

Table 21 provides the DC electrical characteristics for the DUART interface.

Table 20. DDR3 SDRAM Differential Electrical Characteristics

Parameter/Condition Symbol Min Max Unit Notes

DC Input Signal Voltage VIN ——mV—

DC Differential Input Voltage VID ——mV—

AC Differential Input Voltage VIDAC ——mV—

DC Differential Output Voltage VOH ——mV—

AC Differential Output Voltage VOHAC ——mV—

AC Differential Cross-point Voltage VIXAC ——mV—

Input Midpoint Voltage VMP ——mV—

Table 21. DUART DC Electrical Characteristics

Parameter Symbol Min Max Unit

Supply voltage (3.3 V) OVDD 3.13 3.47 V

High-level input voltage VIH 2OV

DD + 0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current

(VIN 1 = 0 V or VIN = VDD)

IIN —±5 μA

High-level output voltage

(OVDD = min, IOH = –2 mA)

VOH 2.4 — V

Low-level output voltage

(OVDD = min, IOL = 2 mA)

VOL —0.4 V

Note:

1. The symbol VIN, in this case, represents the OVIN symbol referenced in Ta b l e 1 .

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

7.2 DUART AC Electrical Specifications

Table 22 provides the AC timing parameters for the DUART interface.

8 Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

This section provides the AC and DC electrical characteristics for the enhanced three-speed Ethernet

controller.

8.1 Enhanced Three-Speed Ethernet Controller (eTSEC)

(10/100/1000 Mbps)—FIFO/GMII/MII/TBI/RGMII/RTBI/RMII

Electrical Characteristics

The electrical characteristics specified here apply to all FIFO mode, gigabit media independent interface

(GMII), media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent

interface (RGMII), reduced ten-bit interface (RTBI), and reduced media independent interface (RMII)

signals except management data input/output (MDIO) and management data clock (MDC), and serial

gigabit media independent interface (SGMII). The RGMII, RTBI and FIFO mode interfaces are defined

for 2.5 V, while the GMII, MII, RMII, and TBI interfaces can operate at both 2.5 V and 3.3V .

The GMII, MII, or TBI interface timing is compliant with IEEE 802.3. The RGMII and RTBI interfaces

follow the Reduced Gigabit Media-Independent Interface (RGMII) Specification Version 1.3

(12/10/2000). The RMII interface follows the RMII Consortium RMII Specification Version 1.2

(3/20/1998).

The electrical characteristics for MDIO and MDC are specified in Section 9, “Ethernet Management

Interface Electrical Characteristics.”

The electrical characteristics for SGMII is specified in Section 8.3, “SGMII Interface Electrical

Characteristics.” The SGMII interface conforms (with exceptions) to the Serial-GMII Specification

Version 1.8.

Table 22. DUART AC Timing Specifications

At recommended operating conditions with OVDD of 3.3V ± 5%.

Parameter Value Unit Notes

Minimum baud rate fCCB/1,048,576 baud 1, 2

Maximum baud rate fCCB/16 baud 1, 2, 3

Oversample rate 16 — 1, 4

Notes:

1. Guaranteed by design

2. fCCB refers to the internal platform clock frequency.

3. Actual attainable baud rate is limited by the latency of interrupt processing.

4. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are

sampled each 16th sample.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 29

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

The Fast Ethernet Controller (FEC) operates in MII mode only, and complies with the AC and DC

electrical characteristics specified in this chapter for MII. Note that if FEC is used, eTSEC 3 and 4 are only

available in SGMII mode.

8.1.1 eTSEC DC Electrical Characteristics

All MII, GMII, RMII, and TBI drivers and receivers comply with the DC parametric attributes specified

in Table 23 and Table 24. All RGMII, RTBI and FIFO drivers and receivers comply with the DC

parametric attributes specified in Table 24. The RGMII and RTBI signals are based on a 2.5-V CMOS

interface voltage as defined by JEDEC EIA/JESD8-5.

Table 23. GMII, MII, RMII, and TBI DC Electrical Characteristics

Parameter Symbol Min Max Unit Notes

Supply voltage 3.3 V LVDD

TVDD

3.13 3.47 V 1, 2

1LVDD supports eTSECs 1 and 2.

2TVDD supports eTSECs 3 and 4 or FEC.

Output high voltage

(LVDD/TVDD = Min, IOH = –4.0 mA)

VOH 2.40 LVDD/TVDD + 0.3 V —

Output low voltage

(LVDD/TVDD = Min, IOL = 4.0 mA)

VOL GND 0.50 V —

Input high voltage VIH 2.0 LVDD/TVDD + 0.3 V —

Input low voltage VIL –0.3 0.90 V —

Input high current

(VIN = LVDD, VIN = TVDD)

IIH —40 μA1, 2,3

3The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Ta b l e 1 .

Input low current

(VIN = GND)

IIL –600 — μA3

Notes:

Table 24. MII, GMII, RMII, RGMII, TBI, RTBI, and FIFO DC Electrical Characteristics

Parameters Symbol Min Max Unit Notes

Supply voltage 2.5 V LVDD/TVDD 2.37 2.63 V 1,2

Output high voltage

(LVDD/TVDD = Min, IOH = –1.0 mA)

VOH 2.00 LVDD/TVDD + 0.3 V —

Output low voltage

(LVDD/TVDD = Min, IOL = 1.0 mA)

VOL GND – 0.3 0.40 V —

Input high voltage VIH 1.70 LVDD/TVDD + 0.3 V —

Input low voltage VIL –0.3 0.70 V —

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

8.2 FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing

Specifications

The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII and RTBI are presented in this

section.

8.2.1 FIFO AC Specifications

The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI

specifications, because they have similar performance and are described in a source-synchronous fashion

like FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and

source clock in GMII fashion.

When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the

relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,

while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit

clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back on

the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is intended

that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a source-

synchronous timing reference. Typically, the clock edge that launched the data can be used, because the

clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is a

relationship between the maximum FIFO speed and the platform (CCB) frequency. For more information

see Section 4.5, “Platform to eTSEC FIFO Restrictions.”

Table 25 and Table 26 summarize the FIFO AC specifications.

Input high current

(VIN = LVDD, VIN = TVDD)

IIH —10μA1, 2,3

Input low current

(VIN = GND)

IIL –15 — μA3

Note:

1LVDD supports eTSECs 1 and 2.

2TVDD supports eTSECs 3 and 4 or FEC.

3Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Ta bl e 1 .

Table 25. FIFO Mode Transmit AC Timing Specification

At recommended operating conditions with LVDD/TVDD of 2.5V ± 5%

Parameter/Condition Symbol Min Typ Max Unit

TX_CLK, GTX_CLK clock period1 t

FIT 5.3 8.0 100 ns

TX_CLK, GTX_CLK duty cycle tFITH/tFIT 45 50 55 %

TX_CLK, GTX_CLK peak-to-peak jitter tFITJ — — 250 ps

Table 24. MII, GMII, RMII, RGMII, TBI, RTBI, and FIFO DC Electrical Characteristics (continued)

Parameters Symbol Min Max Unit Notes

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 7 and Figure 8 show the FIFO timing diagrams.

Figure 7. FIFO Transmit AC Timing Diagram

Rise time TX_CLK (20%–80%) tFITR — — 0.75 ns

Fall time TX_CLK (80%–20%) tFITF — — 0.75 ns

FIFO data TXD[7:0], TX_ER, TX_EN setup time to GTX_CLK tFITDV 2.0 — — ns

GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN hold time tFITDX 0.5 — 3.0 ns

Notes:

1. The minimum cycle period (or maximum frequency) of the TX_CLK is dependent on the maximum platform frequency of the

speed bins the part belongs to as well as the FIFO mode under operation. Refer to Section 4.5, “Platform to eTSEC FIFO

Restrictions,” for more detailed description.

Table 26. FIFO Mode Receive AC Timing Specification

At recommended operating conditions with LVDD/TVDD of 2.5V ± 5%

Parameter/Condition Symbol Min Typ Max Unit

RX_CLK clock period1tFIR 5.3 8.0 100 ns

RX_CLK duty cycle tFIRH/tFIR 45 50 55 %

RX_CLK peak-to-peak jitter tFIRJ — — 250 ps

Rise time RX_CLK (20%–80%) tFIRR — — 0.75 ns

Fall time RX_CLK (80%–20%) tFIRF — — 0.75 ns

RXD[7:0], RX_DV, RX_ER setup time to RX_CLK tFIRDV 1.5 — — ns

RXD[7:0], RX_DV, RX_ER hold time to RX_CLK tFIRDX 0.5 — — ns

1. The minimum cycle period (or maximum frequency) of the RX_CLK is dependent on the maximum platform frequency of the

speed bins the part belongs to as well as the FIFO mode under operation. Refer to Section 4.5, “Platform to eTSEC FIFO

Restrictions,” for more detailed description.

Table 25. FIFO Mode Transmit AC Timing Specification (continued)

At recommended operating conditions with LVDD/TVDD of 2.5V ± 5%

Parameter/Condition Symbol Min Typ Max Unit

tFIT

tFITH

tFITF

tFITDX

TXD[7:0]

TX_EN

GTX_CLK

TX_ER

tFITDV

tFITR

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 8. FIFO Receive AC Timing Diagram

8.2.2 GMII AC Timing Specifications

This section describes the GMII transmit and receive AC timing specifications.

8.2.2.1 GMII Transmit AC Timing Specifications

Table 27 provides the GMII transmit AC timing specifications.

Table 27. GMII Transmit AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

GMII data TXD[7:0], TX_ER, TX_EN setup time tGTKHDV 2.5 — — ns

GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay tGTKHDX 0.5 — 5.0 ns

GTX_CLK data clock rise time (20%-80%) tGTXR2——1.0ns

GTX_CLK data clock fall time (80%-20%) tGTXF2——1.0ns

Notes:

1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII

transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input

signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect

to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold

time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a

particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times,

the latter convention is used with the appropriate letter: R (rise) or F (fall).

2. Guaranteed by design.

tFIR

tFIRH tFIRF

tFIRR

RX_CLK

RXD[7:0]

RX_DV

RX_ER

valid data

tFIRDX

tFIRDV

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 9 shows the GMII transmit AC timing diagram.

Figure 9. GMII Transmit AC Timing Diagram

8.2.2.2 GMII Receive AC Timing Specifications

Table 28 provides the GMII receive AC timing specifications.

Figure 10 provides the AC test load for eTSEC.

Figure 10. eTSEC AC Test Load

Table 28. GMII Receive AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

RX_CLK clock period tGRX —8.0— ns

RX_CLK duty cycle tGRXH/tGRX 40 — 60 ns

RXD[7:0], RX_DV, RX_ER setup time to RX_CLK tGRDVKH 2.0 — — ns

RXD[7:0], RX_DV, RX_ER hold time to RX_CLK tGRDXKH 0——ns

RX_CLK clock rise (20%-80%) tGRXR2——1.0ns

RX_CLK clock fall time (80%-20%) tGRXF2——1.0ns

Note:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII

receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock

reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to

the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time.

Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular

functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter

convention is used with the appropriate letter: R (rise) or F (fall).

2. Guaranteed by design.

GTX_CLK

TXD[7:0]

tGTKHDX

tGTX

tGTXH

tGTXR

tGTXF

tGTKHDV

TX_EN

TX_ER

Output LVDD/2

RL = 50 Ω

Z0 = 50 Ω

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 11 shows the GMII receive AC timing diagram.

Figure 11. GMII Receive AC Timing Diagram

8.2.3 MII AC Timing Specifications

This section describes the MII transmit and receive AC timing specifications.

8.2.3.1 MII Transmit AC Timing Specifications

Table 29 provides the MII transmit AC timing specifications.

Table 29. MII Transmit AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

TX_CLK clock period 10 Mbps tMTX2—400— ns

TX_CLK clock period 100 Mbps tMTX —40—ns

TX_CLK duty cycle tMTXH/tMTX 35 — 65 %

TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay tMTKHDX 1515ns

TX_CLK data clock rise (20%-80%) tMTXR21.0 — 4.0 ns

TX_CLK data clock fall (80%-20%) tMTXF21.0 — 4.0 ns

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII

transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in

general, the clock reference symbol representation is based on two to three letters representing the clock of a particular

functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter

convention is used with the appropriate letter: R (rise) or F (fall).

2. Guaranteed by design.

RX_CLK

RXD[7:0]

tGRDXKH

tGRX

tGRXH

tGRXR

tGRXF

tGRDVKH

RX_DV

RX_ER

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 12 shows the MII transmit AC timing diagram.

Figure 12. MII Transmit AC Timing Diagram

8.2.3.2 MII Receive AC Timing Specifications

Table 30 provides the MII receive AC timing specifications.

Figure 13 provides the AC test load for eTSEC.

Figure 13. eTSEC AC Test Load

Table 30. MII Receive AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

RX_CLK clock period 10 Mbps tMRX2— 400 — ns

RX_CLK clock period 100 Mbps tMRX —40—ns

RX_CLK duty cycle tMRXH/tMRX 35 — 65 %

RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns

RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns

RX_CLK clock rise (20%-80%) tMRXR21.0 — 4.0 ns

RX_CLK clock fall time (80%-20%) tMRXF21.0 — 4.0 ns

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive

timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)

going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input

signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,

the clock reference symbol representation is based on three letters representing the clock of a particular functional. For

example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used

with the appropriate letter: R (rise) or F (fall).

2. Guaranteed by design.

TX_CLK

TXD[3:0]

tMTKHDX

tMTX

tMTXH

tMTXR

tMTXF

TX_EN

TX_ER

Output Z0 = 50 ΩLVDD/2

RL = 50 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 14 shows the MII receive AC timing diagram.

Figure 14. MII Receive AC Timing Diagram

8.2.4 TBI AC Timing Specifications

This section describes the TBI transmit and receive AC timing specifications.

8.2.4.1 TBI Transmit AC Timing Specifications

Table 31 provides the TBI transmit AC timing specifications.

Table 31. TBI Transmit AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

TCG[9:0] setup time GTX_CLK going high tTTKHDV 2.0 — — ns

TCG[9:0] hold time from GTX_CLK going high tTTKHDX 1.0 — — ns

GTX_CLK rise (20%–80%) tTTXR2——1.0ns

GTX_CLK fall time (80%–20%) tTTXF2——1.0ns

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state

)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,

tTTKHDV symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the

referenced data signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing

(TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state

(X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters

representing the clock of a particular functional. For example, the subscript of tTTX represents the TBI (T) transmit

(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).

2. Guaranteed by design.

RX_CLK

RXD[3:0]

tMRDXKL

tMRX

tMRXH

tMRXR

tMRXF

RX_DV

RX_ER

tMRDVKH

Valid Data

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 37

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 15 shows the TBI transmit AC timing diagram.

Figure 15. TBI Transmit AC Timing Diagram

8.2.4.2 TBI Receive AC Timing Specifications

Table 32 provides the TBI receive AC timing specifications.

Table 32. TBI Receive AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition 3Symbol 1Min Typ Max Unit

Clock period for TBI Receive Clock 0, 1 tTRX — 16.0 — ns

Skew for TBI Receive Clock 0, 1 tSKTRX 7.5 — 8.5 ns

Duty cycle for TBI Receive Clock 0, 1 tTRXH/tTRX 40 — 60 %

RCG[9:0] setup time to rising edge of TBI Receive Clock 0, 1 tTRDVKH 2.5 — — ns

RCG[9:0] hold time to rising edge of TBI Receive Clock 0, 1 tTRDXKH 1.5 — — ns

Clock rise time (20%-80%) for TBI Receive Clock 0, 1 tTRXR20.7 — 2.4 ns

Clock fall time (80%-20%) for TBI Receive Clock 0, 1 tTRXF20.7 — 2.4 ns

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH symbolizes TBI receive

timing (TR) with respect to the time data input signals (D) reach the valid state (V) relative to the tTRX clock reference (K) going

to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with respect to the time data input signals

(D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state. Note that, in general, the clock reference

symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of

tTRX represents the TBI (T) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:

R (rise) or F (fall). For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (TRX).

2. Guaranteed by design.

3. The signals “TBI Receive Clock 0” and “TBI Receive Clock 1” refer to TSECn_RX_CLK and TSECn_TX_CLK pins respectively.

These two clock signals are also referred as PMA_RX_CLK[0:1].

GTX_CLK

TCG[9:0]

tTTXR

tTTX

tTTXH

tTTXR

tTTXF

tTTKHDV

tTTKHDX

tTTXF

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 16 shows the TBI receive AC timing diagram.

Figure 16. TBI Receive AC Timing Diagram

8.2.5 TBI Single-Clock Mode AC Specifications

When the eTSEC is configured for TBI modes, all clocks are supplied from external sources to the relevant

eTSEC interface. In single-clock TBI mode, when a 125-MHz TBI receive clock is supplied on TSECn

pin (no receive clock is used in this mode, whereas for the dual-clock mode this is the PMA1 receive

clock). The 125-MHz transmit clock is applied in all TBI modes.

A summary of the single-clock TBI mode AC specifications for receive appears in Table 33.

Table 33. TBI single-clock Mode Receive AC Timing Specification

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol Min Typ Max Unit

RX_CLK clock period tTRRX 7.5 8.0 8.5 ns

RX_CLK duty cycle tTRRH/tTRRX 40 50 60 %

RX_CLK peak-to-peak jitter tTRRJ ——250ps

Rise time RX_CLK (20%–80%) tTRRR ——1.0ns

Fall time RX_CLK (80%–20%) tTRRF ——1.0ns

RCG[9:0] setup time to RX_CLK rising edge tTRRDVKH 2.0 — — ns

RCG[9:0] hold time to RX_CLK rising edge tTRRDXKH 1.0 — — ns

TBI Receive Clock 1

RCG[9:0]

tTRX

tTRXH

tTRXR

tTRXF

tTRDVKH

TBI Receive Clock 0

tTRDXKH

tTRDVKH

tTRDXKH

tSKTRX

tTRXH

Valid Data Valid Data

(TSECn_TX_CLK)

(TSECn_RX_CLK)

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 17 shows the TBI receive the timing diagram.

Figure 17. TBI Single-Clock Mode Receive AC Timing Diagram

8.2.6 RGMII and RTBI AC Timing Specifications

Table 34 presents the RGMII and RTBI AC timing specifications.

Table 34. RGMII and RTBI AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

Data to clock output skew (at transmitter) tSKRGT –500 0 500 ps

Data to clock input skew (at receiver) 2tSKRGT 1.0 — 2.8 ns

Clock period 3tRGT 7.2 8.0 8.8 ns

Duty cycle for 10BASE-T and 100BASE-TX 3, 4 tRGTH/tRGT 40 50 60 %

Rise time (20%–80%) tRGTR — — 0.75 ns

Fall time (20%–80%) tRGTF — — 0.75 ns

Notes:

1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent

RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the

notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the

subscript is skew (SK) followed by the clock that is being skewed (RGT).

2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns will

be added to the associated clock signal.

3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.

4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long

as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned

between.

tTRR

tTRRH tTRRF

tTRRR

RX_CLK

RCG[9:0]

valid data

tTRRDX

tTRRDV

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Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 18 shows the RGMII and RTBI AC timing and multiplexing diagrams.

Figure 18. RGMII and RTBI AC Timing and Multiplexing Diagrams

8.2.7 RMII AC Timing Specifications

This section describes the RMII transmit and receive AC timing specifications.

8.2.7.1 RMII Transmit AC Timing Specifications

Table 35 shows the RMII transmit AC timing specifications.

Table 35. RMII Transmit AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

TSECn_TX_CLK clock period tRMT 15.0 20.0 25.0 ns

TSECn_TX_CLK duty cycle tRMTH 35 50 65 %

TSECn_TX_CLK peak-to-peak jitter tRMTJ — — 250 ps

Rise time TSECn_TX_CLK (20%–80%) tRMTR 1.0 — 2.0 ns

Fall time TSECn_TX_CLK (80%–20%) tRMTF 1.0 — 2.0 ns

GTX_CLK

tRGT

tRGTH

tSKRGT

TX_CTL

TXD[8:5]

TXD[7:4]

TXD[9]

TXERR

TXD[4]

TXEN

TXD[3:0]

(At Transmitter)

TXD[8:5][3:0]

TXD[7:4][3:0]

TX_CLK

(At PHY)

RX_CTL

RXD[8:5]

RXD[7:4]

RXD[9]

RXERR

RXD[4]

RXDV

RXD[3:0]

RXD[8:5][3:0]

RXD[7:4][3:0]

RX_CLK

(At PHY)

tSKRGT

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 41

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 19 shows the RMII transmit AC timing diagram.

Figure 19. RMII Transmit AC Timing Diagram

8.2.7.2 RMII Receive AC Timing Specifications

Table 36 shows the RMII receive AC timing specifications.

TSECn_TX_CLK to RMII data TXD[1:0], TX_EN delay tRMTDX 1.0 — 10.0 ns

Note:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII

transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in

general, the clock reference symbol representation is based on two to three letters representing the clock of a particular

functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter

convention is used with the appropriate letter: R (rise) or F (fall).

Table 36. RMII Receive AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

TSECn_TX_CLK clock period tRMR 15.0 20.0 25.0 ns

TSECn_TX_CLK duty cycle tRMRH 35 50 65 %

TSECn_TX_CLK peak-to-peak jitter tRMRJ ——250ps

Rise time TSECn_TX_CLK (20%–80%) tRMRR 1.0 — 2.0 ns

Fall time TSECn_TX_CLK (80%–20%) tRMRF 1.0 — 2.0 ns

RXD[1:0], CRS_DV, RX_ER setup time to

TSECn_TX_CLK rising edge

tRMRDV 4.0 — — ns

Table 35. RMII Transmit AC Timing Specifications (continued)

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

TSECn_TX_CLK

TXD[1:0]

tRMTDX

tRMT

tRMTH

tRMTR

tRMTF

TX_EN

TX_ER

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

42 Freescale Semiconductor

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 20 provides the AC test load for eTSEC.

Figure 20. eTSEC AC Test Load

Figure 21 shows the RMII receive AC timing diagram.

Figure 21. RMII Receive AC Timing Diagram

8.3 SGMII Interface Electrical Characteristics

Each SGMII port features a 4-wire AC-Coupled serial link from the dedicated SerDes 2 interface of

MPC8572E as shown in Figure 22, where CTX is the external (on board) AC-Coupled capacitor. Each

output pin of the SerDes transmitter differential pair features 50-Ω output impedance. Each input of the

SerDes receiver differential pair features 50-Ω on-die termination to SGND_SRDS2 (xcorevss). The

reference circuit of the SerDes transmitter and receiver is shown in Figure 54.

When an eTSEC port is configured to operate in SGMII mode, the parallel interface’s output signals of

this eTSEC port can be left floating. The input signals should be terminated based on the guidelines

described in Section 21.5, “Connection Recommendations,” as long as such termination does not violate

the desired POR configuration requirement on these pins, if applicable.

