CERAMIC OPEN MODE CAPACITORS FEATURES KEMET's Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the potential for causing catastrophic failures. This product is RoHS Compliant. Applications: * Input side filtering (power plane/bus) * High current applications (battery line) * Circuits that cannot be fused to open when short circuits occur due to flex cracks Markets: * Automotive - All applications connected directly to the battery - Conversion to 42V power system * Power Conversion - Raw power input side filtering OUTLINE DRAWING TIN PLATE L W B T NICKEL PLATE S ELECTRODES CONDUCTIVE METALLIZATION TABLE 1 - DIMENSIONS - MILLIMETERS (INCHES) Metric EIAEIA Size Metric Size L - Length W - Width Size Code Code Code Size Code L - Length W - Width 2012 0805 2.002.0 (.079) .20(.008) (.008) 1.25 1.25 (.049).20 0.2 (.008) (.008) 2012 0805 (.079) .20 (.049) 3216 1206 (.126) .20 (.008) 1.6 (.063) 0.2 (.008) 3216 1206 3.203.2 (.126) .20 (.008) 1.60 (.063) .20 (.008) 3225 1210 3.2 (.126) .20 (.008) 2.5 (.098) 0.2 (.008) 3225 1210 3.204.5 (.126) .20 (.008) 2.50 (.098) .20 (.008) 4532 1812 (.177) 0.3 (.012) 3.2 (.126) 0.3 (.012) B - Bandwidth B - Bandwidth 0.50 (.02) .25 .25 (.010) (.010) 0.50 (.02) 0.50 (.02) .25 (.010) 0.50 (.02) .25 (.010) 0.50 (.02) .25 (.010) 0.50 (.02) .25 (.010) 0.60 (.024) .35 (.014) Separation Separation 0.75 (.030) (.030) 0.75 N/A N/A N/A N/A N/A Note: For thickness dimensions, see Table 2. C 1812 F 105 K 1 R A Ceramic Surface Mount CAPACITOR ORDERING INFORMATION C Style C - Ceramic Size Code 0805, 1206, 1210, 1812 End Metallization C = 100% Plated C =Tin Standard L = 70Sn/30Pb Plated Failure Rate Level A = Not Applicable Specification F - Open-Mode Capacitance Code, pF First two digits represent significant figures. Third digit specifies number of zeros. 100 pF = 101. (Use "9" for 1.0 through 9.9 pF) (Use "8" for 0.1 through .99 pF) Temperature Characteristic Designated by Capacitance Change over Temperature Range R - X7R (15%) (-55C +125C) Capacitance Tolerance K = 10% M = 20% 2 = 200V 1 = 100V Voltage 5 = 50V 3 = 25V 4 = 16V OPEN-MODE INTERNAL DESIGN The open-mode dimension (OM) exceeds the termination bandwidth dimensions: OM >BW (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 79 CERAMIC OPEN MODE CAPACITORS TABLE 2 X7R DIELECTRIC CAPACITANCE RANGE AND THICKNESS TARGETS (mm) 0805 0805 16V 16V DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DD DG DD DG DG DG DG DG DG DD DG DG DG DG DE 25V 25V DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DD DG DD DG DG DG DG DD DG DD DG DG DD DG DG DG DE DG 50V 50V 100V 100V DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DD DD DD DG DD DG DD DG DD DG DD DG DD DG DD DE DD DG DD DD DE DG DG DG DD DG DG DG DG DG 1206 1206 200V 200V 16V 16V 25V 25V 50V 50V DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DD DG DG DG DG DG DG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EC EG EC EG EG EG EG EG EG EG EG EG EG EG EG EC EH EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EC EG EC EG EG EG EG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EC EC EC EC EH EH EC EH EH 1210 1210 100V 100V 200V 200V 16V 16V EC EC EC EC EC EC EC EC EC EC EG EC EG EC ED EG EG EG ED EC EC EC EC EC EC EC EC EC EG EC EG EG EG EG EG EG EG EG EG EC EH FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FG FD FH FD FH FD FJ FG FG FH FH FJ FG 25V 25V 50V 50V FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FG FD FG FD FH FD FG FG FH FD FD FD FD FD FD FD FD FD FD FD FD FG FD FG FD FG FH FG FJ FG FJ FG FH FJ FJ FM 1812 1812 100V 100V 200V 200V 25V 25V FD FD FD FD FD FD FG FD FG