FUJITSU MICROELECTRONICS
DATA SHEET
Copyright©2003-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2008.9
For the information for microcontroller supports, see the following web site.
http://edevice.fujitsu.com/micom/en-support/
8-bit Proprietary Microcontroller
CMOS
F2MC-8L MB89470 Series
MB89475/P475/PV470
DESCRIPTION
The MB89470 series has been developed as a general-purpose version of the F2MC*-8L family consisting of
proprietary 8-bit, single-chip micro controllers.
In addition to a compact instruction set, the microcontroller contains a variety of peripheral functions such as 21-
bit time-base timer, watch prescaler, PWC timer, PWM timer, 8/16-bit timer/counter, external interrupt 1 (edge) ,
exter n al int er rupt 2 (level) , 10-bit A/D converter, UART/SIO, buzzer, watchdog timer reset.
The MB89470 series is designed suitable for home appliance as well as in a wide range of applications for
consumer product.
* : F2MC is the abbreviation of FU JITSU Flexible Microcontroller.
FEATURES
Package used
QFP package , LQFP package and SH-DIP package for MB89P475, MB89475
MQFP package for MB89 PV470 (Continued)
DS07-12552-2E
MB89470 Series
2DS07-12552-2E
(Continued)
High-speed operating capability at low voltage
Minimum execution time : 0.32 µs/12.5 MHz
•F
2MC-8L family CPU core
Six timers
PWC timer (also usable as an interval timer)
PWM timer
8/16-bit timer/counter × 2
21-bit timebase timer
Watch prescaler
•Buzzer
7 frequency types are selectable by software
External interrupts
Edge detection (Sel ectable edge) : 4 channels
Low-level interrupt (Wake-up function) : 5 channels
A/D converter (8 channels)
10-bit successive approximation type
UART/SIO
Synchronous/asynchronous data transfer capable
Low-power consumption modes
Stop mode (Oscillation stops to minimize the current consumption.)
Sleep mode (The CPU stops to reduce the current consumption to approx. 1/3 of normal.)
Subclock mode (for dual clock prod uct)
Watch mode (for dual clock pr oduct)
Watchdog timer reset
I/O ports : Max 39 channels
Multiplication and division instructions
Instruction set optimized for controllers 16-bit arithmetic ope rations
Bit test and branch instructions
Bit manipulation instructions, etc.
MB89470 Series
DS07-12552-2E 3
PRODUCT LINEUP
(Continued)
Part number
Parameter MB89475 MB89P475 MB89PV470
Classification Mass production products
(mask ROM produ ct) OTP Piggy-back
ROM size 16 K × 8-bit (internal ROM) 16 K × 8-bit (int ernal PROM,
can be written to by ROM
programmer) 32 K × 8-bit (external ROM)
RAM size 512 × 8 bits 1 K × 8 bits
CPU functions
Number of instru ctions
Instruction bit length
Instructi on length
Data bit length
Minimum execution time
Minimum interrupt processing time
: 136
: 8 bits
: 1 to 3 bytes
: 1, 8, 16 bits
: 0.32 µs/12.5 MHz
: 2.88 µs/12.5 MHz
Ports
Output-only ports (N-channel open drain)
Input-only ports
I/O ports (CMOS)
Total
: 7 pins
: 3 pins (1 pin in product with
dual clock)
: 29 pins
: 39 pins
21-bit Time-b ase
timer Interrupt period (0.82 ms, 3.3 ms, 26.2 ms, 419.4 ms) at 10 MHz
Interrupt period (0.66 ms, 2.6 ms, 21.0 ms, 335.5 ms) at 12.5 MHz
Watchdog timer Reset period ( 209.7 ms to 419.4 ms) at 10 MHz
Reset period ( 167.8 ms to 335.5 ms) at 12.5 MHz
Watch prescaler 17 bits
Interrupt cycle : 31.25 ms, 0.25 ms, 0. 5 s, 1.00 s, 2.00 s, 4.00 s/32.768 kHz for subclock
Pulse width count
timer
2 channels
8-bit one-shot timer operation (supports underflow output, operating clock period : 1, 4, 32
tinst*, external)
8-bit reload timer operation (supports square wave output, operating clock period : 1, 4,
32 tinst*, external)
8-bit pulse width measurem ent operatio n (support s continuous mea surement, H width, L
width, rising edge to rising edge, falling edge to falling edge measurement and both edge
measurement)
PWM timer 8-bit reload timer operation (supports square wave output, operating clock period : 1, 4,
32 tinst*, external)
8-bit resolution PWM operation
8/16-bit timer /
counter 1, 2
Can be operated either as a 2-channel 8-bit timer/counter (Timer 1 and Timer 2, each with
its own independent opera ting clock cycle) , or as one 16-bit timer/counter
In Timer 1 or 16-bit timer/counter operation, event cou nter operation (external clock-trig-
gered) and square wave output capable
8/16-bit timer /
counter 3, 4
Can be operated either as a 2-channel 8-bit timer/counter (Timer 3 and Timer 4, each with
its own independent opera ting clock cycle) , or as one 16-bit timer/counter
In Timer 3 or 16-bit timer/counter operation, event cou nter operation (external clock-trig-
gered) and square wave output capable
External interrupt 4 independent ch annels (selectable edge, interrupt vector, request flag)
5 channels (low level interrupt)
MB89470 Series
4DS07-12552-2E
(Continued)
* : tinst is one instruction cycle (execution time) , which can be selected as 1/4, 1/8, 1/16, or 1/64 of main clock.
PACKAGE AND CORRESPONDING PRODUCTS
O : Available
X : Not available
DIFFERENCES AMONG PRODUCTS
1. Memory Size
Bef ore e v aluating using the piggyback product, verify its differ ence s fr om the product th at wil l actu ally be use d.
Take particular care on the following point :
The stack area, etc., is set at the upper limit of the RAM.
2. Current Consumption
For the MB89PV470, add the current consumed by the EPROM mounted in t he piggy-back socket.
When operating at low speed, the current consumed by the one-time PROM product is greater than that for
the mask ROM product. However, the current consumption are roughly the same in sleep or stop mode.
For more informat ion, see “ELECTRICAL CHARACTERISTICS”.
3. Oscillation stabilization time after power-on reset
For MB89PV470, there is no powe r-on stabilization time after power-on reset.
F or MB89P475, there is power-on stabilization time after power-on reset.
For MB89475, the power-on stabilization time can be select.
For more information, refer to “MASK OPTIONS”.
Part number
Parameter MB89475 MB89P475 MB89PV470
A/D converter 10-bit resolution × 8 channels
A/D conversion function (conversion time : 60 tinst*)
Supports repeate d activation by internal clock.
UART/SIO Synchr on o us/ as yn chr o no us dat a tra n sfe r cap a ble
(Max baud rate : 78.125 Kbps at 10 MHz)
(7 and 8 bits with parity bit ; 8 and 9 bits without parity bit)
Buzzer output 7 frequency types (F CH/212, FCH/211, FCH/210, FCH/29, FCL/25, FCL/24, FCL/23) are selectable by
software.
Standby mode Sleep mode, stop mod e, subclock mode (dual clock pro duct) and watch mode (dual clo ck
product)
Process CMOS
Operating Voltage 2.2 V to 5.5 V 3.5 V to 5.5 V 2.7 V t o 5.5 V
Part number
Package MB89475 MB89P475 MB89PV470
DIP-48P-M01 O O X
FPT-48P-M26 O O X
FPT-48P-M13 O O X
MQP-48C-P01 X X O
MB89470 Series
DS07-12552-2E 5
PIN ASSIGNMENTS
(Continued)
(TOP VIEW)
(DIP-48P-M01 )
*1 : For pin no. 2, connect this pin to an external 0.1 µF capacitor to ground (for MB89P475 only) .
For MB89PV470 and MB89475, this pin should be left unconnected.