RXD[1:0], CRS_DV, RX_ER hold time to

TSECn_TX_CLK rising edge

tRMRDX 2.0 — — ns

Note:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive

timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)

going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input

signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,

the clock reference symbol representation is based on three letters representing the clock of a particular functional. For

example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used

with the appropriate letter: R (rise) or F (fall).

Table 36. RMII Receive AC Timing Specifications (continued)

At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit

Output Z0 = 50 ΩLVDD/2

RL = 50 Ω

TSECn_TX_CLK

RXD[1:0]

tRMRDX

tRMR

tRMRH

tRMRR

tRMRF

CRS_DV

RX_ER

tRMRDV

Valid Data

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 43

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

When operating in SGMII mode, the eTSEC EC_GTX_CLK125 clock is not required for this port. Instead,

SerDes reference clock is required on SD2_REF_CLK and SD2_REF_CLK pins.

8.3.1 DC Requirements for SGMII SD2_REF_CLK and SD2_REF_CLK

The characteristics and DC requirements of the separate SerDes reference clock are described in

Section 15, “High-Speed Serial Interfaces (HSSI).”

8.3.2 AC Requirements for SGMII SD2_REF_CLK and SD2_REF_CLK

Table 37 lists the SGMII SerDes reference clock AC requirements. Note that SD2_REF_CLK and

SD2_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock

source.

Table 37. SD2_REF_CLK and SD2_REF_CLK AC Requirements

Symbol Parameter Description Min Typical Max Units Notes

tREF REFCLK cycle time — 10 (8) — ns 1

tREFCJ REFCLK cycle-to-cycle jitter. Difference in the period of any two

adjacent REFCLK cycles

——100ps —

tREFPJ Phase jitter. Deviation in edge location with respect to mean edge

location

–50 — 50 ps —

Note:

1. 8 ns applies only when 125 MHz SerDes2 reference clock frequency is selected through cfg_srds_sgmii_refclk during POR.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

44 Freescale Semiconductor

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

8.3.3 SGMII Transmitter and Receiver DC Electrical Characteristics

Table 38 and Table 39 describe the SGMII SerDes transmitter and receiver AC-Coupled DC electrical

characteristics. Transmitter DC characteristics are measured at the transmitter outputs (SD2_TX[n] and

SD2_TX[n]) as depicted in Figure 23.

Table 38. SGMII DC Transmitter Electrical Characteristics

Parameter Symbol Min Typ Max Unit Notes

Supply Voltage XVDD_SRDS2 1.045 1.1 1.155 V —

Output high voltage VOH — — XVDD_SRDS2-Typ/2

+ |VOD|-max/2

mV 1

Output low voltage VOL XVDD_SRDS2-Typ/2

- |VOD|-max/2

——mV1

Output ringing VRING ——10%—

Output differential voltage2, 3, 5

|VOD|

359 550 791

Equalization

setting: 1.0x

329 505 725 Equalization

setting: 1.09x

299 458 659 Equalization

setting: 1.2x

270 414 594 Equalization

setting: 1.33x

239 367 527 Equalization

setting: 1.5x

210 322 462 Equalization

setting: 1.71x

180 275 395 Equalization

setting: 2.0x

Output offset voltage VOS 473 550 628 mV 1, 4

Output impedance (single-ended) RO40 — 60 Ω—

Mismatch in a pair RO——10%—

Change in VOD between “0” and “1” |VOD|— — 25mV—

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 45

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 22. 4-Wire AC-Coupled SGMII Serial Link Connection Example

Change in VOS between “0” and “1” VOS ——25mV—

Output current on short to GND ISA, ISB ——40mA—

Note:

1. This will not align to DC-coupled SGMII. XVDD_SRDS2-Typ=1.1 V.

2. |VOD| = |VSD2_TXn - VSD2_TXn|. |VOD| is also referred as output differential peak voltage. VTX-DIFFp-p = 2*|VOD|.

3. The |VOD| value shown in the table assumes the following transmit equalization setting in the XMITEQAB (for SerDes 2 lanes

A & B) or XMITEQEF (for SerDes 2 lanes E & E) bit field of MPC8572E’s SerDes 2 Control Register:

•The MSbit (bit 0) of the above bit field is set to zero (selecting the full VDD-DIFF-p-p amplitude - power up default);

•The LSbits (bit [1:3]) of the above bit field is set based on the equalization setting shown in table.

4. VOS is also referred to as output common mode voltage.

•5.The |VOD| value shown in the Typ column is based on the condition of XVDD_SRDS2-Typ=1.1V, no common mode offset

variation (VOS =550mV), SerDes2 transmitter is terminated with 100-Ω differential load between SD2_TX[n] and

SD2_TX[n].

Table 38. SGMII DC Transmitter Electrical Characteristics (continued)

Parameter Symbol Min Typ Max Unit Notes

MPC8572E SGMII

SerDes Interface

50 Ω

Transmitter

SD2_TXn SD_RXm

SD2_TXnSD_RXm

Receiver

CTX

50 Ω

SD2_RXn

Receiver Transmitter

SD_TXm

CTX

50 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

46 Freescale Semiconductor

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 23. SGMII Transmitter DC Measurement Circuit

Table 39 lists the SGMII DC receiver electrical characteristics.

Table 39. SGMII DC Receiver Electrical Characteristics

Parameter Symbol Min Typ Max Unit Notes

Supply Voltage XVDD_SRDS2 1.045 1.1 1.155 V —

DC Input voltage range — N/A — 1

Input differential voltage LSTS = 0 VRX_DIFFp-p 100 — 1200 mV 2, 4

LSTS = 1 175 —

Loss of signal threshold LSTS = 0 VLOS 30 — 100 mV 3, 4

LSTS = 1 65 — 175

Input AC common mode voltage VCM_ACp-p — 100 mV 5

Receiver differential input impedance ZRX_DIFF 80 100 120 Ω—

Receiver common mode input

impedance

ZRX_CM 20 — 35 Ω—

Common mode input voltage VCM —V

xcorevss —V6

Note:

1. Input must be externally AC-coupled.

2. VRX_DIFFp-p is also referred to as peak to peak input differential voltage

3. The concept of this parameter is equivalent to the Electrical Idle Detect Threshold parameter in PCI Express. Refer to

PCI Express Differential Receiver (RX) Input Specifications section for further explanation.

4. The LSTS shown in the table refers to the LSTSAB or LSTSEF bit field of MPC8572E’s SerDes 2 Control Register.

5. VCM_ACp-p is also referred to as peak to peak AC common mode voltage.

6. On-chip termination to SGND_SRDS2 (xcorevss).

Transmitter

SD2_TXn

SD2_TXn50

Vos VOD

MPC8572E SGMII

SerDes Interface

50 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 47

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

8.3.4 SGMII AC Timing Specifications

This section describes the SGMII transmit and receive AC timing specifications. Transmitter and receiver

characteristics are measured at the transmitter outputs (SD2_TX[n] and SD2_TX[n]) or at the receiver

inputs (SD2_RX[n] and SD2_RX[n]) as depicted in Figure 25, respectively.

8.3.4.1 SGMII Transmit AC Timing Specifications

Table 40 provides the SGMII transmit AC timing targets. A source synchronous clock is not provided.

8.3.4.2 SGMII Receive AC Timing Specifications

Table 41 provides the SGMII receive AC timing specifications. Source synchronous clocking is not

supported. Clock is recovered from the data. Figure 24 shows the SGMII receiver input compliance mask

eye diagram.

Table 40. SGMII Transmit AC Timing Specifications

At recommended operating conditions with XVDD_SRDS2 = 1.1V ± 5%.

Parameter Symbol Min Typ Max Unit Notes

Deterministic Jitter JD — — 0.17 UI p-p —

Total Jitter JT — — 0.35 UI p-p —

Unit Interval UI 799.92 800 800.08 ps 1

VOD fall time (80%-20%) tfall 50 — 120 ps —

VOD rise time (20%-80%) trise 50 — 120 ps —

Notes:

1. Each UI is 800 ps ± 100 ppm.

Table 41. SGMII Receive AC Timing Specifications

At recommended operating conditions with XVDD_SRDS2 = 1.1V ± 5%.

Parameter Symbol Min Typ Max Unit Notes

Deterministic Jitter Tolerance JD 0.37 — — UI p-p 1

Combined Deterministic and Random Jitter Tolerance JDR 0.55 — — UI p-p 1

Sinusoidal Jitter Tolerance JSIN 0.1 — — UI p-p 1

Total Jitter Tolerance JT 0.65 — — UI p-p 1

Bit Error Ratio BER — — 10-12 ——

Unit Interval UI 799.92 800 800.08 ps 2

AC Coupling Capacitor CTX 5—200nF3

Notes:

1. Measured at receiver.

2. Each UI is 800 ps ± 100 ppm.

3. The external AC coupling capacitor is required. It is recommended to be placed near the device transmitter outputs.

4. See RapidIO 1x/4x LP Serial Physical Layer Specification for interpretation of jitter specifications.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

48 Freescale Semiconductor

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

Figure 24. SGMII Receiver Input Compliance Mask

Figure 25. SGMII AC Test/Measurement Load

Time (UI)

Receiver Differential Input Voltage

0.275 0.4 0.6 0.725

− VRX_DIFFp-p-min/2

VRX_DIFFp-p-min/2

− VRX_DIFFp-p-max/2

VRX_DIFFp-p-max/2

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 49

Ethernet: Enhanced Three-Speed Ethernet (eTSEC)

8.4 eTSEC IEEE Std 1588™ AC Specifications

Figure 26 shows the data and command output timing diagram.

Figure 26. eTSEC IEEE 1588 Output AC Timing

1The output delay is count starting rising edge if tT1588CLKOUT is non-inverting. Otherwise, it is count starting falling edge.

Figure 27 shows the data and command input timing diagram.

Figure 27. eTSEC IEEE 1588 Input AC timing

Table 42 provides the IEEE 1588 AC timing specifications.

Table 42. eTSEC IEEE 1588 AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 3.3 V ± 5% or 2.5 V ± 5%

Parameter/Condition Symbol Min Typ Max Unit Note

TSEC_1588_CLK clock period tT1588CLK 3.3 — TTX_CLK*9 ns 1

TSEC_1588_CLK duty cycle tT1588CLKH

/tT1588CLK

40 50 60 % —

TSEC_1588_CLK peak-to-peak jitter tT1588CLKINJ ——250ps—

Rise time eTSEC_1588_CLK (20%–80%) tT1588CLKINR 1.0 — 2.0 ns —

Fall time eTSEC_1588_CLK (80%–20%) tT1588CLKINF 1.0 — 2.0 ns —

TSEC_1588_CLK_OUT clock period tT1588CLKOUT 2*tT1588CLK ——ns—

TSEC_1588_CLK_OUT

TSEC_1588_PULSE_OUT

TSEC_1588_TRIG_OUT

tT1588OV

tT1588CLKOUT

tT1588CLKOUTH

TSEC_1588_CLK

TSEC_1588_TRIG_IN

tT1588TRIGH

tT1588CLK

tT1588CLKH

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

50 Freescale Semiconductor

Ethernet Management Interface Electrical Characteristics

9 Ethernet Management Interface Electrical

Characteristics

The electrical characteristics specified here apply to MII management interface signals ECn_MDIO

(management data input/output) and ECn_MDC (management data clock). The electrical characteristics

for GMII, SGMII, RGMII, RMII, TBI and RTBI are specified in “Section 8, “Ethernet: Enhanced

Three-Speed Ethernet (eTSEC).”

9.1 MII Management DC Electrical Characteristics

The ECn_MDC and ECn_MDIO are defined to operate at a supply voltage of 3.3 V or 2.5 V. The DC

electrical characteristics for ECn_MDIO and ECn_MDC are provided in Table 43 and Table 44.

TSEC_1588_CLK_OUT duty cycle tT1588CLKOTH

/tT1588CLKOUT

30 50 70 % —

TSEC_1588_PULSE_OUT tT1588OV 0.5 — 3.0 ns —

TSEC_1588_TRIG_IN pulse width tT1588TRIGH 2*tT1588CLK_MAX ——ns2

Note:

1.When TMR_CTRL[CKSEL] is set as ‘00’, the external TSEC_1588_CLK input is selected as the 1588 timer reference clock

source, with the timing defined in Ta b l e 4 2 , “eTSEC IEEE 1588 AC Timing Specifications.” The maximum value of tT1588CLK

is defined in terms of TTX_CLK, that is the maximum clock cycle period of the equivalent interface speed that the eTSEC1

port is running at. When eTSEC1 is configured to operate in the parallel mode, the TTX_CLK is the maximum clock period

of the TSEC1_TX_CLK. When eTSEC1 operates in SGMII mode, the maximum value of tT1588CLK is defined in terms of

the recovered clock from SGMII SerDes. For example, for SGMII 10/100/1000 Mbps modes, the maximum value of

tT1588CLK is 3600, 360, 72 ns respectively. See the MPC8572E PowerQUICC™ III Integrated Communications Processor

Reference Manual for detailed description of TMR_CTRL registers.

2. It needs to be at least two times of the clock period of the clock selected by TMR_CTRL[CKSEL].

Table 43. MII Management DC Electrical Characteristics (LVDD/TVDD=3.3 V)

Parameter Symbol Min Max Unit Notes

Supply voltage (3.3 V) LVDD/TVDD 3.13 3.47 V 1, 2

Output high voltage

(LVDD/TVDD = Min, IOH = –1.0 mA)

VOH 2.10 OVDD + 0.3 V —

Output low voltage

(LVDD/TVDD =Min, IOL = 1.0 mA)

VOL GND 0.50 V —

Input high voltage VIH 2.0 — V —

Input low voltage VIL —0.90V—

Input high current

(LVDD/TVDD = Max, VIN 3 = 2.1 V)

IIH —40μA—

Table 42. eTSEC IEEE 1588 AC Timing Specifications (continued)

At recommended operating conditions with LVDD/TVDD of 3.3 V ± 5% or 2.5 V ± 5%

Parameter/Condition Symbol Min Typ Max Unit Note

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 51

Ethernet Management Interface Electrical Characteristics

9.2 MII Management AC Electrical Specifications

Table 45 provides the MII management AC timing specifications.There are three sets of Ethernet

management signals (EC1_MDC and EC1_MDIO, EC3_MDC and EC3_MDIO, EC5_MDC and

EC5_MDIO). These are not explicitly shown in the table or in the figure following.

Input low current

(LVDD/TVDD = Max, VIN = 0.5 V)

IIL –600 — μA—

Note:

1. EC1_MDC and EC1_MDIO operate on LVDD.

2. EC3_MDC & EC3_MDIO and EC5_MDC & EC5_MDIO operate on TVDD.

3. Note that the symbol VIN, in this case, represents the LVIN and TVIN symbol referenced in Ta b l e 1 .

Table 44. MII Management DC Electrical Characteristics (LVDD/TVDD=2.5 V)

Parameters Symbol Min Max Unit Notes

Supply voltage 2.5 V LVDD/TVDD 2.37 2.63 V 1,2

1EC1_MDC and EC1_MDIO operate on LVDD.

2EC3_MDC & EC3_MDIO and EC5_MDC & EC5_MDIO operate on TVDD.

Output high voltage

(LVDD/TVDD = Min, IOH = –1.0 mA)

VOH 2.00 LVDD/TVDD + 0.3 V —

Output low voltage

(LVDD/TVDD = Min, IOL = 1.0 mA)

VOL GND – 0.3 0.40 V —

Input high voltage VIH 1.70 LVDD/TVDD + 0.3 V —

Input low voltage VIL –0.3 0.70 V —

Input high current

(VIN = LVDD, VIN = TVDD)

IIH —10μA1, 2,3

3Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Ta bl e 1 .

Input low current

(VIN = GND)

IIL –15 — μA3

Note:

Table 45. MII Management AC Timing Specifications

At recommended operating conditions with LVDD/TVDD of 3.3 V ± 5% or 2.5 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit Notes

ECn_MDC frequency fMDC 0.9 2.5 9.3 MHz 2, 3

ECn_MDC period tMDC 107.5 — 1120 ns —

ECn_MDC clock pulse width high tMDCH 32 — — ns —

ECn_MDC to ECn_MDIO delay tMDKHDX 10 — 16*tplb_clk ns 5

ECn_MDIO to ECn_MDC setup time tMDDVKH 5——ns—

Table 43. MII Management DC Electrical Characteristics (LVDD/TVDD=3.3 V) (continued)

Parameter Symbol Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

52 Freescale Semiconductor

Ethernet Management Interface Electrical Characteristics

Figure 28 shows the MII management AC timing diagram.

Figure 28. MII Management Interface Timing Diagram

ECn_MDIO to ECn_MDC hold time tMDDXKH 0——ns—

ECn_MDC rise time tMDCR — — 10 ns 4

ECn_MDC fall time tMDHF — — 10 ns 4

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)

(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX

symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are

invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input

signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For

rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).

2. This parameter is dependent on the eTSEC system clock speed, which is half of the Platform Frequency (fCCB). The actual

ECn_MDC output clock frequency for a specific eTSEC port can be programmed by configuring the MgmtClk bit field of

MPC8572E’s MIIMCFG register, based on the platform (CCB) clock running for the device. The formula is: Platform

Frequency (CCB)/(2*Frequency Divider determined by MIICFG[MgmtClk] encoding selection). For example, if

MIICFG[MgmtClk] = 000 and the platform (CCB) is currently running at 533 MHz, fMDC = 533/(2*4*8) = 533/64 = 8.3 MHz.

That is, for a system running at a particular platform frequency (fCCB), the ECn_MDC output clock frequency can be

programmed between maximum fMDC = fCCB/64 and minimum fMDC = fCCB/448. Refer to MPC8572E reference manual’s

MIIMCFG register section for more detail.

3. The maximum ECn_MDC output clock frequency is defined based on the maximum platform frequency for MPC8572E

(600 MHz) divided by 64, while the minimum ECn_MDC output clock frequency is defined based on the minimum platform

frequency for MPC8572E (400 MHz) divided by 448, following the formula described in Note 2 above. The typical

ECn_MDC output clock frequency of 2.5 MHz is shown for reference purpose per IEEE 802.3 specification.

4. Guaranteed by design.

5. tplb_clk is the platform (CCB) clock.

Table 45. MII Management AC Timing Specifications (continued)

At recommended operating conditions with LVDD/TVDD of 3.3 V ± 5% or 2.5 V ± 5%.

Parameter/Condition Symbol 1Min Typ Max Unit Notes

ECn_MDC

tMDDXKH

tMDC

tMDCH

tMDCR

tMDCF

tMDDVKH

tMDKHDX

ECn_MDIO

(Input)

(Output)

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 53

Local Bus Controller (eLBC)

10 Local Bus Controller (eLBC)

This section describes the DC and AC electrical specifications for the local bus interface of the

MPC8572E.

10.1 Local Bus DC Electrical Characteristics

Table 46 provides the DC electrical characteristics for the local bus interface operating at BVDD = 3.3 V

DC.

Table 47 provides the DC electrical characteristics for the local bus interface operating at BVDD = 2.5 V

DC.

Table 46. Local Bus DC Electrical Characteristics (3.3 V DC)

Parameter Symbol Min Max Unit

Supply voltage 3.3V BVDD 3.13 3.47 V

High-level input voltage VIH 2BV

DD + 0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current

(BVIN 1 = 0 V or BVIN = BVDD)

IIN —±5 μA

High-level output voltage

(BVDD = min, IOH = –2 mA)

VOH BVDD – 0.2 — V

Low-level output voltage

(BVDD = min, IOL = 2 mA)

VOL —0.2 V

Note:

1. Note that the symbol BVIN, in this case, represents the BVIN symbol referenced in Ta bl e 1 .

Table 47. Local Bus DC Electrical Characteristics (2.5 V DC)

Parameter Symbol Min Max Unit

Supply voltage 2.5V BVDD 2.37 2.63 V

High-level input voltage VIH 1.70 BVDD + 0.3 V

Low-level input voltage VIL –0.3 0.7 V

Input current

(BVIN 1 = 0 V or BVIN = BVDD)

IIH —10μA

IIL –15

High-level output voltage

(BVDD = min, IOH = –1 mA)

VOH 2.0 BVDD + 0.3 V

Low-level output voltage

(BVDD = min, IOL = 1 mA)

VOL GND – 0.3 0.4 V

Note:

1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Tab le 1.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

54 Freescale Semiconductor

Local Bus Controller (eLBC)

Table 48 provides the DC electrical characteristics for the local bus interface operating at BVDD = 1.8 V

DC.

10.2 Local Bus AC Electrical Specifications

Table 49 describes the general timing parameters of the local bus interface at BVDD = 3.3 V DC.

Table 48. Local Bus DC Electrical Characteristics (1.8 V DC)

Parameter Symbol Min Max Unit

Supply voltage 1.8V BVDD 1.71 1.89 V

High-level input voltage VIH 0.65 x BVDD BVDD + 0.3 V

Low-level input voltage VIL –0.3 0.35 x BVDD V

Input current

(BVIN 1 = 0 V or BVIN = BVDD)

IIN TBD TBD μA

High-level output voltage

(IOH = –100 μA)

VOH BVDD – 0.2 — V

High-level output voltage

(IOH = –2 mA)

VOH BVDD – 0.45 — V

Low-level output voltage

(IOL = 100 μA)

VOL —0.2 V

Low-level output voltage

(IOL = 2 mA)

VOL —0.45 V

Note:

1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Ta b l e 1 .

Table 49. Local Bus General Timing Parameters (BVDD = 3.3 V DC)—PLL Enabled

At recommended operating conditions with BVDD of 3.3 V ± 5%.

Parameter Symbol 1Min Max Unit Notes

Local bus cycle time tLBK 6.67 12 ns 2

Local bus duty cycle tLBKH/tLBK 43 57 % —

LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7,8

Input setup to local bus clock (except LGTA/LUPWAIT) tLBIVKH1 1.8 — ns 3, 4

LGTA/LUPWAIT input setup to local bus clock tLBIVKH2 1.7 — ns 3, 4

Input hold from local bus clock (except LGTA/LUPWAIT) tLBIXKH1 1.0 — ns 3, 4

LGTA/LUPWAIT input hold from local bus clock tLBIXKH2 1.0 — ns 3, 4

LALE output negation to high impedance for LAD/LDP

(LATCH hold time)

tLBOTOT 1.5 — ns 6

Local bus clock to output valid (except LAD/LDP and LALE) tLBKHOV1 —2.3ns—

Local bus clock to data valid for LAD/LDP tLBKHOV2 —2.4ns3

Local bus clock to address valid for LAD tLBKHOV3 —2.3ns3

Local bus clock to LALE assertion tLBKHOV4 —2.3ns3

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 55

Local Bus Controller (eLBC)

Table 50 describes the general timing parameters of the local bus interface at BVDD = 2.5 V DC.