FD FH FG FH FG FJ FH FR FR FH FJ FQ FR FR FD FD FG FD FG FD FH FG FH FG FJ FH FH FJ FQ GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GB GD GB GN GB GD GD GN 50V 50V GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GB GD GB GN GB GD GD GN 100V 100V 200V 200V GB GB GB GB GB GB GB GB GB GB GB GB GB GB GC GB GD GF GB GK GC GM GD GF GK GM FM FQ FM FM THICKNESS AND PACKAGING INFORMATION ThicknessThickness SeriesSeries Code Code DD DE DG EC EG EH FD FG FH FJ FM FR FQ GB GC GD GF GK GL GM GN DD DE DG EC ED EG EH FD FG FH FJ FM FR FQ GB GC GD GF GK GL GM GN 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1210 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 Dimension Dimension .90 .10 .901.00 .10 .10 1.00 .10 1.25 .15 .10 1.25.90 .15 .10 .901.00 .10 1.60 .15 1.60 .15 1.60 .20 1.60.95 .20 .10 .951.25 .10 .15 1.55 .15 1.25 .15 1.85 .20 1.55 .15 1.70 .20 1.85 .20 2.25 .20 1.702.5 .20 .20 2.251.0 .20 .10 .10 2.51.1 .20 .15 1.01.25 .10 1.50 .15 1.1 .10 1.60 .20 1.25 .15 1.90 .20 1.50 .15 2.00 .20 1.70 .20 1.60 .20 1.90 .20 2.00 .20 1.70 .20 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GC GB GF GB GK GC GL GF GK GL 7" 7" Reel Qty. 13" 13" Reel Qty. 4000 4000 2500 2500 2500 4000 2500 2500 4000 2000 2000 2000 2000 4000 4000 2500 2000 2500 2000 2000 2000 2000 2000 2000 1500 2000 1000 1000 1500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 10000 10000 10000 10000 10000 8000 8000 10000 10000 8000 8000 8000 8000 8000 4000 4000 4000 4000 4000 4000 4000 4000 Reel Qty. 1000 1000 1000 Reel Qty. 10000 10000 10000 10000 8000 8000 10000 10000 8000 8000 8000 8000 8000 4000 4000 4000 4000 4000 4000 4000 4000 (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 Ceramic Surface Mount Cap Cap Code Code 102 102 122 122 152 152 182 182 222 222 272 272 332 332 392 392 472 472 562 562 682 822 682 103 822 123 103 153 123 183 153 223 183 273 223 333 273 393 333 473 393 563 473 683 823 563 104 683 124 823 154 104 184 124 224 154 274 184 334 224 394 274 474 334 564 684 394 824 474 105 564 125 684 155 824 185 105 225 125 475 155 685 185 225 475 CERAMIC CHIP CAPACITORS Packaging Information Tape & Reel Packaging KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with EIA standard 481-1: Taping of surface mount components for automatic handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 78 for details on reeling quantities for commercial chips and page 87 for MIL-PRF-55681 chips. g handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 81 for details on reeling quantities for commercial chips and page 90 for MIL-PRF-55681 chips. Anti-Static Reel Embossed Carrier* 0402 and 0603 case sizes available on punched paper only. (R) T ME KE Chip Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military) Embossment 8mm .30 (.315 .012") or 12mm .30 (.472 .012") 178mm (7.00") or 330mm (13.00") Anti-Static Cover Tape (.10mm (.004") Max Thickness) * Punched paper carrier used for 0402 and 0603 case size. Case Sizes 1210 are 8 mm tape with 4 mm pitch. Case Sizes > 1210 are 12 mm tape with 8 mm pitch Note: TU suffix represents tape and reel packaging of marked components. TM suffix represents tape and reel packaging of marked components. SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM Reflow Solder Dimension 0402 0603 0805 1206 1210 1812 1825 2220 2225 CourtyardC C X X GG Y Z Z Y Z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 G 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 X Y(ref) C(ref) 0.74 0.93 1.21 1.08 1.05 1.73 1.60 1.30 2.00 2.00 1.50 3.00 2.90 1.50 3.00 3.70 1.80 4.10 6.90 1.80 4.10 5.50 1.85 5.15 6.80 1.85 5.15 