*2 : High current drive type
VSS
C*1
P40/X0A
P41/X1A
P17/TO2
P16/EC2
P15/TO1
P14/EC1
P13/INT13
P12/INT12
P11/INT11
P10/INT10
P07/AN7
P06/AN6
P05/AN5
P04/AN4
P03/AN3
P02/AN2
P01/AN1
P00/AN0
AVSS
AVCC
P54/INT24
P53/INT23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
X1
X0
MODE
P42
RST
P20/SCK1
P21/SO1
P22/SI1
P23/PWC
P24/PWM
P25/SI2
VCC
P26/SO2
P27/SCK2
P30/BUZ*2
P31*2
P32*2
P33*2
P34*2
P35*2
P36*2
P50/INT20
P51/INT21
P52/INT22
MB89470 Series
6DS07-12552-2E
(Continued)
(TOP VIEW)
(FPT-48P-M26)
(FPT-48P-M13)
*1 : For pin no. 20, connect this pin to an external 0.1 µF capacitor to gro und (for MB89P475 only) .
For MB89PV470 and MB89475, this pin should be left unconnected .
*2 : High current drive type
1
2
3
4
5
6
7
8
9
10
11
12
P33*2
P32*2
P31*2
P30/BUZ*2
P27/SCK2
P26/SO2
VCC
P25/SI2
P24/PWM
P23/PWC
P22/SI1
P21/SO1
36
35
34
33
32
31
30
29
28
27
26
25
P02/AN2
P03/AN3
P04/AN4
P05/AN5
P06/AN6
P07/AN7
P10/INT10
P11/INT11
P12/INT12
P13/INT13
P14/EC1
P15/TO1
48
47
46
45
44
43
42
41
40
39
38
37
P34*2
P35*2
P36*2
P50/INT20
P51/INT21
P52/INT22
P53/INT23
P54/INT24
AVCC
AVSS
P00/AN0
P01/AN1
13
14
15
16
17
18
19
20
21
22
23
24
P20/SCK1
RST
P42
MODE
X0
X1
VSS
C *1
P40/X0A
P41/X1A
P17/TO2
P16/EC2
MB89470 Series
DS07-12552-2E 7
(Continued)
(TOP VIEW)
(MQP-48C-P01)
*1 : Package uppe r-side pin assignment ( MB89PV470 only)
N.C. : As connected internally, do not use.
*2 : Pin no. 20 should be left unconne cted.
*3 : High current drive type
Pin no. Pin name Pin no. Pin name Pin no. Pin name Pin no. Pin name
49 Vpp 57 N.C. 65 O4 73 OE
50A1258A266O574N.C.
51 A7 59 A1 67 O6 75 A11
52 A6 60 A0 68 O7 76 A9
53 A5 61 O1 69 O8 77 A8
54 A4 62 O2 70 CE 78 A13
55 A3 63 O3 71 A10 79 A14
56 N.C. 64 Vss 72 N.C. 80 Vcc
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
13
14
15
16
17
18
19
20
21
22
23
24
69
70
71
72
73
74
75
76
60
59
58
57
56
55
54
53
68
67
66
65
64
63
62
61
77
78
79
80
49
50
51
52
P33*3
P32*3
P31*3
P30/BUZ*3
P27/SCK2
P26/SO2
VCC
P25/SI2
P24/PWM
P23/PWC
P22/SI1
P21/SO1
P02/AN2
P03/AN3
P04/AN4
P05/AN5
P06/AN6
P07/AN7
P10/INT10
P11/INT11
P12/INT12
P13/INT13
P14/EC1
P15/TO1
P34*3
P35*3
P36*3
P50/INT20
P51/INT21
P52/INT22
P53/INT23
P54/INT24
AVCC
AVSS
P00/AN0
P01/AN1
P20/SCK1
RST
P42
MODE
X0
X1
VSS
C*2
P40/X0A
P41/X1A
P17/TO2
P16/EC2
*1
MB89470 Series
8DS07-12552-2E
PIN DESCRIPTION
(Continued)
Pin no. Pin name I/O
circuit Function
LQFP/QFP/
MQFP*2SDIP*1
17 47 X0 AConnection pins for a crystal or other oscillator.
An external clock can be connected to X0. In this case, leave X1
open.
18 48 X1
16 46 MODE B Input pins for setting the memory access mode.
Connect directly to VSS.
14 44 RST C
Reset I/O pin. The pin is a N-ch open-drain type with pull-up resistor
and a hysteresis inpu t. The pin outputs an “L” level wh en an internal
reset request is present. Inputting an “L” level initializes internal cir-
cuits.
38 to 31 20 to 13 P00/AN0 to
P07/AN7 DGeneral-purpose I/O port.
The pins are shared with the analog inputs for the A/D convert er.
30 to 27 12 to 9 P10/INT10
to
P13/INT13 EGeneral-purpose I/O port.
A hysteresis input fo r INT10 to INT13.
The pin is shared with an external interrupt 1 input.
26 8 P14/EC1 E General-purpose I/O port.
A hysteresis input for EC1.
The pin is shared with th e 8/1 6 bi t time r 1 inp ut .
25 7 P15/TO1 F General-purpose I/O port.
The pin is shared with the output of 8/16-bit timer 1.
24 6 P16/EC2 E General-purpose I/O port.
A hysteresis input for EC2.
The pin is shared with th e 8/1 6 bi t time r 2 inp ut .
23 5 P17/TO2 F General-purpose I/O port.
The pin is shared with the output of 8/16-bit timer 2.
13 43 P20/SCK1 E General-purpose I/O port.
A hysteresis input for SCK1.
The pin is shared with the clock I/O of UART/SIO 1.
12 42 P21/SO1 F General-purpose I/O port.
The pin is shared with th e ser i a l data ou tpu t of UART/ S IO 1.
11 41 P22/SI1 E General-purpose I/O port.
A hysteresis input for SI1.
The pin is shared with th e ser ia l da ta input of UART/SIO 1.
10 40 P23/PWC E General-purpose I/O port.
A hysteresis input fo r PWC.
This pin is shared with PWC input.
939P24/PWMF
General-purpose input port.
This pin is shared with PWM output.
8 38 P25/SI2 E General-purpose I/O port.
A hysteresis input for SI2.
The pin is shared with th e ser ia l da ta input of UART/SIO 2.
MB89470 Series
DS07-12552-2E 9
(Continued)
*1 : DIP-48P-M01
*2 : FPT-48P-M26/FPT-48P-M13/MQP-48C-P01
*3 : When MB89475 or MB89PV470 is used, this pin will become a N.C. pin without internal connection.
When MB89P475 is used, connect this pin to an external 0.1 µF capacitor to grou nd.
Pin no. Pin name I/O
circuit Function
LQFP/QFP/
MQFP*2SDIP*1
636P26/SO2F
General-pur pose I/O port.
The pin is shared with the seri al data output of UART/SIO 2.
535P27/SCK2E
General-pur pose I/O port.
A hysteresis input for SCK2.
The pin is shared with the clock I/O of UART/SIO 2.
434P30/BUZG
N-channel open-dr ain output.
The pin is shared with buzzer output.
3 to 1,
48 to 46 33 to
28 P31 to P36 G N-channel open-drain output.
21 3 P40/X0A
H General-purpose input port. (single clock system)
AConnection pins for a crystal or other oscillator. (dual clock system)
An external clock can be connected to X0A. In this case, leave X1A
open.
22 4 P41/X1A
H General-purpose input port. (single clock system)
AConnection pins for a crystal or other oscillator. (dual clock system)
An external clock can be connected to X0A. In this case, leave X1A
open.
15 45 P42 H General-purpose input port.
45 to 41 27 to
23
P50/INT20
to
P54/INT24 EGeneral-purpose I/O port.
A hysteresis input for INT20 to INT24.
The pin is shared with an external interrupt 2 input.
20 2 C Capacitor connection pin *3
737VCC Power supply pin ( +5 V) .
19 1 VSS Power supp ly pin (GND) .
40 22 AVCC A/D converter power supply pin.
39 21 AVSS A/D converter power supply pin.
Use at the same voltage level as VSS.