Output hold from local bus clock (except LAD/LDP and

LALE)

tLBKHOX1 0.7 — ns 3

Output hold from local bus clock for LAD/LDP tLBKHOX2 0.7 — ns 3

Local bus clock to output high Impedance (except LAD/LDP

and LALE)

tLBKHOZ1 —2.5ns5

Local bus clock to output high impedance for LAD/LDP tLBKHOZ2 —2.5ns5

Note:

1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state)

(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,

tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock

reference (K) goes high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the

tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time.

2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.

3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock

for PLL bypass mode to 0.4 ×BVDD of the signal in question for 3.3-V signaling levels.

4. Input timings are measured at the pin.

5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current

delivered through the component pin is less than or equal to the leakage current specification.

6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is

programmed with the LBCR[AHD] parameter.

7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between

complementary signals at BVDD/2.

8. Guaranteed by design.

Table 50. Local Bus General Timing Parameters (BVDD = 2.5 V DC)—PLL Enabled

At recommended operating conditions with BVDD of 2.5 V ± 5%

Parameter Symbol 1Min Max Unit Notes

Local bus cycle time tLBK 6.67 12 ns 2

Local bus duty cycle tLBKH/tLBK 43 57 % —

LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7, 8

Input setup to local bus clock (except LGTA/LUPWAIT) tLBIVKH1 1.9 — ns 3, 4

LGTA/LUPWAIT input setup to local bus clock tLBIVKH2 1.8 — ns 3, 4

Input hold from local bus clock (except

LGTA/LUPWAIT)

tLBIXKH1 1.1 — ns 3, 4

LGTA/LUPWAIT input hold from local bus clock tLBIXKH2 1.1 — ns 3, 4

LALE output negation to high impedance for LAD/LDP

(LATCH hold time)

tLBOTOT 1.5 — ns 6

Local bus clock to output valid (except LAD/LDP and

LALE)

tLBKHOV1 —2.4ns—

Table 49. Local Bus General Timing Parameters (BVDD = 3.3 V DC)—PLL Enabled (continued)

At recommended operating conditions with BVDD of 3.3 V ± 5%. (continued)

Parameter Symbol 1Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

56 Freescale Semiconductor

Local Bus Controller (eLBC)

Table 51 describes the general timing parameters of the local bus interface at BVDD = 1.8 V DC

Local bus clock to data valid for LAD/LDP tLBKHOV2 —2.5ns3

Local bus clock to address valid for LAD tLBKHOV3 —2.4ns3

Local bus clock to LALE assertion tLBKHOV4 —2.4ns3

Output hold from local bus clock (except LAD/LDP and

LALE)

tLBKHOX1 0.8 — ns 3

Output hold from local bus clock for LAD/LDP tLBKHOX2 0.8 — ns 3

Local bus clock to output high Impedance (except

LAD/LDP and LALE)

tLBKHOZ1 —2.6ns5

Local bus clock to output high impedance for LAD/LDP tLBKHOZ2 —2.6ns5

Note:

1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state)

(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,

tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock

reference (K) goes high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the

tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time.

2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.

3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock

for PLL bypass mode to 0.4 ×BVDD of the signal in question for 2.5-V signaling levels.

4. Input timings are measured at the pin.

5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current

delivered through the component pin is less than or equal to the leakage current specification.

6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT

is programmed with the LBCR[AHD] parameter.

7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between

complementary signals at BVDD/2.

8. Guaranteed by design.

Table 51. Local Bus General Timing Parameters (BVDD = 1.8 V DC)—PLL Enabled

At recommended operating conditions with BVDD of 1.8 V ± 5%

Parameter Symbol 1Min Max Unit Notes

Local bus cycle time tLBK 6.67 12 ns 2

Local bus duty cycle tLBKH/tLBK 43 57 % —

LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7, 8

Input setup to local bus clock (except LGTA/LUPWAIT) tLBIVKH1 2.4 — ns 3, 4

LGTA/LUPWAIT input setup to local bus clock tLBIVKH2 1.9 — ns 3, 4

Input hold from local bus clock (except LGTA/LUPWAIT) tLBIXKH1 1.1 — ns 3, 4

LGTA/LUPWAIT input hold from local bus clock tLBIXKH2 1.1 — ns 3, 4

LALE output negation to high impedance for LAD/LDP

(LATCH hold time)

tLBOTOT 1.2 — ns 6

Table 50. Local Bus General Timing Parameters (BVDD = 2.5 V DC)—PLL Enabled (continued)

At recommended operating conditions with BVDD of 2.5 V ± 5% (continued)

Parameter Symbol 1Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 57

Local Bus Controller (eLBC)

Figure 29 provides the AC test load for the local bus.

Figure 29. Local Bus AC Test Load

Local bus clock to output valid (except LAD/LDP and

LALE)

tLBKHOV1 —3.2ns—

Local bus clock to data valid for LAD/LDP tLBKHOV2 —3.2ns3

Local bus clock to address valid for LAD tLBKHOV3 —3.2ns3

Local bus clock to LALE assertion tLBKHOV4 —3.2ns3

Output hold from local bus clock (except LAD/LDP and

LALE)

tLBKHOX1 0.9 — ns 3

Output hold from local bus clock for LAD/LDP tLBKHOX2 0.9 — ns 3

Local bus clock to output high Impedance (except

LAD/LDP and LALE)

tLBKHOZ1 —2.6ns5

Local bus clock to output high impedance for LAD/LDP tLBKHOZ2 —2.6ns5

Note:

1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state)

(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,

tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock

reference (K) goes high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the

tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time.

2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.

3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus

clock for PLL bypass mode to 0.4 ×BVDD of the signal in question for 1.8-V signaling levels.

4. Input timings are measured at the pin.

5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current

delivered through the component pin is less than or equal to the leakage current specification.

6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT

is programmed with the LBCR[AHD] parameter.

7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured

between complementary signals at BVDD/2.

8. Guaranteed by design.

Table 51. Local Bus General Timing Parameters (BVDD = 1.8 V DC)—PLL Enabled (continued)

At recommended operating conditions with BVDD of 1.8 V ± 5% (continued)

Parameter Symbol 1Min Max Unit Notes

Output Z0 = 50 ΩBVDD/2

RL = 50 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

58 Freescale Semiconductor

Local Bus Controller (eLBC)

Figure 30 through Figure 35 show the local bus signals.

Figure 30. Local Bus Signals, Non-Special Signals Only (PLL Enabled)

Table 52 describes the general timing parameters of the local bus interface at BVDD = 3.3 V DC with PLL

disabled.

Table 52. Local Bus General Timing Parameters—PLL Bypassed

At recommended operating conditions with BVDD of 3.3 V ± 5%

Parameter Symbol 1Min Max Unit Notes

Local bus cycle time tLBK 12 — ns 2

Local bus duty cycle tLBKH/tLBK 43 57 % —

Internal launch/capture clock to LCLK delay tLBKHKT 2.3 4.0 ns —

Input setup to local bus clock (except

LGTA/LUPWAIT)

tLBIVKH1 5.8 — ns 4, 5

LGTA/LUPWAIT input setup to local bus clock tLBIVKL2 5.7 — ns 4, 5

Input hold from local bus clock (except

LGTA/LUPWAIT)

tLBIXKH1 -1.3 — ns 4, 5

LGTA/LUPWAIT input hold from local bus clock tLBIXKL2 -1.3 — ns 4, 5

Output Signals:

LA[27:31]/LCS[0:7]/LWE[0:3]/

LFWE/LBCTL/LFCLE/

LFALE/LOE/LFRE/LFWP

tLBKHOV1

tLBKHOV2

tLBKHOV3

LSYNC_IN

Input Signals:

LAD[0:31]/LDP[0:3]

Output (Data) Signals:

LAD[0:31]/LDP[0:3]

Output (Address) Signal:

LAD[0:31]

LALE

tLBIXKH1

tLBIVKH1

tLBIVKH2

tLBIXKH2

tLBKHOX1

tLBKHOZ1

tLBKHOX2

tLBKHOZ2

Input Signal:

LGTA/LFRB

tLBOTOT

tLBKHOZ2

tLBKHOX2

tLBKHOV4

LUPWAIT

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 59

Local Bus Controller (eLBC)

NOTE

In PLL bypass mode, LCLK[n] is the inverted version of the internal clock

with the delay of tLBKHKT. In this mode, signals are launched at the rising edge

of the internal clock and are captured at the falling edge of the internal clock

with the exception of LGTA/LUPWAIT (which is captured on the rising

edge of the internal clock).

LALE output negation to high impedance for

LAD/LDP (LATCH hold time)

tLBOTOT 1.5 — ns 6

Local bus clock to output valid (except LAD/LDP and

LALE)

tLBKLOV1 —–0.3ns

Local bus clock to data valid for LAD/LDP tLBKLOV2 —–0.1ns4

Local bus clock to address valid for LAD tLBKLOV3 —0.0ns4

Local bus clock to LALE assertion tLBKLOV4 —0.0ns4

Output hold from local bus clock (except LAD/LDP

and LALE)

tLBKLOX1 –3.3 — ns 4

Output hold from local bus clock for LAD/LDP tLBKLOX2 –3.3 — ns 4

Local bus clock to output high Impedance (except

LAD/LDP and LALE)

tLBKLOZ1 —0.2ns7

Local bus clock to output high impedance for

LAD/LDP

tLBKLOZ2 —0.2ns7

Notes:

1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus

timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for

clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the

output (O) going invalid (X) or output hold time.

2. All timings are in reference to local bus clock for PLL bypass mode. Timings may be negative with respect to the local bus

clock because the actual launch and capture of signals is done with the internal launch/capture clock, which precedes LCLK

by tLBKHKT

3. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between

complementary signals at BVDD/2.

4. All signals are measured from BVDD/2 of the rising edge of local bus clock for PLL bypass mode to 0.4 x BVDD of the signal

in question for 3.3-V signaling levels.

5. Input timings are measured at the pin.

6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is

programmed with the LBCR[AHD] parameter.

7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through

the component pin is less than or equal to the leakage current specification.

Table 52. Local Bus General Timing Parameters—PLL Bypassed (continued)

At recommended operating conditions with BVDD of 3.3 V ± 5%

Parameter Symbol 1Min Max Unit Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

60 Freescale Semiconductor

Local Bus Controller (eLBC)

Figure 31. Local Bus Signals (PLL Bypass Mode)

Output Signals:

LA[27:31]/LCS[0:7]/

LWE[0:3]/LFWE/

LBCTL/LFCLE/LFALE/

tLBKLOV2

LCLK[n]

Input Signals:

LAD[0:31]/LDP[0:3]

Output (Data) Signals:

LAD[0:31]/LDP[0:3]

LALE

tLBIXKH1

Input Signal:

LGTA/LFRB

Output (Address) Signal:

LAD[0:31]

tLBIVKH1

tLBIXKL2

tLBIVKL2

tLBKLOX1

tLBKLOZ2

tLBOTOT

Internal launch/

tLBKLOX2

tLBKLOV1

tLBKLOV3

tLBKLOZ1

tLBKHKT

tLBKLOV4

LUPWAIT

capture clock

LOE/LFRE/LFWP

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 61

Local Bus Controller (eLBC)

Figure 32. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Enabled)

LSYNC_IN

UPM Mode Input Signal:

LUPWAIT

tLBIXKH2

tLBIVKH2

tLBIVKH1

tLBIXKH1

tLBKHOZ1

Input Signals:

LAD[0:31]/LDP[0:3]

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKHOV1

tLBKHOV1 tLBKHOZ1

GPCM Mode Input Signal:

LGTA

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

62 Freescale Semiconductor

Local Bus Controller (eLBC)

Figure 33. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Bypass Mode)

tLBIVKH1

tLBIXKL2

Internal launch/capture clock

UPM Mode Input Signal:

LUPWAIT

Input Signals:

LAD[0:31]/LDP[0:3]

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKLOV1

tLBKLOZ1

LCLK

tLBKLOX1

tLBIXKH1

GPCM Mode Input Signal:

LGTA

tLBIVKL2

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 63

Local Bus Controller (eLBC)

Figure 34. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Enabled)

LSYNC_IN

UPM Mode Input Signal:

LUPWAIT

tLBIXKH2

tLBIVKH2

tLBIVKH1

tLBIXKH1

tLBKHOZ1

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKHOV1

tLBKHOV1 tLBKHOZ1

Input Signals:

LAD[0:31]/LDP[0:3]

GPCM Mode Input Signal:

LGTA

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

64 Freescale Semiconductor

Local Bus Controller (eLBC)

Figure 35. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Bypass Mode)

tLBIXKL2

tLBIVKH1

Internal launch/capture clock

UPM Mode Input Signal:

LUPWAIT

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

Input Signals:

LAD[0:31]/LDP[0:3]

LCLK

tLBKLOV1

tLBKLOZ1

tLBKLOX1

tLBIXKH1

GPCM Mode Input Signal:

LGTA

tLBIVKL2

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 65

Programmable Interrupt Controller

11 Programmable Interrupt Controller

In IRQ edge trigger mode, when an external interrupt signal is asserted (according to the programmed

polarity), it must remain asserted for at least 3 system clocks (SYSCLK periods).

12 JTAG

This section describes the AC electrical specifications for the IEEE 1149.1 (JTAG) interface of the

MPC8572E.

Table 53 provides the JTAG AC timing specifications as defined in Figure 37 through Figure 39.

Table 53. JTAG AC Timing Specifications (Independent of SYSCLK) 1

At recommended operating conditions with OVDD of 3.3 V ± 5%.

Parameter Symbol 2Min Max Unit Notes

JTAG external clock frequency of operation fJTG 033.3MHz—

JTAG external clock cycle time t JTG 30 — ns —

JTAG external clock pulse width measured at 1.4 V tJTKHKL 15 — ns —

JTAG external clock rise and fall times tJTGR & tJTGF 02 ns 6

TRST assert time tTRST 25 — ns 3

Input setup times:

Boundary-scan data

TMS, TDI

tJTDVKH

tJTIVKH

—

Input hold times:

Boundary-scan data

TMS, TDI

tJTDXKH

tJTIXKH

—

Valid times:

Boundary-scan data

TDO

tJTKLDV

tJTKLOV

Output hold times:

Boundary-scan data

TDO

tJTKLDX

tJTKLOX

—

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

66 Freescale Semiconductor

JTAG

Figure 36 provides the AC test load for TDO and the boundary-scan outputs.

Figure 36. AC Test Load for the JTAG Interface

Figure 37 provides the JTAG clock input timing diagram.

Figure 37. JTAG Clock Input Timing Diagram

Figure 38 provides the TRST timing diagram.

Figure 38. TRST Timing Diagram

JTAG external clock to output high impedance:

Boundary-scan data

TDO

tJTKLDZ

tJTKLOZ

5, 6

Notes:

1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.

The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 36).

Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)

for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG

device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference

(K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input

signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock

reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall

times, the latter convention is used with the appropriate letter: R (rise) or F (fall).

3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.

4. Non-JTAG signal input timing with respect to tTCLK.

5. Non-JTAG signal output timing with respect to tTCLK.

6. Guaranteed by design.

Table 53. JTAG AC Timing Specifications (Independent of SYSCLK) 1 (continued)

At recommended operating conditions with OVDD of 3.3 V ± 5%.

Parameter Symbol 2Min Max Unit Notes

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

JTAG

tJTKHKL tJTGR

External Clock VMVMVM

tJTG tJTGF

VM = Midpoint Voltage (OVDD/2)

TRST

VM = Midpoint Voltage (OVDD/2)

VM VM

tTRST

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 67

I2C

Figure 39 provides the boundary-scan timing diagram.

Figure 39. Boundary-Scan Timing Diagram

13 I2C

This section describes the DC and AC electrical characteristics for the I2C interfaces of the MPC8572E.

13.1 I2C DC Electrical Characteristics

Table 54 provides the DC electrical characteristics for the I2C interfaces.

Table 54. I2C DC Electrical Characteristics

Parameter Symbol Min Max Unit Notes

Input high voltage level VIH 0.7 × OVDD OVDD + 0.3 V —

Input low voltage level VIL –0.3 0.3 × OVDD V—

Low level output voltage VOL 00.4 V1

Pulse width of spikes which must be suppressed by the

input filter

tI2KHKL 050ns2

Input current each I/O pin (input voltage is between

0.1 × OVDD and 0.9 × OVDD(max)

II–10 10 μA3

Capacitance for each I/O pin CI—10pF—

Notes:

1. Output voltage (open drain or open collector) condition = 3 mA sink current.

2. Refer to the MPC8572E PowerQUICC™ III Integrated Host Processor Family Reference Manual for information on the digital

filter used.

3. I/O pins will obstruct the SDA and SCL lines if OVDD is switched off.

VM = Midpoint Voltage (OVDD/2)

VM VM

tJTDVKH

tJTDXKH

Boundary

Data Outputs

Boundary

Data Outputs

JTAG

External Clock

Boundary

Data Inputs

Output Data Valid

tJTKLDX

tJTKLDZ

tJTKLDV

Input

Data Valid

Output Data Valid

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

68 Freescale Semiconductor

I2C

13.2 I2C AC Electrical Specifications

Table 55 provides the AC timing parameters for the I2C interfaces.

Table 55. I2C AC Electrical Specifications

At recommended operating conditions with OVDD of 3.3 V ± 5%. All values refer to VIH (min) and VIL (max) levels (see Ta b l e 2 ).

Parameter Symbol1Min Max Unit

SCL clock frequency fI2C 0 400 kHz4

Low period of the SCL clock tI2CL 1.3 — μs

High period of the SCL clock tI2CH 0.6 — μs

Setup time for a repeated START condition tI2SVKH 0.6 — μs

Hold time (repeated) START condition (after this period, the first

clock pulse is generated)

tI2SXKL 0.6 — μs

Data setup time tI2DVKH 100 — ns

Data input hold time:

CBUS compatible masters

I2C bus devices

tI2DXKL

—

μs

Data output delay time tI2OVKL —0.9

3μs

Setup time for STOP condition tI2PVKH 0.6 — μs

Bus free time between a STOP and START condition tI2KHDX 1.3 — μs

Noise margin at the LOW level for each connected device

(including hysteresis)

VNL 0.1 × OVDD —V

Noise margin at the HIGH level for each connected device

(including hysteresis)

VNH 0.2 × OVDD —V

Capacitive load for each bus line Cb — 400 pF

Notes:

1.The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for

inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2)

with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high

(H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the START condition

(S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C

timing (I2) for the time that the data with respect to the STOP condition (P) reaching the valid state (V) relative to the tI2C clock

reference (K) going to the high (H) state or setup time.

2. As a transmitter, the MPC8572E provides a delay time of at least 300 ns for the SDA signal (referred to the VIHmin of the

SCL signal) to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP

condition. When the MPC8572E acts as the I2C bus master while transmitting, the MPC8572E drives both SCL and SDA.

As long as the load on SCL and SDA are balanced, the MPC8572E would not cause unintended generation of START or

STOP condition. Therefore, the 300 ns SDA output delay time is not a concern. If, under some rare condition, the 300 ns SDA

output delay time is required for the MPC8572E as transmitter, application note AN2919 referred to in note 4 below is

recommended.

3.The maximum tI2OVKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.

4. The requirements for I2C frequency calculation must be followed. Refer to Freescale application note AN2919, Determining

the I2C Frequency Divider Ratio for SCL.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 69

GPIO

Figure 40 provides the AC test load for the I2C.

Figure 40. I2C AC Test Load

Figure 41 shows the AC timing diagram for the I2C bus.

Figure 41. I2C Bus AC Timing Diagram

14 GPIO

This section describes the DC and AC electrical specifications for the GPIO interface of the MPC8572E.

14.1 GPIO DC Electrical Characteristics

Table 56 provides the DC electrical characteristics for the GPIO interface operating at BVDD = 3.3 V DC.

Table 56. GPIO DC Electrical Characteristics (3.3 V DC)

Parameter Symbol Min Max Unit

Supply voltage 3.3V BVDD 3.13 3.47 V

High-level input voltage VIH 2BV

DD + 0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current

(BVIN 1= 0 V or BVIN =BV

DD)

IIN —±5 μA

High-level output voltage

(BVDD =min, I

OH =–2 mA)

VOH BVDD –0.2 — V

Low-level output voltage

(BVDD =min, I

OL =2 mA)

VOL —0.2 V

Note:

1. Note that the symbol BVIN, in this case, represents the BVIN symbol referenced in Ta bl e 1 .

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

SrS

SDA

SCL

tI2SXKL

tI2CL

tI2CH

tI2DXKL

tI2DVKH

tI2SXKL

tI2SVKH

tI2KHKL

tI2PVKH

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

70 Freescale Semiconductor

GPIO

Table 57 provides the DC electrical characteristics for the GPIO interface operating at BVDD = 2.5 V DC.

Table 58 provides the DC electrical characteristics for the GPIO interface operating at BVDD = 1.8 V DC.

Table 57. GPIO DC Electrical Characteristics (2.5 V DC)

Parameter Symbol Min Max Unit

Supply voltage 2.5V BVDD 2.37 2.63 V

High-level input voltage VIH 1.70 BVDD +0.3 V

Low-level input voltage VIL –0.3 0.7 V

Input current

(BVIN 1 = 0 V or BVIN = BVDD)

IIH —10μA

IIL –15

High-level output voltage

(BVDD =min, I

OH =–1 mA)

VOH 2.0 BVDD + 0.3 V

Low-level output voltage

(BVDD min, IOL = 1 mA)

VOL GND – 0.3 0.4 V

Note:

1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Tab le 1.

Table 58. GPIO DC Electrical Characteristics (1.8 V DC)

Parameter Symbol Min Max Unit

Supply voltage 1.8V BVDD 1.71 1.89 V

High-level input voltage VIH 0.65 x BVDD BVDD +0.3 V

Low-level input voltage VIL –0.3 0.35 x BVDD V

Input current

(BVIN 1=0 V or BV

IN =BV

DD)

IIN TBD TBD μA

High-level output voltage

(IOH = –100 μA)

VOH BVDD – 0.2 — V

High-level output voltage

(IOH =–2 mA)

VOH BVDD – 0.45 — V

Low-level output voltage

(IOL = 100 μA)

VOL —0.2 V

Low-level output voltage

(IOL =2mA)

VOL —0.45 V

Note:

1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Ta b l e 1 .

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 71

High-Speed Serial Interfaces (HSSI)

14.2 GPIO AC Electrical Specifications

Table 59 provides the GPIO input and output AC timing specifications.

Figure 42 provides the AC test load for the GPIO.

Figure 42. GPIO AC Test Load

15 High-Speed Serial Interfaces (HSSI)

The MPC8572E features two Serializer/Deserializer (SerDes) interfaces to be used for high-speed serial

interconnect applications. The SerDes1 interface can be used for PCI Express and/or Serial RapidIO data

transfers. The SerDes2 is dedicated for SGMII application.