Wave Solder Z G X Y(ref) Smin Not Recommended 3.18 3.70 4.90 4.90 0.68 0.70 1.50 1.50 0.80 1.10 1.40 2.00 1.25 1.50 1.70 1.70 1.93 2.20 3.20 3.20 Not Recommended Packaging Grid Grid placement courtyard Placement Calculation Formula Z = Lmin + 2Jt + Tt G = Smax - 2Jh -Th X = Wmin + 2Js + Ts Tt, Th, Ts = Combined tolerances (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 93 TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 Newton to 1.0 Newton (10g to 100g) 12 mm 0.1 Newton to 1.3 Newton (10g to 130g) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13") reels (with C-7280). Note that 13" reels are preferred. 4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556. Embossed Carrier Tape Configuration: Figure 1 Table 1 -- EMBOSSED TAPE DIMENSIONS (Metric will govern) Constant Dimensions -- Millimeters (Inches) Tape Size 8 mm and 12 mm D0 E 1.5 1.75 0.10 +0.10 -0.0 (0.059 (0.069 0.004) +0.004, -0.0) P0 P2 T Max T1 Max 4.0 0.10 2.0 0.05 0.600 0.100 (0.157 0.004) (0.079 0.002) (0.024) (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch B1 Max. Note 1 D1 Min. Note 2 F P1 R Min. Note 3 T2 Max W 8 mm Single (4 mm) 4.4 1.0 3.5 0.05 4.0 0.10 25.0 2.5 8.0 0.30 (.315 0.012) 12 mm Double (8 mm) (0.173) (0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) 8.2 (0.323) 1.5 5.5 0.05 (0.059) (0.217 0.002) 8.0 0.10 30.0 (0.315 0.004) (1.181) 4.6 12.0 0.30 (0.181) (0.472 0.012) A0B0K0 Note 4 NOTES 1. B1 dimension is a reference dimension for tape feeder clearance only. 2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 3. Tape with components shall pass around radius "R" without damage (see sketch A). The minimum trailer length (Fig. 2) may require additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2) 4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not protrude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm maximum in the pocket (not applicable to vertical clearance.) 94 (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Packaging Information Embossed Carrier Tape Configuration (cont.) 20 Sketch D: Tape Camber (Top View) 1mm (0.039) Max. 1mm (0.039) Max. 250mm (9.843) Allowable camber to be 1 mm/250 mm. 400mm (15.75) Min. Figure 2: Tape Leader & Trailer Dimensions (Metric Dimensions Will Govern) Packaging Figure 3: Reel Dimensions (Metric Dimensions will govern) Table 2 - REEL DIMENSIONS (Metric will govern) Tape Size 8 mm A Max 330.0 (12.992) B* Min 1.5 (0.059) C 13.0 0.20 (0.512 0.008) D* Min 20.2 (0.795) 12 mm 330.0 (12.992) 1.5 (0.059) 13.0 0.20 (0.512 0.008) 20.2 (0.795) N Min 50.0 (1.969) See Note 3 Table 1 W1 8.4 +1.5, -0.0 (0.331 +0.059, -0.0) 12.4 +2.0, -0.0 (0.488 +0.078, -0.0) W2 Max 14.4 (0.567) 18.4 (0.724) (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 W3 7.9 Min (0.311) 10.9 Max (0.429) 11.9 Min (0.469) 15.4 Max (0.606) 95 CERAMIC CHIP CAPACITORS Packaging Information Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only): 10 pitches cumulative tolerance on tape 0.2 (0.008) P0 T P2 D0 E Top Tape Cover Bottom Tape Cover A0 F W B0 G2 T1 P1 User Direction of Feed Center lines of cavity Max. Cavity Size See Note 1 Table 1 Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern) Constant Dimensions - Millimeters (Inches) Tape Size D0 P0 E T1 P2 G1 G2 R Min. 8mm 1.5 1.75 0.10 4.0 0.10 2.0 0.05 0.10 0.75 0.75 25 (.984) and +0.10, -0.0 (.004) (.030) (.030) See Note 2 12mm (.059 (.069 0.004) (.157 0.004) (.079 0.002) Max. Min. Min. Table 1 +0.004, -0.0) Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern) Variable Dimensions - Millimeters (Inches) Tape Size 8mm 1/2 Pitch P1 2.0 0.10 (.079 .004) 3.5 0.05 See Requirements Section 3.3 (d) (.138 .002) 8mm 4.0 0.10 (0.157 .004) 12mm 4.0 0.10 (0.157 .004) A0B0 W F 5.5 0.05 12mm 8.0 0.10 (.217 .002) Double (0.315 .004) Pitch 8.0 0.3 (.315 0.012) See Note 1 Table 1 12.0 0.3 T 1.1mm (.043) Max. for Paper Base Tape and 1.6mm (.063) Max. for NonPaper Base Compositions. See Note 3. (.472 .012) Note: 1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002) minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A and B). 