MB89470 Series
10 DS07-12552-2E
External EPROM Socket (MB89PV470 only)
* : MQP-48C-P01
Pin no. Pin
name I/O Function
MQFP*
49 Vpp O “H” level output pin
50
51
52
53
54
55
58
59
60
A12
A7
A6
A5
A4
A3
A2
A1
A0
O Address output pins.
61
62
63
O1
O2
O3 I Data input pins.
64 VSS O Power supply pin (GND) .
65
66
67
68
69
O4
O5
O6
O7
O8
I Data input pins.
70 CE O Chip enable pin for the ROM. Outputs “H” in standby mode.
71 A10 O Address output pin.
73 OE O Output enable pin for the ROM. Always outputs “L”.
75
76
77
78
79
A11
A9
A8
A13
A14
O Address output pins.
80 VCC O Power supply pin for the EPROM.
56
57
72
74
N.C. Internally connected pins. Always leave open.
MB89470 Series
DS07-12552-2E 11
I/O CIRCUIT TYPE
(Continued)
Type Circuit Remarks
A
Main and sub-clo ck circuits
Oscillation feedback resistance
is approx. 500 k f or main clock
circuit and 5 M for sub-clock cir-
cuit.
B
Hysteresis input
The pull-down resistor is
approx. 50 k.
(No pull-down resistor in
MB89P475)
C
The pull-up resistance (P-chan-
nel) is approx. 50 k.
Hysteresis input
D
CMOS output
•CMOS input
Selec table pull-up resis tor
Approx. 50 k
E
CMOS output
•CMOS input
Selec table pull-up resis tor
Approx. 50 k
X1 (X1A)
X0 (X0A)
Nch Pch Pch
Nch
Stop mode control signal
Pch
Nch
R
Pch
Nch
Rpull-up
resistor register
ADIN
Pch
Nch
pull-up
resistor register
resources
port
R
MB89470 Series
12 DS07-12552-2E
(Continued)
Type Circuit Remarks
F
CMOS output
•CMOS input
Selec table pull-up resis tor
Approx. 50 k
G
N-channel open-drain output
Selec table pull-up resis tor
Approx. 50 k
H•CMOS input
Pch
Nch
pull-up
resistor regsiter
R
Pch
Nch
pull-up
resistor register
R
port
MB89470 Series
DS07-12552-2E 13
HANDLING DEVICES
1. Preventing Latchup
Latchup ma y occur on CMOS I Cs if v oltage higher than VCC or lo wer than VSS is applied t o input and output pins
other than medium- to high-voltage pins or if higher than the voltage which shows on “1. Absolute Maximum
Ratings” in “ ELECTRICAL CHARACTERISTICS” is applied between VCC and VSS.
When latchup occurs, power supply current increases rapidly and might thermally damage elements. When
using, take great care not to exceed the absolute maximum ra tings.
Also, take ca re to preven t the ana log power s upply (AVCC) and analog input from exceeding the digital power
supply (VCC) when the analog system power supply is turned on and off.
2. Treatment of Unused Input Pins
Lea ving unu sed input pin s open could cause malfunctions . Th ey should be conn ected to a pull- up or pull-do wn
resistor.
3. Treatment of Power Supply Pins on Microcontrollers with A/D Converter
Connect to be AVCC = VCC and AVSS = VSS even if the A/D converter is not in use.
4. Treatment of N.C. Pins
Be sure to leave (internally connected) N.C. pins open.
5. Power Supply Voltage Fluctuations
Although VCC power supply voltage is assured to operate within the rated range, a rapid fluctuation of the voltage
could cause malfunctions, even if it occurs within the rated range. Stabilizing voltage supplied to the IC is therefore
important. As stabilization guidelines, it is recommended to control power so that VCC ripple fluctuations (P-P
value) will be less than 10% of the standard VCC value at the c ommercial freq uency (50 Hz to 60 Hz) and the
transient fluctuation rate will be less than 0.1 V/ms at the time of a momentary fluctuation such as when power
is switched.
6. Precautions when Using an External Clock
Even when an external clock is used, oscillation stabilization time is required for power-on reset (optional) and
wake-up from stop mode.
7. Note to noise in the External Reset Pin (RST)
If the reset pulse applied to the external reset pin (RST) does not meet the specifications, it m ay cause malf unc-
tions. Use causion so that the reset pulse less than the specifications will not be fed to the external reset pin (RST).
MB89470 Series
14 DS07-12552-2E
PROGRAMMING OTPROM IN MB89P475 WITH SERIAL PROGRAMMER
1. Programming the OTPROM with serial programmer
All OTP products can be programmed with serial programmer.
2. Programming the OTPROM
To program the OTPROM using FUJITSU MCU programmer MB91919-001 .
Inquiry : Fujitsu Microelectronics Asia Pte Ltd. : TEL (65) -281077 0
FAX (65) -2810220
3. Programming Adapter for OTPROM
To program the OTPROM using FUJITSU MCU programmer MB91919-001, use the programming adapter
listed below.
Inquiry : Fujitsu Microelectronics Asia Pte Ltd. : TEL (65) -2810770
FAX (65) -2810220
4. OTPROM Content Protection
For product with OTPROM content protection feature (MB89P475-102, MB89P475-202) , OTPROM content can
be read using serial programmer if the OTPROM cont ent protection mechanism is not activated.
One predefined area of the OTPROM (FFFCH) is assigned to be used for preventing the read access of OTPROM
content. I f the prot ection code “00H” is wr itten in this address (FFFCH) , the OTPROM content cannot be read
by any serial programmer.
Note : The program written into the OTPROM cannot be verified once the OTPROM protection code is written (“00H
in FFFCH) . It is advised to write the OTPROM protection code at last.
5. Programming Yield
All bits cannot be progr ammed at Fujit su shipping test to a bl ank ed O TPR OM microcomputer, d ue to its nature .
For this reason, a programming yield of 100% cannot be assured at all times.
Package Compatible so cket adap t er
DIP-48P-M01 MB91919-805+MB91919-800
FPT-48P-M26 MB91919-806+MB91919-800
FPT-48P-M13 MB91919-807+MB91919-800
MB89470 Series
DS07-12552-2E 15
PROGRAMMING OTPROM IN MB89P475 WITH PROGRAMMER
1. Programming OTPROM with parallel programmer
Only products without protection feature (i.e. MB89P475-101 and MB89P475-201) can be programmed with
parallel programmer. Product with protection feature (i.e. MB89P475-102 and MB89P475-202) cannot be
programmed with parallel programmer.
2. ROM Writer Adapters and Recommended ROM Writers
The following shows ROM writer adapters and recommended ROM writers.
Fujitsu Microelectronics Asia Pte Ltd. (Serial programmer)
Inquiries : Fujitsu Microelectronics Asia Pte Ltd. : TEL (65) -2810770
Writing data to the OTPROM
(1) Set the OTPROM writer for the CU50-OTP (device code : cdB6DC) .
(2) Load the program data to the OTPROM writer.
(3) Write data using the OTPROM writer.
3. Programming Yield
All bits cannot be progr ammed at Fujit su shipping test to a bl ank ed O TPR OM microcomputer, d ue to its nature .
For this reason, a programming yield of 100% cannot be assured at all times.
Package Applicable adapter model Recommended writer
DIP-48P-M01 MB91919-601
MB91919-001FPT-48P-M26 MB91919-602
FPT-48P-M13 MB91919-603
MB89470 Series
16 DS07-12552-2E
PROGRAMMING TO THE EPROM WITH PIGGYBACK/EVALUATION DEVICE
1. EPROM for Use
MBM27C256A-20TVM
2. Memory Space
Memory space in each mode is diagrammed below.
3. Programming to the EPROM
(1) Set the EPROM programmer to the MBM27C256.
(2) Load program data into the EPROM programmer at 0000H to 7FFFH.
(3) Program to 0000H to 7FFFH with the EPROM programmer.