This section describes the common portion of SerDes DC electrical specifications, which is the DC

requirement for SerDes Reference Clocks. The SerDes data lane’s transmitter and receiver reference

circuits are also shown.

15.1 Signal Terms Definition

The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms

used in the description and specification of differential signals.

Figure 43 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for

description. The figure shows waveform for either a transmitter output (SDn_TX and SDn_TX) or a

receiver input (SDn_RX and SDn_RX). Each signal swings between A Volts and B Volts where A > B.

Using this waveform, the definitions are as follows. To simplify illustration, the following definitions

assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling

environment.

1. Single-Ended Swing

The transmitter output signals and the receiver input signals SDn_TX, SDn_TX, SDn_RX and

SDn_RX each have a peak-to-peak swing of A - B Volts. This is also referred as each signal wire’s

Single-Ended Swing.

Table 59. GPIO Input AC Timing Specifications1

Parameter Symbol Typ Unit Notes

GPIO inputs—minimum pulse width tPIWID 20 ns 2

Notes:

1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYSCLK. Timings

are measured at the pin.

2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any

external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation.

Output Z0 = 50 ΩBVDD/2

RL = 50 Ω

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72 Freescale Semiconductor

High-Speed Serial Interfaces (HSSI)

2. Differential Output Voltage, VOD (or Differential Output Swing):

The Differential Output Voltage (or Swing) of the transmitter, VOD, is defined as the difference of

the two complimentary output voltages: VSDn_TX – VSDn_TX. The VOD value can be either positive

or negative.

3. Differential Input Voltage, VID (or Differential Input Swing):

The Differential Input Voltage (or Swing) of the receiver, VID, is defined as the difference of the

two complimentary input voltages: VSDn_RX - VSDn_RX. The VID value can be either positive or

negative.

4. Differential Peak Voltage, VDIFFp

The peak value of the differential transmitter output signal or the differential receiver input signal

is defined as Differential Peak Voltage, VDIFFp = |A – B| Volts.

5. Differential Peak-to-Peak, VDIFFp-p

Because the differential output signal of the transmitter and the differential input signal of the

receiver each range from A – B to –(A – B) Volts, the peak-to-peak value of the differential

transmitter output signal or the differential receiver input signal is defined as Differential

Peak-to-Peak Voltage, VDIFFp-p = 2*VDIFFp = 2 * |(A – B)| Volts, which is twice of differential

swing in amplitude, or twice of the differential peak. For example, the output differential peak-peak

voltage can also be calculated as VTX-DIFFp-p = 2*|VOD|.

6. Differential Waveform

1. The differential waveform is constructed by subtracting the inverting signal (SDn_TX, for

example) from the non-inverting signal (SDn_TX, for example) within a differential pair. There is

only one signal trace curve in a differential waveform. The voltage represented in the differential

waveform is not referenced to ground. Refer to Figure 52 as an example for differential waveform.

2. Common Mode Voltage, Vcm

The Common Mode Voltage is equal to one half of the sum of the voltages between each conductor

of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out =

(VSDn_TX + VSDn_TX)/2 = (A + B) / 2, which is the arithmetic mean of the two complimentary

output voltages within a differential pair. In a system, the common mode voltage may often differ

from one component’s output to the other’s input. Sometimes, it may be even different between the

receiver input and driver output circuits within the same component. It is also referred as the DC

offset in some occasion.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 73

High-Speed Serial Interfaces (HSSI)

Figure 43. Differential Voltage Definitions for Transmitter or Receiver

To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)

transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing

that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD

or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, because

the differential signaling environment is fully symmetrical, the transmitter output’s differential swing

(VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges

between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other

phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p)

is 1000 mV p-p.

15.2 SerDes Reference Clocks

The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by

the corresponding SerDes lanes. The SerDes reference clocks inputs are SD1_REF_CLK and

SD1_REF_CLK for PCI Express and Serial RapidIO, or SD2_REF_CLK and SD2_REF_CLK for the

SGMII interface respectively.

The following sections describe the SerDes reference clock requirements and some application

information.

15.2.1 SerDes Reference Clock Receiver Characteristics

Figure 44 shows a receiver reference diagram of the SerDes reference clocks. Characteristics are as

follows:

• The supply voltage requirements for XVDD_SRDS2 are specified in Table 1 and Table 2.

• SerDes Reference Clock Receiver Reference Circuit Structure

— The SDn_REF_CLK and SDn_REF_CLK are internally AC-coupled differential inputs as

shown in Figure 44. Each differential clock input (SDn_REF_CLK or SDn_REF_CLK) has

on-chip 50-Ω termination to SGND_SRDSn (xcorevss) followed by on-chip AC-coupling.

Differential Swing, VID or VOD = A – B

A Volts

B Volts

SDn_TX or

SDn_RX

SDn_TX or

SDn_RX

Differential Peak Voltage, VDIFFp = |A – B|

Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)

Vcm = (A + B) / 2

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

74 Freescale Semiconductor

High-Speed Serial Interfaces (HSSI)

— The external reference clock driver must be able to drive this termination.

— The SerDes reference clock input can be either differential or single-ended. Refer to the

Differential Mode and Single-ended Mode description below for further detailed requirements.

• The maximum average current requirement that also determines the common mode voltage range

— When the SerDes reference clock differential inputs are DC coupled externally with the clock

driver chip, the maximum average current allowed for each input pin is 8 mA. In this case, the

exact common mode input voltage is not critical as long as it is within the range allowed by the

maximum average current of 8 mA (refer to the following bullet for more detail), because the

input is AC-coupled on-chip.

— This current limitation sets the maximum common mode input voltage to be less than 0.4 V

(0.4 V/50 = 8 mA) while the minimum common mode input level is 0.1 V above

SGND_SRDSn (xcorevss). For example, a clock with a 50/50 duty cycle can be produced by

a clock driver with output driven by its current source from 0 mA to 16 mA (0-0.8 V), such that

each phase of the differential input has a single-ended swing from 0 V to 800 mV with the

common mode voltage at 400 mV.

— If the device driving the SDn_REF_CLK and SDn_REF_CLK inputs cannot drive 50 Ω to

SGND_SRDSn (xcorevss) DC, or it exceeds the maximum input current limitations, then it

must be AC-coupled off-chip.

• The input amplitude requirement

— This requirement is described in detail in the following sections.

Figure 44. Receiver of SerDes Reference Clocks

15.2.2 DC Level Requirement for SerDes Reference Clocks

The DC level requirement for the MPC8572E SerDes reference clock inputs is different depending on the

signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described

below.

• Differential Mode

— The input amplitude of the differential clock must be between 400mV and 1600mV differential

peak-peak (or between 200mV and 800mV differential peak). In other words, each signal wire

Input

Amp

50 Ω

SDn_REF_CLK

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 75

High-Speed Serial Interfaces (HSSI)

of the differential pair must have a single-ended swing less than 800mV and greater than

200mV. This requirement is the same for both external DC-coupled or AC-coupled connection.

— For external DC-coupled connection, as described in Section 15.2.1, “SerDes Reference

Clock Receiver Characteristics,” the maximum average current requirements sets the

requirement for average voltage (common mode voltage) to be between 100 mV and 400 mV.

Figure 45 shows the SerDes reference clock input requirement for DC-coupled connection

scheme.

— For external AC-coupled connection, there is no common mode voltage requirement for the

clock driver. Because the external AC-coupling capacitor blocks the DC level, the clock driver

and the SerDes reference clock receiver operate in different command mode voltages. The

SerDes reference clock receiver in this connection scheme has its common mode voltage set to

SGND_SRDSn. Each signal wire of the differential inputs is allowed to swing below and above

the command mode voltage (SGND_SRDSn). Figure 46 shows the SerDes reference clock

input requirement for AC-coupled connection scheme.

• Single-ended Mode

— The reference clock can also be single-ended. The SDn_REF_CLK input amplitude

(single-ended swing) must be between 400 mV and 800 mV peak-peak (from Vmin to Vmax)

with SDn_REF_CLK either left unconnected or tied to ground.

—The SDn_REF_CLK input average voltage must be between 200 and 400 mV. Figure 47 shows

the SerDes reference clock input requirement for single-ended signaling mode.

— To meet the input amplitude requirement, the reference clock inputs might need to be DC or

AC-coupled externally. For the best noise performance, the reference of the clock could be DC

or AC-coupled into the unused phase (SDn_REF_CLK) through the same source impedance as

the clock input (SDn_REF_CLK) in use.

Figure 45. Differential Reference Clock Input DC Requirements (External DC-Coupled)

SDn_REF_CLK

Vmax < 800 mV

Vmin > 0V

100 mV < Vcm < 400 mV

200mV < Input Amplitude or Differential Peak < 800 mV

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

76 Freescale Semiconductor

High-Speed Serial Interfaces (HSSI)

Figure 46. Differential Reference Clock Input DC Requirements (External AC-Coupled)

Figure 47. Single-Ended Reference Clock Input DC Requirements

15.2.3 Interfacing With Other Differential Signaling Levels

• With on-chip termination to SGND_SRDSn (xcorevss), the differential reference clocks inputs are

HCSL (High-Speed Current Steering Logic) compatible DC-coupled.

• Many other low voltage differential type outputs like LVDS (Low Voltage Differential Signaling)

can be used but may need to be AC-coupled due to the limited common mode input range allowed

(100 to 400 mV) for DC-coupled connection.

• LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at

clock driver output first, then followed with series attenuation resistor to reduce the amplitude,

additionally to AC-coupling.

SDn_REF_CLK

Vcm

200 mV < Input Amplitude or Differential Peak < 800 mV

Vmax < Vcm + 400 mV

Vmin > Vcm – 400 mV

SDn_REF_CLK

400 mV < SDn_REF_CLK Input Amplitude < 800 mV

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 77

High-Speed Serial Interfaces (HSSI)

NOTE

Figure 48 to Figure 51 below are for conceptual reference only. Due to the

fact that clock driver chip's internal structure, output impedance and

termination requirements are different between various clock driver chip

manufacturers, it is very possible that the clock circuit reference designs

provided by clock driver chip vendor are different from what is shown

below. They might also vary from one vendor to the other. Therefore,

Freescale Semiconductor can neither provide the optimal clock driver

reference circuits, nor guarantee the correctness of the following clock

driver connection reference circuits. The system designer is recommended

to contact the selected clock driver chip vendor for the optimal reference

circuits with the MPC8572E SerDes reference clock receiver requirement

provided in this document.

Figure 48 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It

assumes that the DC levels of the clock driver chip is compatible with MPC8572E SerDes reference clock

input’s DC requirement.

Figure 48. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only)

50 Ω

SDn_REF_CLK

Clock Driver 100 Ω differential PWB trace

Clock driver vendor dependent

source termination resistor

SerDes Refer.

CLK Receiver

Clock Driver

CLK_Out

HCSL CLK Driver Chip

33 Ω

Total 50 Ω. Assume clock driver’s

output impedance is about 16 Ω.

MPC8572E

CLK_Out

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

78 Freescale Semiconductor

High-Speed Serial Interfaces (HSSI)

Figure 49 shows the SerDes reference clock connection reference circuits for LVDS type clock driver.

Because LVDS clock driver’s common mode voltage is higher than the MPC8572E SerDes reference

clock input’s allowed range (100 to 400mV), AC-coupled connection scheme must be used. It assumes the

LVDS output driver features 50-Ω termination resistor. It also assumes that the LVDS transmitter

establishes its own common mode level without relying on the receiver or other external component.

Figure 49. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only)

Figure 50 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver.

Because LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible

with MPC8572E SerDes reference clock input’s DC requirement, AC-coupling must be used. Figure 50

assumes that the LVPECL clock driver’s output impedance is 50Ω. R1 is used to DC-bias the LVPECL

outputs prior to AC-coupling. Its value could be ranged from 140Ω to 240Ω depending on clock driver

vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50-Ω termination

resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8572E SerDes

reference clock’s differential input amplitude requirement (between 200mV and 800mV differential peak).

For example, if the LVPECL output’s differential peak is 900mV and the desired SerDes reference clock

input amplitude is selected as 600mV, the attenuation factor is 0.67, which requires R2 = 25Ω. Consult

50 Ω

SDn_REF_CLK

Clock Driver 100 Ω differential PWB trace SerDes Refer.

CLK Receiver

Clock Driver

CLK_Out

LVDS CLK Driver Chip

10 nF

MPC8572E

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 79

High-Speed Serial Interfaces (HSSI)

clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular

clock driver chip.

Figure 50. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only)

Figure 51 shows the SerDes reference clock connection reference circuits for a single-ended clock driver.

It assumes the DC levels of the clock driver are compatible with MPC8572E SerDes reference clock

input’s DC requirement.

Figure 51. Single-Ended Connection (Reference Only)

15.2.4 AC Requirements for SerDes Reference Clocks

The clock driver selected should provide a high quality reference clock with low phase noise and

cycle-to-cycle jitter. Phase noise less than 100KHz can be tracked by the PLL and data recovery loops and

is less of a problem. Phase noise above 15MHz is filtered by the PLL. The most problematic phase noise

50 Ω

SDn_REF_CLK

Clock Driver 100 Ω differential PWB trace SerDes Refer.

CLK Receiver

Clock Driver

CLK_Out

LVPECL CLK

Driver Chip

MPC8572E

10nF

50 Ω

SDn_REF_CLK

100 Ω differential PWB trace SerDes Refer.

CLK Receiver

Clock Driver

CLK_Out

Single-Ended

CLK Driver Chip MPC8572E

33 Ω

Total 50 Ω. Assume clock driver’s

output impedance is about 16 Ω.

50 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

80 Freescale Semiconductor

High-Speed Serial Interfaces (HSSI)

occurs in the 1-15MHz range. The source impedance of the clock driver should be 50 ohms to match the

transmission line and reduce reflections which are a source of noise to the system.

Table 60 describes some AC parameters common to SGMII, PCI Express and Serial RapidIO protocols.

Figure 52. Differential Measurement Points for Rise and Fall Time

Figure 53. Single-Ended Measurement Points for Rise and Fall Time Matching

Table 60. SerDes Reference Clock Common AC Parameters

At recommended operating conditions with XVDD_SRDS1 or XVDD_SRDS2 = 1.1V ± 5%.

Parameter Symbol Min Max Unit Notes

Rising Edge Rate Rise Edge Rate 1.0 4.0 V/ns 2, 3

Falling Edge Rate Fall Edge Rate 1.0 4.0 V/ns 2, 3

Differential Input High Voltage VIH +200 mV 2

Differential Input Low Voltage VIL —-200mV2

Rising edge rate (SDn_REF_CLK) to falling edge rate

(SDn_REF_CLK) matching

Rise-Fall

Matching

—20%1, 4

Notes:

1. Measurement taken from single ended waveform.

2. Measurement taken from differential waveform.

3. Measured from -200 mV to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK). The

signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is centered

on the differential zero crossing. See Figure 52.

4. Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a 200

mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The median cross

point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The Rise Edge Rate

of SDn_REF_CLK should be compared to the Fall Edge Rate of SDn_REF_CLK, the maximum allowed difference should not

exceed 20% of the slowest edge rate. See Figure 53.

VIH = +200 mV

VIL = –200 mV

0.0 V

SD_REF_CLK –

SD_REF_CLK

Fall Edge RateRise Edge Rate

SDn_REF_CLK

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 81

PCI Express

The other detailed AC requirements of the SerDes Reference Clocks is defined by each interface protocol

based on application usage. Refer to the following sections for detailed information:

•Section 8.3.2, “AC Requirements for SGMII SD2_REF_CLK and SD2_REF_CLK”

•Section 16.2, “AC Requirements for PCI Express SerDes Reference Clocks”

•Section 17.2, “AC Requirements for Serial RapidIO SD1_REF_CLK and SD1_REF_CLK”

15.2.4.1 Spread Spectrum Clock

SD1_REF_CLK/SD1_REF_CLK are designed to work with a spread spectrum clock (+0 to –0.5%

spreading at 30–33 KHz rate is allowed), assuming both ends have same reference clock. For better results,

a source without significant unintended modulation should be used.

SD2_REF_CLK/SD2_REF_CLK are not to be used with, and should not be clocked by, a spread spectrum

clock source.

15.3 SerDes Transmitter and Receiver Reference Circuits

Figure 54 shows the reference circuits for SerDes data lane’s transmitter and receiver.

Figure 54. SerDes Transmitter and Receiver Reference Circuits

The DC and AC specification of SerDes data lanes are defined in each interface protocol section below

(PCI Express, Serial Rapid IO or SGMII) in this document based on the application usage:

•Section 8.3, “SGMII Interface Electrical Characteristics”

•Section 16, “PCI Express”

•Section 17, “Serial RapidIO”

Note that external AC Coupling capacitor is required for the above three serial transmission protocols with

the capacitor value defined in specification of each protocol section.

16 PCI Express

This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8572E.

50 Ω

50 ΩReceiver

Transmitter

SD1_TXn or

SD2_TXn

SD1_TXn or

SD2_TXn

SD1_RXn or

SD2_RXn

SD1_RXn or

SD2_RXn

50 Ω

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82 Freescale Semiconductor

PCI Express

16.1 DC Requirements for PCI Express SD1_REF_CLK and

SD1_REF_CLK

For more information, see Section 15.2, “SerDes Reference Clocks.”

16.2 AC Requirements for PCI Express SerDes Reference Clocks

Table 61 lists AC requirements.

16.3 Clocking Dependencies

The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)

of each other at all times. This is specified to allow bit rate clock sources with a +/– 300 ppm tolerance.

16.4 Physical Layer Specifications

The following is a summary of the specifications for the physical layer of PCI Express on this device. For

further details as well as the specifications of the transport and data link layer, Use the PCI Express Base

Specification. REV. 1.0a document.

16.4.1 Differential Transmitter (TX) Output

Table 62 defines the specifications for the differential output at all transmitters (TXs). The parameters are

specified at the component pins.

Table 61. SD1_REF_CLK and SD1_REF_CLK AC Requirements

Symbol Parameter Description Min Typical Max Units Notes

tREF REFCLK cycle time — 10 — ns 1

tREFCJ REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent

REFCLK cycles

——100ps—

tREFPJ Phase jitter. Deviation in edge location with respect to mean edge location –50 — 50 ps —

Notes:

1. Typical cycle time is based on PCI Express Card Electromechanical Specification Revision 1.0a.

Table 62. Differential Transmitter (TX) Output Specifications

Symbol Parameter Min Nominal Max Units Comments

UI Unit Interval 399.88 400 400.12 ps Each UI is 400 ps ± 300 ppm. UI does not account

for Spread Spectrum Clock dictated variations. See

Note 1.

VTX-DIFFp-p Differential

Peak-to-Peak

Output Voltage

0.8 — 1.2 V VTX-DIFFp-p = 2*|VTX-D+ - VTX-D-| See Note 2.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 83

PCI Express

VTX-DE-RATIO De- Emphasized

Differential

Output Voltage

(Ratio)

–3.0 –3.5 -4.0 dB Ratio of the VTX-DIFFp-p of the second and following

bits after a transition divided by the VTX-DIFFp-p of

the first bit after a transition. See Note 2.

TTX-EYE Minimum TX Eye

Width

0.70 — — UI The maximum Transmitter jitter can be derived as

TTX-MAX-JITTER = 1 - TTX-EYE= 0.3 UI.

See Notes 2 and 3.

TTX-EYE-MEDIAN-to-

MAX-JITTER

Maximum time

between the jitter

median and

maximum

deviation from

the median.

— — 0.15 UI Jitter is defined as the measurement variation of the

crossing points (VTX-DIFFp-p = 0 V) in relation to a

recovered TX UI. A recovered TX UI is calculated

over 3500 consecutive unit intervals of sample

data. Jitter is measured using all edges of the 250

consecutive UI in the center of the 3500 UI used for

calculating the TX UI. See Notes 2 and 3.

TTX-RISE, TTX-FALL D+/D- TX Output

Rise/Fall Time

0.125 — — UI See Notes 2 and 5

VTX-CM-ACp RMS AC Peak

Common Mode

Output Voltage

——20mVV

TX-CM-ACp = RMS(|VTXD+ + VTXD-|/2 - VTX-CM-DC)

VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D-|/2

See Note 2

VTX-CM-DC-ACTIVE-

IDLE-DELTA

Absolute Delta of

DC Common

Mode Voltage

During L0 and

Electrical Idle

0—100mV|V

TX-CM-DC (during L0) - VTX-CM-Idle-DC (During Electrical

Idle)|<=100 mV

VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D-|/2 [L0]

VTX-CM-Idle-DC = DC(avg) of |VTX-D+ + VTX-D-|/2

[Electrical Idle]

See Note 2.

VTX-CM-DC-LINE-DELTA Absolute Delta of

DC Common

Mode between

D+ and D–

0—25mV|V

TX-CM-DC-D+ - VTX-CM-DC-D-| <= 25 mV

VTX-CM-DC-D+ = DC(avg) of |VTX-D+|

VTX-CM-DC-D- = DC(avg) of |VTX-D-|

See Note 2.

VTX-IDLE-DIFFp Electrical Idle

differential Peak

Output Voltage

0—20mVV

TX-IDLE-DIFFp = |VTX-IDLE-D+ -VTX-IDLE-D-| <= 20

See Note 2.

VTX-RCV-DETECT The amount of

voltage change

allowed during

Receiver

Detection

— 600 mV The total amount of voltage change that a

transmitter can apply to sense whether a low

impedance Receiver is present. See Note 6.

VTX-DC-CM The TX DC

Common Mode

Voltage

0 — 3.6 V The allowed DC Common Mode voltage under any

conditions. See Note 6.

ITX-SHORT TX Short Circuit

Current Limit

— 90 mA The total current the Transmitter can provide when

shorted to its ground

TTX-IDLE-MIN Minimum time

spent in

Electrical Idle

50 — — UI Minimum time a Transmitter must be in Electrical

Idle Utilized by the Receiver to start looking for an

Electrical Idle Exit after successfully receiving an

Electrical Idle ordered set

Table 62. Differential Transmitter (TX) Output Specifications (continued)

Symbol Parameter Min Nominal Max Units Comments

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

84 Freescale Semiconductor

PCI Express

TTX-IDLE-SET-TO-IDLE Maximum time to

transition to a

valid Electrical

idle after sending

an Electrical Idle

ordered set

— — 20 UI After sending an Electrical Idle ordered set, the

Transmitter must meet all Electrical Idle

Specifications within this time. This is considered a

debounce time for the Transmitter to meet Electrical

Idle after transitioning from L0.