2. Tape with components shall pass around radius "R" without damage. 3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum. Sketch A: Bending Radius See Note 2 Table 1 Sketch B: Max. Component Rotation - Front Cross Sectional View R (Min.) 20 96 Sketch C: Component Rotation - Top View Maximum 20 component rotation. Typical component center line (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP CAPACITORS Packaging Information Bulk Cassette Packaging (Ceramic Chips only) Table 2 - Capacitance Values Available In Bulk Cassette Packaging 6.8 0.1 8.8 0.1 12.0 0.1 (Meets Dimensional Requirements IEC-286-6 and EIAJ 7201) 53.3* 2.0 31.5 0.2 0 3.0 0.1 0 0 0.1 0.2 0 0402 All All All All 0603 All All All All 0805 C0G 200 100 50 109 109 109 181 331 102 X7R 200 100 50 25 16 221 221 221 221 221 392 103 273 104 104 Y5V 25 16 104 104 224 224 19.0* 1.5 Unit: mm * Reference 36 00.2 10* Min. Max. Case Cap Cap Size Dielectric Voltage Value Value 5.0* 110 0.7 Table 1 - Capacitor Dimensions for Bulk Cassette Packaging - Millimeters Metric Size Code EIA Size Code 1005 1608 2012 0402 0603 0805 Length L Width W Thickness Bandwidth T B 1.0 0.05 0.5 0.05 1.6 0.07 0.8 0.07 2.0 0.10 1.25 0.10 0.5 .05 0.8 .07 0.6 .10 0.2 to 0.4 0.2 to 0.5 0.5 to 0.75 Minimum Separation S Number of Pcs/Cassette 0.3 0.7 0.75 50,000 15,000 10,000 Terminations: KEMET nickel barrier layer with a tin overplate. CAPACITOR MARKING TABLE (Marking Optional - Not Available for 0402 Size or Y5V Dielectric) 9 0 1 2 3 4 5 6 7 A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y 0.10 0.11 0.12 0.13 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 24,000 27,000 30,000 33,000 36,000 39,000 43,000 47,000 51,000 56,000 62,000 68,000 75,000 82,000 91,000 25,000 35,000 40,000 45,000 50,000 60,000 70,000 80,000 90,000 100,000 110,000 120,000 130,000 150,000 160,000 180,000 200,000 220,000 240,000 270,000 300,000 330,000 360,000 390,000 430,000 470,000 510,000 560,000 620,000 680,000 750,000 820,000 910,000 250,000 350,000 400,000 450,000 500,000 600,000 700,000 800,000 900,000 1,000,000 1,100,000 1,200,000 1,300,000 1,500,000 1,600,000 1,800,000 2,000,000 2,200,000 2,400,000 2,700,000 3,000,000 3,300,000 3,600,000 3,900,000 4,300,000 4,700,000 5,100,000 5,600,000 6,200,000 6,800,000 7,500,000 8,200,000 9,100,000 2,500,000 3,500,000 4,000,000 4,500,000 5,000,000 6,000,000 7,000,000 8,000,000 9,000,000 10,000,000 11,000,000 12,000,000 13,000,000 15,000,000 16,000,000 18,000,000 20,000,000 22,000,000 24,000,000 27,000,000 30,000,000 33,000,000 36,000,000 39,000,000 43,000,000 47,000,000 51,000,000 56,000,000 62,000,000 68,000,000 75,000,000 82,000,000 91,000,000 25,000,000 35,000,000 40,000,000 45,000,000 50,000,000 60,000,000 70,000,000 80,000,000 90,000,000 Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. Note that marking is not available for size 0402 nor for any Y5V chip. In addition, the 0603 marking option is limited to the K only. KA3 Example shown is 1,000 pF capacitor. (c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 Packaging Capacitance (pF) For Various Numeral Identifiers Numeral Alpha Character 97