0000H
7FFFH
0000H
RAM
Not available
PROM
32 KB EPROM
32 KB
I/O
0080H
FFFFH
8000H
0880H
Address Normal operating
mode Corresponding a ddresses on
the EPROM programmer
MB89470 Series
DS07-12552-2E 17
BLOCK DIAGRAM
*1 : High Current Pins
*2 : Unconnected pin for MB89PV470 and MB89475
*3 : P40, P41 pins for single-clock system and X01A, X1A pins fo r dual-clock system
X0 Oscillator
Clock Controller
Sub-clock
Oscillator
Reset circuit
(Watchdog timer)
21-bit Time-base
timer
External interrupt 2
(Level)
External interrupt 1
(Level)
8/16-bit Timer 1, 2
UART/SIO 1
UART/SIO 2
Buzzer
8-bit PWC
8-bit PWM
8/16-bit Timer 3, 4
Watch Prescaler
Internal data bus
55
CMOS Input port 4
CMOS I/O port 0 P00/AN0
to P07/AN7
AVCC
AVSS
P10/INT10 to P13/INT13
P14/EC1
P15/TO1
P16/EC2
P20/SCK1
P21/SO1
P22/SI1
P23/PWC
P24/PWM
P25/SI2
P26/SO2
P27/SCK2
P30/BUZ*1
P31*1 to P36*1
P17/TO2
8
8
44
CMOS I/O port 1
CMOS I/O port 2
N-ch open-drain output port 3 6
10-bit
A/D converter
CMOS I/O port 5
1 Kbyte RAM/512 Byte RAM
16 Kbyte ROM
Other pins
MODE, VCC, VSS, C*2
F2MC-8L
CPU
X1
P40/X0A*3
P41/X1A*3
P42
P50/INT20 to
P54/INT24
RST
MB89470 Series
18 DS07-12552-2E
CPU CORE
1. Memory Space
The microcontroller s of th e MB89 470 seri es offe r a me mor y space of 64 Kbytes fo r sto ring all of I/ O, data, and
program are as. The I/O area is locat ed at the lowest address. The dat a area is prov ided immediately ab ove the
I/O area. Th e data area ca n be divided in to register, stack, and direct areas accor ding to the app lication. The
program area is located at exactly the opposite end, that is, near the highest address. Provide the tables of
interrupt reset vectors and vector call instructions toward the highest address within the program area. The
memory space of the MB89470 series is structured as illustrated below.
0000H
0080H
0100H
MB89PV470
I/O
RAM
Vacant
External
ROM
(32 K)
0000H
0080H
0100H
0200H
C000HC000H
8000H
FFFFH
I/O
RAM
Vacant
FFFFH
0280H0280H
0200H
0480H
FFC0HFFC0H
0000H
0080H
0100H
MB89P475MB89475
I/O
RAM
Vacant
Vector table (reset, interrupt, vector call instruction)
ROM ROM
FFFFH
0200H
FFC0H
General-
purpose
registers
General-
purpose
registers
General-
purpose
registers
Memory Map
MB89470 Series
DS07-12552-2E 19
2. Registers
The F2MC-8L family has two types of registers; dedicated registers in the CPU and general-purpose registers
in the memory. The following registers are provided :
The PS can further be divided into higher 8 bits for use as a register bank pointer (RP) and the lower 8 bits for
use as a condition code register (CCR) . (See the diagram below.)
Program counter (PC) : A 16-bit registe r for indicating instruction storage positions
Accumulator (A) : A 16-bit temporary register for storing arithmetic operations, etc. When the
instruction is an 8-bit data processing instruction, the lower byte is used.
Temporary accumulator (T) : A 16-bit register which performs arithmetic operations with the accumulator.
When the instruction is an 8-bit data processing instruction, the lower byte is
used.
Index register (IX) : A 16-bit register for index modification
Extra pointer (EP) : A 16-bit pointer for indicating a mem ory ad dr es s
Stack pointer (SP) : A 16-bit register for indicating a stack area
Program status (PS) : A 16-bit register for storing a register pointer, a condition code
PC
A
T
IX
EP
SP
PS
: Program counter
: Accumulator
: Temporary accumulator
: Index register
: Extra pointer
: Stack pointer
: Program status
16 bits
FFFDH
Undefined
Undefined
Undefined
Undefined
Undefined
I-flag = 0, IL1, 0 = 11
Other bits are undefined.
Initial value
PS
RP CCR
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RP VacancyVacancy Vacancy H I IL1, 0 N Z VC
Structure of the Program Status Register
MB89470 Series
20 DS07-12552-2E
The RP indicates the address of the register bank currently in use. The relationship between the pointer contents
and the actual address is based on the conversion rule illustrated below.
The CCR consists of bits indicating the results of arithmetic operations and the contents of transfer data and
bits for control of CPU operations at the time of an interrupt.
H-flag : Set when a carry or a borrow f rom bit 3 to bit 4 occurs as a result of an arithmet ic operation. Cleared
otherwise. This flag is for decimal adjustment instructions.
I-flag : Interrupt is allowed when this flag is set to 1. Interrupt is prohibited when the flag is set to 0. Set to 0
when reset.
IL1, 0 : Indicates the level of the interrupt currently allowed. Processes an interrupt only if its request level is
higher than the value indicated by this bit.
IL1 IL0 Interrupt level High-low
00 1High
Low = no interrupt
01
10 2
11 3
N-flag : Set if the MSB is set to 1 as the result of an arithmetic operation. Cleared when the bit is set to 0.
Z-flag : Set when an arithmetic operation results in 0. Cleared otherwise.
V-flag : Set if the compleme nt on 2 overflows as a result of an arit hmetic operation. Reset if the overflow doe s
not occur.
C-flag : Set when a carry or a borrow from bit 7 occurs as a result of an arithmetic operation. Cleared other-
wise. Set to the shift-out vallue in the case of a shift instruction.
"0" "0" "0" "0" "0" "0" "0" "1" R4 R3 R2 R1 R0 b2 b1
RP Lower OP codes
b0
A7 A6 A5 A4 A3 A2 A1 A0
A15Generated addresses A14 A13 A12 A11 A10 A9 A8
Rule for Conversion of Actual Addresses of the General-purpose Register Area
MB89470 Series
DS07-12552-2E 21
The following gene ra l- pu rp o s e re gis te rs ar e pr ov ide d :
General-purpose registers : An 8-bit resister for storing data
The general-purpose registers are 8 bits and located in the register banks of the memory. One bank contains
eight registers. Up to a total of 32 banks can be used on the MB89470 series. The bank currently in use is
indicated by the register bank pointer (RP) .
R0
This address = 0100
H
+ 8 × (RP)
R1
R2
R3
R4
R5
R6
R7
Memory area
32 banks
Register Bank Configuration
MB89470 Series
22 DS07-12552-2E
I/O MAP
(Continued)
Address Register name Register Description Read/Write Initial value
00HPDR0 Port 0 data register R/W XXXXXXXXB
01HDDR0 Port 0 data direction reg ister W* 00000000B
02HPDR1 Port 1 data register R/W XXXXXXXXB
03HDDR1 Port 1 data direction reg ister W* 00000000B
04HPDR2 Port 2 data regi ster R/W 00000000B
05H (Reserved)
06HDDR2 Port 2 data direction register R/W 00000000B
07HSYCC System clock control register R/W -XXMM-00B
08HSTBC Standby control register R/W 0001XXXXB
09HWDTC Watchdog timer control register W* 0---XXXXB
0AHTBTC Timebase timer con trol register R/W 00---000B
0BHWPCR Watch prescaler control register R/W 00--0000B
0CHPDR3 Port 3 data register R/W -1111111B
0DHPDR4 Port 4 data register R -----XXXB
0EHRSFR Reset flag register R XXXX----B
0FHBUZR Buzzer register R/W -----000B
10HPDR5 Port 5 data register R/W ---XXXXXB
11HDDR5 Port 5 data direction register R/W ---00000B
12H, 13H (Reserved)
14HT4CR Timer 4 control register R/W 000000X0B
15HT3CR Timer 3 control register R/W 000000X0B
16HT4DR Timer 4 data register R/W XXXXXXXXB
17HT3DR Timer 3 data register R/W XXXXXXXXB
18HT2CR Timer 2 control register R/W 000000X0B
19HT1CR Timer 1 control register R/W 000000X0B
1AHT2DR Timer 2 data register R/W XXXXXXXXB
1BHT1DR Timer 1 data register R/W XXXXXXXXB
1CH to 1FH (Reserved)
20HADC1 A/D control reg ister 1 R/W -00000X0B
21HADC2 A/D control register 2 R/W -0000001B
22HADDH A/D data register (Upper byte) R ------XXB
23HADDL A/D data register (Lower byte) R XXXXXXXXB
24HADER A/D input enable register R/W 11111111B
25H (Reserved)
26HSMC11 UART/SIO serial mode control register 11 R/W 00000000B
MB89470 Series
DS07-12552-2E 23
(Continued)
* : Bit manipulation instr u ction cannot be used.