TTX-IDLE-TO-DIFF-DATA Maximum time to

transition to valid

TX specifications

after leaving an

Electrical idle

condition

— — 20 UI Maximum time to meet all TX specifications when

transitioning from Electrical Idle to sending

differential data. This is considered a debounce

time for the TX to meet all TX specifications after

leaving Electrical Idle

RLTX-DIFF Differential

Return Loss

12 — — dB Measured over 50 MHz to 1.25 GHz. See Note 4

RLTX-CM Common Mode

Return Loss

6 — — dB Measured over 50 MHz to 1.25 GHz. See Note 4

ZTX-DIFF-DC DC Differential

TX Impedance

80 100 120 ΩTX DC Differential mode Low Impedance

ZTX-DC Transmitter DC

Impedance

40 — — ΩRequired TX D+ as well as D- DC Impedance

during all states

LTX-SKEW Lane-to-Lane

Output Skew

— — 500 +

2 UI

ps Static skew between any two Transmitter Lanes

within a single Link

CTX AC Coupling

Capacitor

75 — 200 nF All Transmitters shall be AC coupled. The AC

coupling is required either within the media or within

the transmitting component itself. See Note 8.

Tcrosslink Crosslink

Random

Timeout

0 — 1 ms This random timeout helps resolve conflicts in

crosslink configuration by eventually resulting in

only one Downstream and one Upstream Port. See

Note 7.

Notes:

1. No test load is necessarily associated with this value.

2. Specified at the measurement point into a timing and voltage compliance test load as shown in Figure 57 and measured over

any 250 consecutive TX UIs. (Also refer to the transmitter compliance eye diagram shown in Figure 55.)

3. A TTX-EYE = 0.70 UI provides for a total sum of deterministic and random jitter budget of TTX-JITTER-MAX = 0.30 UI for the

Transmitter collected over any 250 consecutive TX UIs. The TTX-EYE-MEDIAN-to-MAX-JITTER median is less than half of the total

TX jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean.

The jitter median describes the point in time where the number of jitter points on either side is approximately equal as

opposed to the averaged time value.

4. The Transmitter input impedance shall result in a differential return loss greater than or equal to 12 dB and a common mode

return loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement

applies to all valid input levels. The reference impedance for return loss measurements is 50 ohms to ground for both the D+

and D- line (that is, as measured by a Vector Network Analyzer with 50 ohm probes—see Figure 57). Note that the series

capacitors CTX is optional for the return loss measurement.

5. Measured between 20-80% at transmitter package pins into a test load as shown in Figure 57 for both VTX-D+ and VTX-D-.

6. See Section 4.3.1.8 of the PCI Express Base Specifications Rev 1.0a.

7. See Section 4.2.6.3 of the PCI Express Base Specifications Rev 1.0a.

8. MPC8572E SerDes transmitter does not have CTX built-in. An external AC Coupling capacitor is required.

Table 62. Differential Transmitter (TX) Output Specifications (continued)

Symbol Parameter Min Nominal Max Units Comments

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 85

PCI Express

16.4.2 Transmitter Compliance Eye Diagrams

The TX eye diagram in Figure 55 is specified using the passive compliance/test measurement load (see

Figure 57) in place of any real PCI Express interconnect + RX component.

There are two eye diagrams that must be met for the transmitter. Both eye diagrams must be aligned in

time using the jitter median to locate the center of the eye diagram. The different eye diagrams differ in

voltage depending whether it is a transition bit or a de-emphasized bit. The exact reduced voltage level of

the de-emphasized bit is always relative to the transition bit.

The eye diagram must be valid for any 250 consecutive UIs.

A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is

created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX

UI.

NOTE

It is recommended that the recovered TX UI is calculated using all edges in

the 3500 consecutive UI interval with a fit algorithm using a minimization

merit function (that is, least squares and median deviation fits).

Figure 55. Minimum Transmitter Timing and Voltage Output Compliance Specifications

VTX-DIFF = 0 mV

(D+ D– Crossing Point)

[De-Emphasized Bit]

0.07 UI = UI – 0.3 UI (JTX-TOTAL-MAX)

566 mV (3 dB ) >=

TX-DIFFp-p-MIN

>= 505 mV (4 dB )

[Transition Bit]

TX-DIFFp-p-MIN

= 800 mV

VRX-DIFF = 0 mV

(D+ D– Crossing Point)

[Transition Bit]

TX-DIFFp-p-MIN

= 800 mV

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

86 Freescale Semiconductor

PCI Express

16.4.3 Differential Receiver (RX) Input Specifications

Table 63 defines the specifications for the differential input at all receivers (RXs). The parameters are

specified at the component pins.

Table 63. Differential Receiver (RX) Input Specifications

Symbol Parameter Min Nominal Max Units Comments

UI Unit Interval 399.88 400 400.12 ps Each UI is 400 ps ± 300 ppm. UI does not

account for Spread Spectrum Clock

dictated variations. See Note 1.

VRX-DIFFp-p Differential Input

Peak-to-Peak

Voltage

0.175 — 1.200 V VRX-DIFFp-p = 2*|VRX-D+ - VRX-D-|

See Note 2.

TRX-EYE Minimum

Receiver Eye

Width

0.4 — — UI The maximum interconnect media and

Transmitter jitter that can be tolerated by the

Receiver can be derived as TRX-MAX-JITTER

= 1 - TRX-EYE= 0.6 UI.

See Notes 2 and 3.

TRX-EYE-MEDIAN-to-MAX

-JITTER

Maximum time

between the jitter

median and

maximum

deviation from

the median.

— — 0.3 UI Jitter is defined as the measurement

variation of the crossing points (VRX-DIFFp-p

= 0 V) in relation to a recovered TX UI. A

recovered TX UI is calculated over 3500

consecutive unit intervals of sample data.

Jitter is measured using all edges of the

250 consecutive UI in the center of the 3500

UI used for calculating the TX UI. See

Notes 2, 3 and 7.

VRX-CM-ACp AC Peak

Common Mode

Input Voltage

— — 150 mV VRX-CM-ACp = |VRXD+ +VRXD-|/2 -

VRX-CM-DC

VRX-CM-DC = DC(avg) of |VRX-D+ + VRX-D-|/2

See Note 2

RLRX-DIFF Differential

Return Loss

15 — — dB Measured over 50 MHz to 1.25 GHz with

the D+ and D- lines biased at +300 mV and

-300 mV, respectively.

See Note 4

RLRX-CM Common Mode

Return Loss

6 — — dB Measured over 50 MHz to 1.25 GHz with

the D+ and D- lines biased at 0 V. See Note

ZRX-DIFF-DC DC Differential

Input Impedance

80 100 120 ΩRX DC Differential mode impedance. See

Note 5

ZRX-DC DC Input

Impedance

40 50 60 ΩRequired RX D+ as well as D- DC

Impedance (50 ± 20% tolerance). See

Notes 2 and 5.

ZRX-HIGH-IMP-DC Powered Down

DC Input

Impedance

200 k — — ΩRequired RX D+ as well as D- DC

Impedance when the Receiver terminations

do not have power. See Note 6.

VRX-IDLE-DET-DIFFp-p Electrical Idle

Detect Threshold

65 — 175 mV VRX-IDLE-DET-DIFFp-p = 2*|VRX-D+ -VRX-D-|

Measured at the package pins of the

Receiver

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 87

PCI Express

TRX-IDLE-DET-DIFF-

ENTERTIME

Unexpected

Electrical Idle

Enter Detect

Threshold

Integration Time

— — 10 ms An unexpected Electrical Idle (VRX-DIFFp-p <

VRX-IDLE-DET-DIFFp-p) must be recognized

no longer than TRX-IDLE-DET-DIFF-ENTERING

to signal an unexpected idle condition.

LRX-SKEW Total Skew — — 20 ns Skew across all lanes on a Link. This

includes variation in the length of SKP

ordered set (for example, COM and one to

five SKP Symbols) at the RX as well as any

delay differences arising from the

interconnect itself.

Notes:

1. No test load is necessarily associated with this value.

2. Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 57 should be used

as the RX device when taking measurements (also refer to the Receiver compliance eye diagram shown in Figure 56). If the

clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must

be used as a reference for the eye diagram.

3. A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the Transmitter and

interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution

in which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over

any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the

point in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value.

If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI

must be used as the reference for the eye diagram.

4. The Receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased

to 300 mV and the D- line biased to -300 mV and a common mode return loss greater than or equal to 6 dB (no bias required)

over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The

reference impedance for return loss measurements for is 50 ohms to ground for both the D+ and D- line (that is, as measured

by a Vector Network Analyzer with 50 ohm probes - see Figure 57). Note: that the series capacitors CTX is optional for the

return loss measurement.

5. Impedance during all LTSSM states. When transitioning from a Fundamental Reset to Detect (the initial state of the LTSSM)

there is a 5 ms transition time before Receiver termination values must be met on all un-configured Lanes of a Port.

6. The RX DC Common Mode Impedance that exists when no power is present or Fundamental Reset is asserted. This helps

ensure that the Receiver Detect circuit does not falsely assume a Receiver is powered on when it is not. This term must be

measured at 300 mV above the RX ground.

7. It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm

using a minimization merit function. Least squares and median deviation fits have worked well with experimental and

simulated data.

Table 63. Differential Receiver (RX) Input Specifications (continued)

Symbol Parameter Min Nominal Max Units Comments

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

88 Freescale Semiconductor

PCI Express

16.5 Receiver Compliance Eye Diagrams

The RX eye diagram in Figure 56 is specified using the passive compliance/test measurement load (see

Figure 57) in place of any real PCI Express RX component.

Note: In general, the minimum Receiver eye diagram measured with the compliance/test measurement

load (see Figure 57) is larger than the minimum Receiver eye diagram measured over a range of systems

at the input Receiver of any real PCI Express component. The degraded eye diagram at the input Receiver

is due to traces internal to the package as well as silicon parasitic characteristics which cause the real PCI

Express component to vary in impedance from the compliance/test measurement load. The input Receiver

eye diagram is implementation specific and is not specified. RX component designer should provide

additional margin to adequately compensate for the degraded minimum Receiver eye diagram (shown in

Figure 56) expected at the input Receiver based on some adequate combination of system simulations and

the Return Loss measured looking into the RX package and silicon. The RX eye diagram must be aligned

in time using the jitter median to locate the center of the eye diagram.

The eye diagram must be valid for any 250 consecutive UIs.

A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is

created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX

UI.

NOTE

The reference impedance for return loss measurements is 50. to ground for

both the D+ and D- line (that is, as measured by a Vector Network Analyzer

with 50. probes—see Figure 57). Note that the series capacitors, CTX, are

optional for the return loss measurement.

Figure 56. Minimum Receiver Eye Timing and Voltage Compliance Specification

VRX-DIFF = 0 mV

(D+ D– Crossing Point)

VRX-DIFF = 0 mV

(D+ D– Crossing Point)

RX-DIFFp-p-MIN

> 175 mV

0.4 UI = TRX-EYE-MIN

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 89

Serial RapidIO

16.5.1 Compliance Test and Measurement Load

The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2

inches of the package pins, into a test/measurement load shown in Figure 57.

NOTE

The allowance of the measurement point to be within 0.2 inches of the

package pins is meant to acknowledge that package/board routing may

benefit from D+ and D– not being exactly matched in length at the package

pin boundary.

Figure 57. Compliance Test/Measurement Load

17 Serial RapidIO

This section describes the DC and AC electrical specifications for the RapidIO interface of the MPC8572E

for the LP-Serial physical layer. The electrical specifications cover both single and multiple-lane links.

Two transmitters (short run and long run) and a single receiver are specified for each of three baud rates,

1.25, 2.50, and 3.125 GBaud.

Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to

driving two connectors across a backplane. A single receiver specification is given that accepts signals

from both the short run and long run transmitter specifications.

The short run transmitter should be used mainly for chip-to-chip connections on either the same printed

circuit board or across a single connector. This covers the case where connections are made to a mezzanine

(daughter) card. The minimum swings of the short run specification reduce the overall power used by the

transceivers.

The long run transmitter specifications use larger voltage swings that are capable of driving signals across

backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications

allow a distance of at least 50 cm at all baud rates.

All unit intervals are specified with a tolerance of +/– 100 ppm. The worst case frequency difference

between any transmit and receive clock is 200 ppm.

To ensure interoperability between drivers and receivers of different vendors and technologies, AC

coupling at the receiver input must be used.

Silicon

+ Package

C = CTX

R = 50 ΩR = 50 Ω

D+ Package

D– Package

D+ Package

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

90 Freescale Semiconductor

Serial RapidIO

17.1 DC Requirements for Serial RapidIO SD1_REF_CLK and

SD1_REF_CLK

For more information, see Section 15.2, “SerDes Reference Clocks.”

17.2 AC Requirements for Serial RapidIO SD1_REF_CLK and

SD1_REF_CLK

Figure 64lists the AC requirements.

17.3 Equalization

With the use of high speed serial links, the interconnect media causes degradation of the signal at the

receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss

can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification.

To negate a portion of these effects, equalization can be used. The most common equalization techniques

that can be used are as follows:

• A passive high pass filter network placed at the receiver. This is often referred to as passive

equalization.

• The use of active circuits in the receiver. This is often referred to as adaptive equalization.

17.4 Explanatory Note on Transmitter and Receiver Specifications

AC electrical specifications are given for transmitter and receiver. Long run and short run interfaces at

three baud rates (a total of six cases) are described.

The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified

in Clause 47 of IEEE 802.3ae-2002.

XAUI has similar application goals to serial RapidIO, as described in Section 8.1, “Enhanced Three-Speed

Ethernet Controller (eTSEC) (10/100/1000 Mbps)—FIFO/GMII/MII/TBI/RGMII/RTBI/RMII Electrical

Characteristics.” The goal of this standard is that electrical designs for Serial RapidIO can reuse electrical

designs for XAUI, suitably modified for applications at the baud intervals and reaches described herein.

Table 64. SDn_REF_CLK and SDn_REF_CLK AC Requirements

Symbol Parameter Description Min Typical Max Units Comments

tREF REFCLK cycle time — 10(8) — ns 8 ns applies only to serial RapidIO

with 125-MHz reference clock

tREFCJ REFCLK cycle-to-cycle jitter. Difference in

the period of any two adjacent REFCLK

cycles

——80ps —

tREFPJ Phase jitter. Deviation in edge location with

respect to mean edge location

–40 — 40 ps —

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 91

Serial RapidIO

17.5 Transmitter Specifications

LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section.

The differential return loss, S11, of the transmitter in each case shall be better than

• –10 dB for (Baud Frequency)/10 < Freq(f) < 625 MHz, and

• –10 dB + 10log(f/625 MHz) dB for 625 MHz ≤ Freq(f) ≤ Baud Frequency

The reference impedance for the differential return loss measurements is 100 Ω resistive. Differential

return loss includes contributions from on-chip circuitry, chip packaging and any off-chip components

related to the driver. The output impedance requirement applies to all valid output levels.

It is recommended that the 20%-80% rise/fall time of the transmitter, as measured at the transmitter output,

in each case have a minimum value 60 ps.

It is recommended that the timing skew at the output of an LP-Serial transmitter between the two signals

that comprise a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB and 15 ps at 3.125 GB.

Table 65. Short Run Transmitter AC Timing Specifications—1.25 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 500 1000 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

Multiple output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 800 800 ps +/- 100 ppm

Table 66. Short Run Transmitter AC Timing Specifications—2.5 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 500 1000 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

92 Freescale Semiconductor

Serial RapidIO

Multiple Output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 400 400 ps +/- 100 ppm

Table 67. Short Run Transmitter AC Timing Specifications—3.125 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 500 1000 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

Multiple output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 320 320 ps +/– 100 ppm

Table 68. Long Run Transmitter AC Timing Specifications—1.25 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 800 1600 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

Multiple output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 800 800 ps +/- 100 ppm

Table 66. Short Run Transmitter AC Timing Specifications—2.5 GBaud (continued)

Characteristic Symbol

Range

Unit Notes

Min Max

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 93

Serial RapidIO

For each baud rate at which an LP-Serial transmitter is specified to operate, the output eye pattern of the

transmitter shall fall entirely within the unshaded portion of the transmitter output compliance mask shown

in Figure 58 with the parameters specified in Figure 71 when measured at the output pins of the device and

the device is driving a 100 Ω +/–5% differential resistive load. The output eye pattern of an LP-Serial

transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol interference) need

only comply with the Transmitter Output Compliance Mask when pre-emphasis is disabled or minimized.

Table 69. Long Run Transmitter AC Timing Specifications—2.5 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 800 1600 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

Multiple output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 400 400 ps +/- 100 ppm

Table 70. Long Run Transmitter AC Timing Specifications—3.125 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Output Voltage, VO–0.40 2.30 Volts Voltage relative to COMMON of

either signal comprising a

differential pair

Differential Output Voltage VDIFFPP 800 1600 mV p-p —

Deterministic Jitter JD—0.17 UI p-p —

Total Jitter JT—0.35 UI p-p —

Multiple output skew SMO — 1000 ps Skew at the transmitter output

between lanes of a multilane

link

Unit Interval UI 320 320 ps +/- 100 ppm

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

94 Freescale Semiconductor

Serial RapidIO

Figure 58. Transmitter Output Compliance Mask

17.6 Receiver Specifications

LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section.

Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode

return loss better than 6 dB from 100 MHz to (0.8) × (Baud Frequency). This includes contributions from

on-chip circuitry, the chip package and any off-chip components related to the receiver. AC coupling

components are included in this requirement. The reference impedance for return loss measurements is

100 Ohm resistive for differential return loss and 25-Ω resistive for common mode.

Table 71. Transmitter Differential Output Eye Diagram Parameters

Transmitter Type VDIFFmin (mV) VDIFFmax (mV) A (UI) B (UI)

1.25 GBaud short range 250 500 0.175 0.39

1.25 GBaud long range 400 800 0.175 0.39

2.5 GBaud short range 250 500 0.175 0.39

2.5 GBaud long range 400 800 0.175 0.39

3.125 GBaud short range 250 500 0.175 0.39

3.125 GBaud long range 400 800 0.175 0.39

VDIFF min

VDIFF max

-VDIFF min

-VDIFF max

0B1-B1

Time in UI

Transmitter Differential Output Voltage

A1-A

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 95

Serial RapidIO

Table 72. Receiver AC Timing Specifications—1.25 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Differential Input Voltage VIN 200 1600 mV p-p Measured at receiver

Deterministic Jitter Tolerance JD0.37 — UI p-p Measured at receiver

Combined Deterministic and Random

Jitter Tolerance

JDR 0.55 — UI p-p Measured at receiver

Total Jitter Tolerance1JT0.65 — UI p-p Measured at receiver

Multiple Input Skew SMI — 24 ns Skew at the receiver input

between lanes of a multilane

link

Bit Error Rate BER — 10–12 ——

Unit Interval UI 800 800 ps +/– 100 ppm

Note:

1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The

sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 59. The sinusoidal jitter component

is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.

Table 73. Receiver AC Timing Specifications—2.5 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Differential Input Voltage VIN 200 1600 mV p-p Measured at receiver

Deterministic Jitter Tolerance JD0.37 — UI p-p Measured at receiver

Combined Deterministic and Random

Jitter Tolerance

JDR 0.55 — UI p-p Measured at receiver

Total Jitter Tolerance1JT0.65 — UI p-p Measured at receiver

Multiple Input Skew SMI — 24 ns Skew at the receiver input

between lanes of a multilane

link

Bit Error Rate BER — 10–12 ——

Unit Interval UI 400 400 ps +/– 100 ppm

Note:

1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The

sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 59. The sinusoidal jitter component

is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

96 Freescale Semiconductor

Serial RapidIO

Figure 59. Single Frequency Sinusoidal Jitter Limits

Table 74. Receiver AC Timing Specifications—3.125 GBaud

Characteristic Symbol

Range

Unit Notes

Min Max

Differential Input Voltage VIN 200 1600 mV p-p Measured at receiver

Deterministic Jitter Tolerance JD0.37 — UI p-p Measured at receiver

Combined Deterministic and Random

Jitter Tolerance

JDR 0.55 — UI p-p Measured at receiver

Total Jitter Tolerance1JT0.65 — UI p-p Measured at receiver

Multiple Input Skew SMI — 22 ns Skew at the receiver input

between lanes of a multilane

link

Bit Error Rate BER — 10-12 ——

Unit Interval UI 320 320 ps +/- 100 ppm

Note:

1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The

sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 59. The sinusoidal jitter component

is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.

8.5 UI p-p

0.10 UI p-p

Sinusoidal

Jitter

Amplitude

22.1 kHz 1.875 MHz 20 MHzFrequency

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 97

Serial RapidIO

17.7 Receiver Eye Diagrams

For each baud rate at which an LP-Serial receiver is specified to operate, the receiver shall meet the

corresponding Bit Error Rate specification (Table 72, Table 73, and Table 74) when the eye pattern of the

receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the Receiver

Input Compliance Mask shown in Figure 60 with the parameters specified in Table 75. The eye pattern of

the receiver test signal is measured at the input pins of the receiving device with the device replaced with

a 100-Ω +/– 5% differential resistive load.

Figure 60. Receiver Input Compliance Mask

17.8 Measurement and Test Requirements

Because the LP-Serial electrical specification are guided by the XAUI electrical interface specified in

Clause 47 of IEEE 802.3ae-2002, the measurement and test requirements defined here are similarly guided

by Clause 47. Additionally, the CJPAT test pattern defined in Annex 48A of IEEE 802.3ae-2002 is

Table 75. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter

Receiver Type VDIFFmin (mV) VDIFFmax (mV) A (UI) B (UI)

1.25 GBaud 100 800 0.275 0.400

2.5 GBaud 100 800 0.275 0.400

3.125 GBaud 100 800 0.275 0.400

VDIFF max

-VDIFF max

VDIFF min

-VDIFF min

Time (UI)

Receiver Differential Input Voltage

AB 1-B1-A

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

98 Freescale Semiconductor

Serial RapidIO

specified as the test pattern for use in eye pattern and jitter measurements. Annex 48B of IEEE

802.3ae-2002 is recommended as a reference for additional information on jitter test methods.

17.8.1 Eye Template Measurements

For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point

at (Baud Frequency)/1667 is applied to the jitter. The data pattern for template measurements is the

Continuous Jitter Test Pattern (CJPAT) defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-Serial

link shall be active in both the transmit and receive directions, and opposite ends of the links shall use

asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane

implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The

amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10-12.

The eye pattern shall be measured with AC coupling and the compliance template centered at 0 Volts

differential. The left and right edges of the template shall be aligned with the mean zero crossing points of

the measured data eye. The load for this test shall be 100 Ω resistive +/– 5% differential to 2.5 GHz.

17.8.2 Jitter Test Measurements

For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (Baud

Frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter

Test Pattern (CJPAT) pattern defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-Serial link shall

be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous

clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations

shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured

with AC coupling and at 0 Volts differential. Jitter measurement for the transmitter (or for calibration of a

jitter tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that

described in Annex 48B of IEEE 802.3ae.

17.8.3 Transmit Jitter

Transmit jitter is measured at the driver output when terminated into a load of 100 Ω resistive +/– 5%

differential to 2.5 GHz.