Address Register name Register Description Read/Write Initial value
27H SMC12 UART/SIO serial mod e control register 12 R/W 00000000B
28HSSD1 UART/SIO serial status and data register 1 R 00001---B
29HSIDR1/SODR1 UART/SIO serial data register 1 R/W * XXXXXXXXB
2AHSRC1 UART/SIO serial rate control register 1 R/W XXXXXXXXB
2BHSMC21 UART serial mode control register 21 R/W 00000000B
2CHSMC22 UART serial mode control register 22 R/W 00000000B
2DHSSD2 UART ser ia l status an d da ta reg ist er 2 R 00001---B
2EHSIDR2/SODR2 UART serial data register 2 R/W * XXXXXXXXB
2FHSRC2 UART serial rate control register 2 R/W XXXXXXXXB
30HEIC1 External interrupt 1 control register 1 R/W 00000000B
31HEIC2 External interrupt 1 control register 2 R/W 00000000B
32HEIE2 External interrupt 2 enable register R/W ---00000B
33HEIF2 External interrupt 2 flag register R/W -------0B
34HPCR1 PWC control register 1 R/W 0-0--000B
35HPCR2 PWC control register 2 R/W 00000000B
36HPLBR PWC reload buffer register R/W XXXXXXXXB
37H (Reserved)
38HCNTR PWM timer control register R/W 0-00000000B
39HCOMR PWM timer compare register W* XXXXXXXXB
3AH to 6FH (Reserved)
70HPURC0 Port 0 pull up resistor control register R/W 11111111B
71HPURC1 Port 1 pull up resistor control register R/W 11111111B
72HPURC2 Port 2 pull up resistor control register R/W 11111111B
73HPURC3 Port 3 pull up resistor control register R/W -1111111B
74H (Reserved)
75HPURC5 Port 5 pull up resistor control register R/W ---1111B
76H to 7AH (Reserved)
7BHILR1 Interrupt level setting register 1 W* 11111111B
7CHILR2 Interrupt level setting register 2 W* 11111111B
7DHILR3 Interrupt level setting register 3 W* 11111111B
7EHILR4 Interrupt level setting register 4 W* 11111111B
7FH (Reserved)
MB89470 Series
24 DS07-12552-2E
Read/write access symb o ls
Initial value symbols
R/W : Readable and writable
R : Read-only
W : Write-only
0 : The initial value of this bit is “0”.
1 : The initial value of this bit is “1”.
X : The initial value of this bit is undefined.
- : Unused bit.
M : The initial value of this bit is determined by mask option.
MB89470 Series
DS07-12552-2E 25
ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings (AVSS = VSS = 0.0 V)
WARNING: Semiconductor devices can be permanently damaged by ap plication of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Parameter Symbol Value Unit Remarks
Min Max
Power supply voltage VCC
AVCC VSS 0.3 VSS + 6.0 V AVCC must not exceed V CC
Input voltage VIVSS 0.3 VCC + 0.3 V
Output voltage VOVSS 0.3 VCC + 0.3 V
“L” level maximum output cur rent IOL 15 mA
“L” level average output current
IOLAV1 4mA
Average value (operating current
× operating rat e)
P00 to P07, P10 to P17,
P20 to P27, P50 to P54, RST
IOLAV2 12 mA Average value (operating current
× operating rat e)
P30 to P36
“L” level total maximum output
current ΣIOL 100 mA
“L” level total average output
current ΣIOLAV 40 mA Average value (operating current
× operating rat e)
“H” level maximum outp ut current IOH ⎯−15 mA
“H” level average output current IOHAV ⎯−2mA
Average value (operating current
× operating rat e)
“H” level total maximum output
current ΣIOH ⎯−50 mA
“H” level total average out put
current ΣIOHAV ⎯−20 mA Average value (operating current
× operating rat e)
Power consumption PD300 mW
Operating temperature TA40 +85 °C
Storage temperature Tstg 55 +150 °C
MB89470 Series
26 DS07-12552-2E
2. Recommended Operating Conditions (AVSS = VSS = 0.0 V)
* : These v alues depend on the oper ating conditions and the analog assurance range. See “Operating Voltage vs.
Main Clock Operating Frequency” and “5. A/D Converter Electrical Characteristics.”
Parameter Symbol Value Unit Remarks
Min Max
Power supply voltage VCC
AVCC
2.2* 5.5 V Operation assurance
range MB89475
3.5* 5.5 V Operation assurance
range MB89P475
2.7* 5.5 V Operation assurance
range MB89PV470
1.5 5.5 V Retains the RAM state in
stop mode
Operating temperature TA40 +85 °C
MB89470 Series
DS07-12552-2E 27
Operating Voltage vs. Main Clock Operating Frequency
“Operating Voltage vs. Main Clock Operating Frequency” indicates the operating frequency of the external oscilla-
tor at an instruction cycle of 4/FCH.
Since the operating voltage range is dependent on the instruction cycle, see minimum execution time if the oper-
ating speed is switched using a gear.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconducto r device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data shee t. Users consider ing application outside th e listed cond itions are advised t o contact
their representatives beforehand.
5.5
5.0
4.5
4.0
3.5
3.0
2.0
2.7
2.2
1.0
Note : This area is not assured for MB89P475.
This area is not assured for MB89PV470 and MB89P475.
2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0
4.0 2.0 1.33 1.0 0.8 0.66 0.57 0.50 0.44 0.4 0.36 0.33
12.5
0.32
;
Operating
Voltage (V)
Analog accuracy
assurance range :
VCC = AVCC = 4.5 V to 5.5 V
Main clock
operating Freq. (MHz)
Min execution
time (inst. cycle) (µs)
;
MB89470 Series
28 DS07-12552-2E
3. DC Characteristics (AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
(Continued)
Parameter Symbol Pin Condition Value Unit Remarks
Min Typ Max
“H” level
input voltage
VIH
P00 to P07,
P10 to P17,
P20 to P27,
P40 to P42,
P50 to P54
0.7 VCC VCC + 0.3 V
VIHS
RST, MODE, EC1,
EC2, SC K1, SI1,
SCK2, SI2, PWC,
INT10 to INT13,
INT20 to INT24
0.8 VCC VCC + 0.3 V
“L” level
input voltage
VIL
P00 to P07,
P10 to P17,
P20 to P27,
P40 to P42,
P50 to P54
VSS 0.3 0.3 VCC V
VILS
RST, MODE, EC1,
EC2, SC K1, SI1,
SCK2, SI2, PWC,
INT10 to INT13,
INT20 to INT24
VSS 0.3 0.2 VCC V
Open-drain
output pin
application
voltage
VDP30 to P36 VSS 0.3 VCC + 0.3 V
“H” level
output
voltage VOH
P00 to P07,
P10 to P17,
P20 to P27,
P50 to P54
IOH = 2.0 mA 4.0 ⎯⎯V
“L” level
output
voltage
VOL1
P00 to P07,
P10 to P17,
P20 to P27,
P50 to P54, RST
IOL = 4.0 mA ⎯⎯0.4 V
VOL2 P30 to P36 IOL = 12.0 mA ⎯⎯0.4 V
Input leak-
age current ILI
P00 to P07,
P10 to P17,
P20 to P27,
P50 to P54
0.45 V < VI < VCC 5⎯+5µAWithout
pull-up
resistor
Open drain
output
leakage
current
ILOD P30 to P36 0.45 V < VI < VCC 5⎯+5µA
MB89470 Series
DS07-12552-2E 29
(Continued) (AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
P arameter Symbol Pin Condition Value Unit Remarks
Min Typ Max
Pull-down
resistance RDOWN MODE VI = VCC 25 50 100 kExcept
MB89P475
Pull-up
resistance RPULL
P00 to P07,
P10 to P17,
P20 to P27,
P30 to P36,
P50 to P54, RST
VI = 0.0 V 25 50 100 k
When pull-up
resistor is
selected (ex-
cept RST)
Power
supply
current
ICC1
VCC
FCH = 12.5 MHz
tinst = 0.32 µs
Main clock
run mode
713mA
ICC2
FCH = 12.5 MHz
tinst = 5.12 µs
Main clock
run mode
13mA
ICCS1
FCH = 12.5 MHz
tinst = 0.32 µs
Main clock
sleep mode
2.5 5 mA
ICCS2
FCH = 12.5 MHz
tinst = 5.12 µs
Main clock
sleep mode
0.7 2 mA
ICCL FCL =
32.768 kHz
Subclock mode
37 85 µAMB89PV470
MB89475
350 785 µA MB89P475
ICCLS
FCL =
32.768 kHz
Subclock sleep
mode
11 30 µA
ICCT
FCL =
32.768 kHz
Watch mode
Main clock
stop mode
1.4 15 µAMB89PV470
MB89475
5.6 21 µA MB89P475
ICCH Ta = +25 °C
Subclock stop
mode 110µA
IAAVcc FCH = 12.5 MHz 2.8 6 mA A/D
converting
IAH Ta = +25 °C15µAA/D stop
Input
capacitance CIN Other than VCC,
VSS, AVCC, AVSS f = 1 MHz 515pF
MB89470 Series
30 DS07-12552-2E
4. AC Characteristics
(1) Reset Timing (VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
Notes : tHCYL is the oscillation cycle (1/FC) to input to the X0 pin.
If the reset pulse applied to the external re set pin (RST) does not meet the specifications, it may cause
malfunctions. Use caution so that the reset pulse less than the specifications will not be fed to the external
reset pin (RST).
(2) Power-on Reset (AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
Note : Make sure that power supply rises within the selected oscillation stabilization time.
Rapid changes in power su pply vo ltag e may cause a powe r- on reset . If po we r su pp ly volt age need s t o be
varied in the course of ope ration, a smooth voltage rise is recommended.
Parameter Symbol Condition Value Unit Remarks
Min Max
RST “L” pulse width tZLZH 48 tHCYL ns
Parameter Symbol Condition Value Unit Remarks
Min Max
Power supply rising time tR50 ms
Power supply cut-off ti me tOFF 1ms Due to repeated operations
0.2 V
CC
0.2 V
CC
t
ZLZH
RST
0.2 V
3.5 V
0.2 V 0.2 V
tOFF
VCC
tR
MB89470 Series
DS07-12552-2E 31
(3) Clock Timing (AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
Parameter Symbol Pin Value Unit Remarks
Min Typ Max
Clock frequency FCH X0, X1 1 12.5 MHz
FCL X0A, X1A 32.768 kHz
Clock cycle time tHCYL X0, X1 80 1000 ns
tLCYL X0A, X1A 30.5 ⎯µs
Input clock pulse width
PWH
PWL X0 20 ⎯⎯ns
External clock
PWHL
PWLL X0A 15.2 ⎯µs
Input clock rising/falling time tCR
tCF X0, X0A ⎯⎯10 ns
0.2 V
CC
0.2 V
CC
0.8 V
CC
0.8 V
CC
0.2 V
CC
P
WH
t
HCYL
t
CR
t
CF
P
WL
X0
X0 X1
C1 C2
FCH
When a crystal
or
ceramic oscillator is used
Open
When an external clock is used
FCH
X0 X1
X0 and X1 Timing and Conditions
Main Clock Conditions
MB89470 Series
32 DS07-12552-2E
(4) Instruction Cycle
Parameter Symbol Value Unit Remarks
Instruction cycle
(minimum execution time) tinst
4/FCH, 8/FCH, 16/FCH, 64/FCH µs (4/FCH) tinst = 0.32 µs when op erating
at FCH = 12.5 MHz
2/FCL µstinst = 61.036 µs when operating at
FCL = 32.768 kHz
X0A X1A
C0C1
Rd Open
When a crystal
or
ceramic oscillator is used When sub-clock is not used in dual clock product
X0A X1A
FCL Open
When an external clock is used
FCL
X0A X1A
0.8 VCC
tLCYL
0.2 VCC
PWHL PWLL
tCF tCR
X0A
Subclock Timing and Conditions
Subclock Conditions
MB89470 Series
DS07-12552-2E 33
(5) Serial I/O Timing (VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
* : For information on tinst, see “ (4) Instruction Cycle.”
Parameter Symbol Pin Condition Value Unit
Min Max
Serial clock cycle time tSCYC SCK1, SCK2
Internal shift
clock mode
2 tinst*⎯µs
SCK SO time tSLOV SCK1, SO1, SCK2, SO2 200 +200 ns
Valid SI SCK tIVSH SI1, SCK1, SI2, SCK2 1/2 tinst*ns
SCK valid SI hold time tSHIX SCK1, SI1, SCK2, SI2 1/2 tinst*ns
Serial clock “H” pulse width tSHSL SCK1, SCK2 External
shift clock
mode
1 tinst*⎯µs
Serial clock “L” pulse width tSLSH 1 tinst*⎯µs
SCK SO time tSLOV SCK1, SO1, SCK2, SO2 0 200 n s
Valid SI SCK tIVSH SI1, SCK1, SI2, SCK2 1/2 tinst*ns
SCK valid SI hold time tSHIX SCK1, SI1, SCK2, SI2 1/2 tinst*ns
0.8 V
2.4 V
2.4 V
0.8 VCC
0.2 VCC
0.8 V
tSCYC
tSLOV
tIVSHtSHIX
SCK1, SCK2
SO1, SO2
SI1, SI2
0.8 V
0.8 VCC
0.2 VCC
0.2 VCC0.2 VCC
2.4 V
0.8 VCC 0.8 VCC
0.8 VCC
0.2 VCC
tSLSHtSHSL
tSLOV
tIVSHtSHIX
SCK1, SCK2
SO1, SO2
SI1, SI2
0.8 V
0.8 VCC
0.2 VCC
Internal Clock Operation
External Clock Operation
MB89470 Series
34 DS07-12552-2E
(6) Peripheral Input Timing (AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = 40 °C to +85 °C)
* : For information on tinst, see “ (4) Instruction Cycle.”
Parameter Symbol Pin Value Unit Remarks
Min Max
Peripheral input “H” pulse width 1 tILIH1 INT10 to INT1 3 ,
INT20 to INT24, EC1,
EC2, PWC
2 tinst*⎯µs
Peripheral input “L” pulse width 1 tIHIL1 2 tinst*⎯µs
0.2 V
CC
0.8 V
CC
t
IHIL1
0.8 V
CC
INT10 to INT13,
INT20 to INT24,
EC1, EC2,
PWC
0.2 V
CC
t
ILIH1
MB89470 Series
DS07-12552-2E 35
5. A/D Converter Electrical Characteristics
(1) A/D Converter Electrical Characteristi cs
(AVCC = VCC = 4.5 V to 5.5 V, AV SS = VSS = 0.0 V, TA = 40 °C to +85 °C)
* : For information on tinst, see “ (4) Instruction Cycle” in “4. AC Characteristics”.
(2) A/D Converter Glossary
Resolution
Analog changes that are identifiable with the A/D converter
When the number of bits is 10, analog voltage can be divided into 210 = 1024.
Linearity error (unit : LSB)
The de viation o f the straight line connecting the z ero tr ansition point (“00 0000 0000” “00 0000 0001”) with
the full-scale transition point (“11 1111 1111” “11 1111 1110”) from actual conversion characteristics.