17.8.4 Jitter Tolerance

Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first

producing the sum of deterministic and random jitter defined in Section 17.6, “Receiver Specifications,”

and then adjusting the signal amplitude until the data eye contacts the 6 points of the minimum eye opening

of the receive template shown in Figure 60 and Table 75. Note that for this to occur, the test signal must

have vertical waveform symmetry about the average value and have horizontal symmetry (including jitter)

about the mean zero crossing. Eye template measurement requirements are as defined above. Random

jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade

roll-off below this. The required sinusoidal jitter specified in Section 17.6, “Receiver Specifications,” is

then added to the signal and the test load is replaced by the receiver being tested.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 99

Package Description

18 Package Description

This section describes package parameters, pin assignments, and dimensions.

18.1 Package Parameters for the MPC8572E FC-PBGA

The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023

flip chip plastic ball grid array (FC-PBGA).

Package outline 33 mm × 33 mm

Interconnects 1023

Ball Pitch 1 mm

Ball Diameter (Typical) 0.6 mm

Solder Balls 63% Sn

37% Pb

Solder Balls (Lead-Free) 96.5% Sn

3.5% Ag

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

100 Freescale Semiconductor

Package Description

18.2 Mechanical Dimensions of the MPC8572E FC-PBGA

Figure 61 shows the mechanical dimensions of the MPC8572E FC-PBGA package with full lid.

Figure 61. Mechanical Dimensions of the MPC8572E FC-PBGA with Full Lid

NOTES:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. All dimensions are symmetric across the package center lines unless dimensioned otherwise.

4. Maximum solder ball diameter measured parallel to datum A.

5. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 101

Package Description

6. Parallelism measurement shall exclude any effect of mark on top surface of package.

18.3 Pinout Listings

Table 76 provides the pin-out listing for the MPC8572E 1023 FC-PBGA package.

Table 76. MPC8572E Pinout Listing

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

DDR SDRAM Memory Interface 1

D1_MDQ[0:63] Data D15, A14, B12, D12,

A15, B15, B13, C13,

C11, D11, D9, A8, A12,

A11, A9, B9, F11, G12,

K11, K12, E10, E9,

J11, J10, G8, H10, L10,

M11, F10, G9, K9, K8,

AC6, AC7, AG8, AH9,

AB6, AB8, AE9, AF9,

AL8, AM8, AM10,

AK11, AH8, AK8, AJ10,

AK10, AL12, AJ12,

AL14, AK14, AL11,

AM11, AK13, AM14,

AM15, AJ16, AL18,

AM18, AJ15, AL15,

AK17, AM17

I/O GVDD —

D1_MECC[0:7] Error Correcting Code M10, M7, R8, T11, L12,

L11, P9, R10

I/O GVDD —

D1_MAPAR_ERR Address Parity Error P6 I GVDD —

D1_MAPAR_OUT Address Parity Out W6 O GVDD —

D1_MDM[0:8] Data Mask C14, A10, G11, H9,

AD7, AJ9, AM12,

AK16, N11

OGV

DD —

D1_MDQS[0:8] Data Strobe A13, C10, H12, J7,

AE8, AM9, AM13,

AL17, N9

I/O GVDD —

D1_MDQS[0:8] Data Strobe D14, B10, H13, J8,

AD8, AL9, AJ13,

AM16, P10

I/O GVDD —

D1_MA[0:15] Address Y7, W8, U6, W9, U7,

V8, Y11, V10, T6, V11,

AA10, U9, U10, AD11,

T8, P7

OGV

DD —

D1_MBA[0:2] Bank Select AA7, AA8, R7 O GVDD —

D1_MWE Write Enable AC12 O GVDD —

D1_MCAS Column Address Strobe AC9 O GVDD —

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

102 Freescale Semiconductor

Package Description

D1_MRAS Row Address Strobe AB12 O GVDD —

D1_MCKE[0:3] Clock Enable M8, L9, T9, N8 O GVDD 11

D1_MCS[0:3] Chip Select AB9, AF10, AB11,

AE11

OGV

DD —

D1_MCK[0:5] Clock V7, E13, AH11, Y9,

F14, AG10

OGV

DD —

D1_MCK[0:5] Clock Complements Y10, E12, AH12, AA11,

F13, AG11

OGV

DD —

D1_MODT[0:3] On Die Termination AD10, AF12, AC10,

AE12

OGV

DD —

D1_MDIC[0:1] Driver Impedance Calibration E15, G14 I/O GVDD 25

DDR SDRAM Memory Interface 2

D2_MDQ[0:63] Data A6, B7, C5, D5, A7, C8,

D8, D6, C4, A3, D3,

D2, B4, A4, B1, C1, E3,

E1, G2, G6, D1, E4,

G5, G3, J4, J2, P4, R5,

H3, H1, N5, N3, Y6, Y4,

AC3, AD2, V5, W5,

AB2, AB3, AD5, AE3,

AF6, AG7, AC4, AD4,

AF4, AF7, AH5, AJ1,

AL2, AM3, AH3, AH6,

AM1, AL3, AK5, AL5,

AJ7, AK7, AK4, AM4,

AL6, AM7

I/O GVDD —

D2_MECC[0:7] Error Correcting Code J5, H7, L7, N6, H4, H6,

M4, M5

I/O GVDD —

D2_MAPAR_ERR Address Parity Error N1 I GVDD —

D2_MAPAR_OUT Address Parity Out W2 O GVDD —

D2_MDM[0:8] Data Mask A5, B3, F4, J1, AA4,

AE5, AK1, AM5, K5

OGV

DD —

D2_MDQS[0:8] Data Strobe B6, C2, F5, L4, AB5,

AF3, AL1, AM6, L6

I/O GVDD —

D2_MDQS[0:8] Data Strobe C7, A2, F2, K3, AA5,

AE6, AK2, AJ6, K6

I/O GVDD —

D2_MA[0:15] Address W1, U4, U3, T1, T2, T3,

R1, R2, T5, R4, Y3, P1,

N2, AF1, M2, M1

OGV

DD —

D2_MBA[0:2] Bank Select Y1, W3, P3 O GVDD —

D2_MWE Write Enable AA2 O GVDD —

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 103

Package Description

D2_MCAS Column Address Strobe AD1 O GVDD —

D2_MRAS Row Address Strobe AA1 O GVDD —

D2_MCKE[0:3] Clock Enable L3, L1, K1, K2 O GVDD 11

D2_MCS[0:3] Chip Select AB1, AG2, AC1, AH2 O GVDD —

D2_MCK[0:5] Clock V4, F7, AJ3, V2, E7,

AG4

OGV

DD —

D2_MCK[0:5] Clock Complements V1, F8, AJ4, U1, E6,

AG5

OGV

DD —

D2_MODT[0:3] On Die Termination AE1, AG1, AE2, AH1 O GVDD —

D2_MDIC[0:1] Driver Impedance Calibration F1, G1 I/O GVDD 25

Local Bus Controller Interface

LAD[0:31] Muxed Data/Address M22, L22, F22, G22,

F21, G21, E20, H22,

K22, K21, H19, J20,

J19, L20, M20, M19,

E22, E21, L19, K19,

G19, H18, E18, G18,

J17, K17, K14, J15,

H16, J14, H15, G15

I/O BVDD 34

LDP[0:3] Data Parity M21, D22, A24, E17 I/O BVDD —

LA[27] Burst Address J21 O BVDD 5, 9

LA[28:31] Port Address F20, K18, H20, G17 O BVDD 5, 7, 9

LCS[0:4] Chip Selects B23, E16, D20, B25,

A22

OBV

DD 10

LCS[5]/DMA2_DREQ[1] Chip Selects / DMA Request D19 I/O BVDD 1, 10

LCS[6]/DMA2_DACK[1] Chip Selects / DMA Ack E19 O BVDD 1, 10

LCS[7]/DMA2_DDONE[1] Chip Selects / DMA Done C21 O BVDD 1, 10

LWE[0]/LBS[0]/LFWE Write Enable / Byte Select D17 O BVDD 5, 9

LWE[1]/LBS[1] Write Enable / Byte Select F15 O BVDD 5, 9

LWE[2]/LBS[2] Write Enable / Byte Select B24 O BVDD 5, 9

LWE[3]/LBS[3] Write Enable / Byte Select D18 O BVDD 5, 9

LALE Address Latch Enable F19 O BVDD 5, 8, 9

LBCTL Buffer Control L18 O BVDD 5, 8, 9

LGPL0/LFCLE UPM General Purpose Line 0 /

Flash Command Latch Enable

J13 O BVDD 5, 9

LGPL1/LFALE UPM General Purpose Line 1/

Flash Address Latch Enable

J16 O BVDD 5, 9

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

104 Freescale Semiconductor

Package Description

LGPL2/LOE/LFRE UPM General Purpose Line 2 /

Output Enable / Flash Read

Enable

A27 O BVDD 5, 8, 9

LGPL3/LFWP UPM General Purpose Line 3 /

Flash Write Protect

K16 O BVDD 5, 9

LGPL4/LGTA/LUPWAIT/LPBSE

/LFRB

UPM General Purpose Line 4 /

Target Ack / Wait / Parity Byte

Select / Flash Ready-Busy

L17 I/O BVDD —

LGPL5 UPM General Purpose Line 5 /

Amux

B26 O BVDD 5, 9

LCLK[0:2] Local Bus Clock F17, F16, A23 O BVDD —

LSYNC_IN Local Bus DLL Synchronization B22 I BVDD —

LSYNC_OUT Local Bus DLL Synchronization A21 O BVDD —

DMA

DMA1_DACK[0:1] DMA Acknowledge W25, U30 O OVDD 21

DMA2_DACK[0] DMA Acknowledge AA26 O OVDD 5, 9

DMA1_DREQ[0:1] DMA Request Y29, V27 I OVDD —

DMA2_DREQ[0] DMA Request V29 I OVDD —

DMA1_DDONE[0:1] DMA Done Y28, V30 O OVDD 5, 9

DMA2_DDONE[0] DMA Done AA28 O OVDD 5, 9

DMA2_DREQ[2] DMA Request M23 I BVDD —

Programmable Interrupt Controller

UDE0 Unconditional Debug Event

Processor 0

AC25 I OVDD —

UDE1 Unconditional Debug Event

Processor 1

AA25 I OVDD —

MCP0 Machine Check Processor 0 M28 I OVDD —

MCP1 Machine Check Processor 1 L28 I OVDD —

IRQ[0:11] External Interrupts T24, R24, R25, R27,

R28, AB27, AB28, P27,

R30, AC28, R29, T31

IOV

DD —

IRQ_OUT Interrupt Output U24 O OVDD 2, 4

1588

TSEC_1588_CLK Clock In AM22 I LVDD —

TSEC_1588_TRIG_IN Trigger In AM23 I LVDD —

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 105

Package Description

TSEC_1588_TRIG_OUT Trigger Out AA23 O LVDD 5, 9

TSEC_1588_CLK_OUT Clock Out AC23 O LVDD 5, 9

TSEC_1588_PULSE_OUT1 Pulse Out1 AA22 O LVDD 5, 9

TSEC_1588_PULSE_OUT2 Pulse Out2 AB23 O LVDD 5, 9

Ethernet Management Interface 1

EC1_MDC Management Data Clock AL30 O LVDD 5, 9

EC1_MDIO Management Data In/Out AM25 I/O LVDD —

Ethernet Management Interface 3

EC3_MDC Management Data Clock AF19 O TVDD 5, 9

EC3_MDIO Management Data In/Out AF18 I/O TVDD —

Ethernet Management Interface 5

EC5_MDC Management Data Clock AF14 O TVDD 21

EC5_MDIO Management Data In/Out AF15 I/O TVDD —

Gigabit Ethernet Reference Clock

EC_GTX_CLK125 Reference Clock AM24 I LVDD 32

Three-Speed Ethernet Controller 1

TSEC1_RXD[7:0]/FIFO1_RXD[

7:0]

Receive Data AM28, AL28, AM26,

AK23, AM27, AK26,

AL29, AM30

ILV

DD 1

TSEC1_TXD[7:0]/FIFO1_TXD[

7:0]

Transmit Data AC20, AD20, AE22,

AB22, AC22, AD21,

AB21, AE21

OLV

DD 1, 5, 9

TSEC1_COL/FIFO1_TX_FC Collision Detect/Flow Control AJ23 I LVDD 1

TSEC1_CRS/FIFO1_RX_FC Carrier Sense/Flow Control AM31 I/O LVDD 1, 16

TSEC1_GTX_CLK Transmit Clock Out AK27 O LVDD

TSEC1_RX_CLK/FIFO1_RX_C

Receive Clock AL25 I LVDD 1

TSEC1_RX_DV/FIFO1_RX_DV

/FIFO1_RXC[0]

Receive Data Valid AL24 I LVDD 1

TSEC1_RX_ER/FIFO1_RX_E

R/FIFO1_RXC[1]

Receive Data Error AM29 I LVDD 1

TSEC1_TX_CLK/FIFO1_TX_C

Transmit Clock In AB20 I LVDD 1

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

106 Freescale Semiconductor

Package Description

TSEC1_TX_EN/FIFO1_TX_EN

/FIFO1_TXC[0]

Transmit Enable AJ24 O LVDD 1, 22

TSEC1_TX_ER/FIFO1_TX_ER

R/FIFO1_TXC[1]

Transmit Error AK25 O LVDD 1, 5, 9

Three-Speed Ethernet Controller 2

TSEC2_RXD[7:0]/FIFO2_RXD[

7:0]/FIFO1_RXD[15:8]

Receive Data AG22, AH20, AL22,

AG20, AK21, AK22,

AJ21, AK20

ILV

DD 1

TSEC2_TXD[7:0]/FIFO2_TXD[

7:0]/FIFO1_TXD[15:8]

Transmit Data AH21, AF20, AC17,

AF21, AD18, AF22,

AE20, AB18

OLV

DD 1, 5, 9, 24

TSEC2_COL/FIFO2_TX_FC Collision Detect/Flow Control AE19 I LVDD 1

TSEC2_CRS/FIFO2_RX_FC Carrier Sense/Flow Control AJ20 I/O LVDD 1, 16

TSEC2_GTX_CLK Transmit Clock Out AE18 O LVDD —

TSEC2_RX_CLK/FIFO2_RX_C

Receive Clock AL23 I LVDD 1

TSEC2_RX_DV/FIFO2_RX_DV

/FIFO1_RXC[2]

Receive Data Valid AJ22 I LVDD 1

TSEC2_RX_ER/FIFO2_RX_E

Receive Data Error AD19 I LVDD 1

TSEC2_TX_CLK/FIFO2_TX_C

Transmit Clock In AC19 I LVDD 1

TSEC2_TX_EN/FIFO2_TX_EN

/FIFO1_TXC[2]

Transmit Enable AB19 O LVDD 1, 22

TSEC2_TX_ER/FIFO2_TX_ER

Transmit Error AB17 O LVDD 1, 5, 9

Three-Speed Ethernet Controller 3

TSEC3_TXD[3:0]/FEC_TXD[3:

0]/FIFO3_TXD[3:0]

Transmit Data AG18, AG17, AH17,

AH19

OTV

DD 1, 5, 9

TSEC3_RXD[3:0]/FEC_RXD[3:

0]/FIFO3_RXD[3:0]

Receive Data AG16, AK19, AD16,

AJ19

ITV

DD 1

TSEC3_GTX_CLK Transmit Clock Out AE17 O TVDD

TSEC3_RX_CLK/FEC_RX_CL

K/FIFO3_RX_CLK

Receive Clock AF17 I TVDD 1

TSEC3_RX_DV/FEC_RX_DV/F

IFO3_RX_DV

Receive Data Valid AG14 I TVDD 1

TSEC3_RX_ER/FEC_RX_ER/

FIFO3_RX_ER

Receive Error AH15 I TVDD 1

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 107

Package Description

TSEC3_TX_CLK/FEC_TX_CL

K/FIFO3_TX_CLK

Transmit Clock In AF16 I TVDD 1

TSEC3_TX_EN/FEC_TX_EN/F

IFO3_TX_EN

Transmit Enable AJ18 O TVDD 1, 22

Three-Speed Ethernet Controller 4

TSEC4_TXD[3:0]/TSEC3_TXD[

7:4]/FIFO3_TXD[7:4]

Transmit Data AD15, AC16, AC14,

AB16

OTV

DD 1, 5, 9

TSEC4_RXD[3:0]/TSEC3_RXD

[7:4]/FIFO3_RXD[7:4]

Receive Data AE15, AF13, AE14,

AH14

ITV

DD 1

TSEC4_GTX_CLK Transmit Clock Out AB14 O TVDD —

TSEC4_RX_CLK/TSEC3_COL/

FEC_COL/FIFO3_TX_FC

Receive Clock AG13 I TVDD 1

TSEC4_RX_DV/TSEC3_CRS/

FEC_CRS/FIFO3_RX_FC

Receive Data Valid AD13 I/O TVDD 1, 23

TSEC4_TX_EN/TSEC3_TX_E

R/FEC_TX_ER/FIFO3_TX_ER

Transmit Enable AB15 O TVDD 1, 22

DUART

UART_CTS[0:1] Clear to Send W30, Y27 I OVDD —

UART_RTS[0:1] Ready to Send W31, Y30 O OVDD 5, 9

UART_SIN[0:1] Receive Data Y26, W29 I OVDD —

UART_SOUT[0:1] Transmit Data Y25, W26 O OVDD 5, 9

I2C Interface

IIC1_SCL Serial Clock AC30 I/O OVDD 4, 20

IIC1_SDA Serial Data AB30 I/O OVDD 4, 20

IIC2_SCL Serial Clock AD30 I/O OVDD 4, 20

IIC2_SDA Serial Data AD29 I/O OVDD 4, 20

SerDes (x10) PCIe, SRIO

SD1_RX[7:0] Receive Data (positive) P32, N30, M32, L30,

G30, F32, E30, D32

IXV

DD_SR

DS1

—

SD1_RX[7:0] Receive Data (negative) P31, N29, M31, L29,

G29, F31, E29, D31

IXV

DD_SR

DS1

—

SD1_TX[7] PCIe1 Tx Data Lane 7 / SRIO or

PCIe2 Tx Data Lane 3 / PCIe3

TX Data Lane 1

M26 O XVDD_SR

DS1

—

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

108 Freescale Semiconductor

Package Description

SD1_TX[6] PCIe1 Tx Data Lane 6 / SRIO or

PCIe2 Tx Data Lane 2 / PCIe3

TX Data Lane 0

L24 O XVDD_SR

DS1

—

SD1_TX[5] PCIe1 Tx Data Lane 5 / SRIO or

PCIe2 Tx Data Lane 1

K26 O XVDD_SR

DS1

—

SD1_TX[4] PCIe1 Tx Data Lane 4 / SRIO or

PCIe2 Tx Data Lane 0

J24 O XVDD_SR

DS1

—

SD1_TX[3] PCIe1 Tx Data Lane 3 G24 O XVDD_SR

DS1

—

SD1_TX[2] PCIe1 Tx Data Lane 2 F26 O XVDD_SR

DS1

—

SD1_TX[1] PCIe1 Tx Data Lane 1] E24 O XVDD_SR

DS1

—

SD1_TX[0] PCIe1 Tx Data Lane 0 D26 O XVDD_SR

DS1

—

SD1_TX[7:0] Transmit Data (negative) M27, L25, K27, J25,

G25, F27, E25, D27

OXV

DD_SR

DS1

—

SD1_PLL_TPD PLL Test Point Digital J32 O XVDD_SR

DS1

SD1_REF_CLK PLL Reference Clock H32 I XVDD_SR

DS1

—

SD1_REF_CLK PLL Reference Clock

Complement

H31 I XVDD_SR

DS1

—

Reserved — C29, K32 — — 26

Reserved — C30, K31 — — 27

Reserved — C24, C25, H26, H27 — — 28

Reserved — AL20, AL21 — — 29

SerDes (x4) SGMII

SD2_RX[3:0] Receive Data (positive) AK32, AJ30, AF30,

AE32

IXV

DD_SR

DS2

—

SD2_RX[3:0] Receive Data (negative) AK31, AJ29, AF29,

AE31

IXV

DD_SR

DS2

—

SD2_TX[3] SGMII Tx Data eTSEC4 AH26 O XVDD_SR

DS2

—

SD2_TX[2] SGMII Tx Data eTSEC3 AG24 O XVDD_SR

DS2

—

SD2_TX[1] SGMII Tx Data eTSEC2 AE24 O XVDD_SR

DS2

—

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 109

Package Description

SD2_TX[0] SGMII Tx Data eTSEC1 AD26 O XVDD_SR

DS2

—

SD2_TX[3:0] Transmit Data (negative) AH27, AG25, AE25,

AD27

OXV

DD_SR

DS2

—

SD2_PLL_TPD PLL Test Point Digital AH32 O XVDD_SR

DS2

SD2_REF_CLK PLL Reference Clock AG32 I XVDD_SR

DS2

—

SD2_REF_CLK PLL Reference Clock

Complement

AG31 I XVDD_SR

DS2

—

Reserved — AF26, AF27 — — 28

General-Purpose Input/Output

GPINOUT[0:7] General Purpose Input / Output B27, A28, B31, A32,

B30, A31, B28, B29

I/O BVDD —

System Control

HRESET Hard Reset AC31 I OVDD —

HRESET_REQ Hard Reset Request L23 O OVDD 21

SRESET Soft Reset P24 I OVDD —

CKSTP_IN0 Checkstop In Processor 0 N26 I OVDD —

CKSTP_IN1 Checkstop In Processor 1 N25 I OVDD —

CKSTP_OUT0 Checkstop Out Processor 0 U29 O OVDD 2, 4

CKSTP_OUT1 Checkstop Out Processor 1 T25 O OVDD 2, 4

Debug

TRIG_IN Trigger In P26 I OVDD —

TRIG_OUT/READY_P0/QUIES

Trigger Out / Ready Processor

0/ Quiesce

P25 O OVDD 21

READY_P1 Ready Processor 1 N28 O OVDD 5, 9

MSRCID[0:1] Memory Debug Source Port ID U27, T29 O OVDD 5, 9, 30

MSRCID[2:4] Memory Debug Source Port ID U28, W24, W28 O OVDD 21

MDVAL Memory Debug Data Valid V26 O OVDD 2, 21

CLK_OUT Clock Out U32 O OVDD 11

Clock

RTC Real Time Clock V25 I OVDD —

SYSCLK System Clock Y32 I OVDD —

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

110 Freescale Semiconductor

Package Description

DDRCLK DDR Clock AA29 I OVDD 31

JTAG

TCK Test Clock T28 I OVDD

TDI Test Data In T27 I OVDD 12

TDO Test Data Out T26 O OVDD —

TMS Test Mode Select U26 I OVDD 12

TRST Test Reset AA32 I OVDD 12

DFT

L1_TSTCLK L1 Test Clock V32 I OVDD 18

L2_TSTCLK L2 Test Clock V31 I OVDD 18

LSSD_MODE LSSD Mode N24 I OVDD 18

TEST_SEL Test Select 0 K28 I OVDD 18

Power Management

ASLEEP Asleep P28 O OVDD 9, 15, 21

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 111

Package Description

Power and Ground Signals

GND Ground A18, A25, A29, C3, C6,

C9, C12, C15, C20,

C22, E5, E8, E11, E14,

F3, G7, G10, G13,

G16, H5, H21, J3, J9,

J12, J18, K7, L5, L13,

L15, L16, L21, M3, M9,

M12, M14, M16, M18,

N7, N13, N15, N17,

N19, N21, N23, P5,

P12, P14, P16, P20,

P22, R3, R9, R11, R13,

R15, R17, R19, R21,

R23, R26, T7, T12,

T14, T16, T18, T20,

T22, T30, U5, U11,

U13, U15, U16, U17,

U19, U21, U23, U25,

V3, V9, V12, V14, V16,

V18, V20, V22, W7,

W11, W13, W15, W17,

W19, W21, W27, W32,

Y5, Y12, Y14, Y16,

Y18, Y20, AA3, AA9,

AA13, AA15, AA17,

AA19, AA21, AA30,

AB7, AB26, AC5,

AC11, AC13, AD3,

AD9, AD14, AD17,

AD22, AE7, AE13,

AF5, AF11, AG3, AG9,

AG15, AG19, AH7,

AH13, AH22, AJ5,

AJ11, AJ17, AK3, AK9,

AK15, AK24, AL7,

AL13, AL19, AL26

———

XGND_SRDS1 SerDes Transceiver Pad GND

(xpadvss)