Differential linearity error (unit : LSB)
The deviation of input voltage needed to change the output code by 1 LSB from the theoretical value.
Total error (u nit : LSB)
The difference between theoretical and actual conversion values.
Parameter Symbol Pin Value Unit Remarks
Min Typ Max
Resolution
10 bit
Total error ⎯⎯±4.0 LSB
Linearity error ⎯⎯±2.5 LSB
Differential linearity error ⎯⎯±1.9 LSB
Zero transition voltage VOT AVSS
1.5 LSB AVSS +
0.5 LSB AVSS +
2.5 LSB V
Full-scale transition
voltage VFST AVCC
4.5 LSB AVCC
2.5 LSB AVCC
0.5 LSB V
A/D mode conversion time ⎯⎯60 tinst*µs
Analog port input current IAIN AN0 to
AN7
⎯⎯10 µA
Analog input voltage VAIN AVSS AVCC V
MB89470 Series
36 DS07-12552-2E
(Continued)
V
FST
1.5 LSB
1 LSB
Analog input
Theoretical I/O characteristics
Digital output
0.5 LSB
V
OT
AV
CC
AV
SS
3FF
3FE
3FD
004
003
002
001
Analog input
Total error
Digital output
VNT
Actual conversion
value
Actual
conversion
value
Theoretical
value
{1 LSB × N +
VOT}
AVCCAVSS
3FF
3FE
3FD
004
003
002
001
004
003
002
001
AV
SS
AV
CC
Analog input
Zero transition error
Digital output
Actual conversion
value
V
OT
(Actual measurement)
Actual conversion
value3FF
3FE
3FD
3FC
AV
CC
AV
SS
Analog input
Full-scale transition error
Digital output
V
FST
(Actual
measurement)
Actual conversion
value
Theoretical value
Actual conversion value
1 LSB = VFST VOT
1022 (V) Total error = VNT {1 LSB × N + 0.5 LSB}
1 LSB
MB89470 Series
DS07-12552-2E 37
(Continued)
3FF
3FE
3FD
004
003
002
001
AVSS AVCC
VNT
{1 LSB × N + VOT}
Analog input
Linearity error
Digital output
Actual conversion
value
Actual conversion
value
Theoretical value
VOT (Actual measurement)
VFST
(Actual
measurement)
V (N + 1) T
VNT
N + 1
N
N1
N2
AVSS AVCC
Analog input
Differential linearity error
Digital output
Actual conversion
value
Actual conversion
value
Theoretical value
1
Differential linearity error V (N + 1) T VNT
1 LSB
Linearity err or VNT {1 LSB × N + VOT}
1 LSB
= =
MB89470 Series
38 DS07-12552-2E
(3) Notes on Using A/D Converter
Input impedance of the analog inp ut pins
The A/D con verter used for th e MB89470 series contains a sample & hold circuit as illustrated below to fetch
analog input v oltage into the sample & hold capacitor for 16 instruction cycles after act ivation A/ D conv ersion.
F or this reason, if the output impedance of the e xternal circuit f or the analog input is high, a nalog input voltage
might not stabilize within the analog input sampling per iod. Therefore, it is recommended to keep the output
impedance of the external circuit low.
Note that if the impedance cannot be kept low, it is recommended to connect an external capacitor of about
0.1 µF for the analog input pin.
Sample & hold circuit MB89475
MB89PV470 MB89P475
R : analog input equivalent re sistance 2.2 k2.6 k
C : analog input equivalent capacitance 45 pF 28 pF
Analog input pin
Sample & hold circuit
If the analog input
impedance is higher
than to 10 k, it is
recommended to
connect an external
capacitor of approx.
0.1 µF.
Comparator
R C
Analog channel selector
Close for 16 instruction cycles after
activating A/D conversion.
Analog Input Circuit Model
MB89470 Series
DS07-12552-2E 39
EXAMPLE CHARACTERISTICS
“L” level output voltag e
“H” level output voltage
“H” level input voltage/“L” level input voltage
V
CC
= 3.0 V
V
CC
= 3.5 V
V
CC
= 4.0 V
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
V
CC
= 6.0 V
VOL1 IOL (MB89475)
Ta = + 25 °C
VOL1 (V)
0.8
0.6
0.4
0.2
0.00246810
IOL1
(mA)
0.4
0.3
0.2
0.1
0.00246810121416
V
CC
= 3.0 V
V
CC
= 3.5 V
V
CC
= 4.0 V
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
V
CC
= 6.0 V
Ta = + 25 °C
VOL2 IO2 (MB89475)
VOL2 (V)
IOL2 (mA)
(VCC VOH ) IOH (MB89475)
V
CC
V
OH
(V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0246810
I
OH
(mA)
VCC = 3.0 V
VCC = 3.5 V VCC = 4.0 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 6.0 V
VCC = 5.5 V
Ta = + 25 °C
CMOS Input (MB89475)
VIN (V)
VCC (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1234567
Ta = + 25 C
VIN (V)
VCC (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1234567
Ta = + 25 C
VIHS
VILS
CMOS hysteresis Input (MB89475)
VIHS : Threshold when input voltage in hysteresis
characteristics is set to “H” level.
VILS : Threshold when input voltage in hysteresis
characteristics is set to “L” level.
MB89470 Series
40 DS07-12552-2E
Power supply current (External clock)
(Continued)
I
CC1
V
CC
(MB89475)
ICC1 (mA)
VCC (V)
0.0
2.0
4.0
6.0
8.0
10.0
1234567
Ta = + 25 °CFCH = 12.5 MHz
FCH = 10.0 MHz
FCH = 8.0 MHz
FCH = 4.0 MHz
FCH = 2.0 MHz
FCH = 1.0 MHz
I
CC2
V
CC
(MB89475)
ICC1 (mA)
VCC (V)
0.0
0.2
0.4
0.6
0.8
1.0
1234567
Ta = + 25 °CFCH = 12.5 MHz
FCH = 10.0 MHz
FCH = 8.0 MHz
FCH = 4.0 MHz
FCH = 2.0 MHz
FCH = 1.0 MHz
1.2
1.4
ICC1 (mA)
VCC (V)
0.0
0.5
1.0
1.5
2.0
2.5
1234567
Ta = + 25 °CFCH = 12.5 MHz
FCH = 10.0 MHz
FCH = 8.0 MHz
FCH = 4.0 MHz
FCH = 2.0 MHz
FCH = 1.0 MHz
3.0
3.5
I
CCS1
V
CC
(MB89475)
ICC2 (mA)
VCC (V)
0.0
0.2
0.4
0.6
0.8
1.0
1234567
Ta = + 25 °CFCH = 12.5 MHz
FCH = 10.0 MHz
FCH = 8.0 MHz
FCH = 4.0 MHz
FCH = 2.0 MHz
FCH = 1.0 MHz
I
CCS2
V
CC
(MB89475)
MB89470 Series
DS07-12552-2E 41
(Continued)
Ta = + 25 °CFCH = 32.768 MHz
0
10
20
30
40
50
60
ICCL (µA)
1234567
VCC (V)
ICCL VCC (MB89475)
FCH = 32.768 MHz
Ta = + 25 °C
ICCLS (µA)
ICCLS VCC (MB89475)
0
2
4
6
8
10
12
14
16
1234567
VCC (V)
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
1234567
VCC (V)
ICCT (µA)
ICCT VCC (MB89475)
Ta = + 25 °C
FCH = 32.768 MHz
MB89470 Series
42 DS07-12552-2E
Pull-up resistance
Ta = + 25 °C
RPULL VCC (MB89475)
RPULL (k)
0
40
80
120
160
200
240
280
320
1234567
VCC (V)
MB89470 Series
DS07-12552-2E 43
MASK OPTIONS
ORDERING IN FORMATION
No. Part number MB89475 MB89P475 MB89PV470
Specifying procedure Specify when
ordering mask Setting not possible Setting not possible
1Selection of clock mode
Single clock mode
Dual clock mode Selectable 101/ 102 : Single clock
201/202 : Dual clock 101 : Single clock
201 : Dual clock
2
Selection of oscillation stabilization
time (OSC)
The initial value of the oscillation
stabilization time for the main
cloc k can be set by selecting the
v a lues of th e WT M1 an d WT M0
bits on the right.