C23, C27, D23, D25,

E23, E26, F23, F24,

G23, G27, H23, H25,

J23, J26, K23, K24,

L27, M25

———

XGND_SRDS2 SerDes Transceiver Pad GND

(xpadvss)

AD23, AD25, AE23,

AE27, AF23, AF24,

AG23, AG26, AH23,

AH25, AJ27

———

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

112 Freescale Semiconductor

Package Description

SGND_SRDS1 SerDes Transceiver Core Logic

GND (xcorevss)

C28, C32, D30, E31,

F28, F29, G32, H28,

H30, J28, K29, L32,

M30, N31, P29, R32

———

SGND_SRDS2 SerDes Transceiver Core Logic

GND (xcorevss)

AE28, AE30, AF28,

AF32, AG28, AG30,

AH28, AJ28, AJ31,

AL32

———

AGND_SRDS1 SerDes PLL GND J31 — — —

AGND_SRDS2 SerDes PLL GND AH31 — — —

OVDD General I/O Supply U31, V24, V28, Y31,

AA27, AB25, AB29

—OVDD—

LVDD TSEC 1&2 I/O Supply AC18, AC21, AG21,

AL27

—LVDD—

TVDD TSEC 3&4 I/O Supply AC15, AE16, AH18 — TVDD —

GVDD SSTL_1.8 DDR Supply B2, B5, B8, B11, B14,

D4, D7, D10, D13, E2,

F6, F9, F12, G4, H2,

H8, H11, H14, J6, K4,

K10, K13, L2, L8, M6,

N4, N10, P2, P8, R6,

T4, T10, U2, U8, V6,

W4, W10, Y2, Y8, AA6,

AB4, AB10, AC2, AC8,

AD6, AD12, AE4,

AE10, AF2, AF8, AG6,

AG12, AH4, AH10,

AH16, AJ2, AJ8, AJ14,

AK6, AK12, AK18, AL4,

AL10, AL16, AM2

—GVDD—

BVDD Local Bus and GPIO Supply A26, A30, B21, D16,

D21, F18, G20, H17,

J22, K15, K20

— BVDD —

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 113

Package Description

VDD Core, L2, Logic Supply L14, M13, M15, M17,

N12, N14, N16, N20,

N22, P11, P13, P15,

P17, P19, P21, P23,

R12, R14, R16, R18,

R20, R22, T13, T15,

T19, T21, T23, U12,

U14, U18, U20, U22,

V13, V15, V17, V19,

V21, W12, W14, W16,

W18, W20, W22, Y13,

Y15, Y17, Y19, Y21,

AA12, AA14, AA16,

AA18, AA20, AB13

—VDD—

SVDD_SRDS1 SerDes Core 1 Logic Supply

(xcorevdd)

C31, D29, E28, E32,

F30, G28, G31, H29,

K30, L31, M29, N32,

P30

———

SVDD_SRDS2 SerDes Core 2 Logic Supply

(xcorevdd)

AD32, AF31, AG29,

AJ32, AK29, AK30

———

XVDD_SRDS1 SerDes1 Transceiver Supply

(xpadvdd)

C26, D24, E27, F25,

G26, H24, J27, K25,

L26, M24, N27

———

XVDD_SRDS2 SerDes2 Transceiver Supply

(xpadvdd)

AD24, AD28, AE26,

AF25, AG27, AH24,

AJ26

———

AVDD_LBIU Local Bus PLL Supply A19 — — 19

AVDD_DDR DDR PLL Supply AM20 — — 19

AVDD_CORE0 CPU PLL Supply B18 — — 19

AVDD_CORE1 CPU PLL Supply A17 — — 19

AVDD_PLAT Platform PLL Supply AB32 — — 19

AVDD_SRDS1 SerDes1 PLL Supply J29 — — 19

AVDD_SRDS2 SerDes2 PLL Supply AH29 — — 19

SENSEVDD VDD Sensing Pin N18 — — 13

SENSEVSS GND Sensing Pin P18 — — 13

Analog Signals

MVREF1 SSTL_1.8 Reference Voltage C16 I GVDD/2 —

MVREF2 SSTL_1.8 Reference Voltage AM19 I GVDD/2 —

SD1_IMP_CAL_RX SerDes1 Rx Impedance

Calibration

B32 I 200Ω

(±1%) to

GND

—

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

114 Freescale Semiconductor

Package Description

SD1_IMP_CAL_TX SerDes1 Tx Impedance

Calibration

T32 I 100Ω

(±1%) to

GND

—

SD1_PLL_TPA SerDes1 PLL Test Point Analog J30 O AVDD_S

RDS

analog

SD2_IMP_CAL_RX SerDes2 Rx Impedance

Calibration

AC32 I 200Ω

(±1%) to

GND

—

SD2_IMP_CAL_TX SerDes2 Tx Impedance

Calibration

AM32 I 100Ω

(±1%) to

GND

—

SD2_PLL_TPA SerDes2 PLL Test Point Analog AH30 O AVDD_S

RDS

analog

TEMP_ANODE Temperature Diode Anode AA31 — internal

diode

TEMP_CATHODE Temperature Diode Cathode AB31 — internal

diode

No Connection Pins

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 115

Package Description

N/C No Connection A16, A20, B16, B17,

B19, B20, C17, C18,

C19, D28, R31, T17,

V23, W23, Y22, Y23,

Y24, AA24, AB24,

AC24, AC26, AC27,

AC29, AD31, AE29,

AJ25, AK28, AL31,

AM21

——17

Note:

1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the

local bus controller section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2.

2. Recommend a weak pull-up resistor (2–10 KΩ) be placed on this pin to OVDD.

4. This pin is an open drain signal.

5. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the

reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kO pull-down resistor. However, if the

signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net at

reset, then a pullup or active driver is needed.

6. Treat these pins as no connects (NC) unless using debug address functionality.

7. The value of LA[29:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down

resistors. See Section 19.2, “CCB/SYSCLK PLL Ratio.”

8. The value of LALE, LGPL2 and LBCTL at reset set the e500 core clock to CCB Clock PLL ratio. These pins require 4.7-kΩ

pull-up or pull-down resistors. See the Section 19.3, “e500 Core PLL Ratio.”

9. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or

because it has other manufacturing test functions. This pin therefore be described as an I/O for boundary scan.

10. If this pin is configured for local bus controller usage, recommend a weak pull-up resistor (2-10 KΩ) be placed on this pin to

BVDD, to ensure no random chip select assertion due to possible noise and so on.

11. This output is actively driven during reset rather than being three-stated during reset.

12. These JTAG pins have weak internal pull-up P-FETs that are always enabled.

13. These pins are connected to the VDD/GND planes internally and may be used by the core power supply to improve tracking

and regulation.

14. Internal thermally sensitive diode.

15. If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state

during reset.

16. This pin is only an output in FIFO mode when used as Rx Flow Control.

17. Do not connect.

18. These are test signals for factory use only and must be pulled up (100 Ω - 1 KΩ) to OVDD for normal machine operation.

19. Independent supplies derived from board VDD.

20. Recommend a pull-up resistor (~1 KΩ) be placed on this pin to OVDD.

21. The following pins must NOT be pulled down during power-on reset: DMA1_DACK[0:1], EC5_MDC, HRESET_REQ,

TRIG_OUT/READY_P0/QUIESCE, MSRCID[2:4], MDVAL, ASLEEP.

22. This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is

actively driven.

23. This pin is only an output in eTSEC3 FIFO mode when used as Rx flow control.

24. TSEC2_TXD[1] is used as cfg_dram_type. IT MUST BE VALID AT POWER-UP, EVEN BEFORE HRESET ASSERTION.

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

116 Freescale Semiconductor

Package Description

25. When operating in DDR2 mode, connect Dn_MDIC[0] to ground through 18.2-Ω (full-strength mode) or 36.4-Ω (half-strength

mode) precision 1% resistor, and connect Dn_MDIC[1] to GVDD through 18.2-Ω (full-strength mode) or 36.4-Ω

(half-strength mode) precision 1% resistor. When operating in DDR3 mode, connect Dn_MDIC[0] to ground through 20-Ω

(full-strength mode) or 40-Ω (half-strength mode) precision 1% resistor, and connect Dn_MDIC[1] to GVDD through 20-Ω

(full-strength mode) or 40-Ω (half-strength mode) precision 1% resistor. These pins are used for automatic calibration of the

DDR IOs.

26. These pins should be connected to XVDD_SRDS1.

27. These pins should be pulled to ground (XGND_SRDS1) through a 300-Ω (±10%) resistor.

28. These pins should be left floating.

29. These pins should be pulled up to TVDD through a 2–10 KΩ resistor.

30. These pins have other manufacturing or debug test functions. It is recommended to add both pull-up resistor pads to OVDD

and pull-down resistor pads to GND on board to support future debug testing when needed.

31. DDRCLK input is only required when the MPC8572E DDR controller is running in asynchronous mode. When the DDR

controller is configured to run in synchronous mode via POR setting cfg_ddr_pll[0:2]=111, the DDRCLK input is not

required. It is recommended to tie it off to GND when DDR controller is running in synchronous mode. See the MPC8572E

PowerQUICC™ III Integrated Host Processor Family Reference Manual Rev.0, Table 4-3 in section 4.2.2 “Clock Signals”,

section 4.4.3.2 “DDR PLL Ratio” and Table 4-10 “DDR Complex Clock PLL Ratio” for more detailed description regarding

DDR controller operation in asynchronous and synchronous modes.

32. EC_GTX_CLK125 is a 125-MHz input clock shared among all eTSEC ports in the following modes: GMII, TBI, RGMII and

RTBI. If none of the eTSEC ports is operating in these modes, the EC_GTX_CLK125 input can be tied off to GND.

33. These pins should be pulled to ground (GND).

34. These pins are sampled at POR for General Purpose configuration use by software. Their value has no impact on the

functionality of the hardware.

Table 76. MPC8572E Pinout Listing (continued)

Signal Signal Name Package Pin Number Pin Type Power

Supply Notes

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 117

Clocking

19 Clocking

This section describes the PLL configuration of the MPC8572E. Note that the platform clock is identical

to the core complex bus (CCB) clock.

19.1 Clock Ranges

Table 77 provides the clocking specifications for both processor cores.

The DDR memory controller can run in either synchronous or asynchronous mode. When running in

synchronous mode, the memory bus is clocked relative to the platform clock frequency. When running in

asynchronous mode, the memory bus is clocked with its own dedicated PLL with clock provided on

DDRCLK input pin. Table 78 provides the clocking specifications for the memory bus.

Table 77. MPC8572E Processor Core Clocking Specifications

Characteristic

Maximum Processor Core Frequency

Unit Notes1067 MHz 1200 MHz 1333 MHz 1500 MHz

Min Max Min Max Min Max Min Max

e500 core processor frequency 800 1067 800 1200 800 1333 800 1500 MHz 1, 2

CCB frequency 400 533 400 533 400 533 400 600 MHz

DDR Data Rate 400 667 400 667 400 667 400 800 MHz

Notes:

1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK

frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating

frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” Section 19.3, “e500 Core PLL Ratio,” and Section 19.4,

“DDR/DDRCLK PLL Ratio,” for ratio settings.

2. The processor core frequency speed bins listed also reflect the maximum platform (CCB) and DDR data rate frequency

supported by production test. Running CCB and/or DDR data rate higher than the limit shown above, although logically

possible via valid clock ratio setting in some condition, is not supported.

Table 78. Memory Bus Clocking Specifications

Characteristic Min Max Unit Notes

Memory bus clock frequency 200 400 MHz 1, 2, 3, 4

Notes:

1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting

SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum

operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” Section 19.3, “e500 Core PLL Ratio,” and

Section 19.4, “DDR/DDRCLK PLL Ratio,” for ratio settings.

2. The Memory bus clock refers to the MPC8572E memory controllers’ Dn_MCK[0:5] and Dn_MCK[0:5] output clocks, running

at half of the DDR data rate.

3. In synchronous mode, the memory bus clock speed is half the platform clock frequency. In other words, the DDR data rate is

the same as the platform (CCB) frequency. If the desired DDR data rate is higher than the platform (CCB) frequency,

asynchronous mode must be used.

4. In asynchronous mode, the memory bus clock speed is dictated by its own PLL. Refer to Section 19.4, “DDR/DDRCLK PLL

Ratio.” The memory bus clock speed must be less than or equal to the CCB clock rate which in turn must be less than the

DDR data rate.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

118 Freescale Semiconductor

Clocking

As a general guideline when selecting the DDR data rate or platform (CCB) frequency, the following

procedures can be used:

• Start with the processor core frequency selection;

• After the processor core frequency is determined, select the platform (CCB) frequency from the

limited options listed in Table 80 and Table 81;

• Check the CCB to SYSCLK ratio to verify a valid ratio can be choose from Table 79;

• If the desired DDR data rate can be same as the CCB frequency, use the synchronous DDR mode;

Otherwise, if a higher DDR data rate is desired, use asynchronous mode by selecting a valid DDR

data rate to DDRCLK ratio from Table 82. Note that in asynchronous mode, the DDR data rate

must be greater than the platform (CCB) frequency. In other words, running DDR data rate lower

than the platform (CCB) frequency in asynchronous mode is not supported by MPC8572E.

• Verify all clock ratios to ensure that there is no violation to any clock and/or ratio specification.

19.2 CCB/SYSCLK PLL Ratio

The CCB clock is the clock that drives the e500 core complex bus (CCB), and is also called the platform

clock. The frequency of the CCB is set using the following reset signals, as shown in Table 79:

• SYSCLK input signal

• Binary value on LA[29:31] at power up

Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note

that, in synchronous mode, the DDR data rate is the determining factor in selecting the CCB bus frequency,

because the CCB frequency must equal the DDR data rate. In asynchronous mode, the memory bus clock

frequency is decoupled from the CCB bus frequency.

19.3 e500 Core PLL Ratio

The clock speed for each e500 core can be configured differently, determined by the values of various

signals at power up.

Table 79. CCB Clock Ratio

Binary Value of

LA[29:31] Signals CCB:SYSCLK Ratio

000 4:1

001 5:1

010 6:1

011 8:1

100 10:1

101 12:1

110 Reserved

111 Reserved

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 119

Clocking

Table 80 describes the clock ratio between e500 Core0 and the e500 core complex bus (CCB). This ratio

is determined by the binary value of LBCTL, LALE and LGPL2/LOE/LFRE at power up, as shown in

Table 80.

Table 81 describes the clock ratio between e500 Core1 and the e500 core complex bus (CCB). This ratio

is determined by the binary value of LWE[0]/LBS[0]/LFWE, UART_SOUT[1], and READY_P1 signals

at power up, as shown in Table 81.

19.4 DDR/DDRCLK PLL Ratio

The dual DDR memory controller complexes can be synchronous with, or asynchronous to, the CCB,

depending on configuration.

Table 82 describes the clock ratio between the DDR memory controller complexes and the DDR PLL

reference clock, DDRCLK, which is not the memory bus clock. The DDR memory controller complexes

clock frequency is equal to the DDR data rate.

When synchronous mode is selected, the memory buses are clocked at half the CCB clock rate. The default

mode of operation is for the DDR data rate for both DDR controllers to be equal to the CCB clock rate in

synchronous mode, or the resulting DDR PLL rate in asynchronous mode.

In asynchronous mode, the DDR PLL rate to DDRCLK ratios listed in Table 82 reflects the DDR data rate

to DDRCLK ratio, because the DDR PLL rate in asynchronous mode means the DDR data rate resulting

from DDR PLL output.

Table 80. e500 Core0 to CCB Clock Ratio

Binary Value of

LBCTL, LALE,

LGPL2/LOE/LFRE

Signals

e500 Core0:CCB Clock Ratio

Binary Value of

LBCTL, LALE,

LGPL2/LOE/LFRE

Signals

e500 Core0:CCB Clock Ratio

000 Reserved 100 2:1

001 Reserved 101 5:2 (2.5:1)

010 Reserved 110 3:1

011 3:2 (1.5:1) 111 7:2 (3.5:1)

Table 81. e500 Core1 to CCB Clock Ratio

Binary Value of

LWE[0]/LBS[0]/

LFWE, UART_SOUT[1],

READY_P1 Signals

e500 Core1:CCB Clock Ratio

Binary Value of

LWE[0]/LBS[0]/

LFWE, UART_SOUT[1],

READY_P1 Signals

e500 Core1:CCB Clock Ratio

000 Reserved 100 2:1

001 Reserved 101 5:2 (2.5:1)

010 Reserved 110 3:1

011 3:2 (1.5:1) 111 7:2 (3.5:1)

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

120 Freescale Semiconductor

Clocking

Note that the DDR PLL reference clock input, DDRCLK, is only required in asynchronous mode.

MPC8572E does not support running one DDR controller in synchronous mode and the other in

asynchronous mode.

19.5 Frequency Options

19.5.1 Platform to Sysclk Frequency Options

Table 83 shows the expected frequency values for the platform frequency when using the specified CCB

clock to SYSCLK ratio.

Table 82. DDR Clock Ratio

Binary Value of

TSEC_1588_CLK_OUT,

TSEC_1588_PULSE_OUT1,

TSEC_1588_PULSE_OUT2 Signals

DDR:DDRCLK Ratio

000 3:1

001 4:1

010 6:1

011 8:1

100 10:1

101 12:1

110 14:1

111 Synchronous mode

Table 83. Frequency Options for Platform Frequency

CCB to

SYSCLK Ratio SYSCLK (MHz)

33.33 41.66 50 66.66 83 100 111 133.33

Platform /CCB Frequency (MHz)

4400 444 533

5415 500 555

6 400 498 600

8400 533

10 417 500

12 400 500 600

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 121

Thermal

19.5.2 Minimum Platform Frequency Requirements for High-Speed

Interfaces

Section 4.4.3.6, “I/O Port Selection,” in the MPC8572E PowerQUICC III Integrated Host Processor

Family Reference Manual describes various high-speed interface configuration options. Note that the CCB

clock frequency must be considered for proper operation of such interfaces as described below.

For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:

See Section 21.1.3.2, “Link Width,” in the MPC8572E PowerQUICC III Integrated Host Processor

Family Reference Manual for PCI Express interface width details. Note that the “PCI Express link width”

in the above equation refers to the negotiated link width as the result of PCI Express link training, which

may or may not be the same as the link width POR selection.

For proper serial RapidIO operation, the CCB clock frequency must be greater than:

See Section 20.4, “1x/4x LP-Serial Signal Descriptions,” in the MPC8572E PowerQUICC III Integrated

Host Processor Family Reference Manual for Serial RapidIO interface width and frequency details.

20 Thermal

This section describes the thermal specifications of the MPC8572E.

Table 84 shows the thermal characteristics for the package, 1023 33 ×33 FC-PBGA.

The package uses a 29.6 × 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink

force is 10 pounds force (45 Newton).

Table 84. Package Thermal Characteristics

Rating Board Symbol Value Unit Notes

Junction to ambient, natural convection Single-layer (1s) RΘJA 15 °C/W 1, 2

Junction to ambient, natural convection Four-layer (2s2p) RΘJA 11 °C/W 1, 3

Junction to ambient (at 200 ft./min.) Single-layer (1s) RΘJMA 11 °C/W 1, 3

Junction to ambient (ar 200 ft./min.) Four-layer (2s2p) RΘJMA 8°C/W 1, 3

Junction to board — RΘJB 4°C/W 4

527 MHz PCI Express link width()×

----------------------------------------------------------------------------------------------

20.80()serial RapidIO interface frequency()×× serial RapidIO link width()×

-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

122 Freescale Semiconductor

Thermal

20.1 Temperature Diode

The MPC8572E has a temperature diode on the microprocessor that can be used in conjunction with other

system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the

negative temperature coefficient of a diode operated at a constant current to determine the temperature of

the microprocessor and its environment. It is recommended that each MPC8572E device be calibrated.

The following are the specifications of the on-board temperature diode:

Vf > 0.40 V

Vf < 0.90 V

Operating range 2–300 μA

Diode leakage < 10 nA @ 125°C

An approximate value of the ideality may be obtained by calibrating the device near the expected

operating temperature.

Ideality factor is defined as the deviation from the ideal diode equation:

Another useful equation is:

Where:

Ifw = Forward current

Is = Saturation current

Vd = Voltage at diode

Junction to case — RΘJC 0.5 °C/W 5

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance

2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

5. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method

(MIL SPEC-883, Method 1012.1).

Table 84. Package Thermal Characteristics (continued)

Rating Board Symbol Value Unit Notes

Ifw = Is e – 1

qVf___

nKT

VH – VL = n ln

IH__

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 123

System Design Information

Vf = Voltage forward biased

VH = Diode voltage while IH is flowing

VL = Diode voltage while IL is flowing

IH = Larger diode bias current

IL = Smaller diode bias current

q = Charge of electron (1.6 x 10 –19 C)

n = Ideality factor (normally 1.0)

K = Boltzman’s constant (1.38 x 10–23 Joules/K)

T = Temperature (Kelvins)

The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following:

Solving for T, the equation becomes:

21 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC8572E.

21.1 System Clocking

The platform PLL generates the platform clock from the externally supplied SYSCLK input. The

frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio configuration

bits as described in Section 19.2, “CCB/SYSCLK PLL Ratio.” The MPC8572E includes seven PLLs, with

the following functions:

• Two core PLLs have ratios that are individually configurable. Each e500 core PLL generates the

core clock as a slave to the platform clock. The frequency ratio between the e500 core clock and

the platform clock is selected using the e500 PLL ratio configuration bits as described in

Section 19.3, “e500 Core PLL Ratio.”

• The DDR complex PLL generates the clocking for the DDR controllers.

• The local bus PLL generates the clock for the local bus.

• The PLL for the SerDes1 module is used for PCI Express and Serial Rapid IO interfaces.

• The PLL for the SerDes2 module is used for the SGMII interface.

VH – VL = 1.986 × 10–4 × nT

nT =

VH – VL

__________

1.986 × 10–4

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

124 Freescale Semiconductor

System Design Information

21.2 Power Supply Design

21.2.1 PLL Power Supply Filtering

Each of the PLLs listed above is provided with power through independent power supply pins

(AVDD_PLAT, AVDD_CORE0, AVDD_CORE1, AVDD_DDR, AVDD_LBIU, AVDD_SRDS1 and

AV DD_SRDS2 respectively). The AVDD level should always be equivalent to VDD, and preferably these

voltages are derived directly from VDD through a low frequency filter scheme such as the following.

There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to

provide independent filter circuits per PLL power supply as illustrated in Figure 62, one to each of the

AV DD pins. By providing independent filters to each PLL the opportunity to cause noise injection from

one PLL to the other is reduced.

This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz

range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).

Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook

of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a

single large value capacitor.

Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize

noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD

pin, which is on the periphery of the 1023 FC-PBGA footprint, without the inductance of vias.

Figure 62 shows the PLL power supply filter circuits.

Figure 62. PLL Power Supply Filter Circuit

NOTE

It is recommended to have the minimum number of vias in the AVDD trace

for board layout. For example, zero vias might be possible if the AVDD filter

is placed on the component side. One via might be possible if it is placed on

the opposite of the component side. Additionally, all traces for AVDD and

the filter components should be low impedance, 10 to 15 mils wide and

short. This includes traces going to GND and the supply rails they are

filtering.

The AVDD_SRDSn signal provides power for the analog portions of the SerDesn PLL. To ensure stability

of the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in

following figure. For maximum effectiveness, the filter circuit is placed as closely as possible to the

AV DD_SRDSn ball to ensure it filters out as much noise as possible. The ground connection should be near

the AVDD_SRDSn ball. The 0.003-µF capacitor is closest to the ball, followed by the two 2.2 µF

capacitors, and finally the 1 Ω resistor to the board supply plane. The capacitors are connected from

VDD AVDD

2.2 µF 2.2 µF

GND Low ESL Surface Mount Capacitors

10 Ω

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 125

System Design Information

AV DD_SRDSn to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant

frequency. All traces should be kept short, wide and direct.

Figure 63. SerDes PLL Power Supply Filter

NOTE

AV DD_SRDSn should be a filtered version of SVDD_SRDSn.

NOTE

Signals on the SerDesn interface are fed from the XVDD_SRDSn power

plane.

21.3 Decoupling Recommendations

Due to large address and data buses, and high operating frequencies, the device can generate transient

power surges and high frequency noise in its power supply, especially while driving large capacitive loads.

This noise must be prevented from reaching other components in the MPC8572E system, and the device

itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system

designer place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and LVDD pin

of the device. These decoupling capacitors should receive their power from separate VDD,TVDD, BVDD,

OVDD, GVDD, and LVDD, and GND power planes in the PCB, utilizing short traces to minimize

inductance. Capacitors may be placed directly under the device using a standard escape pattern. Others

may surround the part.

These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)

capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.

Additionally, it is recommended that there be several bulk storage capacitors distributed around the PCB,

feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the

smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating

to ensure the quick response time necessary. They should also be connected to the power and ground

planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS

tantalum or Sanyo OSCON).

21.4 SerDes Block Power Supply Decoupling Recommendations

The SerDes1 and SerDes2 blocks require a clean, tightly regulated source of power (SVDD_SRDSn and

XVDD_SRDSn) to ensure low jitter on transmit and reliable recovery of data in the receiver. An

appropriate decoupling scheme is outlined below.

Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections

from all capacitors to power and ground should be done with multiple vias to further reduce inductance.

2.2 µF 10.003 µF

GND

1.0 Ω

AVDD_SRDSn

1. An 0805 sized capacitor is recommended for system initial bring-up.

SVDD_SRDSn

2.2 µF 1

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

126 Freescale Semiconductor

System Design Information

• First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible

to the supply balls of the device. Where the board has blind vias, these capacitors should be placed

directly below the chip supply and ground connections. Where the board does not have blind vias,

these capacitors should be placed in a ring around the device as close to the supply and ground

connections as possible.

• Second, there should be a 1-µF ceramic chip capacitor from each SerDes supply (SVDD_SRDSn

and XVDD_SRDSn) to the board ground plane on each side of the device. This should be done for

all SerDes supplies.

• Third, between the device and any SerDes voltage regulator there should be a 10-µF, low

equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT

tantalum chip capacitor. This should be done for all SerDes supplies.

21.5 Connection Recommendations

To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal

level. All unused active low inputs should be tied to VDD,TVDD, BVDD, OVDD, GVDD, and LVDD, as

required. All unused active high inputs should be connected to GND. All NC (no-connect) signals must

remain unconnected. Power and ground connections must be made to all external VDD,TVDD, BVDD,

OVDD, GVDD, and LVDD, and GND pins of the device.

21.6 Pull-Up and Pull-Down Resistor Requirements

The MPC8572E requires weak pull-up resistors (2–10 kΩ is recommended) on open drain type pins

including I2C pins and MPIC interrupt pins.

Correct operation of the JTAG interface requires configuration of a group of system control pins as

demonstrated in Figure 66. Care must be taken to ensure that these pins are maintained at a valid deasserted

state under normal operating conditions as most have asynchronous behavior and spurious assertion gives

unpredictable results.

The following pins must NOT be pulled down during power-on reset: DMA_DACK[0:1], EC5_MDC,

HRESET_REQ, TRIG_OUT/READY_P0/QUIESCE, MSRCID[2:4], MDVAL, and ASLEEP. The

TEST_SEL pin must be set to a proper state during POR configuration. For more details, refer to the pinlist

table of the individual device.

21.7 Output Buffer DC Impedance

The MPC8572E drivers are characterized over process, voltage, and temperature. For all buses, the driver

is a push-pull single-ended driver type (open drain for I2C).

To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD

or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 64). The

output impedance is the average of two components, the resistances of the pull-up and pull-down devices.

When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals

OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each

other in value. Then, Z0 = (RP + RN)/2.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 127

System Design Information

Figure 64. Driver Impedance Measurement

OVDD

OGND

Pad

Data

SW1

SW2

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

128 Freescale Semiconductor

System Design Information

Table 85 summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD,

nominal OVDD, 105°C.

21.8 Configuration Pin Muxing

The MPC8572E provides the user with power-on configuration options which can be set through the use

of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible

configuration pins). These pins are generally used as output only pins in normal operation.

While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins

while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled

and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped

with an on-chip gated resistor of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to pull

the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and

for platform /system clocks after HRESET deassertion to ensure capture of the reset value). When the input

receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with

minimal signal quality or delay disruption. The default value for all configuration bits treated this way has

been encoded such that a high voltage level puts the device into the default state and external resistors are

needed only when non-default settings are required by the user.

Careful board layout with stubless connections to these pull-down resistors coupled with the large value

of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus

configured.

The platform PLL ratio, DDR complex PLL and e500 PLL ratio configuration pins are not equipped with

these default pull-up devices.

21.9 JTAG Configuration Signals

Correct operation of the JTAG interface requires configuration of a group of system control pins as

demonstrated in Figure 66. Care must be taken to ensure that these pins are maintained at a valid deasserted

state under normal operating conditions as most have asynchronous behavior and spurious assertion gives

unpredictable results.

Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the

IEEE Std 1149.1 specification, but it is provided on all processors built on Power Architecture technology.

The device requires TRST to be asserted during power-on reset flow to ensure that the JTAG boundary

logic does not interfere with normal chip operation. While the TAP controller can be forced to the reset

Table 85. Impedance Characteristics

Impedance

Local Bus, Ethernet, DUART,

Control, Configuration, Power

Management

DDR DRAM Symbol Unit

RN45 Target 18 Target (full strength mode)

36 Target (half strength mode)

Z0Ω

RP45 Target 18 Target (full strength mode)

36 Target (half strength mode)

Z0Ω

Note: Nominal supply voltages. See Ta bl e 1 , Tj = 105°C.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 129

System Design Information

state using only the TCK and TMS signals, generally systems assert TRST during the power-on reset flow.

Simply tying TRST to HRESET is not practical because the JTAG interface is also used for accessing the

common on-chip processor (COP), which implements the debug interface to the chip.

The COP function of these processors allow a remote computer system (typically, a PC with dedicated

hardware and debugging software) to access and control the internal operations of the processor. The COP

interface connects primarily through the JTAG port of the processor, with some additional status

monitoring signals. The COP port requires the ability to independently assert HRESET or TRST to fully

control the processor. If the target system has independent reset sources, such as voltage monitors,

watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be

merged into these signals with logic.

The arrangement shown in Figure 66 allows the COP port to independently assert HRESET or TRST,

while ensuring that the target can drive HRESET as well.

The COP interface has a standard header, shown in Figure 65, for connection to the target system, and is

based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The

connector typically has pin 14 removed as a connector key.

The COP header adds many benefits such as breakpoints, watchpoints, register and memory

examination/modification, and other standard debugger features. An inexpensive option can be to leave

the COP header unpopulated until needed.

There is no standardized way to number the COP header; so emulator vendors have issued many different

pin numbering schemes. Some COP headers are numbered top-to-bottom then left-to-right, while others

use left-to-right then top-to-bottom. Still others number the pins counter-clockwise from pin 1 (as with an

IC). Regardless of the numbering scheme, the signal placement recommended in Figure 65 is common to

all known emulators.

21.9.1 Termination of Unused Signals

If the JTAG interface and COP header is not used, Freescale recommends the following connections:

•TRST should be tied to HRESET through a 0 kΩ isolation resistor so that it is asserted when the

system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during

the power-on reset flow. Freescale recommends that the COP header be designed into the system

as shown in Figure 66. If this is not possible, the isolation resistor allows future access to TRST in

case a JTAG interface may need to be wired onto the system in future debug situations.

• No pull-up/pull-down is required for TDI, TMS, TDO or TCK.

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

130 Freescale Semiconductor

System Design Information

Figure 65. COP Connector Physical Pinout

KEY

No pin

COP_TDO

COP_TDI

COP_TRST

COP_VDD_SENSE

COP_CHKSTP_IN

GND

COP_TCK

COP_TMS

COP_SRESET

COP_HRESET

COP_CHKSTP_OUT

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 131

System Design Information

Figure 66. JTAG Interface Connection

HRESET

From Target

Board Sources

COP_HRESET

COP_SRESET

SRESET

COP_VDD_SENSE2

10 Ω

10 kΩ

COP_CHKSTP_IN CKSTP_IN0

COP_TMS

COP_TDO

COP_TDI

COP_TCK

TMS

TDO

TDI

4COP_TRST

(if any)

COP Header

14 3

Notes:

10 kΩ

TRST1

10 kΩ

CKSTP_OUT0

COP_CHKSTP_OUT

KEY

No pin

COP Connector

Physical Pinout

SRESET

2. Populate this with a 10 Ω resistor for short-circuit/current-limiting protection.

OVDD

10 kΩHRESET1

to fully control the processor as shown here.

1. The COP port and target board should be able to independently assert HRESET and TRST to the processor

signal integrity.

TCK

5.This switch is included as a precaution for BSDL testing. The switch should be closed to position A during BSDL testing

to position B.

10 kΩ

Asserting SRESET causes a machine check interrupt to the e500 cores.

3. T

he KEY location (pin 14) is not physically present on the COP header.

4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for improved

to avoid accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed

510 kΩ

CKSTP_OUT1

CKSTP_IN1

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

132 Freescale Semiconductor

System Design Information

21.10 Guidelines for High-Speed Interface Termination

21.10.1 SerDes 1 Interface Entirely Unused

If the high-speed SerDes 1 interface is not used at all, the unused pin should be terminated as described in

this section.

The following pins must be left unconnected (float):

• SD1_TX[7:0]

• Reserved pins C24, C25, H26, H27

The following pins must be connected to XGND_SRDS1:

• SD1_RX[7:0]

• SD1_REF_CLK

•SD1_REF_CLK

Pins K32 and C29 must be tied to XVDD_SRDS1. Pins K31 and C30 must be tied to XGND_SRDS1

through a 300-Ω resistor.

The POR configuration pin cfg_srds1_en on TSEC2_TXD[5] can be used to power down SerDes 1 block

for power saving. Note that both SVDD_SRDS1 and XVDD_SRDS1 must remain powered.

21.10.2 SerDes 1 Interface Partly Unused

If only part of the high speed SerDes 1 interface pins are used, the remaining high-speed serial I/O pins

should be terminated as described in this section.

The following pins must be left unconnected (float) if not used:

• SD1_TX[7:0]

• Reserved pins: C24, C25, H26, H27

The following pins must be connected to XGND_SRDS1 if not used:

• SD1_RX[7:0]

Pins K32 and C29 must be tied to XVDD_SRDS1. Pins K31 and C30 must be tied to XGND_SRDS1

through a 300-Ω resistor.

21.10.3 SerDes 2 Interface (SGMII) Entirely Unused

If the high-speed SerDes 2 interface (SGMII) is not used at all, the unused pin should be terminated as

described in this section.

The following pins must be left unconnected (float):

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 133

System Design Information

• SD2_TX[3:0]

• Reserved pins: AF26, AF27

The following pins must be connected to XGND_SRDS2:

• SD2_RX[3:0]

• SD2_REF_CLK

•SD2_REF_CLK

The POR configuration pin cfg_srds_sgmii_en on UART_RTS[1] can be used to power down SerDes 2

block for power saving. Note that both SVDD_SRDS2 and XVDD_SRDS2 must remain powered.

21.10.4 SerDes 2 Interface (SGMII) Partly Unused

If only part of the high speed SerDes 2 interface (SGMII) pins are used, the remaining high-speed serial

I/O pins should be terminated as described in this section.

The following pins must be left unconnected (float):

• SD2_TX[3:0]

• Reserved pins: AF26, AF27

The following pins must be connected to XGND_SRDS2:

• SD2_RX[3:0]

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

134 Freescale Semiconductor

Ordering Information

22 Ordering Information

Ordering information for the parts fully covered by this specification document is provided in

Section 22.1, “Part Numbers Fully Addressed by this Document.”

22.1 Part Numbers Fully Addressed by this Document

Table 86 through Table 88 provide the Freescale part numbering nomenclature for the MPC8572E. Note

that the individual part numbers correspond to a maximum processor core frequency. For available

frequencies, contact your local Freescale sales office. In addition to the processor frequency, the part

numbering scheme also includes an application modifier which may specify special application

conditions. Each part number also contains a revision code which refers to the die mask revision number.

Table 86. Part Numbering Nomenclature—Rev 2.2.1

MPC nnnn e t l pp ffm r

Product

Code1

1MPC stands for “Qualified.”

PPC stands for “Prototype”

Part

Identifier

Security

Engine Temperature Power

Package

Sphere

Type2

2See Section 18, “Package Description,” for more information on the available package types.

Processor Frequency/

DDR Data Rate3

3Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification

support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core

frequencies.

4. The VT part number is ROHS-compliant with the permitted exception of the C4 die bumps.

5. The VJ part number is entirely lead-free. This includes the C4 die bumps.

Silicon

Revision

MPC

PPC

8572 E = Included Blank = 0 to 105°C

C=–40to105°C

Blank =

Standard

L=Low

PX =

Leaded,

FC-PBGA

VT = Pb-free,

FC-PBGA4

VJ = Fully

Pb-free

FC-PBGA5

AVN =

1500-MHz processor;

800 MT/s DDR data rate

AUL =

1333-MHz processor;

667 MT/s DDR data rate

AT L =

1200-MHz processor;

667 MT/s DDR data rate

ARL =

1067-MHz processor;

667 MT/s DDR data rate

E = Ver. 2.2.1

(SVR =

0x80E8_0022)

SEC included

Blank = Not

included

E = Ver. 2.2.1

(SVR =

0x80E0_0022)

SEC not

included

Notes:

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 135

Ordering Information

Table 87. Part Numbering Nomenclature—Rev 2.1

MPC nnnn e t l pp ffm r

Product

Code1

1MPC stands for “Qualified.”

PPC stands for “Prototype”

Part

Identifier

Security

Engine Temperature Power

Package

Sphere

Type2

2See Section 18, “Package Description,” for more information on the available package types.

Processor Frequency/

DDR Data Rate3

3Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification

support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core

frequencies.

Silicon

Revision

MPC

PPC

8572 E = Included Blank = 0 to 105°C

C = –40 to 105°C

Blank =

Standard

L=Low

PX =

Leaded,

FC-PBGA

VT = Pb-free,

FC-PBGA

AVN =

150- MHz processor;

800 MT/s DDR data rate

AUL =

1333-MHz processor;

667 MT/s DDR data rate

ATL =

1200-MHz processor;

667 MT/s DDR data rate

ARL =

1067-MHz processor;

667 MT/s DDR data rate

D= Ver. 2.1

(SVR =

0x80E8_0021)

SEC included

Blank = Not

included

D= Ver. 2.1

(SVR =

0x80E0_0021)

SEC not

included

Notes:

Table 88. Part Numbering Nomenclature—Rev 1.1.1

MPC nnnn e t pp ffm r

Product

Code1

1MPC stands for “Qualified.”

PPC stands for “Prototype”

Part

Identifier Security Engine Temperature Package Sphere

Type2

2See Section 18, “Package Description,” for more information on the available package types.

Processor Frequency/

DDR Data Rate3

Silicon

Revision

MPC

PPC

8572 E = Included Blank=0 to 105°C

C= –40 to 105°C

PX = Leaded,

FC-PBGA

VT = Pb-free,

FC-PBGA

AVN =

1500-MHz processor;

800 MT/s DDR data rate

AUL =

1333-MHz process or;

667 MT/s DDR datarate

AT L =

1200-MHz processor;

667 MT/s DDR data rate

ARL =

1067-MHz processor;

667 MT/s DDR data rate

B = Ver. 1.1.1

(SVR =

0x80E8_0011)

SEC included

Blank = Not

included

B = Ver. 1.1.1

(SVR =

0x80E0_0011)

SEC not included

Notes:

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

136 Freescale Semiconductor

Document Revision History

22.2 Part Marking

Parts are marked as the example shown in Figure 67.

Figure 67. Part Marking for FC-PBGA Device

Table 89 explains line four of Figure 67.

23 Document Revision History

Table 90 provides a revision history for the MPC8572E hardware specification.

3Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification

support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core

frequencies.

Table 89. Meaning of Last Line of Part Marking

Digit Description

A Assembly Site

E Oak Hill

QKLM

WL Lot number

YY Year assembled

WW Work week assembled

Table 90. Document Revision History

Rev.

Number Date Substantive Change(s)

6 06/2014 • Updated Ta b le 7 6 , “MPC8572E Pinout Listing,” TDO signal is not driven during HRSET* assertion.

•In Ta b l e 8 6 , “Part Numbering Nomenclature—Rev 2.2.1,“ added full Pb-free part code.

MMMMM CCCCC

ATWLYYWW

Notes:

CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States.

MMMMM is the 5-digit mask number.

ATWLYYWW is the traceability code.

FC-PBGA

MPC8572xxxxxx

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor 137

Document Revision History

5 01/2011 • Editorial changes throughout

• Updated Ta bl e 4 , “MPC8572E Power Dissipation,” to include low power product.

•In Section 22.1, “Part Numbers Fully Addressed by this Document,” defined PPC as “Prototype” and

changed table headings to say “Package Sphere Type”.

• Added Ta b l e 8 6 , “Part Numbering Nomenclature—Rev 2.2.1.”

4 06/2010 • In Section 18.3, “Pinout Listings,” updated Ta b l e 7 6 showing GPINOUT power rail as BVDD.

• Updated Section 14.1, “GPIO DC Electrical Characteristics.”

3 03/2010 • In Section 2.1, “Overall DC Electrical Characteristics,” changed GPIO power from OVDD to BVDD.

•In Section 22.1, “Part Numbers Fully Addressed by this Document,” added Ta bl e 8 7 for Rev 2.1

silicon.

•In Section 22.1, “Part Numbers Fully Addressed by this Document,” updated Ta bl e 8 8 for Rev 1.1.1

silicon.

2 06/2009 • In Section 3, “Power Characteristics,” updated CCB Max to 533MHz for 1200MHz core device in

Ta bl e 5 , “MPC8572EL Power Dissipation.”

•In Section 4.4, “DDR Clock Timing,” changed DDRCLK Max to 100MHz. This change was

announced in Product Bulletin #13572.

• Clarified restrictions in Section 4.5, “Platform to eTSEC FIFO Restrictions.”

•In Ta b l e 9 , “RESET Initialization Timing Specifications,” added note 2.

• Added Section 14, “GPIO.”

•In Section 18.1, “Package Parameters for the MPC8572E FC-PBGA,” updated material composition

to 63% Sn, 37% Pb.

•In Section 18.2, “Mechanical Dimensions of the MPC8572E FC-PBGA, updated Figure 61 to

correct the package thickness and top view.

•In Section 19.1, “Clock Ranges,” updated CCB Max to 533MHz for 1200MHz core device in

Ta bl e 7 7 , “MPC8572E Processor Core Clocking Specifications.”

•In Section 19.5.2, “Minimum Platform Frequency Requirements for High-Speed Interfaces,”

changed minimum CCB clock frequency for proper PCI Express operation.

• Added LPBSE to description of LGPL4/LGTA/LUPWAIT/LPBSE/LFRB signal in Ta b l e 7 6 ,

“MPC8572E Pinout Listing.”

• Corrected supply voltage for GPIO pins in Ta b l e 7 6 , “MPC8572E Pinout Listing.”

• Applied note to SD1_PLL_TPA in Ta bl e 7 6 , “MPC8572E Pinout Listing.”

• Updated note regarding MDIC in Tab l e 7 6 , “MPC8572E Pinout Listing.”

• Added note for LAD pins in Ta bl e 7 6 , “MPC8572E Pinout Listing.”

• Updated Ta bl e 8 8 , “,Part Numbering Nomenclature—Rev 1.1.1” with Rev 2.0 and Rev 2.1 part

number information. Added note indicating that silicon version 2.0 is available for prototype

purposes only and will not be available as a qualified device.

1 08/2008 • In Section 22.1, “Part Numbers Fully Addressed by this Document,” added SVR information in,

Ta bl e 8 8 “Part Numbering Nomenclature—Rev 1.1.1,” for devices without Security Engine feature.

0 07/2008 • Initial release.

Table 90. Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

Document Number: MPC8572EEC

Rev. 6

06/2014

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