Selectable
OSC
1 : 214/FCH
2 : 217/FCH
3 : 218/FCH
Fixed to oscillation
stabilization time of
218/FCH
Fixed to oscillation
stabilization time of
218/FCH
3
Selection of power-on stabilization
time
Nil
•2
17/FCH
Selectable Fixed to power-on sta-
bilization time of
217/FCH Fixed to nil
Part number Pa ckage Remarks
MB89475PFM
MB89P475-101PFM
MB89P475-102PFM
MB89P475-201PFM
MB89P475-202PFM
48-pin Plastic QFP
(FPT-48P-M13)
101 :
Single clock, without content protection
102 :
Single clock, with content protection
201 :
Dual clock, without content protection
202 :
Dual clock, with content protection
MB89475PMC
MB89P475-101PMC
MB89P475-102PMC
MB89P475-201PMC
MB89P475-202PMC
48-pin Plastic LQFP
(FPT-48P-M26)
MB89475P-SH
MB89P475-101P-SH
MB89P475-102P-SH
MB89P475-201P-SH
MB89P475-202P-SH
48-pin Plastic SH-DIP
(DIP-48P-M01)
MB89PV470-101CF
MB89PV470-201CF 48-pin Ceramic MQFP
(MQP-48C-P01)
MB89470 Series
44 DS07-12552-2E
PACKAGE DIMENSIONS
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/ (Continued)
48-pin plastic SH-DIP Lead pitch 1.778mm(70mil)
Row spacing 15.24mm(600mil)
Sealing method Pl astic mold
48-pin plastic SH-DIP
(DIP-48P-M01)
(DIP-48P-M01)
C
1994-2008 FUJITSU MICROELECTRONICS LIMITED D48002S-3C-4
43.69
+0.20
–0.30
+.008
–.012
1.720
13.80±0.25
(.543±.010)
INDEX-1
5.25(.207)
3.00(.118)
0.45±0.10
(.018±.004)
+.020
–0
.039
–0
+0.50
1.00
1.778±0.18
(.070±.007)
1.778(.070)
MAX
0.25±0.05
(.010±.002)
15.24(.600)
TYP 15°MAX
INDEX-2
40.894(1.610)REF
MAX
MIN
0.51(.020)MIN
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB89470 Series
DS07-12552-2E 45
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/ (Continued)
48-pin plastic LQFP Lead pitch 0.50 mm
Package width ×
package length 7× 7 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 1.70 mm MAX
Weigh t 0.1 7 g
Code
(Reference) P-LFQFP48-7×7-0.50
48-pin plastic LQFP
(FPT-48P-M26)
(FPT-48P-M26)
C
2003 FUJITSU LIMITED F48040S-c-2-2
24
13
3625
48
37
INDEX
SQ
9.00±0.20(.354±.008)SQ
0.145±0.055
(.006±.002)
0.08(.003)
"A" 0˚~8˚
.059 –.004
+.008
–0.10
+0.20
1.50
0.60±0.15
(.024±.006)
0.10±0.10
(.004±.004)
(Stand off)
0.25(.010)
Details of "A" part
112
0.08(.003)
M
(.008±.002)
0.20±0.05
0.50(.020)
LEAD No.
(Mounting height)
.276 –.004
+.016
–0.10
+0.40
7.00
*
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
©2003-2008 FUJITSU MICROELECTRONICS LIMITED F48040S-c-2-3
Note 1) * : These dimensions include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3)Pins width do not include tie bar cutting remainder.
MB89470 Series
46 DS07-12552-2E
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/ (Continued)
48-pin plastic QFP Lead pitch 0.80 mm
Package width ×
package length 10 × 10 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 2.35 mm MAX
Code
(Reference) P-QFP44-10×10-0.80
48-pin plastic QFP
(FPT-48P-M13)
(FPT-48P-M13)
C
2003-2008 FUJITSU MICROELECTRONICS LIMITED F48023S-c-3-5
(.013±.002)
0.32±0.05
0.80(.031)
M
0.20(.008)
0.10(.004)
(.007±.002)
0.17±0.06
10.00±0.20(.394±.008)SQ
13.10±0.40(.516±.016)SQ
112
13
24
37
48
2536
INDEX
Details of "A" part
0.80±0.20
(.031±.008)
0.88±0.15
(.035±.006)
0.25(.010)
.008
–.008
+.004
–0.20
+0.10
0.20
(Stand off)
1.95
+0.40
–0.20
+.016
–.008
.077 (Mounting height)
0~8
°
"A"
0.10(.004)
*
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3)Pins width do not include tie bar cutting remainder.
MB89470 Series
DS07-12552-2E 47
(Continued)
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
48-pin ceramic MQFP Lead pitch 0.8 mm
Lead shape Straight
Motherboard
materialCeramic
Mounted package
materialPlastic
48-pin ceramic MQFP
(MQP-48C-P01)
(MQP-48C-P01)
C
1994-2008 FUJITSU MICROELECTRONICS LIMITED M48001SC-4-3
14.82±0.35
(.583±.014)
15.00±0.25
(.591±.010)
17.20(.677)TYP
PIN No.1 INDEX
.430
–0
+.005
–0.0
+0.13
10.92
1.02±0.13
(.040±.005)
7.14(.281) 8.71(.343)
TYP
TYP
0.30(.012)TYP 4.50(.177)TYP
PAD No.1 INDEX
0.15±0.05
(.006±.002)
8.50(.335)MAX
0.60(.024)TYP1.10
+0.45
–0.25
+.018
–.010
.043
0.40±0.08
(.016±.003)
0.80±0.22
(.0315±.0087)
8.80(.346)REF
1.00(.040)TYP
1.50(.059)TYP
PIN No.1 INDEX
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB89470 Series
48 DS07-12552-2E
MAIN CHANGES IN THIS EDITION
The vertical lines marked in the left side of the page show the changes.
Page Section Change Results
⎯⎯
Changed the package code.
FPT-48P-M05 FPT-48P-M26
15 PROGRAMMING OTPROM IN MB89P475
WITH PROGRAMMER Changed the "2. RO M Writer Adapters and Recom-
mended ROM Writers".
16 PROGRAMMING TO THE EPROM WITH
PIGGYBACK/EVALUATION DEVICE Deleted the “2. Programming Socket Adapter”
43
ORDERING INFORMATION Order informations are changed.
MB89475PFV MB89475PMC
MB89P475-101PFV MB89P475-101PMC
MB89P475-102PFV MB89P475-102PMC
MB89P475-201PFV MB89P475-201PMC
MB89P475-202PFV MB89P475-202PMC
45 PACKAGE DIMENSIONS Changed the package figure.
FPT-48P-M05 FPT-48P-M26
MB89470 Series
DS07-12552-2E 49
MEMO
MB89470 Series
50 DS07-12552-2E
MEMO
MB89470 Series
DS07-12552-2E 51
MEMO
MB89470 Series
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome,
Shinjuku-ku, Tokyo 163-0722, Ja pan
Tel: +81-3-5322-3347 Fax: +81-3-5322-3387
http://jp.fujitsu.com/fml/en/
F or further inf ormation please contact:
North and South America
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U .S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/microelectronics/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fmal.fujitsu.com/
FUJITSU MICROELECTR ONICS SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-36 88 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fmc/
FUJITSU MICROELECTRONI CS PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fmc/en/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The informatio n, such as desc riptions of function and application circuit examples, in this document a re present ed solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of functio n and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS
or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual p roper ty right or
other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and househo ld use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to
the public, and could lead directly to death, personal injury, severe p hysical damage or other loss (i.e., nuclear reaction control in nuclear
facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon
system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and equipment such as redund ancy, fire protection, and prevention of over-current
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of
the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Business & Media Promotion Dept.